6 thin film bga delay lines us patent 5,365,203 6,127,906 bl1l series 1.0 description 2.0 mechanical 3.0 electrical 4.0 part number these delay lines offer the same excellent frequency performance as the gl delay lines but come in a solder bump configuration that takes up less board space than the gl series. as with all of tft?s delay lines, these feature stripline conductors on ceramic for high speed, high stability performance. dimension mm schematic time delay height (h) code 0.1 - 0.8 ns 1.05 max p 0.9 - 1.7 ns 1.65 max q 1.8 - 2.6 ns 2.25 max r 2.7 - 3.5 ns 2.85 max s manufacturer(s) of the products described on this page are indicated by their respective logos. -please refer to page 37 for land pattern bl 1l 5 r t 250 s t1 serial code time delay (250 = 2.5ns) solder bump height code impedance (5 = 50 ohm) product designator circuit/element qualifier packaging (t = tape, 1 = 100) schematic 6.40 0.10 1.27 0.07 1.27 0.07 3.81 1 2 0.711 (28 mil) dia. 10/90 sn/pb sphere time delay height (h) code 0.10 to 0.20ns 1.80 max w 0.30 to 0.50ns 2.40 max x 0.60 to 0.80ns 3.00 max y 0.80 max 5.10 0.10 1.27 1.27 1.27 1.27 type bl1l (p, q, r, s) bl1l (w, x, y) time delay 0.1- 3.5 ns 0.10 - 0.80 ns time delay increment 0.1 ns step to 3.5 ns 0.1 ns step to 0.80 ns rated current 100 ma rise/fall time 200 ps/ns insulation resistance >100 mohm 50v dc resistance <1.0 ohm/ns max temp. coefficient of td 0 to +150 ppm/c rated voltage 100 vdc (1 min) time delay tolerance 0.05 ns operating temperature -40 to + 85 characteristic impedance 50 5 ohm storage temperature -55 to +125c
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