surface mount sockets terminals type -638 type -647 molded only 1 f g a xxx 638 x footprint dash# if applicable terminal plating g - gold t - tin terminal type see left body type f - fr-4 m - molded a ax = standard adapter (bga body + .079(2mm)) = extraction slot adapter (bga body + .157(4mm)) how to order pitch b = .059 (1.5mm) pitch g = .050 (1.27mm) pitch number of pins 96 - 736 see bga footprint pages rev. 14-a page 155 inch/(mm) .193 (4.90) .018/(0.45) dia. .031/(0.78) dia. c' sink .018/(0.45) dia. .182 (4.62) b all grid array socketing system bga adapters features: terminals: plating: body material: ? ? ? ? ? soldering bga to adapter subjects bga to less thermal stress than soldering bga to a mother board due to the adapters lower mass. countersink in head of pin allows easy positioning of bga onto adapter. head above insulator in adapter allows visual inspection for solder shorts in both x & y axis. custom adapters available for heat sink attachment. extraction slot for tool #5082-2 shown on page 163. brass - copper alloy 360, astm-b-16 terminal tl: tin lead over nickel terminal g: gold over nickel fr-4 glass epoxy, u.l. rated 94v-o b.g.a. bga body + .157/(4.0) bga body + .079/(2.0) .079/(2.0) detail a b.g.a. .039/(1.0) detail c extraction slot adapter (mates with extraction slot & guide box socket) standard adapter (mates with standard socket) 5 energy way, p .o. box 1019, west warwick, ri 02893 usa tel. 800-424-9850 / 401-823-5200 ? fax 401-823-8723 ? email advintcorp@aol.com ? internet advanced interconnections ? ? after soldering pcb ball grid array bga adapter solder joints bga adapter socket before soldering bga bga adapter bga adapter socket pcb fr-4 only
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