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  october 2007 rev 3 1/10 AN1224 application note evaluation board us ing sd57045 ldmos rf transistor for fm broadcast application introduction ldmos technology allows the manufacturing of high efficiency and high gain amplifiers for fm transmitters. ldmos has proven advantages against bipolar devices in terms of higher gain, efficiency, linearity, and biasing simpleness that lower the overall system cost and make them attractive for high volume businesses demanding low cost rf power transistor solutions. thanks to these advantages, ldmos rf power transistors are the proven mainstay in the power amplifier business of the cellular base station today. the device used for the present characterization, sd57045, an stmicroelectronics product, is a lateral current, double diffused mos transistor that delivers 45 w under 28 v supply. it is unmatched from dc to 1 ghz making it eligible for a variety of applications, especially for high performance, low cost fm driver applications. this application note documents the feasibility of a low cost 900 mhz cellular de vice as a commercial fm driver. the key advantages of ldmos technology are improved thermal resistance and reduced source output inductance. the wire-bonded connections to the external circuitry (dmos config.) are no longer required because the source at the chip surface is connected to the substrate by the diffusion of a highly doped p-type region. consequently, ldmos has excellent high frequency response because of its high f t and superior gain due to the low feedback capacitance and reduced source inductance. an additional advantage of the ldmos structure is that beryllium oxide (beo), a toxic electrical insu lator required to isolate the drain with dmos transistors, is no longer needed. hence, not only the thermal resistance is improved, but package cost and environmental impact are significantly reduced. finally, in an ldmos, the parasitic bipolar has been nullified guaranteei ng good ruggedness, efficiency and high cu rrent handling capability. www.st.com
contents AN1224 2/10 contents 1 circuit design . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 1.1 description and consideration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 2 characterization results . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 3 conclusion . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 4 revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
AN1224 list of figures 3/10 list of figures figure 1. broadband 4:1 transformer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 figure 2. broadband power amplifier . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 figure 3. layout for broadband power amplifier . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 figure 4. drain current vs. gate-source voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 figure 5. gate-source voltage vs. case temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 figure 6. output power and efficiency vs. input power . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 figure 7. power gain and efficiency vs. output power . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 figure 8. class a safe operating area . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
circuit design AN1224 4/10 1 circuit design 1.1 description and consideration input and output impedances for the sd57045 are shown in ta b l e 1 below: with respect to these impedances, two 4:1 transmission line auto transformers were designed using a 25 ? , 1/8 wavelength, semi rigid coaxial cable. to achieve this transformation across the band, a capacitor was added to the low impedance port of each transformer to cancel the leakage induct ance. the frequency response is shown in figure 1 . simple l-sections were utilized to make th e final transformation from the low impedance port of the transformers (12.5 ? ) to the measured impedances of the device (see ta bl e 1 ). this design uses printed series inductors on a 30 mil glass teflon board. the gain of any power fet is extremely high from dc throughout the low hf frequency band. a feedback network is necessary to suppress the low frequency gain, as well as give a nominal amount of gain at the frequency of interest. this feedback also helps to increase the input impedance. since ldmos has such a high gain at low frequencies, a low value, high power, flange mount resistor must be comprised in the design. the capacitor in the feedback path (c3) provides negative feedback at low frequencies. this component was designed to be self-resonant. far below the fm band, at 100 mhz, the capacitor looks slightly inductive, reducing the amount of feedback in the band of interest. figure 1. broadband 4:1 transformer unbalanced transformers offer an efficient matching method from 50 w to low impedance. besides, auto transformers have a zero impedance point over a broad bandwidth, offering an ideal dc feeding point to the gate and drain circuits. in order to prevent high frequency oscillations, a bypass capacitor is used at the zero impedance point of the transformer. the capacitor value must be selected so that its own resonant frequency is above the frequency table 1. input and output impedances frequency (mhz) z input z output 88 10.8-j7.60 7.5-j0.15 95 10.6-j8.36 7.8-j0.34 108 10.5-j9.87 8.1-j0.61 s11 0db -30db -60db 80mhz 90mhz 100mhz 110mhz
AN1224 circuit design 5/10 of interest. depending on the application, additional low frequency bypass capacitors isolated with lossy elements (ferrite beads) may be required to prevent power supply noise affecting gate and drain circuits. circuit schematic is given in figure 2 , and layout in figure 3 with component values in ta bl e 2 . figure 2. broadband power amplifier table 2. bill of material reference description l1, l3, l4, l7 50 ? transmission line c1,c13 1000 pf chip capacitor c2 39000 pf chip capacitor c3 36 pf chip capacitor r1 1 k ? resistor c4, c6, c10 10000 pf chip capacitor r2 1.2 k ? resistor c5, c12 10 f, 50v electrolytic capacitor r3 240 ? / 40 w resistor c9, c11 1200 pf chip capacitor c8 33 pf chip capacitor c7 25-115 pf variable cap-arco trimmer l2, l6 4:1 transformers, 10.7", 25 ? . board 30mils, 2 ounces of copper, r = 2.55
characterization results AN1224 6/10 figure 3. layout for broadband power amplifier 2 characterization results t case = 25 c table 3. absolute maximum ratings symbol parameter value unit v (br)dss drain-source voltage 65 v v dgr drain-gate voltage (r gs = 1 m ? ) 65 v v gs gate-source voltage +/-20 v i d drain current 5 a p diss power dissipation (at t c =70 c) 93 w t jmax operating junction temperature 200 c t stg storage temperature -65 to 200 c table 4. thermal data symbol parameter value unit r th(j-c) junction-case thermal resistance 1.4 c/w
AN1224 characterization results 7/10 figure 4. drain current vs. gate-source voltage figure 5. gate-source voltage vs. case temperature 2.5 3 3.5 4 4.5 5 vgs, gate-source voltage (volts) 0 0.5 1 1.5 2 2.5 3 3.5 4 id, drain current (a) -25 0 25 50 75 tcase, case temperature (?c) 0.96 0.98 1 1.02 1.04 vgs, gate-source voltage (normalized) id=250ma id=1.5a id=2a id=3a id=1a
characterization results AN1224 8/10 figure 6. output power and efficiency vs. input power figure 7. power gain and efficiency vs. output power figure 8. class a safe operating area 0.1 0.2 0.3 0.4 0.5 0.6 input power (w) 12 24 36 48 60 output power (w) 40 50 60 70 efficiency (%) pout eff freq=95 mhz idq=250 ma vdd=28v 15 30 45 60 pout (w) 18 20 22 24 gain (db) 40 50 60 70 efficiency(%) gain eff freq=95 mhz idq=250 ma vdd=28v 1 10 100 vds, drain-source voltage (volts) 1 10 id, drain current (a) tc= 70?c tc=100?c tj=200?c
AN1224 conclusion 9/10 3 conclusion in this application note we have demonstrated the feasibility of a low cost, 900 mhz cellular device as a commercial fm driver. one can conclude that st ldmos technology offers viable solutions for power amplifiers at frequencies covering the high hf throughout the high uhf bands. more information about these devices can be found at http://www.st.com/rf. 4 revision history table 5. document revision history date revision changes 13-sep-2007 2 no content change 26-oct-2007 3 ? document reformatted no content change ? modified: title
AN1224 10/10 please read carefully: information in this document is provided solely in connection with st products. stmicroelectronics nv and its subsidiaries (?st ?) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described he rein at any time, without notice. all st products are sold pursuant to st?s terms and conditions of sale. purchasers are solely responsible for the choice, selection and use of the st products and services described herein, and st as sumes no liability whatsoever relating to the choice, selection or use of the st products and services described herein. no license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. i f any part of this document refers to any third party products or services it shall not be deemed a license grant by st for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoev er of such third party products or services or any intellectual property contained therein. unless otherwise set forth in st?s terms and conditions of sale st disclaims any express or implied warranty with respect to the use and/or sale of st products including without limitation implied warranties of merchantability, fitness for a parti cular purpose (and their equivalents under the laws of any jurisdiction), or infringement of any patent, copyright or other intellectual property right. unless expressly approved in writing by an authorized st representative, st products are not recommended, authorized or warranted for use in milita ry, air craft, space, life saving, or life sustaining applications, nor in products or systems where failure or malfunction may result in personal injury, death, or severe property or environmental damage. st products which are not specified as "automotive grade" may only be used in automotive applications at user?s own risk. resale of st products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by st for the st product or service described herein and shall not create or extend in any manner whatsoev er, any liability of st. st and the st logo are trademarks or registered trademarks of st in various countries. information in this document supersedes and replaces all information previously supplied. the st logo is a registered trademark of stmicroelectronics. all other names are the property of their respective owners. ? 2007 stmicroelectronics - all rights reserved stmicroelectronics group of companies australia - belgium - brazil - canada - china - czech republic - finland - france - germany - hong kong - india - israel - ital y - japan - malaysia - malta - morocco - singapore - spain - sweden - switzerland - united kingdom - united states of america www.st.com


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