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customer approval sheet company name model a060se02 v5 customer approved approval for specifications only (spec. ver. 0.2) approval for specifications and es sample (spec. ver. 0.2) approval for specifications and cs sample (spec. ver. 0.2) customer remark : auo pm : ken cm chen p/n : comment : 1 li-hsin rd. 2. science-based industrial park hsinchu 300, taiwan, r.o.c. tel: +886-3-500-8899 fax: +886-3-577-2730
all rights strictly reserved. any portion of this paper shall not be reproduced, copied, or t r ansformed to any other forms without permission from au optronics corp. doc. v ersion : 0.1 total pages : 35 date : 2010/07/13 product specification 6" epd with touch panel module model name a060se02 v5 planned lifetime: from 2010/may. to 2011/may. phase-out control: from 2011/feb. to 2011/may. eol schedule: 2011/may. < >prelim inary specification < >f inal specification note: the content of this specification is subject to change. ? 20 1 0 au optronics all rights reserved, do not copy.
version: 0.1 page: 1/35 all rights strictly reserved. any portion of this paper shall not be reproduced, copied, or t ransformed to any other forms without permission from au optronics corp. reco rd of revision version revise date page content 0.0 2010/05/19 all first draft. 0 modify life time, phase out control and eol time 3 modify general information, overall dimension, and number of gray levels. 10 add item ?image update time? to ?d. electrical characteristic? 10 update power consumption format 17 update power on/off sequence 18, 19 modify value of ?reflectance? and remark modify value of ?contrast ratio? and remark modify item ?response time? to ?update time?, remove definition of ?response time? 20, 21 add reliability test item ?uv exposure resistance? , remove some items and modify remarks and notes 26 add precaution items 19~21. 0.1 2010/6/10 30 update int_setting default value 10 update typical power consumption measured pattern 20,21 reliability test items number typo modify 0.2 2010/7/13 26 add precaution items 22,23
version: 0.1 page: 2/35 all rights strictly reserved. any portion of this paper shall not be reproduced, copied, or t ransformed to any other forms without permission from au optronics corp. contents a. general information..............................................................................................3 b. outline dimension ................................................................................................4 c. electrical specifications ........................................................................................5 1. pin assignment .................................................................................................................................................. 5 2. touch panel pin assignment ........................................................................................................................... 9 3. absolute maximum ratings ............................................................................................................................ 9 d. electrical characteristics .....................................................................................10 e. input timing ac characteristics .......................................................................11 1. horizontal input timing ...................................................................................................................................... 11 1.1 relation ship of input data and source output voltage................................................................................ 12 2. vertical input timing ............................................................................................................................................ 13 3. vcom voltage definition ................................................................................................................................... 14 4. vcom relationship.............................................................................................................................................. 14 5. touch panel timing............................................................................................................................................... 15 f. power on/off characteristics............................................................................17 1. recommended power on/off sequence........................................................................................................ 17 g. optical specification ...........................................................................................18 h. reliability test items.........................................................................................20 i. packing and marking ..........................................................................................22 1. packing form ...................................................................................................................................................... 22 2. module/panel label information ................................................................................................................... 23 3. carton label information................................................................................................................................. 23 j. application note ..................................................................................................24 1. application circuit............................................................................................................................................ 24 2. touch panel pin assign circuit............................................................................................................................ 25 l. touch panel command and register map ........................................................27 1. i2c protocol definition ....................................................................................................................................... 27 2. coordinate register map .................................................................................................................................... 29 3. sensitivity .............................................................................................................................................................. 29 4. interrupt operation mode .................................................................................................................................. 29 5. power mode ........................................................................................................................................................... 33 6. calibration ............................................................................................................................................................. 35 7. power on/off sequence...................................................................................................................................... 35
version: 0.1 page: 3/35 all rights strictly reserved. any portion of this paper shall not be reproduced, copied, or transformed to any other forms without permission from au optronics corp. a. general information this display is a active matrix electrophoretic display (epd), which comprises a-si tft substrace, el e ctrophoretic front plane, protective anti-glare top-sheet, driver ics, and fpc. it is designed for applications such as e-book or e-reader. no. item unit specification remark 1 screen size inch 6 (diagonal) 2 display resolution dot 800 (h) 600(v) 3 overall dimension mm 131.4(h) 105.39(v) (1.84) (t) note 1 4 active area mm 122.4(h)90.6(v) 5 dot pitch mm 0.153 (h)x 0.151(v) 6 gray level -- 8 7 weight g (52) 8 surface treatment ag (7.5 2%) hard coating (3h) note 2 note 1: not include fpc and label. refer to next page to get further information. note 2: 750 g load force on uni/jpia 3h pencil, speed is 3.5mm/s on the ag film and scratch length is 1cm and write 5 handwriting, scratch no. Q 2 is ok
version: 0.1 page: 4/35 all rights strictly reserved. any portion of this paper shall not be reproduced, copied, or transformed to any other forms without permission from au optronics corp. b. outline dimension
version: 0.1 page: 5/35 all rights strictly reserved. any portion of this paper shall not be reproduced, copied, or tr a nsformed to any other forms without permission from au optronics corp. c. electrical specifications 1. pin assignment recommended connector : fh12-50s-0.5sh. pin no. symbol i/o i/o structure description remark 1 dummy -- -- dummy pin 2 vcom o -- vcom polarity output signal 3 vcom_bot i -- vcom signal setting pin 4 vcomdc p type2 external voltage for vcomdc power. 5 vcomh p -- external voltage for vcom high power. 6 vcoml p -- external voltage for vcom low power. 7 rst_n i type 3 global reset pin. low reset. 8 shd_n i type 3 dc-dc converter shut down pin. ?0? : enable.(panel shut down; default ) ?1? : disable. 9 pwr_rdy o type 1 power ready output. when shd_n from ?1? to ?0?: pwr_rdy will become ?0?. when shd_n from ?0? to ?1?: after 100ms, pwr_rdy will become ?1?. note1 10 vcomin_0 i type 2 logic input for vcom voltage generate. 11 vcomin_1 i type 2 logic input for vcom voltage generate. 12 yoe i type 3 vertical output enable pin. note2 13 yclk i type 3 vertical clock. input note2 14 ud i type 3 vertical (up/down) scan direction. u/d = "l": shift up to down. default u/d = "h": shift down to up.
version: 0.1 page: 6/35 all rights strictly reserved. any portion of this paper shall not be reproduced, copied, or t ransformed to any other forms without permission from au optronics corp. 15 ydiod i/o type 5 16 ydiou i/o type 5 vertical start pulse input/output. these pins are used to input and output shift data. these pins are switched as input or output by setting the ud pin as follow. ud ydiou ydiod l output input h input output 17 xdiol i/o type 5 18 xdior i/o type 5 horizontal start pulse input/output. these pins are used to input and output shift data. these pins are switched as input or output by setting the shl pin as follow. shl xdiol xdior l input output h output input 19 ld i type 3 latch data. 20 d0 i type 3 data input, first pixel lsb 21 d1 i type 3 data input, first pixel msb 22 d2 i type 3 data input, second pixel lsb 23 d3 i type 3 data input, second pixel msb 24 d4 i type 3 data input, third pixel lsb 25 d5 i type 3 data input, third pixel msb 26 d6 i type 3 data input, forth pixel lsb 27 d7 i type 3 data input, forth pixel msb 28 shl i type 3 horizontal (left/right) scan direction. shl = ?l?: shift right to left. shl = ?h?:shift left to right. default 29 xclk i type 3 horizontal clock input.. note3 30 vref c -- for power setting capactor connected pin. 31 vr p -- vcomdc reference voltage 32 avdd c -- for power setting capactor connected pin. 33 c1p c -- for charge pump capactor connected pin. 34 c1n c -- for charge pump capactor connected pin. 35 vss p -- digital ground 36 vssa p -- analog ground. 37 vdd p -- analog power. 38 vref_pos c -- for power setting capactor connected pin. 39 vref_neg c -- for power setting capactor connected pin.
version: 0.1 page: 7/35 all rights strictly reserved. any portion of this paper shall not be reproduced, copied, or t ransformed to any other forms without permission from au optronics corp. 40 v ddx8 p -- dcdc positive voltage 41 nvddx8 p -- dcdc negative voltage 42 vdd_drv p -- dcdc power. 43 adrvu o type 1 pwm output for dcdc converter. 44 adrvd o type 1 pwm output for dcdc converter. 45 vss_drv p -- dcdc ground. 46 vdps p -- external voltage for source postive power. 47 vdns p -- external voltage for source negative power. 48 vdpg c -- for power setting capactor connected pin. 49 vdng c -- for power setting capactor connected pin. 50 dummy d -- dummy pin i: input pin; o:output pin, i/o: input / output; p: power pin; c: capacitor pin; d dummy note 1: please reference chapter f note 2: please reference chapter e note 3: please reference chapter e
version: 0.1 page: 8/35 all rights strictly reserved. any portion of this paper shall not be reproduced, copied, or transforme d to any other forms without permission from au optronics corp. i/o pin struct ure:

version: 0.1 page: 9/35 all rights strictly reserved. any portion of this paper shall not be reproduced, copied, or t ransformed to any other forms without permission from au optronics corp. 2. touch panel pin assignment pin no. symbol i/o description remark 1 gnd p touch panel ground. 2 vdd_tp p touch panel power. 3 tp_int o touched interrupt indicator pin. 4 iicscl i serial input clock in i2c-bus interface operation pin. 5 iicsda i/o serial input/output data in i2c-bus interface operation pin. 6 rst_tp i touch panel reset pin. 3. absolute maximum ratings item symbol condition min. max. unit remark power voltage vdd vssa=vss=0 -0.3 +5.0 v power voltage vdd_drv vss_drv=0 -0.3 +5.0 v vdps vssa=vss=0 +20 v source voltage vdns vssa=vss=0 -20 v vdpg vssa=vss=0 -0.3 vdng+40 gate voltage vdng vssa=vss=0 vdpg-40 +0.3 storage temperature tstg - -25 70 operating topa - 0 50
version: 0.1 page: 10/35 all rights strictly reserved. any portion of this paper shall not be reproduced, copied, or tr a nsformed to any other forms without permission from au optronics corp. d. elect rical characteristics 1. panel power consumption item symbol condition min. typical max. unit vdd vssa=vss=vss_drv=0v -- 3.3 -- v supply voltage vdd_drv vssa=vss=vss_drv=0v -- 3.3 -- touch panel supply voltage vdd_tp vssa=vss=vss_drv=0v - 3.3 - v low level input voltage vil digital input pins gnd - 0.3xvdd v high level input voltage vih digital input pins 0.7xvdd - vdd v operating temperature t op - 25 - c vdd=vdd_drv=3.3v -- 1.07 2 ma vdns=-15v 0.82 1.5 ma vdps=15v 0.86 1.5 ma vdpg=20v 1.23 2 ma vdng=-20v 0.66 1.5 ma vcomh=12v 0.36 1 ma operation power dissipation p vcoml=-18v 0.56 1 ma vdd=vdd_drv=3.3v -- 0.06 0.15 ma vdns=0v 0.02 0.1 ma vdps=0v 0.02 0.1 ma vdpg=3.3v 0.02 0.1 ma vdng=0v 0.02 0.1 ma vcomh=0v 0.01 0.1 ma standby power dissipation p vcoml=0v 0.02 0.1 ma t=25 -- 950 1010 ms t=10 -- 2310 2450 ms image update time t=0 -- 2750 3150 ms *: typical power consumption measured by following pattern
version: 0.1 page: 11/35 all rights strictly reserved. any portion of this paper shall not be reproduced, copied, or t ransformed to any other forms without permission from au optronics corp. 2. touch panel power consumption mode symbol condition min. typ. max. unit remark active ptp_a - (9) - ma sleep ptp_s - (1) - ma deep sleep ptp_dp vdd= 3.0v - (0.7) - ma e. input timing ac characteristics 1. horizontal input timing figure 1: ld input timing
version: 0.1 page: 12/35 all rights strictly reserved. any portion of this paper shall not be reproduced, copied, or tran s formed to any other forms without permission from au optronics corp. n=800 figure 2: horizontal data input timing (vdd=vdd_drv=3.3v, vssa=vss=vss_drv=0v, ta=25 ) parameter symbol min. typ. max. unit clock pulse width t wxdclk 13 ns data setup time t setup 2 - - ns data hold time t hold 2 - - ns ld pulse width t wld 1 - - xclk time from ld to xdiol/xdior t ld_dio 5 - - xclk 1.1 relation ship of input data and source output voltage the source driver output voltage will base on input 2 bits data, and the relationship is as below: msb lsb function 0 0 source output is 0v 0 1 source output is vdps(+15v) 1 0 source output is vdns(-15v) 1 1 source output is floating
version: 0.1 page: 13/35 all rights strictly reserved. any portion of this paper shall not be reproduced, copied, or transformed to any other forms without permission from au optronics corp. 2. vertical input timing yclk yd i ou/ ydiod (input) ydiou/ yd i od (output) yoe g1 g2 1 2 n 3 g3 gn n=600 figure 3: vertical input timing
version: 0.1 page: 14/35 all rights strictly reserved. any portion of this paper shall not be reproduced, copied, or transformed to any other forms without permission from au optronics corp. 3. vcom voltage definition the vcom output voltage will base on input pins vcomin[1:0], and the relationship is as below: vcomin[1 :0] function 00 vcom output is (-vdc) v 01 vcom output is (vdps-vdc) v 10 vcom output is (vdns-vdc) v 11 vcom output is floating 4. vcom relationship vcom will change while vocmin change sou rce output will change while ld signal falling edge.
version: 0.1 page: 15/35 all rights strictly reserved. any portion of this paper shall not be reproduced, copied, or transformed to any other forms without permission from au optronics corp. 5. touch panel timing 5.1. i2c timing diagram note : slave address is 1001100. 5.2. register write sequence 5.3. register read sequence
version: 0.1 page: 16/35 all rights strictly reserved. any portion of this paper shall not be reproduced, copied, or t r ansformed to any other forms without permission from au optronics corp. 5.4. i2c timing characteristics vddi=1.65~3.3v, vci=2.5~3.3v, ta=25 item symbol min. typ. max. unit working frequency fclk - - 400 khz i2c clock low tckl 1250 - - ns i2c clock high tckh 1250 - - ns i2c data ring time tr - - 300 ns i2c data falling time tf - - 300 ns i2c data hold time tdathd 0 - - ns i2c data setup time tdatsu 100 - - ns i2c start condition hold time tstahd 600 - - ns i2c start condition setup time tstasu 600 - - ns i2c stop condition setup time tstpsu 600 - - ns i2c bus free time tbusfree 1300 - - ns
version: 0.1 page: 17/35 all rights strictly reserved. any portion of this paper shall not be reproduced, copied, or tra n sformed to any other forms without permission from au optronics corp. f. power on/off characteristics 1. recommended power on/off sequence the suggested power on/off sequence is below: 1. p o wer on sequence: 2. powe r off sequence:
version: 0.1 page: 18/35 all rights strictly reserved. any portion of this paper shall not be reproduced, copied, or transformed to any other forms without permission from au optronics corp. g. optical specification all optical specification is measured under typical condition (note 1, 2) item symbol condition min. typ. max. unit remark reflectance r white 24 26 -- % note1,2,3,4 contrast ratio cr at optimized viewing angle 4 5 -- note1,2,3,5 update time t t=25 t=10 t=0 -- 950 2310 2750 1010 2450 3150 ms note 3 note 1. ambient temperature =25 note 2. reflectance and constrast ratio are measured by konica minolta spectrophotometer cm-2600d. note 3: the measurement shall be conducted under auo specificed driving condition, including lut and tcon codes.
version: 0.1 page: 19/35 all rights strictly reserved. any portion of this paper shall not be reproduced, copied, or t ransformed to any other forms without permission from au optronics corp. note 4. definition of reflectance: the reflectance is expressed as: r = reflectance factor white board x (l center / l white board ) l center is the luminance measured at center in a white area. l white board is the luminance of a stan dard white board. note 5. definition of contrast ratio: the contrast ratio (cr) is the ratio between the reflectance in a full white area (rl) and reflectance in a dark area (rd). rd rl (cr) ratio contrast =
version: 0.1 page: 20/35 all rights strictly reserved. any portion of this paper shall not be reproduced, copied, or tran s formed to any other forms without permission from au optronics corp. h. reliability test items test condition condition remark 1 high-temperature operation tamb=+50 , rh=30% for 240hrs iec 60068-2-2bp update pattern four times per minute. 2 low-temperature operation tamb=0 for 240hrs iec 60068-2-2ab update pattern four times per minute. 3 high-temperature storage tamb=+70 , rh=23% for 240hrs iec 60068-2-2bp 4 low-temperature storage tamb=-25 for 240hrs iec 60068-2-2ab 5 high-temperature, high-humidity operation tamb=+40 , rh=90% for 168hrs iec 60068-2-3ca update pattern four times per minute. 6 high-temperature, high-humidity storage tamb=+60 , rh=80% for 240hrs iec 60068-2-3ca 7 temperature cycle 1 cycle [-25 c 30min] -> [+70 c 30min] 100 cycles iec 60068-2-14 8 uv exposure resistance condition: 1120w/m2, 40 test duration: 3 cycles (definition of 1 cycle: 8 hr at exposure state and 16 hr at non-exposure state) iec 60068-2-5sa 9 package vibration 1.04g, frequency 10 ~ 500hz direction x, y, z duration 1 hours in each direction 10 package drop impact drop from height of 100 cm on concrete surface. drop sequence 1 corner, 3 edges, 6 faces one drop for each. 11 electrostatic discharge air-mode : +/- 8kv contact-mode : +/- 4kv iec 61000-4-2 12 altitude test operation 700hpa(=3,000m) 48hrs 13 altitude test storage 260hpa(=10,000m) 48hrs
version: 0.1 page: 21/35 all rights strictly reserved. any portion of this paper shall not be reproduced, copied, or tran s formed to any other forms without permission from au optronics corp. 14 fpc bonding strength pull the fpc stiffener part with a force of 500gf in the horizontal and vertical directions 15 fpc bending performance apply mit method. bending rate radius 1.0mm weight 500gf, bending angle 135 bending cycle 20 times 16 stylus tapping polyacetal pen top r0.8mm load 300gf speed 3 times/sec total 13,500 times pass criteria - no glass breakage or damage to micro-cups. note 1. in the above conditions, there is no display function ng issue occurred. all the cosmetic specification is judge d before the reliability stress. note 2. the test modules will be kept at 25 environment for 4 hours after finish the environmental test and make measurement after auo specified tcon code and waveform re-driving. the judgement of above tests should satisfy minimum contrast ratio and minimum reflectance. note 3. for item 10, in addition tosatisfy minimum contrast ratio and minimum reflectance, the display shall be able to identify 4 gray levels, including black and white when being driven under auo specified driving condition at the end of test. note 4. esd testing method. 1. ambient: 24~26 , 56~65%rh, atmospheric pressure : 940~960hpa 2. instruments:noisekeness-2000, 3. operation system: auo pattern generator 4. test mode: non-operating mode, test pattern: chess 5. test method: a. contact discharge: 150pf(330 ) 1sec, 8 points, 25 times/point b. air discharge: 150pf(330 ) 1sec, 8 points, 25 times/point 6. test point:
version: 0.1 page: 22/35 all rights strictly reserved. any portion of this paper shall not be reproduced, copied, or transformed to any other forms without permission from au optronics corp. i. packing and marking 1. packing form
version 0.1 page: 23/35 all rights strictly reserved. any portion of this paper shall not be reproduced, copied, or transfo r med to any other forms without permission from au optronics corp. 2. module/panel label information the module/panel (collectively called as the ?product?) will be attached with a label of shipp i ng number which represents the identification of the product at a specific location. refer to the product outline drawing for detailed location and size of the label. the label is composed of a 22-digit serial number and printed with code 39/128 with the following definition: 3. carton label information the packing carton will be attached with a carton label where packing q?ty, auo model name, auo pa rt number, customer part number (optional) and a series of carton number in 13 or 14 digits are printed. the carton number is apparing in the following format: refer to the drawing of packing format for the location and size of the carton label.
version 0.1 page: 24/35 all rights strictly reserved. any portion of this paper shall not be reproduced, copied, or tran sf ormed to any other forms without permission from au optronics corp. j. application note 1. application circuit
version 0.1 page: 25/35 all rights strictly reserved. any portion of this paper shall not be reproduced, copied, or transf o rmed to any other forms without permission from au optronics corp. 2. touch panel pin assign circuit rst_tp iicscl iicsda tp_int 1 1 2 2 3 3 4 4 5 5 6 6 vdd_tp
version 0.1 page: 26/35 all rights strictly reserved. any portion of this paper shall not be reproduced, copied, or transformed t o any other forms without permission from au optronics corp. k. precautions 1. do not twist or bend the module and prevent the unsuitable external force for display module during assem b ly. 2. adopt measures for good heat radiation. be sure to use the module with in the specified temperature. 3. avoid dust or oil mist during assembly. 4. follow the correct power sequence while operating. do not apply the invalid signal, otherwise, it will cause improper shut down and damage the module. 5. less emi: it will be more safety and less noise. 6. please operate module in suitable temperature. the response time & brightness will drift by different temperature. 7. be sure to turn off the power when connecting or disconnecting the circuit. 8. display surface never likes dirt or stains. 9. a dewdrop may lead to destruction. please wipe off any moisture before using module. 10. high temperature and humidity may degrade performance. please do not expose the module to the direct sunlight and so on. 11. acetic acid or chlorine compounds are not friends with display module. 12. static electricity will damage the module, please do not touch the module without any grounded device. 13. do not disassemble and reassemble the module by self. 14. be careful do not touch the rear side directly. 15. no strong vibration or shock. it will cause module broken. 16. storage the modules in suitable environment with regular packing. 17. be careful of injury from a broken display module. 18. please avoid the pressure adding to the surface (front or rear side) of modules, because it will cause the display non-uniformity or other function issue. 19. application under direct sunlight is strongly not recommended as it would result in display performance degradation. 20. it is hig hly recommended that the display is exposed to an even lighting condition to ensure a good display uniformity. 21. elimination of light exposure to the display by applying proper means, e.g. lighting shielding cover is sugge sted when the display is not being used to extend the life performance of the device. 22. heat isolation or heat sink to control uniformity of panel temperature should smaller than 1 23. any performance degradation or display distortion which can be eliminated by display refreshing should not be regarded as a defect
version 0.1 page: 27/35 all rights strictly reserved. any portion of this paper shall not be reproduced, copied, or transformed t o any other forms without permission from au optronics corp. l. touch panel command and register map 1. i2c protocol definition figure 1. standard i 2 c transaction unit the sensor controller supports standard i 2 c protocol with scl up to 400khz. the device address is 0x5 c. the chip also provides both single and sequential access. figure 2 shows the write operation using single or sequential mode. figure 3 also depicts the standard i2c transaction for single for sequential read mechanism. write operation single start device address (w) a mem addr a data[0] a stop sequential start device address (w) a mem addr a data[0] a data[1] a ?? a data[n] a stop figure 2. write operation with single/multiply access read operation single start device address (w) a mem addr a start device address (r) a data[0] na stop sequential start device address (w) a mem addr a start device address (r) a data[0] a ?? a data[n] na stop figure 3. read operation with single/multiply acce b7 b6 b5 b4 b3 b2 b1 b0 ack clock start stop scl sda
version 0.1 page: 28/35 all rights strictly reserved. any portion of this paper shall not be reproduced, copied, or tran sf ormed to any other forms without permission from au optronics corp. suppose the y[3] raw data is 321. if only y[3] is read, user should issue the waveform as following: b 7 b 6 b 5 b 4 b 3 b 2 b 1 b 0 a c k b 7 b 6 b 5 b 4 b 3 b 2 b 1 b 0 a c k b 7 b 6 b 5 b 4 b 3 b 2 b 1 b 0 a c k b 7 b 6 b 5 b 4 b 3 b 2 b 1 b 0 a c k b 7 b 6 b 5 b 4 b 3 b 2 b 1 b 0 n a c k start stop scl sda sta rt device address(0x5c) write memory address(0x06) device address(0x5c) read
version 0.1 page: 29/35 all rights strictly reserved. any portion of this paper shall not be reproduced, copied, or transfor m ed to any other forms without permission from au optronics corp. 2. coordinate register map addr. addr.(hex) description r/w b7 b6 b 5 b 4 b3 b2 b1 b0 0 00 x1 (lsb) r x1[7] x1[6] x1[5] x1[4] x1[3] x1[2] x1[1] x1[0] 1 01 x1 (msb) r 0 0 0 0 0 0 x1[9] x1[8] 2 02 y1 (lsb) r y1[7] y1[6] y1[5] y1[4] y1[3] y1[2] y1[1] y1[0] 3 03 y1 (msb) r 0 0 0 0 0 0 y1[9] y1[8] note: (1) (x1, y1) means the touched point (2) the coordinate of x1 = x1(lsb) + x1(msb)*256, y1 = y1(lsb) + y1(msb)*256 (3) if no touch, (x1, y1)=(0,0) 3. display and touch resolution if screen resolution (blue) is 800x600 , and touch resolution (yellow) is the same (800x600) figure 5 reference of touched point diagram 4. single touch single touching 5. sensitivity addr. addr.(hex) description r/w b7 b 6 b5 b4 b3 b2 b1 b0 111 6f x_sensitivity (threshold) r/w 112 70 y_sensitivity (threshold) r/w x_sensitivity[7:0] y_sensitivity[7:0] note: (1) the default value for x/y sensitivity is 0x14 6. interrupt operation mode this chip should support both polling and interrupt way to get the coordinate and raw data by i2c interf a ce. the figure below depicts the interruption operation.
version 0.1 page: 30/35 all rights strictly reserved. any portion of this paper shall not be reproduced, copied, or transformed to any other forms without permission from au optronics corp. 6.1 interrupt mode setting addr addr.(hex) description r/w b7 b6 b5 b4 b3 b2 b1 b0 113 71 int_setting r/w tp_num[2] tp_num[1] tp_num[0] int_release en_int int_pol int_mode[1] int_mode[0] 114 72 int_width r/w int_width[7:0] note: (1)tp_num[2:0] :tp_n um means how many fingers touched on the panel 000: no finger 001: one finger 010: two fingers others: reserved (2) int_release under touch periodical mode, once the behaviour of finger touched and then left was established, sensing ic will stop to scan until int_release be modified int_release default is 0 (3) en_int 0: disable interrupt 1: enable interrupt (4) int_pol 0: the interrupt is low-active(default) 1: the interrupt is high-active (5) int_ mode[1:0] 00: int assert periodically 01: int assert only when coordinate difference 10: touch indicate(default) 11: int assert only when int_release be modified (6) the default value for int_setting is 0x0c ; int_width is 0x64 6.2 sensing periodical mode (int_mode[1:0] = [0,0]). for sensing periodica l mode, the int_mode[1:0] should be [0,0]. the data must be read y (including coordinate and raw data) before signal ?int? rising. figure 7: interruption with int_r auto-reset 6.3 coordinate compare mode (int_mode[1:0] = [0,1]). the int signal will be asserted while coordinate changes under comparison mode (int_mode[1:0] = [0, 1]).
version 0.1 page: 31/35 all rights strictly reserved. any portion of this paper shall not be reproduced, copied, or transformed to any other forms without permission from au optronics corp. figure 8: interruption flag under coordinate compare mode 6.4 touch indicate mode (int_mode[1:0] = [1,0]). the interrupt will assert when the touch is valid. the interrupt should keep high until the touch is released. int sensing i sensing ii sensing iii read y read y read y sensing iv status touch untouch figure 9: touch indicate mode
version 0.1 page: 32/35 all rights strictly reserved. any portion of this paper shall not be reproduced, copied, or transformed t o any other forms without permission from au optronics corp. combination interrupt with i2c sequential read raw data operation for as following (for int_mode[1 : 0] = [1,0]) b 7 b 6 b 5 b 4 b 3 b 2 b 1 b 0 a c k b 7 b 6 b 5 b 4 b 3 b 2 b 1 b 0 a c k b 7 b 6 b 5 b 4 b 3 b 2 b 1 b 0 a c k n a c k start stop scl sda start int b7 y[0]_lsb b6 y[0]_lsb b1 x[n]_msb b0 x[n]_msb
version 0.1 page: 33/35 all rights strictly reserved. any portion of this paper shall not be reproduced, copied, or transformed t o any other forms without permission from au optronics corp. 7. power mode addr. addr.(hex) description r/w b7 b6 b5 b4 b3 b2 b1 b0 115 73 power mode r/w idle period[3] idle period[2] idle period[1] idle period[0] 0 allow sleep power mode[1] power mode[0] the capacitive sensor controller support 3 steps of power saving: active, sleep, deep sleep, the following section describe relative s can rate and power consumption: the default value is 0x50 active mode: the scan speed will reach 60hz, this mode makes full-speed sensing and data process to provide best performance. the power mode is ?0?. sleep mode: this mode will lower the scan speed down to 10hz. active mode can enter sleep mode automatically or by command. when the system issues a command to change power mode to ?1?, the scan rate will switch to 10hz at next scan cycle. when allow_sleep parameter is given, and user don?t touch the screen longer than idle_period ms. the controller should also enter sleep mode directly and change the scan rate to 10 hz immediately. when user touches the screen in active region , the controller should return to active mode. besides, when system assert a command to change the power mode to ?0?, the scan rate should also rise to 60hz deep sleep mode: when the chip enter deep sleep mode, the scan speed will reduce to 1hz to achieve minimum power consumption. while deep sleep mode, all the registers are accessible during 4 ms, and it start from end of interrupt transition. the figure 13 and figure 14 shows a example to reference. the only way to leave/enter deep sleep mode is change the power mode by specific command. the power mode is defined as ?2?
version 0.1 page: 34/35 all rights strictly reserved. any portion of this paper shall not be reproduced, copied, or transfo r med to any other forms without permission from au optronics corp. figure 10 power mode diagram figure 11 command accessible in deep sleep mode (int_pol=1) figure 12 command accessible in deep sleep mode (int_pol=0)
version 0.1 page: 35/35 all rights strictly reserved. any portion of this paper shall not be reproduced, copied, or transformed t o any other forms without permission from au optronics corp. 8. calibration addr. addr.(hex) description r/w b7 b6 b5 b4 b3 b 2 b 1 b0 120 7 8 c alibration w 0 0 0 0 0 0 1 1 ?calibration? procedure has to do once after assembly set addres s 0x78 as a 0x03 and wait 500ms, ?calibration? procedure will be done 9. power on/off sequence 9.1 power on sequence 9.2 power off sequence

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