cystech electronics corp. spec. no. : c857a3 issued date : 2013.03.26 revised date : page no. : 1/8 btd1304a3 cystek product specification npn epitaxial planar transistor bv ceo 20v audio muting application i c 500ma btd1304a3 features ? high emitter-base voltage, v ebo =12v(min). ? high reverse h fe , reverse h fe =20(min.) @v ce =2v, i c =4ma. ? low on-resistance, ron=0.6 (max)@i b =1ma. ? pb-free and halogen-free package. symbol outline btd1304a3 to-92 absolute maximum ratings (ta=25 c) parameter symbol limit unit collector-base voltage v cbo 50 v collector-emitter voltage v ceo 20 v emitter-base voltage v ebo 12 v collector current i c 500 ma base current i b 50 ma power dissipation p d 625 mw thermal resistance, junction to ambient r ja 200 c/w operating junction temperature range tj -55~+150 c storage temperature range tstg -55~+150 c r ce(sat) 0.3 (typ) b base e c b c collector e emitter
cystech electronics corp. spec. no. : c857a3 issued date : 2013.03.26 revised date : page no. : 2/8 btd1304a3 cystek product specification characteristics (ta=25 c) symbol min. typ. max. unit test conditions bv cbo 50 - - v i c =100 a, i e =0 bv ceo 20 - - v i c =1ma, i b =0 bv ebo 12 - - v i e =10 a, i c =0 i cbo - - 100 na v cb =40v, i e =0 i ebo - - 100 na v eb =12v, i c =0 *v ce(sat) - 34 100 mv i c =100ma, i b =10ma *v ce(sat) - 0.15 0.3 v i c =500ma, i b =20ma *r ce(sat) - 0.3 0.6 i c =500ma, i b =20ma *v be(sat) - 0.67 1 v i c =100ma, i b =10ma *h fe 1(for) 400 - 800 - v ce =2v, i c =4ma *h fe 2(for) 400 - - - v ce =3v, i c =100ma *h fe 3(rev) 20 - - - v ce =2v, i c =4ma f t - 250 - mhz v ce =10v, i c =50ma, f=100mhz cob - 10 - pf v cb =10v, f=1mhz ron - - 0.6 vin=0.3v, i b =1ma, f=1khz *pulse test : pulse width 300 s, duty cycle 2% ordering information device package shipping BTD1304A3-0-BK-G 1000 pcs/ bag, 10 bags/box, 10boxes/carton btd1304a3-0-tb-g to-92 (pb-free and halogen-free package) 2000 pcs / tape & box
cystech electronics corp. spec. no. : c857a3 issued date : 2013.03.26 revised date : page no. : 3/8 btd1304a3 cystek product specification typical characteristics emitter grounded output characteristics 0 0.1 0.2 0.3 0.4 0.5 0.6 0123456 collector-to-emitter voltage---vce(v) collector current---ic(a) 200ua 300ua 400ua 500ua 1ma ib=100ua emitter grounded output characteristics 0 0.2 0.4 0.6 0.8 1 1.2 1.4 0123456 collector-to-emitter voltage---vce(v) collector current---ic(a) ib= 500ua 1ma 1.5ma 2ma 5ma emitter grounded output characteristics 0 0.5 1 1.5 2 0123456 collector-to-emitter voltage---vce(v) collector current---ic(a) ib=2ma 20ma 4ma 6ma emitter grounded output characteristics 0 0.5 1 1.5 2 2.5 0123456 collector-to-emitter voltage---vce(v) collector current---ic(a) ib=5ma 10ma 20ma 50ma current gain vs collector current 100 1000 10 100 1000 collector current---ic(ma) current gain---hfe 75 25 125 vce=1v -25 current gain vs collector current 100 1000 10 100 1000 collector current---ic(ma) current gain---hfe 75 25 125 vce=2v -25
cystech electronics corp. spec. no. : c857a3 issued date : 2013.03.26 revised date : page no. : 4/8 btd1304a3 cystek product specification typical characteristics(cont.) current gain vs collector current 100 1000 10 100 1000 collector current---ic(ma) current gain---hfe 75 25 125 vce=3v -25 current gain vs collector current 100 1000 10 100 1000 collector current---ic(ma) current gain---hfe 75 -25 125 vce=10v 25 saturation voltage vs collector current 1 10 100 1000 1 10 100 1000 collector current---ic(ma) saturation voltage---(mv) vcesat=10ib 125c 75c 25c -25 saturation voltage vs collector current 10 100 1000 1 10 100 1000 collector current---ic(ma) saturation voltage---(mv) vcesat=20ib 125c 75c 25c -25 saturation voltage vs collector current 10 100 1000 1 10 100 1000 collector current---ic(ma) saturation voltage---(mv) vcesat=25ib 125c 75c 25c -25 saturation voltage vs collector current 100 1000 10000 1 10 100 1000 collector current---ic(ma) saturation voltage---(mv) 125 vbesat=10ib 75 25 -25
cystech electronics corp. spec. no. : c857a3 issued date : 2013.03.26 revised date : page no. : 5/8 btd1304a3 cystek product specification typical characteristics(cont.) saturation voltage vs collector current 100 1000 10000 1 10 100 1000 collector current---ic(ma) saturation voltage---(mv) 125 vbesat=20ib 75 -25 25 on voltage vs collector current 100 1000 10000 1 10 100 1000 collector current---ic(ma) on voltage---(mv) 125 vce=2v 75 25 -25 capacitance vs reverse-biased voltage 1 10 100 0.1 1 10 100 reverse-biased voltage---vr(v) capacitance---(pf) cib cob
cystech electronics corp. spec. no. : c857a3 issued date : 2013.03.26 revised date : page no. : 6/8 btd1304a3 cystek product specification to-92 taping outline millimeters dim item min. max. a component body height 4.33 4.83 d tape feed diameter 3.80 4.20 h2a h2a h2 h2 d2 a h w w1 h3 h4 h1 l1 l p2 p p1 f1 f2 d1 d t2 t t1 d1 lead diameter 0.36 0.53 d2 component body diameter 4.33 4.83 f1,f2 component lead pitch 2.40 2.90 f1,f2 f1-f2 - 0.3 h height of seating plane 15.50 16.50 h1 feed hole location 8.50 9.50 h2 front to rear deflection - 1 h2a deflection left or right - 1 h3 component height - 27 h4 feed hole to bottom of component - 21 l lead length after component removal - 11 l1 lead wire enclosure 2.50 - p feed hole pitch 12.50 12.90 p1 center of seating plane location 5.95 6.75 p2 4 feed hole pitch 50.30 51.30 t over all tape thickness - 0.55 t1 total taped package thickness - 1.42 t2 carrier tape thickness 0.36 0.68 w tape width 17.50 19.00 w1 adhesive tape width 5.00 7.00 - 20 pcs pitch 253 255
cystech electronics corp. spec. no. : c857a3 issued date : 2013.03.26 revised date : page no. : 7/8 btd1304a3 cystek product specification recommended wave soldering condition soldering time product peak temperature pb-free devices 260 +0/-5 c 5 +1/-1 seconds recommended temperature profile for ir reflow profile feature sn-pb eutectic assembly pb-free assembly average ramp-up rate (tsmax to tp) 3 c/second max. 3 c/second max. preheat ? temperature min(t s min) ? temperature max(t s max) ? time(ts min to ts max ) 100 c 150 c 60-120 seconds 150 c 200 c 60-180 seconds 183 c 60-150 seconds time maintained above: ? temperature (t l ) 217 c ? time (t l ) 60-150 seconds peak temperature(t p ) 240 +0/-5 c 260 +0/-5 c time within 5 c of actual peak 10-30 seconds 20-40 seconds temperature(tp) ramp down rate 6 c/second max. 6 c/second max. time 25 c to peak temperature 6 minutes max. 8 minutes max. note : all temperatures refer to topside of t he package, measured on the package body surface.
cystech electronics corp. spec. no. : c857a3 issued date : 2013.03.26 revised date : page no. : 8/8 btd1304a3 cystek product specification to-92 dimension *: typical inches d1304 marking: 3 1 a d b c i 1 e f 2 3 g h 2 s t yle: pin 1.emitter 2.colle ctor 3.ba se 3-l ead t o -9 2 plastic pa ckag e cys t ek pa ck a g e code: a 3 device nam e date co de m i l l i m e t e r s i n c h e s m i l l i m e t e r s dim m i n . m a x . m i n . m a x . dim m i n . m a x . m i n . m a x . a 0 . 1 7 0 4 0 . 1 9 0 2 4 . 3 3 4 . 8 3 g 0.0142 0 . 0 2 2 0 0 . 3 6 0 . 5 6 b 0 . 1 7 0 4 0 . 1 9 0 2 4 . 3 3 4 . 8 3 h - * 0 . 1 0 0 0 - * 2.54 c 0 . 5 0 0 0 - 1 2 . 7 0 - i - * 0 . 0 5 0 0 - * 1.27 d 0 . 0 1 4 2 0 . 0 2 2 0 0 . 3 6 0 . 5 6 1 - * 5 - * 5 e - * 0 . 0 5 0 0 - * 1.27 2 - * 2 - * 2 f 0 . 1 3 2 3 0 . 1 4 8 0 3 . 3 6 3 . 7 6 3 - * 2 - * 2 note s: 1.controlling dimension: millimeter s. 2.maximum lead thickness include s lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 3.if there is an y q uestion w i th p a ck ing specification or p a cking metho d , please c ont act y our local c y s t ek sales of fice. material: ? lead: pur e tin plated. ? mold compou n d : epoxy resin fa mily , flammabilit y solid burning cla ss: ul94v -0. im portan t n o tice : ? all rights are re served. reprod u c tion in w hole or in part is prohibited w i thout the p r ior w r itten a pprov al of c y stek. ? c y stek reserv es the right to m a ke changes to its products w i tho u t notice. ? cy st e k semic ond uct o r pr odu cts are n o t warr ante d t o be s u it able f o r use i n l i fe-su p p o rt a p p licatio ns, or sys tems. ? c y stek assumes no liability fo r an y consequenc e of customer pr oduct design, infringement of pat e n ts, or application assistance .
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