creat by art - low forward voltage drop - ideal for automated placement - high surge current capability - halogen-free according to iec 61249-2-21 definition symbol unit v rrm v v rms v v dc v i f(av) a c j p f r ja o c/w t j o c t stg o c document number 1307006 version:a13 note 3: mount on cu pad size 16mm x 16mm on pcb 400 600 800 1000 peak forward surge current 8.3 ms single half sine-wave t j =25 t j =125 200 170 400 600 800 1000 280 420 560 700 s8gc s8jc s8kc S8MC peak forward surge current 1.0 ms single half sine-wave t j =25 i fsm 600 t j =125 338 48 - 55 to + 150 weight 0.27 gram (approximately) do-214ab(smc) case do-214ab(smc) maximum average forward rectified current parameter 0.985 10 250 polarity indicated by cathode band molding compound, ul flammability classification rating 94v-0 base p/n with suffix "g" on packing code - halogen-free, rohs compliant terminal matte tin plated leads, solderable per jesd22-b102 meet jesd 201 class 1a whisker test maximum ratings and electrical characterstics (t a =25 unless otherwise noted) a - 55 to + 150 s8gc thru S8MC surface mount glass passivated rectifier taiwan semiconductor mechanical data - compliant to rohs directive 2011/65/eu and in accordance to weee 2002/96/ec - moisture sensitivity: level 1, per j-std-020 features 8 note 1 pulse test with pw=300u sec, 1% duty cycle operating junction temperature range storage temperature range a maximum reverse current @ rated vr t a =25 t a =125 typical thermal resistance (note 3) i r v f typical junction capacitance (note 2) maximum repetitive peak reverse voltage maximum rms voltage maximum dc blocking voltage v a maximum instantaneous forward voltage (note 1) if= 8 a 44 i fsm note 2: measured at 1.0mhz and applied reverse voltage of 4.0v dc
part no. part no. ss36 ss36 (ta=25 unless otherwise noted) document number 1307006 version:a13 example ratings and chatacteristics curves S8MC r7 r7 smc r7g r7 g green compound m6 smc 3000 / 13" plastic reel note 1: "xx" defines voltage from 400v (s8gc) to 1000v (S8MC) preferred p/n packing code green compound code description packing s8xc (note 1) r7 suffix "g" smc 850 / 7" plastic reel r6 smc 3000 / 13" paper reel ordering information s8gc thru S8MC taiwan semiconductor packing code green compound package 0 2 4 6 8 10 0 25 50 75 100 125 150 average forward a current (a) lead temperature ( o c) fig.1- maximum forward current derating curve resistiveor inductive load 0 50 100 150 200 250 1 10 100 peak forward surge current (a) number of cycles at 60 hz fig. 2- maximum non-repetitive peak forward surge current 8.3ms single half sine wave jedec method 0.01 0.1 1 10 100 0 20 40 60 80 100 instantaneous reverse current (ua) percent of rated peak reverse voltage (%) fig. 4- typical reverse characteristics ta=125 ta=25 0.1 1 10 100 0 0.2 0.4 0.6 0.8 1 1.2 1.4 1.6 instantaneous forward current (a) forward voltage (v) fig. 3- typical forward characteristics ta=125 ta=25
min max min max a 2.90 3.20 0.114 0.126 b 6.60 7.11 0.260 0.280 c 5.59 6.22 0.220 0.245 d 2.00 2.62 0.079 0.103 e 1.00 1.60 0.039 0.063 f 7.75 8.13 0.305 0.320 g 0.10 0.20 0.004 0.008 h 0.15 0.31 0.006 0.012 p/n = specific device code g = green compound yw = date code f = factory code document number 1307006 version:a13 marking diagram c6.8 d4.4 e9.4 suggested pad layout symbol unit(mm) a3.3 b2.5 s8gc thru S8MC taiwan semiconductor package outline dimensions dim. unit(mm) unit(inch)
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