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| directfet ? power mosfet description the IRF8304MPBF combines the latest hexfet ? power mosfet silicon technology with the advanced directfet ? packaging to achieve the lowest on-state resistance in a package that has the footprint of a micro-8 and only 0.7 mm profile. the directfet ? package is compatible with existing layout geometries used in power applications, pcb assembly equipment and vapor phase, infra-red or con vection soldering techniques, when application note an-1035 is followed regarding the manufacturing methods and processes. the directfe t ? package allows dual sided cooling to maximize thermal transfer in power systems, improving previous best thermal resistance by 80%. the IRF8304MPBF balances both low resistance and low charge along with ultra low package inductance to reduce both conduction a nd switching losses. the reduced total losses make this product ideal for high efficiency dc-dc converters that power the latest g eneration of processors operating at higher frequencies. the IRF8304MPBF has been optimized for parameters that are critical in synchronous buck operating from 12 volt bus converters including rds(on) and gate charge to minimize losses . applicable directfet outline and substrate outline (see p.7,8 for details) fig 1. typical on-resistance vs. gate voltage fig 2. typical total gate charge vs. gate-to-source voltage click on this section to link to the appropriate technical paper. click on this section to link to the directfet website. surface mounted on 1 in. square cu board, steady state. t c measured with thermocouple mounted to top (drain) of part. repetitive rating; pulse width limited by max. junction temperature. starting t j = 25c, l = 0.75mh, r g = 25 ? , i as = 22a. directfet isometric rohs compliant and halogen free low profile (<0.7 mm) dual sided cooling compatible ultra low package inductance optimized for high frequency switching ideal for cpu core dc-dc converters optimized for both sync.fet and some control fet application low conduction and switching losses compatible with existing surface mount techniques 100% rg tested sq sx st mq mx mt mp 0 5 10 15 20 v gs, gate -to -source voltage (v) 0 1 2 3 4 5 6 t y p i c a l r d s ( o n ) ( m ? ) i d = 28a t j = 25c t j = 125c v dss v gs r ds(on) r ds(on) 30v max 20v max 1.7m ? @ 10v 2.4m ? @ 4.5v absolute maximum ratin g s parameter units v ds drain-to-source voltage v v gs gate-to-source voltage i d @ t a = 25c continuous drain current, v gs @ 10v i d @ t a = 70c continuous drain current, v gs @ 10v a i d @ t c = 25c continuous drain current, v gs @ 10v i dm pulsed drain current e as single pulse avalanche energy mj i ar avalanche current a max. 22 170 220 20 30 28 190 22 0 1020304050607080 q g total gate charge (nc) 0.0 2.0 4.0 6.0 8.0 10.0 12.0 14.0 v g s , g a t e - t o - s o u r c e v o l t a g e ( v ) v ds = 24v v ds = 15v v ds = 6.0v i d = 22a q g tot q gd q gs2 q rr q oss v gs(th) 28nc 7.9nc 4.2nc 39nc 21nc 1.8v ! orderable part number form quantity IRF8304MPBF directfet mx tape and reel 4800 irf8304mtrpbf base part number package type standard pack ! pulse width 400s; duty cycle 2%. static @ t j = 25c (unless otherwise specified) parameter min. typ. max. units bv dss drain-to-source breakdown voltage 30 ??? ??? v ? v dss / ? t j breakdown voltage temp. coefficient ??? 22 ??? mv/c r ds(on) static drain-to-source on-resistance ??? 1.7 2.2 m ? ??? 2.4 3.2 v gs(th) gate threshold voltage 1.35 1.8 2.35 v ? v gs(th) / ? t j gate threshold voltage coefficient ??? -6.1 ??? mv/c i dss drain-to-source leakage current ??? ??? 1.0 a ??? ??? 150 i gss gate-to-source forward leakage ??? ??? 100 na gate-to-source reverse leakage ??? ??? -100 gfs forward transconductance 150 ??? ??? s q g total gate charge ??? 28 42 q gs1 pre-vth gate-to-source charge ??? 8.3 ??? q gs2 post-vth gate-to-source charge ??? 4.2 ??? nc q gd gate-to-drain charge ??? 7.9 ??? q godr gate charge overdrive ??? 7.6 ??? see fig. 15 q sw switch charge (q gs2 + q gd ) ??? 12.1 ??? q oss output charge ??? 21 ??? nc r g gate resistance ??? 1.3 2.2 ? t d(on) turn-on delay time ??? 16 ??? t r rise time ??? 22 ??? ns t d(off) turn-off delay time ??? 19 ??? t f fall time ??? 13 ??? c iss input capacitance ??? 4700 ??? c oss output capacitance ??? 960 ??? pf c rss reverse transfer capacitance ??? 420 ??? diode characteristics parameter min. typ. max. units i s continuous source current ??? ??? 130 (body diode) a i sm pulsed source current ??? ??? 220 (body diode) v sd diode forward voltage ??? 0.77 1.0 v t rr reverse recovery time ??? 24 36 ns q rr reverse recovery charge ??? 39 59 nc di/dt = 260a/s t j = 25c, i s = 22a, v gs = 0v showing the integral reverse p-n junction diode. v gs = 4.5v, i d = 22a v ds = v gs , i d = 100a t j = 25c, i f = 22a v gs = 4.5v i d = 22a v gs = 0v v ds = 15v i d = 22a v dd = 15v, v gs = 4.5v conditions v gs = 0v, i d = 250a reference to 25c, i d = 1ma v gs = 10v, i d = 28a v gs = 20v v gs = -20v v ds = 24v, v gs = 0v v ds = 15v v ds = 24v, v gs = 0v, t j = 125c mosfet symbol r g = 1.8 ? v ds = 15v, i d = 22a conditions see fig. 17 ? = 1.0mhz v ds = 16v, v gs = 0v ! " fig 3. maximum effective transient thermal impedance, junction-to-ambient used double sided cooling , mounting pad with large heatsink. mounted on minimum footprint full size board with metalized back and with small clip heatsink. r is measured at t j of approximately 90c. surface mounted on 1 in. square cu (still air). # $%& with small clip heatsink (still air) mounted on minimum footprint full size board with metalized back and with small clip heatsink (still air) 1e-006 1e-005 0.0001 0.001 0.01 0.1 1 10 100 1000 t 1 , rectangular pulse duration (sec) 0.001 0.01 0.1 1 10 100 t h e r m a l r e s p o n s e ( z t h j a ) 0.20 0.10 d = 0.50 0.02 0.01 0.05 single pulse ( thermal response ) notes: 1. duty factor d = t1/t2 2. peak tj = p dm x zthja + tc ri (c/w) i (sec) 1.3216 0.000312 5.1963 0.040534 21.489 1.0378 17.005 46 j j 1 1 2 2 3 3 r 1 r 1 r 2 r 2 r 3 r 3 ci= i / ri ci= i / ri a a 4 4 r 4 r 4 absolute maximum ratin g s parameter units p d @t a = 25c power dissipation w p d @t a = 70c power dissipation p d @t c = 25c power dissipation t p peak soldering temperature c t j operating junction and t stg storage temperature range thermal resistance parameter typ. max. units r ja junction-to-ambient ??? 45 r ja junction-to-ambient 12.5 ??? r ja junction-to-ambient 20 ??? c/w r jc junction-to-case ??? 1.2 r j-pcb junction-to-pcb mounted 1.0 ??? linear derating factor w/c 0.022 270 -40 to + 150 max. 100 2.8 1.8 ! fig 5. typical output characteristics fig 4. typical output characteristics fig 6. typical transfer characteristics fig 7. normalized on-resistance vs. temperature fig 8. typical capacitance vs.drain-to-source voltage fig 9. typical on-resistance vs. drain current and gate voltage 0.1 1 10 100 v ds , drain-to-source voltage (v) 0.01 0.1 1 10 100 1000 i d , d r a i n - t o - s o u r c e c u r r e n t ( a ) vgs top 10v 5.0v 4.5v 3.5v 3.0v 2.7v 2.5v bottom 2.3v 60s pulse width tj = 25c 2.3v 0.1 1 10 100 v ds , drain-to-source voltage (v) 1 10 100 1000 i d , d r a i n - t o - s o u r c e c u r r e n t ( a ) 2.3v 60s pulse width tj = 150c vgs top 10v 5.0v 4.5v 3.5v 3.0v 2.7v 2.5v bottom 2.3v -60 -40 -20 0 20 40 60 80 100 120 140 160 t j , junction temperature (c) 0.5 1.0 1.5 2.0 t y p i c a l r d s ( o n ) ( n o r m a l i z e d ) i d = 28a v gs = 10v v gs = 4.5v 1 10 100 v ds , drain-to-source voltage (v) 100 1000 10000 100000 c , c a p a c i t a n c e ( p f ) v gs = 0v, f = 1 mhz c iss = c gs + c gd , c ds shorted c rss = c gd c oss = c ds + c gd c oss c rss c iss 0 50 100 150 200 i d , drain current (a) 1 2 3 4 5 6 7 t y p i c a l r d s ( o n ) ( m ? ) t j = 25c vgs = 3.5v vgs = 4.0v vgs = 4.5v vgs = 5.0v vgs = 8.0v vgs = 10v 1.0 1.5 2.0 2.5 3.0 3.5 4.0 v gs , gate-to-source voltage (v) 0.1 1 10 100 1000 i d , d r a i n - t o - s o u r c e c u r r e n t ( a ) t j = 150c t j = 25c t j = -40c v ds = 15v 60s pulse width ! ' fig 13. typical threshold voltage vs. junction temperature fig 12. maximum drain current vs. case temperature fig 10. typical source-drain diode forward voltage fig11. maximum safe operating area fig 14. maximum avalanche energy vs. drain current 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1 v sd , source-to-drain voltage (v) 0 1 10 100 1000 i s d , r e v e r s e d r a i n c u r r e n t ( a ) t j = 150c t j = 25c t j = -40c v gs = 0v 25 50 75 100 125 150 t c , case temperature (c) 0 20 40 60 80 100 120 140 160 180 i d , d r a i n c u r r e n t ( a ) -75 -50 -25 0 25 50 75 100 125 150 t j , temperature ( c ) 0.5 1.0 1.5 2.0 2.5 3.0 t y p i c a l v g s ( t h ) g a t e t h r e s h o l d v o l t a g e ( v ) i d = 100a i d = 150a i d = 250a i d = 1.0ma i d = 1.0a 0.01 0.10 1.00 10.00 100.00 v ds , drain-to-source voltage (v) 0.01 0.1 1 10 100 1000 i d , d r a i n - t o - s o u r c e c u r r e n t ( a ) operation in this area limited by r ds (on) t a = 25c t j = 150c single pulse 100sec 1msec 10msec dc 25 50 75 100 125 150 starting t j , junction temperature (c) 0 100 200 300 400 500 600 700 800 e a s , s i n g l e p u l s e a v a l a n c h e e n e r g y ( m j ) i d top 2.1a 2.8a bottom 22a ! ( fig 15a. gate charge test circuit fig 15b. gate charge waveform fig 16b. unclamped inductive waveforms t p v (br)dss i as fig 16a. unclamped inductive test circuit fig 17b. switching time waveforms fig 17a. switching time test circuit r g i as 0.01 ? t p d.u.t l v ds + - v dd driver a 15v 20v vds vgs id vgs(th) qgs1 qgs2 qgd qgodr 1k vcc dut 0 l s 20k v ds 90% 10% v gs t d(on) t r t d(off) t f 1 0.1 % + - ! fig 18. ) ) * % for hexfet power mosfets ? ? ? p.w. period di/dt diode recovery dv/dt ripple 5% body diode forward drop re-applied voltage reverse recovery current body diode forward current v gs =10v v dd i sd driver gate drive d.u.t. i sd waveform d.u.t. v ds waveform inductor curent d = p. w . period +++ +++ + - + + + - - - ? !" # $ ? ! % &'& & ? # (( ? &'& & ) ! ' ++ + + ++ ! $ ,* -- ./0 "' 1 1 ,* * 1 g = gate d = drain s = source d d d d g s s ! 2 directfet part marking $ ,* -- ./0 "' 1 1 ,* * 1 code a b c d e f g h j k l m p 0.017 0.028 0.007 0.040 0.095 0.156 0.028 0.018 0.028 max 0.250 0.38 0.59 0.08 0.88 2.28 3.85 0.68 0.35 0.68 min 6.25 4.80 0.42 0.70 0.17 1.02 2.42 3.95 0.72 0.45 0.72 max 6.35 5.05 0.015 0.023 0.003 0.090 0.035 0.152 0.027 0.027 0.014 min 0.189 0.246 metric imperial dimensions 1.38 1.42 0.80 0.84 0.056 0.054 0.033 0.031 r 0.03 0.08 0.001 0.003 dimensions are shown in millimeters (inches) 0.199 gate marking part number logo batch number date code line above the last character of the date code indicates "lead-free" note: for the most current drawing please refer to ir website at http://www.irf.com/package/ ! 3 directfet ? tape & reel dimension (showing component orientation). loaded tape feed direction note: controlling dimensions in mm code a b c d e f g h imperial min 0.311 0.154 0.469 0.215 0.201 0.256 0.059 0.059 max 8.10 4.10 12.30 5.55 5.30 6.70 n.c 1.60 min 7.90 3.90 11.90 5.45 5.10 6.50 1.50 1.50 metric dimensions max 0.319 0.161 0.484 0.219 0.209 0.264 n.c 0.063 ! "# ! " # # $ %&&''' (&'$ ) & date comments 2/17/2014 ? added the orgering information table, on page 1. ? updated data sheet with new ir corporate template. revision history note: controlling dimensions in mm std reel quantity is 4800 parts. (ordered as irf8304mtrpbf). for 1000 parts on 7" reel, order irf8304mtr1pbf code min max min max a 330 n.c 12.992 n.c b 20.2 n.c 0.795 n.c c 12.8 13.2 0.504 0.520 d 1.5 n.c 0.059 n.c e 100.0 n.c 3.937 n.c f n.c 18.4 n.c 0.724 g 12.4 14.4 0.488 0.567 h 11.9 15.4 0.469 0.606 metric imperial standard option ( qty 4800 ) reel dimensions |
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