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| Datasheet File OCR Text: |
| geometry process details principal device types cmdsh05-4 cmlsh05-4 cmpsh05-4 gross die per 5 inch wafer 42,213 process CPD94X schottky diode 0.5 amp schottky diode chip die size 20 x 20 mils die thickness 5.9 mils anode bonding pad area 16 x 16 mils top side metalization al - 20,000? back side metalization au - 12,000? www.centralsemi.com r0 (19-july 2010)
process CPD94X typical electrical characteristics www.centralsemi.com r0 (19-july 2010) |
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