cystech electronics corp. spec. no. : c472fp issued date : 2012.02.24 revised date : page no. : 1/4 MUR2060FP cystek product specification 20amp. ultrafast plastic rectifiers i f(av) 2 10a MUR2060FP v rrm 600v i fsm 120a trr 60ns tj 175 c features ? 175 operating junction temperature v f(max) 1.5v ? low leakage current ? low switching loss, high efficiency ? high forward surge capability ? insulating package, in sulating voltage=2500v ac ? high temperature soldering guaranteed : 260 /40s, 0.25?(6.35mm) from case ? pb-free lead plating package mechanical data ? case: to-220fp molded plastic ? mounting position: any ? weight: 2.2 grams, 0.078 ounce approximately ? terminals: pure tin plated, so lderable per mil-std-750 method 2026 ? epoxy: ul 94v-0 rate flame retardant ? mounting torque: 5 in.-lb. maximum equivalent circuit outline to-220fp MUR2060FP a k a
cystech electronics corp. spec. no. : c472fp issued date : 2012.02.24 revised date : page no. : 2/4 MUR2060FP cystek product specification maximum ratings and electrical ch aracteristics (per diode leg) ( rating at 25 c ambient temperature unless otherwise sp ecified. single phase, half wave, 60hz, resistive or inductive loa d. for capacitive load, derate current by 20%.) parameter symbol min. typ. max. units maximum recurrent peak reverse voltage v rrm 600 v maximum rms voltage v rms 420 v maximum dc blocking voltage v dc 600 v i f =10a, t c =25 c 1.25 1.5 i f =10a, t c =150 c 1.06 1.3 i f =20a, t c =25 c 1.42 1.8 maximum instantaneous forward voltage i f =20a, t c =150 c v f 1.29 1.6 v per diode 10 maximum average forward rectified current @ t c =100 per device i f(av) 20 a non-repetitive peak forward surge current @ 8.3ms single half sine wave superimposed on rated load (jedec method) i fsm 120 a v r =600 v, t c =25 10 maximum instantaneous reverse current at v r =600 v, t c =125 i r 100 a maximum reverse recovery time i f =1a, v r =30v, di f /dt=100a/ s trr 60 ns typical junction capacitance @ f=1mhz and applied 4v reverse voltage c j 80 pf isolation voltage from terminal to heatsink, t=1minute v ac 2500 v storage temperature range t stg -65 +175 operating junction temperature range t j -65 +175 thermal data parameter symbol value unit maximum thermal resistance, junction-to-case r th,j-c 4 c/w maximum thermal resistance, junction-to-ambient r th,j-a 60 c/w lead temperature for soldering purposes : 1/8? from case for 5 seconds t l 300 c ordering information device package shipping MUR2060FP to-220fp (rohs compliant package) 50 pcs / tube, 40 tubes/box
cystech electronics corp. spec. no. : c472fp issued date : 2012.02.24 revised date : page no. : 3/4 MUR2060FP cystek product specification typical characteristics forward current derating curve 0 2 4 6 8 10 12 0 25 50 75 100 125 150 175 case temperature---t c () average forward current---io(a) resistive or inductive load per leg forward current vs forward voltage 1 10 100 1000 10000 100000 0 0.2 0.4 0.6 0.8 1 1.2 1.4 forward voltage---v f (v) instantaneous forward current---i f (ma) pulse width=300s, 1% duty cycle tj=25 tj=150 per leg reverse leakage current vs reverse voltage 0.001 0.01 0.1 1 10 0 100 200 300 400 500 600 reverse voltage---v r (v) reverse leakage current---i r (a) tj=75 tj=25 tj=125 per leg junction capacitance vs reverse voltage 10 100 1000 0.1 1 10 100 reverse voltage---v r (v) junction capacitance---c j (pf) tj=25, f=1.0mhz per leg
cystech electronics corp. spec. no. : c472fp issued date : 2012.02.24 revised date : page no. : 4/4 MUR2060FP cystek product specification to-220fp dimension *typical marking: style: pin 1.anode 2.cathode 3.anode 3-lead to-220fp plastic package cystek package code: fp date code device name inches millimeters inches millimeters dim min. max. min. max. dim min. max. min. max. a 0.171 0.183 4.35 4.65 g 0.246 0.258 6.25 6.55 a1 0.051 ref 1.300 ref h 0.138 ref 3.50 ref a2 0.112 0.124 2.85 3.15 h1 0.055 ref 1.40 ref a3 0.102 0.110 2.60 2.80 h2 0.256 0.272 6.50 6.90 b 0.020 0.030 0.50 0.75 j 0.031 ref 0.80 ref b1 0.031 0.041 0.80 1.05 k 0.020 0.50 ref b2 0.047 ref 1.20 ref l 1.102 1.118 28.00 28.40 c 0.020 0.030 0.500 0.750 l1 0.043 0.051 1.10 1.30 d 0.396 0.404 10.06 10.26 l2 0.036 0.043 0.92 1.08 e 0.583 0.598 14.80 15.20 m 0.067 ref 1.70 ref e 0.100 * 2.54* n 0.012 ref 0.30 ref f 0.106 ref 2.70 ref notes: 1.controlling dimension: millimeters. 2.maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 3.if there is any question with packing specification or packing method, please c ontact your local cystek sales office. material: ? lead: pure tin plated. ? mold compound: epoxy resin family, flammability solid burning class: ul94v-0. important notice: ? all rights are reserved. reproduction in whole or in part is prohibited without the prior written approval of cystek. ? cystek reserves the right to make changes to its products without notice. ? cystek semiconductor products are not warranted to be suitable for use in life-support applications, or systems. ? cystek assumes no liability for any consequence of customer pr oduct design, infringement of pat ents, or application assistance .
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