cys tech electronics corp. s pec. no. : c338 sh issued date : 20 09.04.03 revised date :20 10.12.10 page no. : 1/4 csod12 0-1 1 0 0 s h c y s t ek product s pecification 1.0amp. surface mount schottky barrier diodes csod120-1100sh series features ? for surface mounted applications. ? for use in low voltage, high frequency inverters, free wheeling, and polarity protection applications ? plastic material used carries underwriters laboratory flammability classification 94v-0 ? low leakage current ? high sur g e capability ? high temperature soldering: 250 c/10 seconds at terminals ? exceeds environmental standards of mil-s-19500/228 ? rohs compliant package mechanical data ? case: molded plastic, jedec sod-123. ? terminals: pure tin plated, solderable per mil-std-202 method 208 ? polarity: indicated by cathode band. ? weight: 0.04 gram approximately maximum ratings and electrical characteristics ( rating at 25 c ambient temperature unless otherwise specified.) type parameter symbol csod120 csod140 csod160 csod1100 units repetitive peak reverse voltage v rrm 20 40 60 100 v maximum rms voltage v rms 14 28 42 70 v maximum dc blocking voltage v r 20 40 60 100 v maximum instantaneous forward voltage, i f =1a (note 1) v f 0.45 0.55 0.66 0.83 v average forward rectified current i o 1 a peak forward sur g e current @8.3m s single half sine wave superimposed on rated load (jedec method) i fsm 30 a maximum dc reverse current v r =v rrm ,t j =25 (note 1) v r =v rrm ,t j =125 (note 1) i r 0.3 10 ma ma maxi m u m ther m a l r esist ance, junction to ambient r th,ja 250(typ) /w diode junction capacitance @ f=1mhz and applied 5v reverse voltage c d 45 (typ) pf storage temperature range tstg -65 ~ +175 operating temperature range t j -50 ~ +150 notes : 1.pulse test, pulse width=300 sec, 2% duty cycle http://
cys tech electronics corp. s pec. no. : c338 sh issued date : 20 09.04.03 revised date :20 10.12.10 page no. : 2/4 csod12 0-1 1 0 0 s h c y s t ek product s pecification characteristic curves fi g. 1 fo r w a r d c ur r e nt d e r a t i ng c u r v e 0 0. 2 0. 4 0. 6 0. 8 1 1. 2 0 2 5 50 75 10 0 125 150 175 2 00 c a s e t e m p e ra t u re ---t c ( ) a v e ra g e f o rw a r d c u rre n t ---i o (a ) r es i s t i v e o r i n d u ct i v e l o a d 0.375"(9.5mm) lead length f i g . 2 m a x i mu m n o n - r e p e t i t i v e p e a k fo r w a rd s u r g e c urr e n t 0 5 10 15 20 25 30 11 0 n u m b er o f c y cl es at 6 0 h z p e a k f or w a r d s ur ge c ur r e nt - - - i fs m (a) 1 0 0 fi g 3 . for w a r d c h a r a c t e r i s t i c s 10 100 1000 1 0000 10 0000 0 0. 2 0. 4 0. 6 0 . 8 1 1. 2 1. 4 f o r w a rd v o l t a g e ---v f (v ) i n s t a nt a ne ous f o r w a r d c ur r e nt - - - i f ( m a ) p u l se w i d t h = 3 0 0 s, 1 % d u ty c y c le fi g. 4 ty pi c a l r e v e r s e c ha r a c t e r i s t i c s 0.1 1 10 100 1000 1000 0 0 1 0 2 03 04 0 5 06 0 r e v e rs e v o l t a g e ---v r (v ) r e v e r s e le ak ag e c u r r en t - - - i r ( a ) tj=75 tj=25 tj=125 fi g . 5 ty pi c a l j unc t i o n c a pa c i t a nc e 10 100 1 000 0. 1 1 10 1 00 r ev er s e v o l t ag e - - - v r (v) j unc t i o n c a pa c i t a nc e - - - c j (p f ) t j = 25 , f = 1. 0mh z vsig=50mvp-p fi g. 6 ty pi c a l t r a ns i e nt t he r m a l i m pe d a nc e 0.1 1 10 100 0. 01 0. 1 1 10 1 00 p u l s e d u ra t i o n ---t (s ) t r an s i e n t t h er m al i m p e d an ce( / w )
cys tech electronics corp. s pec. no. : c338 sh issued date : 20 09.04.03 revised date :20 10.12.10 page no. : 3/4 csod12 0-1 1 0 0 s h c y s t ek product s pecification recommended wave soldering condition product peak temperature soldering time pb-free devices 260 +0/-5 c 5 +1/-1 seconds recommended temperature profile for ir reflow profile feature sn-pb eutectic assembly pb-free assembly average ramp-up rate (tsmax to tp) 3 c/second max. 3 c/second max. preheat ? temperature min(t s min) ? temperature max(t s max) ? time(ts min to ts max ) 100 c 150 c 60-120 seconds 150 c 200 c 60-180 seconds time maintained above: ? temperature (t l ) ? time (t l ) 183 c 60-150 seconds 217 c 60-150 seconds peak temperature(t p ) 240 +0/-5 c 260 +0/-5 c time within 5 c of actual peak temperature(tp) 10-30 seconds 20-40 seconds ramp down rate 6 c/second max. 6 c/second max. t i me 25 c to peak temperature 6 minutes max. 8 minutes max. note : all temperature s refer to top s ide of t he p a cka g e , measure d on the p a cka ge body surfa c e.
cys tech electronics corp. s pec. no. : c338 sh issued date : 20 09.04.03 revised date :20 10.12.10 page no. : 4/4 csod12 0-1 1 0 0 s h c y s t ek product s pecification sod-123 dimension marking: device csod120 csod140 marking sj sl device csod160 csod1100 marking sn sp xx 2-l ead so d-123 pla s tic surface mounted package cystek package code: sh style: pin 1.cathode 2.anode millimeters inches millimeters inches dim min. max. min. max. dim min. max. min. max. a 1.050 1.250 0.041 0.049 e 2.600 2.800 0.102 0.110 a1 0.000 0.100 0.000 0.004 e1 3.550 3.850 0.140 0.152 a2 1.050 1.115 0.041 0.045 l 0.500 ref 0.020 ref b 0.450 0.650 0.018 0.026 l1 0.250 0.450 0.010 0.018 c 0.080 0.150 0.003 0.006 0 8 0 8 d 1.500 1.700 0.059 0.067 notes: 1.controlling dimension : millimeters. 2.lead thickness specified per l/f drawing with solder plating. 3.if there is any question with pa cking specification or packing me thod, please contact your local cystek sales office. material: ? lead: pure tin plated. ? mold compound: epoxy resin family, flammability solid burning class: ul94v-0. im portan t n otice : ? all rights are reserved. reproduction in whole or in part is prohibited without the prior written approval of cystek. ? cystek reserves the right to make changes to its products without notice. ? cystek semiconductor products are not warranted to be suitable for use in life-support applications, or systems. ? cystek assumes no liability for any consequence of customer pr oduct design, infringement of pat ents, or application assistance .
|
