Part Number Hot Search : 
07PBF CA3094AH C1403 DGBGQ B0000 2SA95 74ACT 1N5396
Product Description
Full Text Search
 

To Download TGA2620-15 Datasheet File

  If you can't view the Datasheet, Please click here to try to view without PDF Reader .  
 
 


  Datasheet File OCR Text:
  t ga2 620 16 C 18 ghz driver amplifier preliminary datasheet: rev - 07 - 2 6 - 1 4 - 1 of 13 - disclaimer: subject to change without notice ? 2014 triquint www.triquint.com p ad configuration p ad no. symbol 1 rf in 2 v g 3 v d 4 rf out applications ? commercial and military ra dar ? communications general description triquints tga2620 is a ku - band mmic driver a mplifier fabricated on triquint s 0.1 5um ga as phemt production process . operating from 16 - 1 8ghz, the tga2620 provides more than 19 dbm saturated output power , 18 dbm p1db and more than 20 db small signal gain . fully matched to 50 ohms with integrated dc blocking capacitors on both i/o ports allows for simple system integration. the tg a2620 is an ideal choice for general purpose amplification across both commercial and military ku - band platforms. lead - free and rohs compliant. evaluation boards are available upon request . ordering information part eccn description tga2 620 ear99 16 C 1 8 ghz driver amplifier product features ? frequency range: 16 C 18 ghz ? p sat : 19 dbm ? p1db : 18 dbm ? small signal gain: 20 db ? input return loss: 20 db ? output return loss: 2 5 db ? bias : v d = 6 v, i dq = 3 0 ma , v g = - 0 . 6 v typical ? chip dimensions: 1.14 x 1.24 x 0.10 mm functional block diagram 1 4 3 2
t ga2 620 16 C 18 ghz driver amplifier preliminary datasheet: rev - 07 - 2 6 - 1 4 - 2 of 13 - disclaimer: subject to change without notice ? 2014 triquint www.triquint.com absolute maximum ratings parameter value drain voltage (v d ) 6 .5 v gate voltage range (v g ) - 2 to 0v drain current (i d ) 65 ma gate current (i g ) - 0.5 to 5 ma power dissipation (p diss ) , 85c 0.3 w input power (p in ) , cw, 50, v d =6 v, i dq =3 0ma . 15 dbm channel t emperature (t ch ) 150 c mounting temperature (30 seconds) 320 c storage temperature - 55 to 150 c operation of this device outside the parameter ranges given above may cause permanent damage. these are stress ratings only, and functional operation of the device at these conditions is not implied. recommended operating conditions parameter value drain voltage (v d ) 6 v drain current (i d q ) 3 0 m a gate voltage (v g ) - 0 .6 v (typ.) electrical specifications are measured at specified test conditions. specifications are not guaranteed over all recommended operating conditions. electrical specifications test conditions unless otherwise noted: 25c , v d = 6 v, i d q = 3 0 m a, v g = - 0 .6 v typical , cw parameter min typical max units operational frequency range 1 6 1 8 ghz small signal gain 20 db input return loss 20 db output return loss 25 db output power ( p sat ) 19 db m power added efficiency ( p sat ) 2 6 % small signal gain temperature coefficient - 0.0 2 db/ c
t ga2 620 16 C 18 ghz driver amplifier preliminary datasheet: rev - 07 - 2 6 - 1 4 - 3 of 13 - disclaimer: subject to change without notice ? 2014 triquint www.triquint.com thermal and reliability information parameter test conditions value units thermal resistance ( jc ) (1) t base = 85 c v d = 6 v, i dq = 3 0ma, i d _drive = 55ma , cw p in = 5 dbm, p out = 18 .5dbm, p diss = 260mw 204 oc/w channel temperature (t ch ) (under rf drive) 138 c median lifetime (t m ) 4.1 x 10^ 6 hrs notes: 1. thermal resistance measured to back of c arrier plate. mmic mounted on 2 0 mils cumo carrier using 0.8 mil diemat 6030 or ausn. median lifetime test conditions: v d = 6.5v; failure criteria = 10% reduction in i d_max 1e+03 1e+04 1e+05 1e+06 1e+07 1e+08 1e+09 1e+10 1e+11 1e+12 1e+13 1e+14 1e+15 25 50 75 100 125 150 175 200 median lifetime, t m (hours) channel temperature, t ch ( c) median lifetime vs. channel temperature fet5
t ga2 620 16 C 18 ghz driver amplifier preliminary datasheet: rev - 07 - 2 6 - 1 4 - 4 of 13 - disclaimer: subject to change without notice ? 2014 triquint www.triquint.com typical performance typical performance (small signal) 15 16 17 18 19 20 21 22 23 14 15 16 17 18 19 20 s21 (db) frequency (ghz) gain vs. frequency vs. i d 25ma 30ma 35ma temp. = +25 c v d = 6v 15 16 17 18 19 20 21 22 23 14 15 16 17 18 19 20 s21 (db) frequency (ghz) gain vs. frequency vs. temperature -50c +25c +85c v d = 6v, i dq = 30ma -30 -25 -20 -15 -10 -5 0 14 15 16 17 18 19 20 s11 (db) frequency (ghz) input return loss vs. freq. vs. temp. -50c +25c +85c v d = 6v, i dq = 30ma -30 -25 -20 -15 -10 -5 0 14 15 16 17 18 19 20 s22 (db) frequency (ghz) output return loss vs. freq. vs. temp. -50c +25c +85c v d = 6v, i dq = 30ma
t ga2 620 16 C 18 ghz driver amplifier preliminary datasheet: rev - 07 - 2 6 - 1 4 - 5 of 13 - disclaimer: subject to change without notice ? 2014 triquint www.triquint.com typical performance (large signal ) 0 3 6 9 12 15 18 21 24 15 16 17 18 19 20 p out (dbm) frequency (ghz) output power vs. frequency vs. temp. +25 c +85 c p in = 2dbm v d = 6v, i dq = 30ma 0 5 10 15 20 25 30 35 40 15 16 17 18 19 20 pae (%) frequency (ghz) pae vs. frequency vs. temp. +25 c +85 c p in = 2dbm v d = 6v, i dq = 30ma 13 14 15 16 17 18 19 20 21 15 16 17 18 19 20 p out (dbm) frequency (ghz) p out vs. frequency vs. i dq 6v25ma 6v30ma 6v35ma p in = 2dbm temp. = +25 c 0 3 6 9 12 15 18 21 24 15 16 17 18 19 20 p out (dbm) frequency (ghz) p out vs. frequency vs. p in - 2dbm 2dbm 5dbm v d = 6v, i dq = 30ma temp. = +25 c 13 14 15 16 17 18 19 20 21 15 16 17 18 19 20 p out (dbm) frequency (ghz) p out vs. frequency vs. v d 6v30ma 5v30ma p in = 2dbm temp. = +25 c 0 3 6 9 12 15 18 21 24 15 16 17 18 19 20 p out (dbm) frequency (ghz) p out vs. frequency p3db p1db v d = 6v, i dq = 30ma temp. = +25 c
t ga2 620 16 C 18 ghz driver amplifier preliminary datasheet: rev - 07 - 2 6 - 1 4 - 6 of 13 - disclaimer: subject to change without notice ? 2014 triquint www.triquint.com typical performance ( large signal) 7 9 11 13 15 17 19 21 -10 -8 -6 -4 -2 0 2 4 6 p out (dbm) input power (dbm) output power vs. p in vs. frequency 16ghz 17ghz 18ghz v d = 6v, i dq = 30ma temp. = +25 c 0 5 10 15 20 25 30 35 -10 -8 -6 -4 -2 0 2 4 6 pae (%) input power (dbm) pae vs. input power vs. frequency 16ghz 17ghz 18ghz v d = 6v, i dq = 30ma temp. = +25 c 20 25 30 35 40 45 50 55 60 65 -10 -8 -6 -4 -2 0 2 4 6 drain current ma) input power (dbm) drain current vs. p in vs. frequency 16ghz 17ghz 18ghz v d = 6v, i dq = 30ma temp. = +25 c 0 3 6 9 12 15 18 21 24 15 16 17 18 19 20 gain (db) frequency (ghz) power gain vs. frequency vs. p in v d = 6v, i dq = 30ma temp. = +25 c - 10dbm - 2dbm 2dbm 5 dbm 14 15 16 17 18 19 20 21 22 -10 -8 -6 -4 -2 0 2 4 6 gain (db) input power (dbm) gain vs. input power vs. frequency 16ghz 17ghz 18ghz v d = 6v, i dq = 30ma temp. = +25 c
t ga2 620 16 C 18 ghz driver amplifier preliminary datasheet: rev - 07 - 2 6 - 1 4 - 7 of 13 - disclaimer: subject to change without notice ? 2014 triquint www.triquint.com typical performance (linearity) -60 -50 -40 -30 -20 -10 0 -2 0 2 4 6 8 10 12 14 im3 (dbc) output power per tone (dbm) im3 vs. output power vs. temperature v d = 6v, i dq = 30ma, 17ghz, 10mhz tone spacing +25 c +85 c -80 -70 -60 -50 -40 -30 -20 -10 0 -2 0 2 4 6 8 10 12 14 im5 (dbc) output power per tone (dbm) im5 vs. output power vs. temperature v d = 6v, i dq = 30ma, 17ghz, 10mhz tone spacing +25 c +85 c -60 -50 -40 -30 -20 -10 0 -20 -17 -14 -11 -8 -5 im3 (dbc) input power per tone (dbm) im3 vs. input power vs. freq. v d = 6v, i dq = 30ma, 10mhz tone spacing 17ghz 18ghz 16ghz -80 -70 -60 -50 -40 -30 -20 -10 0 -20 -17 -14 -11 -8 -5 im5 (dbc) input power per tone (dbm) im5 vs. input power vs. freq. v d = 6v, i dq = 30ma, 10mhz tone spacing 17ghz 18ghz 16ghz 0 5 10 15 20 25 30 15 16 17 18 19 20 otoi (dbm) frequency (ghz) otoi vs. frequency vs. temperature p in = - 10dbm, 10mhz tone spacing +25 c +85 c v d = 6v, i dq = 30ma -4 -2 0 2 4 6 8 15 16 17 18 19 20 itoi (dbm) frequency (ghz) itoi vs. frequency vs. temperature p in = - 10dbm, 10mhz tone spacing +25 c +85 c v d = 6v, i dq = 30ma
t ga2 620 16 C 18 ghz driver amplifier preliminary datasheet: rev - 07 - 2 6 - 1 4 - 8 of 13 - disclaimer: subject to change without notice ? 2014 triquint www.triquint.com typical performance (harmonics ) -60 -50 -40 -30 -20 -10 0 8 10 12 14 16 18 20 2f 0 output power (dbc) output power (dbm) 2 nd harmonic vs. output power vs. temp. v d = 6v, i dq = 30ma freq. = 16ghz +85c +25c -60 -50 -40 -30 -20 -10 0 -10 -8 -6 -4 -2 0 2 4 2f 0 output power (dbc) input power (dbm) 2 nd harmonic vs. input power vs. temp. v d = 6v, i dq = 30ma freq. = 16ghz +85c +25c -60 -50 -40 -30 -20 -10 0 -10 -8 -6 -4 -2 0 2 4 3f 0 output power (dbc) input power (dbm) 3 rd harmonic vs. input power vs. temp. v d = 6v, i dq = 30ma freq. = 16ghz +85c +25c -60 -50 -40 -30 -20 -10 0 8 10 12 14 16 18 20 3f 0 output power (dbc) output power (dbm) 3 rd harmonic vs. output power vs. temp. v d = 6v, i dq = 30ma freq. = 16ghz +85c +25c
t ga2 620 16 C 18 ghz driver amplifier preliminary datasheet: rev - 07 - 2 6 - 1 4 - 9 of 13 - disclaimer: subject to change without notice ? 2014 triquint www.triquint.com application circuit bias - up procedure 1. set i d limit to 60 m a, i g limit to 4 ma 2 . apply - 1.5 v to v g 3 . apply + 6 v to v d 4. adjust v g more positive until i dq = 3 0 ma (v g ~ - 0 . 6 v typical) 5 . apply rf signal bias - down procedure 1. turn off rf signal 2. reduce v g to - 1.5 v. ensure i dq ~ 0ma 3. set v d to 0v 4. turn off v d supp l y 5 . turn off v g supp l y v g = -0.6 v typical j1 rf in j2 rf out 1 4 3 2 c4 10 uf r1 10 ohm c2 100 pf v d = 6v, i dq = 30 ma c1 100 pf c3 10 uf
t ga2 620 16 C 18 ghz driver amplifier preliminary datasheet: rev - 07 - 2 6 - 1 4 - 10 of 13 - disclaimer: subject to change without notice ? 2014 triquint www.triquint.com assembly drawing bill of material reference des. value description manuf. part number c1 C c2 100p f cap, 50v, 25%, single layer cap various c3 C c4 10 f cap, 1206, 50 v, 2 0 % , x5 r various r1 10 ? res, 0603 , 5% various c1 100 pf c2 100 pf rf in rf out gate drain c4 10 uf v d = 6v, i dq = 30 ma v g = -0.6 v typical c3 10 uf r1 10 ohm
t ga2 620 16 C 18 ghz driver amplifier preliminary datasheet: rev - 07 - 2 6 - 1 4 - 11 of 13 - disclaimer: subject to change without notice ? 2014 triquint www.triquint.com mechanical drawing & bond pad description unit: millimeters thickness: 0.10 die x, y size tolerance: +/ - 0.050 chip edge to bond pad dimensions are shown to center of pad ground is backside of die bond pad symbol pad size description 1 rf in 0.106 x 0.19 0 input; matched to 50 ohms ; dc blocked . 2 v g 0.090 x 0.0 90 gate voltage , b ias network is required; s ee application circuit on page 9 as an example . 3 v d 0.090 x 0.0 90 drain voltage , b ias network is required; s ee application circuit on page 9 as an example. 10 as an exampl 4 rf out 0.10 6 x 0.19 0 output; matched to 50 ohms ; dc blocked. 1 2 3 4
t ga2 620 16 C 18 ghz driver amplifier preliminary datasheet: rev - 07 - 2 6 - 1 4 - 12 of 13 - disclaimer: subject to change without notice ? 2014 triquint www.triquint.com assembly notes component placement and adhesive attachment assembly notes: ? vacuum pencils and/or vacuum collets are the preferred method of pick up. ? air bridges must be avoided during placement. ? the force impact is critical during auto placement. ? organic attachment (i.e. epoxy) can be used in low - power applications. ? curing should be done in a convection oven; proper exhaust is a safety concern. reflow process ass embly notes: ? use ausn ( 8 0/ 2 0) solder and limit exposure to temperatures above 300 ? c to 3 - 4 minutes, maximum. ? an alloy station or conveyor furnace with reducing atmosphere should be used. ? do not use any kind of flux. ? coefficient of thermal expansion matchin g is critical for long - term reliability. ? devices must be stored in a dry nitrogen atmosphere. interconnect process assembly notes: ? thermosonic ball bonding is the preferred interconnect technique. ? force, time, and ultrasonic are critical parameters. ? alumi num wire should not be used. ? devices with small pad sizes should be bonded with 0.0007 - inch wire.
t ga2 620 16 C 18 ghz driver amplifier preliminary datasheet: rev - 07 - 2 6 - 1 4 - 13 of 13 - disclaimer: subject to change without notice ? 2014 triquint www.triquint.com important notice the information contained herein is believed to be reliable. triquint makes no warranties regarding the information contained herein. triquint assumes no responsibility or liability whatsoever for any of the information contained herein. triquint assumes no responsibility or liability whatsoever for the use of the information contained herein. the information contained herein is provided "as is, where is" and with all faults, and the entire risk associated with such information is entirely with the user. all information contained herein is subject to change witho ut notice. customers should obtain and verify the latest relevant information before placing orders for triquint products. the information contained herein or any use of such information does not grant, explicitly or implicitly, to any party any patent r ights, licenses, or any other intellectual property rights, whether with regard to such information itself or anything described by such information. triquint products are not warranted or authorized for use as critical components in medical, life - saving , or life - sustaining applications, or other applications where a failure would reasonably be expected to cause severe personal injury or death. contact information for the latest specifications, additional product information, worldwide sales and distribution locations, and information about triquint: web: www.triquint.com tel: +1. 972 . 994 . 8465 email: info - sales@triquint.com fax: +1. 972 . 994 . 8504 for technical questions and application information: email: info - products@triquint.com product compliance information esd sensitivity ratings caution! esd - sensitive device esd rating: tbd value: tbd test: human body model (hbm) standard: jedec standard jesd22 - a114 solderability use ausn (80/20) solder and limit exposure to temperature above 300c to 3 - 4 minutes, maximum. rohs compliance this part is compliant with eu 2002/95/ec rohs directive (restrictions on the use of certain hazardous substances in electrical and electronic equipment ). this product also has the following attributes: ? lead free ? halogen free (chlorine, bromine) ? antimony free ? tbbp - a (c 15 h 12 br 4 0 2 ) free ? pfos free ? svhc free eccn us department of commerce : ear99


▲Up To Search▲   

 
Price & Availability of TGA2620-15

All Rights Reserved © IC-ON-LINE 2003 - 2022  

[Add Bookmark] [Contact Us] [Link exchange] [Privacy policy]
Mirror Sites :  [www.datasheet.hk]   [www.maxim4u.com]  [www.ic-on-line.cn] [www.ic-on-line.com] [www.ic-on-line.net] [www.alldatasheet.com.cn] [www.gdcy.com]  [www.gdcy.net]


 . . . . .
  We use cookies to deliver the best possible web experience and assist with our advertising efforts. By continuing to use this site, you consent to the use of cookies. For more information on cookies, please take a look at our Privacy Policy. X