 |
|
| If you can't view the Datasheet, Please click here to try to view without PDF Reader . |
|
|
|
| If you can't view the Datasheet, Please click here to try to view without PDF Reader . |
|
|
| Datasheet File OCR Text: |
| gross die per 5 inch wafer 2,260 process CPD34X schottky rectifier 10 amp schottky rectifier chip geometry process details die size 85 x 85 mils die thickness 5.9 mils 0.8 mils anode bonding pad area 78 x 78 mils top side metalization al ? 30,000? back side metalization ti/ni/au - 1,600?/5,550?/1,500? principal device type cshd10-60 www.centralsemi.com r0 (17-october 2011)
process CPD34X typical electrical characteristics www.centralsemi.com r0 (17-october 2011) |
Price & Availability of CPD34X
 |
|
|
|
|
All Rights Reserved © IC-ON-LINE 2003 - 2022 |
| [Add Bookmark] [Contact Us] [Link exchange] [Privacy policy] |
|
Mirror Sites : [www.datasheet.hk]
[www.maxim4u.com] [www.ic-on-line.cn]
[www.ic-on-line.com] [www.ic-on-line.net]
[www.alldatasheet.com.cn]
[www.gdcy.com]
[www.gdcy.net] |