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data sheet ligitek electronics co.,ltd. property of ligitek only LGFLY-311E 1w power light led doc. no : qw0905- rev a date : 16 - jul. -2013 LGFLY-311E lead-free parts pb
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absolute maximum ratings at ta=25 . luminous flux characteristics at 350ma (ratings at 25 ambient) led junction temperature tj peak pulse current duty 1/10@10khz power dissipation dc forward current pd i fp i f parameter symbol 125 unit ma w ma blue 500 1.05 350 ratings lm ---- 23.5 lambertian amber radiation pattern units luminous flux @350ma(lm) emission color min. max. ligitek electronics co.,ltd. property of ligitek only page2/12 reverse current(vr=5v) storage temperature operating temperature ir tstg t opr 100 -40 ~ +120 -40 ~ +100 a manual soldering time at 260 ! c(max) t sol 5 seconds part no LGFLY-311E typ. 35
3/12 page ligitek electronics co.,ltd. property of ligitek only typ. max. min. emission color radiation pattern . emission angle characteristics at 350ma (ratings at 25 ambient ) LGFLY-311E 140 degrees part no emission color lambertian units typ. rth,j-b 18 mv/ ! c -2 LGFLY-311E radiation pattern lambertian typ. units emission color part no vf/ t ! c/w units . tempeature coefficient of forward voltage&thermal resistance junction to board characteristics at 350ma (ratings at 25 ambient ) 595 LGFLY-311E lambertian ---- 587 nm 2.53.0 v LGFLY-311E lambertian 1.9 . dominant wavelength characteristics at 350ma (ratings at 25 ambient ) note : forward voltage is measublue with an accuracy of 0.1v part no d units max. part no radiation pattern typ. emission color min. vf . forward voltage characteristics at 350ma (ratings at 25 ambient) units amber amber amber amber
group ligitek electronics co.,ltd. property of ligitek only luminous flux(lm) min max f21 f22 30.639.8 39.851.7 brightness code for high power led note : flux is measublue with an accuracy of 10% f20 23.530.6 y 17 589592 dominant wavelength for high power led min 587 16 group max 589 d (nm) 18 592 595 page4/12
4/9 page precautions for use: storage : 1.the operation of temperatures and rh are : 5 ~35 ,rh60%,after the package is opened, leds should be stored at temperatures less than 30 and humidity less than 30%. 2.once the package is opened, the products should be used within a week. otherwise, they should be kept in a damp proof box with descanting agent. considering the products life, we suggest our customers to use our products within a year(from production date). 3.if opened more than one week in an atmosphere 5 ~ 35 ,rh60%, they should be treated at 60 5 for 6hrs. 2 11.65 16.65 5.82 note: 1. all dimensions are in mm. 2. the drawings are not to scale. 3. solder pad can't be connected to slug. solder mark solder pad slug independent recommended solder pad design ligitek electronics co.,ltd. property of ligitek only 5/12 page
handling precaution: 5. avoid leaving fingerprints or scratches (by sharp tools) on the silicone resin parts. 6. do not force over 2000gf impact or pressure on the silicone molding lens. 7. the leds should only be picked up by making contact with the sides of the led body. 8. when populating in smt production, the pick-and-place nozzle must not place excessive pressure on the silicone molding lens. 1. for prototype builds or small series production runs it possible to place and solder the emitters by hand. 2. solder tip temperature : 230 ! c max for lead solder and 260 ! c max for lead-free solder. 3. avoiding damage to the emitter or to the mcpcb dielectric layer.damage to the epoxy layer can cause a short circuit in the array. 4. do not let the solder contact from solder pad to back-side of mcpcb.this one will cause a short circuit and damage emitter. place thermal comductive glue on the mcpcb. mcpcb manual hand soldering 3. 1. 6/12 page use soldering iron to solder the leads of emitter within 5 seconds. heat plate heat plate solder wire 4. soldering iron place emitter on the mcpcb. + - thermal conductive glue emitter l i g i t e k - + - 2. ligitek electronics co.,ltd. property of ligitek only
7/12 page ligitek electronics co.,ltd. property of ligitek only 0 rth(j-a)=60c/w rth(j-a)=50c/w rth(j-a)=40c/w rth(j-a)=30c/w f o r w a r d c u r r e n t ( m a ) 25 ambient temperature( ! c) 0 50 125 100 75 50 200 100 300 2.5 forward voltage(v) fig.2 operating current vs. ambient temperature 400 2.04.0 3.5 3.04.5 f o r w a r d c u r r e n t ( m a ) 100 200 fig.1 forward current vs. forward voltage 400 300
8/12 page ligitek electronics co.,ltd. property of ligitek only 0.2 r e l a t i v e l u m i n o u s f l u x ( % ) 0.6 r e l a t i v e f l u x ( % ) 120 100 80 60 40 20 -200 junction temperature( ! c) 0.2 0.4 1.2 0.8 1.0 1.6 1.4 1.8 amber if(ma) fig.4 junction temperature vs. forward voltage 2.0 0 300 200 100 500 400 0.4 0.6 0.8 1.2 1.0 fig.3 forward current vs. luminous flux
page9/12 ligitek electronics co.,ltd. property of ligitek only fig.6 directivity radiation fig.5 relative luminous flux vs. wavelength spectral radiance r e l a t i v e l u m i n o u s f l u x 50%100% 75% 25% 0 50%25% 100%75% 30 -30 -60 60 0 wavelength (nm)
10/12 page ligitek electronics co.,ltd. property of ligitek only l 3. 10 inner boxes / carton size : l x w x h 480cm x 240cm x 325cm c/no: made in china l w h i t e m n o . q ' t y : p c s n , w , : k g s g , w , : k g s 2. 20 tubes / inner box (10*2) size : l x w x h 460cm x 110cm x 60cm packing specification 4.76 16.6 0.56 2.2 1. 50pcs / tube anode 9.6 8 420
solder reflow process parameters: 1.reflow soldering of helixeon emitters requires effective control of heating and cooling. both the rate of heating and cooling and the absolute temperatures reached are critical in assuring the formation of a reliable solder joint while avoiding damage to the emitter during the reflow process. the recommended temperature profile of solder reflow process is shown below in the figure. page11/12 1-1. preheat set the temperature rising speed a at a rate of 1~5 /s. careful about rapid temperature rise in preheat zone as it may cause excessive slumping of the solder paste.appropriate preheat time b will be from 60 to 120 seconds. if the preheat is insufficient, rather large solder balls tend to be generated. conversely, if performed excessively, fine balls and large balls will generate in clusters at a time.appropriate preheat ending temperature c will be from 180 to 200 . if the temperature is too low, non-melting tends to be caused in the area with large heat capacity after reflow. 1-2. heating careful about sudden rise in temperature as it may worsen the slump of solder paste. set the peak temperature d in the range from 220 to 250 .adjust the melting time that the time over 220 , e, will be from 30 to 60 seconds. 1-3. cooling careful about slow cooling as it may cause the positional shift of parts and decline in joining strength at times. e a reflow soldering should not be done more than two times. b 120 sec.max. preheat 180~200 ! c 1~5 ! c/sec above 220 ! c 60 sec.max. 1~5 ! c/sec recommended soldering conditions 1. pb-free reflow solder c d 250 ! c max. 10sec.max ligitek electronics co.,ltd. property of ligitek only
page 12/12 ligitek electronics co.,ltd. property of ligitek only reliability test 1000 hours 120 ! c high temperature storage life htsl 260 5 ! c, 5secs 1500g,0.5msec pulse, 5 shocks each 6 axis on concrete from 1.2m, 3xtimes 6g rms from 10 to 2khz, 10mins/axis 10-2000-10hz, 20g 1 min, 1.5mm, 3timesx/axis note : failure criteria: electrical failures v f shife >= 10% i r < 50ua@vr = 5v ligitek output degradation %i v shift >= 30%@1000hrs or 200cycle visual failures broken or damaged pockage or lead dimension out of tolerance ltsl shr ms nd rv vvf variable vibration frequency random vibration natural drop low temperature storage life solder heat resistance mechanical shock -40 ! c1000 hours stress condition 25 ! c, max. i f -40/+110 ! c, 30min dwell,<5min trans. -40/+110 ! c, 20min dwell,<20min trans. 85 ! c/85%rh item rtol tc ts wht thermal shock temperature cycling wet high temperature room temperature operation life description 200 cycles 200 cycles 1000 hours test duration 1000 hours

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