- meet iec61000-4-2 (esd) 15kv (air), 8kv (contact) - protects one bi-directional i/o lines - low clamping voltage - working voltage : 5, 12 and 24v - high component density case : 0603-b standard package molded plastic terminals : gold plated, solderable per mil-std-750, method 2026 symbol units TESDUB5V0 tesdub12v tesdub24v TESDUB5V0 tesdub12v tesdub24v TESDUB5V0 tesdub12v tesdub24v TESDUB5V0 tesdub12v tesdub24v TESDUB5V0 tesdub12v tesdub24v t j c t stg c document number ds_s1312002 version : b13 i l v bo c t -55 to + 125 -55 to + 150 iec 61000-4-2(air) iec 61000-4-2(contact) i pp =5a, t p =8/20us i pp =1a, t p =8/20us i pp =1a, t p =8/20us t p =8/20us vc p pp esd conditions ir=1ma vr=5v vr=12v vr=24v vr=0v, f=1mhz 25 47 25 47 8 --15 12 - 10 - 15 -1520 28 - -0.12 min typ max 5.1 13 17 - 7- w junction temperature range storage temperature range --75 clamping voltage v peak pulse power junction capacitance pf esd capability kv v leakage current a 25 maximum ratings and electrical characteristics (t a =25 unless otherwise noted) parameter diode breakdown voltage 0603-b mechanical data weight : 0.003g (approximately) TESDUB5V0/12v/24v taiwan semiconductor small signal product bi-directional esd protection diodes features
part no. note 1: "xxx" defines voltage from 5v (TESDUB5V0) to 24v (tesdub24v) part no. TESDUB5V0 TESDUB5V0 TESDUB5V0 TESDUB5V0 (ta=25 unless otherwise noted) document number ds_s1312002 version : b13 ratings and characteristics curves 4000 / reel r4 TESDUB5V0 r4 r4 f0 TESDUB5V0 r4g r4 g f0 green compound TESDUB5V0 r4 r4 TESDUB5V0 r4g r4 g green compound (note 2) note 2: manufacture special control, if empty means no special control requirement. example preferred p/n packing code green compound code manufacture code description packing code green compound code package packing manufacture code tesdubxxx (note 1) suffix "g" 0603-b TESDUB5V0/12v/24 v taiwan semiconductor small signal product ordering information 0.001 0.01 0.1 1 10 0 20406080100 reverse current (ua) time (us) fig. 2 reverse characteristics 0 20 40 60 80 100 120 0 255075100125150 power rating (%) ambient temperature ( o c) fig.4 power derating curve mounting on glass epoxy pcb 0 3 6 9 12 15 0 10203040 capacitance(pf) reverse voltage(v) 5v0 fig. 3 capacitance between terminals 12v 24v 0 20 40 60 80 100 0 10203040 percent of i ppm time (us) fig. 1 8/20us peak pulse current waveform acc. iec 61000-4-5 tr = 8 s to 100% 20us to 50us
min max min max a 1.60 1.80 0.063 0.071 b 0.80 1.00 0.031 0.039 c d 0.70 0.85 0.028 0.033 e f g0.80 x0.60 x1 2.00 y0.80 TESDUB5V0 e05 tesdub12v e12 tesdub24v e24 document number ds_s1312002 version : b13 small signal product TESDUB5V0/12v/24v taiwan semiconductor suggested pad layout marking 0.70 typ. 0.028 typ. 0.35 typ. 0.014 typ. 0.30 typ. 0.012 typ. part no. dim. unit(mm) dimensions dim. marking unit(mm) unit(inch)
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