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product structure silicon monolithic integrated circuit this product has not designed protection against radioactive rays 1/ 23 05.feb.2015 rev.001 www.rohm.com ? 2015 rohm co., ltd. all rights reserved. tsz22111 ? 14 ? 001 tsz02201 - 0ggg0h300010 - 1 - 2 1 c h high side switch ics 1.5a current limit high side switch i c s bd82004fvj - m bd8200 5 fvj - m general description bd82004fvj -m and bd82005fvj -m are low on-r esistance n -c hannel mosfet high - side power switc hes optimized for universal serial bus (usb) applications. bd82004fvj -m and bd82005fvj -m are equipped with the function of over - current pro tection, thermal shutdown, under - voltage lockout and soft - start . features ? aec - q100 qualified ? built -in low o n - resistance ( typ 70 m) n -c hannel mosfet ? current limit t hreshold 1.5a ? control input logic ? active high control logic: bd8200 4 fvj -m ? active low control logic : bd8200 5 fvj -m ? soft - start circuit ? over - current protection ? thermal shutdown ? under - voltage lockout protection ? open - drain fault flag output ? ttl enable input applications car accessory key specifications ? i nput v oltage r ange: 2.7v to 5.5v ? on -r esistance : 7 0m (typ ) ? over -c urrent t hreshold : 1.0 a (m in ), 2.0 a (m ax ) ? number of c hannels : 1ch ? output rise time: 0.8ms(typ) ? s tandby c urrent: 0.01 a ( typ ) ? operating temperature r ange : -40c to +85 c package w (typ ) d (typ ) h (max ) typical application circuit lineup c urrent limit t hreshold control i nput l ogic package orderable part number min typ max 1. 0 a 1 .5a 2. 0 a high tssop - b 8 j reel of 2 5 00 bd8200 4 fvj - m g e2 1. 0 a 1 .5a 2. 0 a low tssop - b 8 j reel of 2 5 00 bd8200 5 fvj - m g e2 ts sop - b 8 j 3.00mm x 4.90mm x 1.10mm out out out in in /oc gnd 5v(typ.) c l c in i - + en( /en ) 3.3 v 10k ~ 100k v out datashee t
2 / 23 05.feb.2015 rev.001 www.rohm.com ? 2015 rohm co., ltd. all rights reserved. tsz22111 >? 15 >? 001 bd82004fvj - m bd8200 5 fvj - m tsz02201 - 0ggg0h300010 - 1 - 2 block diagram pin configuration s pin description pin no. symbol i / o f unction 1 gnd - ground 2, 3 in - switch input and the supply voltage for the ic. at use, connect both pin s together . 4 en , /en i enable input. en: high level input turns on the switch .( bd8200 4 fvj - m ) / en: low level input turns on the switch .( bd8200 5 fvj - m ) high level input > 2.0v, l ow level input < 0.8v. 5 /oc o over - current detection terminal. low level output during over - current or over - temperature condition. open - drain fault flag output. 6, 7, 8 out o power switch output. at use, connect each pin together . bd8200 4 fvj - m (top view) bd8200 5 fvj - m (top view) uvlo in gnd charge pump gate logic ocd tsd in en /en out out out /oc 1 2 3 4 8 7 6 5 out out out /oc gnd in in en 1 2 3 4 8 7 6 5 out out out /oc gnd in in / en
3 / 23 05.feb.2015 rev.001 www.rohm.com ? 2015 rohm co., ltd. all rights reserved. tsz22111 >? 15 >? 001 bd82004fvj - m bd8200 5 fvj - m tsz02201 - 0ggg0h300010 - 1 - 2 absolute maximum ratings ( ta=25 c ) parameter symbol r ating unit supply v oltage v in - 0.3 to + 6.0 v enable input v oltage v en , v /en - 0.3 to + 6.0 v /oc v oltage v /oc - 0.3 to + 6.0 v /oc sink c urrent i /oc 5 ma out v oltage v out - 0.3 to + 6.0 v storage t emperature t s t g - 55 to + 150 c power d issipation pd 0. 58 (note 1) w (note 1 ) mounted on 70mm x 70mm x 1.6mm glass epoxy board . reduce 4.7mw/ c above ta=25 c caution: operating the ic over the absolute maximum ratings may damage the ic. the damage can either be a short circuit between pins or an open circuit between pins and the internal circuitry. therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the ic is operated over the absolute maximum ratings. recommended operating conditions parameter symbol r ating unit min typ max operating v oltage v in 2.7 - 5.5 v op erating t emperature topr - 40 - + 85 c electrical characteristics ? bd82004fvj - m (v in = 5.0v, ta = 25 c , unless otherwise specified) dc characteristics parameter symbol limit unit condition s min typ max operating c urrent i dd - 110 160 $ v en = 5 v , out=open standby c urrent i stb - 0.01 1 $ v en = 0 v , out=open en i nput v oltage v en h 2.0 - - v high i npu t v en l - - 0.8 v low i nput en i nput c urrent i en - 1.0 + 0.01 + 1.0 $ v en = 0v or v en = 5v /oc o utput l ow v oltage v /ocl - - 0.5 v i /oc = 0.5ma /oc o utput l eak c urrent i l /oc - 0.01 1 $ v /oc = 5v /oc d elay t ime t /oc 10 15 20 ms o n - r esistance r on - 70 110 p i out = 500ma switch l eak c urrent i l sw - - 1.0 $ v en = 0 v, v out = 0v current l imit t hreshold i th 1.0 1.5 2.0 a short c ircuit c urrent i sc 0.7 1.0 1.4 a v out = 0v c l )506 output r ise t ime t on1 - 0.8 10 ms r l output t urn o n t ime t on2 - 1.1 20 ms r l output f all t ime t off1 - 5 20 v r l output t urn o ff t ime t off2 - 10 40 v r l uvlo t hreshold v tuvh 2.1 2.3 2.5 v v in increasing v tuvl 2.0 2.2 2.4 v v in decreasing
4 / 23 05.feb.2015 rev.001 www.rohm.com ? 2015 rohm co., ltd. all rights reserved. tsz22111 >? 15 >? 001 bd82004fvj - m bd8200 5 fvj - m tsz02201 - 0ggg0h300010 - 1 - 2 electrical characteristics C
5 / 23 05.feb.2015 rev.001 www.rohm.com ? 2015 rohm co., ltd. all rights reserved. tsz22111 >? 15 >? 001 bd82004fvj - m bd8200 5 fvj - m tsz02201 - 0ggg0h300010 - 1 - 2 measurement circuit a. operating c urrent b. en, /en i nput v oltage, output r ise / f all t ime inrush c urrent c. o n - resistance over - c urrent d etection d. /oc o utput low v oltage fig ure 1 . measurement c ircuit timing diagram fig ure 2. timing diagram ( bd8200 4 fvj - m ) fig ure 3. timing diagram ( bd8200 5 fvj - m ) gnd in in en(/en) out out out /oc v en (v /en ) 1 f r l c l v in 10k gnd in in en(/en) out out out /oc v en (v /en ) 1 f 10k gnd in in en(/en) out out out /oc v en (v /en ) 1 f v in v in i /oc t on1 v out 10% 90% 90% t off1 t on2 v en v en h t off2 v en l t on1 v out 10% 90% 90% t off1 t on2 v /e n v /en l t off2 v /en h gnd in in en(/en) out out out /oc v en (v /en ) 1 f v in a
6 / 23 05.feb.2015 rev.001 www.rohm.com ? 2015 rohm co., ltd. all rights reserved. tsz22111 >? 15 >? 001 bd82004fvj - m bd8200 5 fvj - m tsz02201 - 0ggg0h300010 - 1 - 2 typical performance curves figure 4. operating c urrent vs supply voltage ( en , / en e nable ) ta=25 c figure 6. standby c urrent vs supply voltage ( en, /en d isable ) ta=25 c standby current : i stb [ a] supply vo ltage : v in [v] figure 5. operating c urrent vs ambient temperature ( en , / en e nable ) v in =5.0v ambient temperature : ta [ c ] figure 7. standby c urrent vs ambient temperature ( en, /en d isable ) v in =5.0v standby current : i stb [ a] ambient temperature : ta [ c ] 0 20 40 60 80 100 120 140 2 3 4 5 6 supply voltage : v in [v] operating current : i dd [a] 0.0 0.2 0.4 0.6 0.8 1.0 2 3 4 5 6 supply voltage : v in [v] standby current : i stb [a] 0 20 40 60 80 100 120 140 -50 0 50 100 ambient temperature : ta[] [a] 0.0 0.2 0.4 0.6 0.8 1.0 -50 0 50 100 ambient temperature : ta[ [a]
7 / 23 05.feb.2015 rev.001 www.rohm.com ? 2015 rohm co., ltd. all rights reserved. tsz22111 >? 15 >? 001 bd82004fvj - m bd8200 5 fvj - m tsz02201 - 0ggg0h300010 - 1 - 2 typical performance curves - continued figure 1 0. o n - r esistance vs supply voltage ta=25 c o n - resistance: r on [ p? ] figure 9. e n , / en in put v oltage vs ambient temperature v in =5.0v high to low low to high enable input voltage : v en, v / en [ v ] ambient temperature : ta [ c ] figure 11. o n - r esistance vs ambient temperature v in =5.0v o n - resistance: r on [ p? ] ambient temperature : ta [ c ] figure 8. en , / en i nput v oltage vs supply voltage low to high high to low ta=25 c enable input voltage : v en, v / en [ v ] 0 50 100 150 200 2 3 4 5 6 supply voltage : v in [v] on resistance : r on [m] 0.0 0.5 1.0 1.5 2.0 -50 0 50 100 ambient temperature : ta[ 0 50 100 150 200 -50 0 50 100 ambient temperature : ta[] [m] 0.0 0.5 1.0 1.5 2.0 2 3 4 5 6 supply voltage : v in [v] enable input voltage : v en [v] 0
8 / 23 05.feb.2015 rev.001 www.rohm.com ? 2015 rohm co., ltd. all rights reserved. tsz22111 >? 15 >? 001 bd82004fvj - m bd8200 5 fvj - m tsz02201 - 0ggg0h300010 - 1 - 2 typical performance curves - continued figure 12. current l imit t hreshold vs suppl y voltage ta=25 c figur e 14. short c ircuit c urrent vs supply voltage ta=25 c i sc [a] figure 13. current l imit t hreshold vs ambient temperature v in =5.0v ambient temperature : ta [ c ] figure 15. sh ort c ircuit c urrent vs ambient temperature v in =5.0v ambient temperature : ta [ c ] 1.0 1.2 1.4 1.6 1.8 2.0 2 3 4 5 6 supply voltage : v in [v] current limit threshold : i th [a] 0.4 0.6 0.8 1.0 1.2 1.4 2 3 4 5 6 supply voltage : v in [v] short-circuit current : i sc [a] 1.0 1.2 1.4 1.6 1.8 2.0 -50 0 50 100 ambient temperature : ta[] 0.4 0.6 0.8 1.0 1.2 1.4 -50 0 50 100 ambient temperature : ta[
9 / 23 05.feb.2015 rev.001 www.rohm.com ? 2015 rohm co., ltd. all rights reserved. tsz22111 >? 15 >? 001 bd82004fvj - m bd8200 5 fvj - m tsz02201 - 0ggg0h300010 - 1 - 2 typical performance curves - continued figure 16. /oc o utput l ow v oltage vs supply voltage ta=25 c figure 17. /oc o utput l ow v oltage vs ambient temperature v in =5.0v ambient temperature : ta [ c ] figure 18. uvlo threshold voltage vs ambient temperature v tuvh v tuv l ambient temperature : ta [ c ] figure 19. uvlo h ysteresis v oltage vs ambient temperature uvlo hysteresis voltage : v hys [v] ambient temperature : ta [ c ] 0 20 40 60 80 100 2 3 4 5 6 supply voltage : v in [v] /oc output low voltage : v /oc [mv] 0 20 40 60 80 100 -50 0 50 100 ambient temperature : ta[] 2.0 2.1 2.2 2.3 2.4 2.5 -50 0 50 100 ambient temperature : ta[ 0.0 0.2 0.4 0.6 0.8 1.0 -50 0 50 100 ambient temperature : ta[
10 / 23 05.feb.2015 rev.001 www.rohm.com ? 2015 rohm co., ltd. all rights reserved. tsz22111 >? 15 >? 001 bd82004fvj - m bd8200 5 fvj - m tsz02201 - 0ggg0h300010 - 1 - 2 typical performance curves - continued figure 2 0. output r ise t ime vs supply voltage ta=25 c figure 21. output r ise t ime vs ambient temperature v i n =5.0v figure 22 . output t urn on t ime vs supply voltage ta=25 c figure 23. output t urn on t ime vs a mbient temperature v in =5.0v 0.0 1.0 2.0 3.0 4.0 5.0 2 3 4 5 6 supply voltage : v in [v] output rise time : t on1 [ms] 0.0 1.0 2.0 3.0 4.0 5.0 -50 0 50 100 ambient temperature : ta[] 0.0 1.0 2.0 3.0 4.0 5.0 2 3 4 5 6 supply voltage : v in [v] output turn on time : t on2 [ms] 0.0 1.0 2.0 3.0 4.0 5.0 -50 0 50 100 ambient temperature : ta[]
11 / 23 05.feb.2015 rev.001 www.rohm.com ? 2015 rohm co., ltd. all rights reserved. tsz22111 >? 15 >? 001 bd82004fvj - m bd8200 5 fvj - m tsz02201 - 0ggg0h300010 - 1 - 2 typical performance curves - continued figure 27. output t urn off t ime vs ambient temperature output fall time: t off1 [ s ] figure 24. output f all t ime vs supply voltage ta=25 c ambient temperature: ta[ c] figure 2 5 . output f all t ime vs ambient temperature ta=25 c figure 26. output t urn off t ime vs supply voltage ambient temperature : ta [ c ] v i n =5.0 v 0 2 4 6 8 10 2 3 4 5 6 supply voltage : v in [v] output turn off time : t off2 [s] 0 2 4 6 8 10 -50 0 50 100 ambient temperature : ta[ 0.0 1.0 2.0 3.0 4.0 5.0 2 3 4 5 6 supply voltage: v in [v] output fall time : t off1 [s]
12 / 23 05.feb.2015 rev.001 www.rohm.com ? 2015 rohm co., ltd. all rights reserved. tsz22111 >? 15 >? 001 bd82004fvj - m bd8200 5 fvj - m tsz02201 - 0ggg0h300010 - 1 - 2 typical performance curves - continued figure 29. / oc d elay t ime vs ambient temperature figure 28. / oc d elay t ime vs supply voltage ta=25 c v in =5.0v 100 ambie nt temperature : ta[ c] 10 12 14 16 18 20 - 50 0 50 /oc delay time: t /oc [ms ] v in =5.0v 10 12 14 16 18 20 2 3 4 5 6 supply voltage : v in [v] /oc delay time : t /oc [ms]
13 / 23 05.feb.2015 rev.001 www.rohm.com ? 2015 rohm co., ltd. all rights reserved. tsz22111 >? 15 >? 001 bd82004fvj - m bd8200 5 fvj - m tsz02201 - 0ggg0h300010 - 1 - 2 typical wave f orms ( bd82004fvj - m ) v en (5v/div.) v in =5v r l =10 c l =100 f v /oc (5v/div.) v out (5v/div.) i in (0.5a/div.) time ( 1ms/div.) figure 3 0. output r ise c haracteristic v en (5v/div.) v in =5v r l =10 c l =100 f v /oc (5v/div.) v out (5v/div.) i in (0. 5a/div.) time ( 1ms/div.) figure 31. output fall c haracteristic v en (5v/div.) v in =5v r l =10 v /oc (5v/d iv.) i in (0.5a/div.) c l = 47 f c l =100 f c l =147 f time ( 1ms/div.) figure 32. inrush c urrent r esponse v out (5v/div.) v /oc (5v/div.) i out (0.5a/div.) v in =5v c l =100 f time ( 10ms/div.) figure 33. over - c urrent r esponse ramp ed l oad
14 / 23 05.feb.2015 rev.001 www.rohm.com ? 2015 rohm co., ltd. all rights reserved. tsz22111 >? 15 >? 001 bd82004fvj - m bd8200 5 fvj - m tsz02201 - 0ggg0h300010 - 1 - 2 typical wave f orms - continued v out (5v/div.) v in =5v c l =100 f v /oc (5v/div.) i out (0.5a/div.) time ( 2ms/div.) figure 34. over - c urrent r esponse ramp ed l oad v en (5v/div.) v in =5v c l =100 f v /oc (5v/div.) v out (5v/div.) i out (0.5a/div.) time ( 5ms/div.) figure 35. over - c urrent r esponse enable to short circ uit time ( 5ms/div.) figure 36. over - c urrent r esponse 1 l oad c onnected at enable v /oc (5v/div.) v out (5v/div.) i out (1.0a/div.) v in =5v c l =100 f time ( 200ms/div.) figure 37. thermal shutdown 1 l oad c onnected at enable v in =5v c l =100 f v /oc (5v/ div.) v out (5v/div.) thermal shutdown i out (1.0a/div.)
15 / 23 05.feb.2015 rev.001 www.rohm.com ? 2015 rohm co., ltd. all rights reserved. tsz22111 >? 15 >? 001 bd82004fvj - m bd8200 5 fvj - m tsz02201 - 0ggg0h300010 - 1 - 2 typical wave f orms - continued v in (5v/div.) r l =10 c l =100 f v out (5v/div.) v /oc (5v/div.) i out (0.5a/div.) time ( 10ms/div.) figure 38. uvlo r esponse i ncreasing v in v in (5v/d iv.) r l =10 c l =100 f v out (5v/div.) v /oc (5v /div.) i out (0.5a/div.) time ( 10ms/div.) figure 39. uvlo r esponse d ecreasing v in
16 / 23 05.feb.2015 rev.001 www.rohm.com ? 2015 rohm co., ltd. all rights reserved. tsz22111 >? 15 >? 001 bd82004fvj - m bd8200 5 fvj - m tsz02201 - 0ggg0h300010 - 1 - 2 typical application circuit application information when excessive current flows due to output short circuit or so, ringing occurs by inductance of power source line and ic . this may cause bad effect s on ic opera tions. in order to avoid this cas e , a bypa ss capacitor ( c in ) should be connected across the in terminal and gnd terminal of ic. a ) or higher value is recommended. moreover, i n order to decrease voltage fluctuations of power source line and ic , connect a low esr capacitor in parallel with c in . a 1 0 )wr 100 ) or higher is effective . 3xooxs2&rxwsxwe\uhvlvwdqfhn wrn set up value s for c l which satisfies the application . this application circuit does n o t guarantee its operati on . when using the circuit with changes to the external circuit constants, make sure to leave an adequate margin for external components including a c/dc characteristics as well as dispersion of the ic. functional description 1. switch o peration in terminal and out terminal are connected to the drain and the source of switch mosfet respectively. t he in terminal is also used as power source input to internal control circuit. when the switch is turned on from en ( /en ) control input, the in and out terminal s are connected by a p (typ ) switch . in on status, the switch is bidirectional. therefore, when the potential of out terminal is higher than t hat of in t erminal, current flows from out to in terminal. on the other hand, when the switch is turned off , it is possible to prevent curre nt from flowing reversely from out to in terminal s ince a parasitic diode between the drain and the source of switch mosfet is not present . 2. thermal s hutdown c ircuit ( tsd) if over - current would continue, the temperature of the ic would increase drastically. if the junction temperature goes beyond 170 c ( t yp ) in the condition of over - current detection, thermal shutdow n circuit operates and turns power switch off , causing the ic to output a fault flag (/oc). then, when the junction temperature decreases lower than 150 c ( t yp ), the power switch is turned on and the fault flag (/oc) is can celled. t his operation repeats , u nless the increas e of chip ? s temperature is removed or the output of power switch is turned off. the thermal shutdown circuit operates when the switch is on (en ( /en ) signal is active). 3. over - c urrent d etection (ocd) the over - current detection circuit limits current (i sc ) and outputs fault flag (/oc) when current flowing in each swit ch mosfet exceeds a specified value . the over - current detection circuit works when the switch is on (en ( /en ) signal is active). there are three types of response against over - current : (1) when the switch is turned on while the output is in short circuit status, the switch g oe s in to current limit status immediately . (2) when the output short - circuits or high capacity load is connected while the switch is on , very large cu rrent flows until the over - current limit circuit reacts. when the current detection and limit circuit operates , current limitation is carried out. 5v( t yp) c in in out regulator out out out in in /oc gnd vbus d - d+ gnd usb controller 5v(typ.) 10k 100k
17 / 23 05.feb.2015 rev.001 www.rohm.com ? 2015 rohm co., ltd. all rights reserved. tsz22111 >? 15 >? 001 bd82004fvj - m bd8200 5 fvj - m tsz02201 - 0ggg0h300010 - 1 - 2 (3) when the output current increases gradually, current limitation would not operate unless the output current e xceeds the over - current detection value. when it exceeds the detection value, current limitation is carried out. 4. under - v oltage l ockout (uvlo) uvlo circuit prevents the switch from turning on until the v in exceeds 2.3v (typ). if v in drops below 2.2v (typ) while the switch is still on , then uvlo shuts off the power switch. uvlo has a hysteresis of 100mv (typ). under - voltage lockout circuit operates when the switch is on (en ( /en ) signal is active). 5. fault fl ag (/oc) o utput fault flag output is n - mos open drain output. during detection of over - current and/or thermal shutdown, the output level will turn low . over - current detection has delay filter. this delay filter prevents current detecti on flags from being sent during instantaneous events such as inrush current at switch on or during hot plug . if fault flag output is unused, /oc pin should be connected to ground line or open. fig ure 4 0 . over - c urrent detection, t hermal s hutdown t iming ( bd82004fvj - m ) fig ure 4 1 . over - current d etection, t hermal s hutdown t iming ( bd82005fvj - m ) v /en v out i out v /oc output short c ircuit thermal shutdown dela y v en v out i out v /oc output short c ircuit thermal shutdown /oc delay time v en v out i out v /oc output shortcircuit thermal shut down delay v /en v out i out v /oc output shortcircuit thermal shut down /oc d elay time
18 / 23 05.feb.2015 rev.001 www.rohm.com ? 2015 rohm co., ltd. all rights reserved. tsz22111 >? 15 >? 001 bd82004fvj - m bd8200 5 fvj - m tsz02201 - 0ggg0h300010 - 1 - 2 power dissipation (tssop - b8j p ackage ) mounted on 70mm x 70mm x 1.6mm glass epoxy board . fig ure 4 2. power d issipation c urve (pd - ta curve) i/o equivalen ce circuit symbol pin no . equivalen ce c ircuit en(/en) 4 /oc 5 out 6,7,8 ambient temperature: ta [ c] power dissipation: pd [mw] 0 100 200 300 400 500 600 0 25 50 75 100 125 150 ambient temperature: ta [
19 / 23 05.feb.2015 rev.001 www.rohm.com ? 2015 rohm co., ltd. all rights reserved. tsz22111 >? 15 >? 001 bd82004fvj - m bd8200 5 fvj - m tsz02201 - 0ggg0h300010 - 1 - 2 operational notes 1. reverse c onnection of p ower s upply connecting the power supply in reverse polarity can damage the ic. take pr ecautions against reverse polarity when connecting the power supply , such as mounting an external diode between the power supply and the ic ? s power supply pins . 2. power s upply l ines design the pcb layout pattern to provide low impedance supply lines. s eparate the gr ound and supply lines of the digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog block . furthermore, connect a capacitor to ground at all power supply pins . consider the effect of tempera ture and aging on the capacitance value when using electrolytic capacitors. 3. g round voltage ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition. 4. g round w iring p attern when using both small - signa l and large - current ground traces, the two ground traces should be routed separately but connected to a single ground at the reference point of the application board to avoid fluctuations in the small - signal ground caused by large currents. also ensure tha t the ground traces of external components do not cause variations on the ground voltage. the ground lines must be as short and thick as possible to reduce line impedance. 5. thermal c onsideration should by any chance the power dissipation rating be exceede d the rise in temperature of the chip may result in deterioration of the properties of the chip. the absolute maximum rating of the pd stated in this specification is when the ic is mounted on a 70mm x 70mm x 1.6mm glass epoxy board. in case of exceeding t his absolute maximum rating, increase the board size and copper area to prevent exceeding the pd rating. 6. recommended o perating c onditions these conditions represent a range within which the expected characteristics of the ic can be approximately obtained . the e lectrical characteristics are guaranteed under the conditions of each parameter . 7. in r ush current when power is first supplied to the ic, it is possible that the internal logic may be unstable and inrush current may flow instantaneously due to the internal powering sequence and delays, especially if the ic has more than one power supply. therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and routing of connections. 8. operation u nder s trong e lec tromagnetic f ield operating the ic in the presence of a strong electromagnetic field may cause the ic to malfunction . 9. testing on a pplication b oards when testing the ic on an application board, connecting a capacitor directly to a low - impedance output pin may vxemhfwwkh,&wrvwuhvv$ozd\vglvfkdujhfdsdflwruvfrpsohwho\diwhuhdfksurfhvvruvwhs7kh,&?vsrzhuvxsso\ should always be turned off completely before connecting or removing it from the test setup during the inspection process. to prevent da mage from static discharge, ground the ic during assembly and use similar precautions during transport and storage. 10. inter - pin short and mounting errors ensure that the direction and position are correct when mounting the ic on the pcb. incorrect mounting may result in damaging the ic. avoid nearby pins being shorted to each other especia lly to ground , power supply and output pin . inter - pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and unintenti onal solder bridge deposited in between pins during assembly to name a few. 11. unused input pins input pins of an ic are often connected to the gate of a mos transistor. the gate has extremely high impedance and extremely low c apacitance. if left unconnected, the electric field from the outside can easily char ge it. the small charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and cause unexpected operation of the ic. so unless otherwise specified, unused input pins should be connected to the power supp ly or ground line.
20 / 23 05.feb.2015 rev.001 www.rohm.com ? 2015 rohm co., ltd. all rights reserved. tsz22111 >? 15 >? 001 bd82004fvj - m bd8200 5 fvj - m tsz02201 - 0ggg0h300010 - 1 - 2 operational notes - continued 12. regard ing the i nput p in of the ic this monolithic ic contains p+ isolation and p substrate layers between adjacen t elements in order to keep them isolated. p - n junctions are formed at the intersection of the p layers with the n layers o f other elements, creating a parasitic diode or transistor. for example (refer to figure below): when gnd > pin a and gnd > pin b, t he p - n junction operates as a parasitic diode. when gnd > pin b, the p - n junction operates as a parasitic transistor. par asitic diodes inevitably occur in the structure of the ic. the operation of parasitic diodes can result in mutual interference among circuits, operational faults, or physical damage. therefore , conditions that cause these diodes to operate, such as applying a voltage lower than the gnd voltage to an input pin (and thus to the p substrate) should be avoided. fig ure 43 . example of mono lithic ic structure 13. ceramic capacitor when using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with temperature and the decrease in nominal capacitance due to dc bias and others. 14. thermal s hutdown c ircuit(tsd ) this ic has a built - in thermal shutdown circuit that prevents heat damage to the ic. normal operation should always be wi wklq wkh ,&?v srzhu glvvlsdwlrq udwlqj ,i krzhyhu wkh udwlqj lv h[fhhghg iru d frqwlqxhg shulrg wkh mxqfwlrq temperature (tj) will rise which will activate the tsd circuit that will turn off all output pins. when the tj falls below the tsd threshold, the circuits are automatically restored to normal operation. note that the tsd circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no circumstances, should the tsd circuit be used in a set design or for any purpose other than protecting the ic from heat damage. 15. thermal design perform thermal design in which there are adequate margins by taking i nto account the p ower dissipation (pd) in actual states of use. n n p + p n n p + p s u b s t r a t e g n d n p + n n p + n p p s u b s t r a t e g n d g n d p a r a s i t i c e l e m e n t s p i n a p i n a p i n b p i n b b c e p a r a s i t i c e l e m e n t s g n d p a r a s i t i c e l e m e n t s c b e t r a n s i s t o r ( n p n ) r e s i s t o r n r e g i o n c l o s e - b y p a r a s i t i c e l e m e n t s
21 / 23 05.feb.2015 rev.001 www.rohm.com ? 2015 rohm co., ltd. all rights reserved. tsz22111 >? 15 >? 001 bd82004fvj - m bd8200 5 fvj - m tsz02201 - 0ggg0h300010 - 1 - 2 ordering information b d 8 2 0 0 4 f v j - m g e 2 part n umber package fvj : tssop - b8j product rank m: for automotive packaging and forming specification g : halogen free e2: embossed tape and reel b d 8 2 0 0 5 f v j - m g e 2 part n umber package fvj : tssop - b8j product rank m: for automotive pac kaging and forming specification g : halogen free e2: embossed tape and reel marking diagram part number part number marking bd82004fvj - m d8200 4 bd8 2005fvj - m d8200 5 tssop - b8j (top view) part number marking lot number 1pin mark
22 / 23 05.feb.2015 rev.001 www.rohm.com ? 2015 rohm co., ltd. all rights reserved. tsz22111 >? 15 >? 001 bd82004fvj - m bd8200 5 fvj - m tsz02201 - 0ggg0h300010 - 1 - 2 physical dimension , tape and reel information package name tssop - b8j
23 / 23 05.feb.2015 rev.001 www.rohm.com ? 2015 rohm co., ltd. all rights reserved. tsz22111 >? 15 >? 001 bd82004fvj - m bd8200 5 fvj - m tsz02201 - 0ggg0h300010 - 1 - 2 revision history date revision changes 0 5 . feb .201 5 001 new release
datasheet d a t a s h e e t notice-ss rev.004 ? 2013 rohm co., ltd. all rights reserved. notice precaution on using rohm products 1. if you intend to use our products in devices requiring extremely high reliability (such as medical equipment (note 1) , aircraft/spacecraft, nuclear power controllers, etc.) and whos e malfunction or failure may cause loss of human life, bodily injury or serious damage to property (?specific applications?), please consult with the rohm sales representative in advance. unless otherwise agreed in writ ing by rohm in advance, rohm shall not be in any way responsible or liable for any damages, expenses or losses in curred by you or third parties arising from the use of any rohm?s products for specific applications. (note1) medical equipment classification of the specific applications japan usa eu china class class class b class class class 2. rohm designs and manufactures its products subject to strict quality control system. however, semiconductor products can fail or malfunction at a certain rate. please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe desi gn against the physical injury, damage to any property, which a failure or malfunction of our products may cause. the following are examples of safety measures: [a] installation of protection circuits or other protective devices to improve system safety [b] installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. our products are not designed under any special or extr aordinary environments or conditi ons, as exemplified below. accordingly, rohm shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any rohm?s products under an y special or extraordinary environments or conditions. if you intend to use our products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] use of our products in any types of liquid, incl uding water, oils, chemicals, and organic solvents [b] use of our products outdoors or in places where the products are exposed to direct sunlight or dust [c] use of our products in places where the products ar e exposed to sea wind or corrosive gases, including cl 2 , h 2 s, nh 3 , so 2 , and no 2 [d] use of our products in places where the products are exposed to static electricity or electromagnetic waves [e] use of our products in proximity to heat-producing components, plastic cords, or other flammable items [f] sealing or coating our products with resin or other coating materials [g] use of our products without cleaning residue of flux (ev en if you use no-clean type fluxes, cleaning residue of flux is recommended); or washing our products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] use of the products in places subject to dew condensation 4. the products are not subjec t to radiation-proof design. 5. please verify and confirm characteristics of the final or mounted products in using the products. 6. in particular, if a transient load (a large amount of load applied in a short per iod of time, such as pulse. is applied, confirmation of performance characteristics after on-boar d mounting is strongly recomm ended. avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading c ondition may negatively affect product performance and reliability. 7. de-rate power dissipation (pd) depending on ambient temper ature (ta). when used in seal ed area, confirm the actual ambient temperature. 8. confirm that operation temperat ure is within the specified range descr ibed in the product specification. 9. rohm shall not be in any way responsible or liable for fa ilure induced under deviant condi tion from what is defined in this document. precaution for mounting / circuit board design 1. when a highly active halogenous (chlori ne, bromine, etc.) flux is used, the resi due of flux may negatively affect product performance and reliability. 2. in principle, the reflow soldering method must be us ed on a surface-mount products, the flow soldering method must be used on a through hole mount products. if the flow sol dering method is preferred on a surface-mount products, please consult with the rohm representative in advance. for details, please refer to rohm mounting specification
datasheet d a t a s h e e t notice-ss rev.004 ? 2013 rohm co., ltd. all rights reserved. precautions regarding application examples and external circuits 1. if change is made to the constant of an external circuit, pl ease allow a sufficient margin c onsidering variations of the characteristics of the products and external components, including transient characteri stics, as well as static characteristics. 2. you agree that application notes, re ference designs, and associated data and in formation contained in this document are presented only as guidance for products use. theref ore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. precaution for electrostatic this product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. please take proper caution in your manufacturing process and storage so that voltage exceeding t he products maximum rating will not be applied to products. please take special care under dry condit ion (e.g. grounding of human body / equipment / solder iron, isolation from charged objects, se tting of ionizer, friction prevention and temperature / humidity control). precaution for storage / transportation 1. product performance and soldered connections may deteriora te if the products are stor ed in the places where: [a] the products are exposed to sea winds or corros ive gases, including cl2, h2s, nh3, so2, and no2 [b] the temperature or humidity exceeds those recommended by rohm [c] the products are exposed to di rect sunshine or condensation [d] the products are exposed to high electrostatic 2. even under rohm recommended storage c ondition, solderability of products out of recommended storage time period may be degraded. it is strongly recommended to confirm sol derability before using products of which storage time is exceeding the recommended storage time period. 3. store / transport cartons in the co rrect direction, which is indicated on a carton with a symbol. otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. use products within the specified time after opening a hum idity barrier bag. baking is required before using products of which storage time is exceeding the recommended storage time period. precaution for product label qr code printed on rohm products label is for rohm?s internal use only. precaution for disposition when disposing products please dispose them proper ly using an authorized industry waste company. precaution for foreign exchange and foreign trade act since our products might fall under cont rolled goods prescribed by the applicable foreign exchange and foreign trade act, please consult with rohm representative in case of export. precaution regarding intellectual property rights 1. all information and data including but not limited to application example contain ed in this document is for reference only. rohm does not warrant that foregoi ng information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. rohm shall not be in any way responsible or liable for infringement of any intellectual property rights or ot her damages arising from use of such information or data.: 2. no license, expressly or implied, is granted hereby under any intellectual property rights or other rights of rohm or any third parties with respect to the information contained in this document. other precaution 1. this document may not be reprinted or reproduced, in whol e or in part, without prior written consent of rohm. 2. the products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of rohm. 3. in no event shall you use in any wa y whatsoever the products and the related technical information contained in the products or this document for any military purposes, incl uding but not limited to, the development of mass-destruction weapons. 4. the proper names of companies or products described in this document are trademarks or registered trademarks of rohm, its affiliated companies or third parties.
datasheet datasheet notice ? we rev.001 ? 2015 rohm co., ltd. all rights reserved. general precaution 1. before you use our pro ducts, you are requested to care fully read this document and fully understand its contents. rohm shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny rohms products against warning, caution or note contained in this document. 2. all information contained in this docume nt is current as of the issuing date and subj ec t to change without any prior notice. before purchasing or using rohms products, please confirm the la test information with a rohm sale s representative. 3. the information contained in this doc ument is provi ded on an as is basis and rohm does not warrant that all information contained in this document is accurate an d/or error-free. rohm shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information.

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