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  this is information on a product in full production. march 2014 docid17500 rev 4 1/10 lcp12 protection ic for ringing slics datasheet ? production data features ? protection ic recommended for ringing slics ? wide firing voltage range: -120 v to +120 v ? low gate triggering current: i g = 5 ma max ? peak pulse current: i pp = 50 a (10/1000 s) ? holding current: i h = 150 ma min. applications ? dual battery supply voltage slics ? central office (co) ? private branch exchange ( pbx) ? digital loop carrier (dlc) ? digital subscriber line access multiplexer (dslam) ? fiber in the loop (fitl) ? wireless local loop (wll) ? hybrid fiber coax (hfc) ? isdn terminal adapter ? cable modem tm: trisil is a trademark of stmicroelectronics description the lcp12 has been developed to protect slics operating on both negative and positive battery supplies, as well as high voltage slics. it provides crowbar mode protection for both tip and ring lines. the surge suppression is assumed for each wire by two thyristor structures, one dedicated to positive surges the second one for negative surges. both positive and negative threshold levels are programmable by two gates. lcp12 can be used to help equipment to meet various standards such as ul1950, iec 60950 / csac22.2, ul1459 and tia-968-a. lcp12 pinout and clearance is compatible with ul60950. resin meets ul94 v0. lcp12 is ul497b approved - file: e136224. the lcp12 associated with epcos ptc model b59173c1130a151 is compliant with itu tk20/k21 (4 kv lightning and ac power fault tests). figure 1. functional diagram figure 2. pin-out configuration so-8 wide lcp12 gn tip gp gnd ring gnd tip ring g p g n nc nc gnd www.st.com
characteristics lcp12 2/10 docid17500 rev 4 1 characteristics table 1. compliant with the following standards standard peak surge voltage (v) voltage waveform required peak current (a) current waveform minimum series resistor rs to meet standard ( ? ) gr-1089 core first level 2500 1000 2/10 s 10/1000 s 500 100 2/10 s 10/1000 s 12 10 gr-1089 core second level 5000 2/10 s 500 2/10 s 24 gr-1089 core intra-building 1500 2/10 s 100 2/10 s 0 itu-t-k20/k21 6000 4000 1500 10/700 s 150 100 37.5 5/310 s 35 10 0 itu-t-k20 (iec61000-4-2) 8000 15000 1/60 ns esd contact discharge esd air discharge 0 0 iec61000-4-5 4000 4000 10/700 s 1.2/50 s 100 100 5/310 s 8/20 s 14 0 tia-968-a (formerly fcc part 68) type a 1500 800 10/160 s 10/560 s 200 100 10/160 s 10/560 s 20 15 tia-968-a (formerly fcc part 68) type b 1000 9/720 s 25 5/320 s 0 table 2. absolute maximum ratings (t amb = 25 c) symbol parameter value unit i pp peak pulse current 10/1000 s 5/310 s 2/10s 50 80 150 a i tsm non repetitive surge peak on-state current (f = 50 hz) i tsm value specified for each line i tsm value can be applied on both lines at the same time (gnd capability is twice the line i tsm ) t p = 0.2 s t p = 1 s t p = 15 min. 11 7.5 3 a v gn v gp negative battery voltage range positive battery voltage range -120 to 0 0 to +120 v t j operating junction temperature range -40 to +125 c t stg storage temperature range -55 to +150 c t l lead solder temperature (10 s duration) 260 c
docid17500 rev 4 3/10 lcp12 characteristics 10 figure 3. pulse waveform 100 50 %i pp t t r p 0 t table 3. thermal resistance symbol parameter value unit r th(j-a) junction to ambient 150 c/w table 4. parameters related to the negative suppressor symbol parameter test conditions min. max. unit i gn negative gate trigger current v gn/gnd = -60 v measured at 50 hz 5ma i h- holding current (see figure 4 )v gn = -60 v 150 ma v dgl- dynamic switching voltage gn / tip or ring (1) v gn/gnd = -60 v v 10/700 s 1.2/50 s 2 kv 2 kv r s = 25 ? r s = 25 ? i pp = 30 a i pp = 30 a 8 12 v gnt g n to tip voltage i gn = 20 ma 0.7 1.7 v 1. the v dgl value is the difference between the peak line voltage during the surge and the programmed gate voltage. table 5. parameters related to the positive suppressor symbol parameter test conditions min. max. unit i gp positive gate trigger current v gp/gnd = 60 v, measured at 50 hz 5 ma v dgl+ dynamic switching voltage gp / tip or ring (1) v gp/gnd = 60 v v 10/700 s 1.2/50 s 2 kv 2 kv r s = 25 ? r s = 25 ? i pp = 30 a i pp = 30 a 8 20 v gpr g p to ring voltage i gp = -20 ma 1 2 v 1. the v dgl value is the difference between the peak line voltage during the surge and the programmed gate voltage. table 6. parameters related to tip or ring / gnd symbol parameter test conditions min. max. unit i r reverse leakage current v tip or ring = +120 v v tip or ring = -120 v v gp/tip or ring = +1 v v gn/tip or ring = -1 v 5 5 a c capacitance tip or ring / gnd v r = -3 v, f =1 mhz, v gp = 60 v, v gn = -60 v 60 pf
characteristics lcp12 4/10 docid17500 rev 4 figure 4. relative variation of holding current versus junction temperature figure 5. maximum non repetitive surge peak on state current versus overload duration figure 6. capacitance versus reverse applied voltage (typical values) with v gn = -90 v and v gp = +90 v table 7. recommended gate capacitance symbol component min. typ. max. unit c n , c p gate decoupling capacitance 100 220 nf 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 -40 -20 0 20 40 60 80 100 120 i h [t j ]/i h [t j =25 c] t (c) 0 2 4 6 8 10 12 14 16 18 20 0.01 0.1 1 10 100 1000 f = 50 hz t j initial=25 c t(s) i tsm (a) 20 40 60 80 100 0 10 20 30 40 50 60 70 vline (v) c (pf) line + line -
docid17500 rev 4 5/10 lcp12 technical information 10 2 technical information figure 7. lcp12 concept behavior figure 7 shows the classical protection circuit using the lcp12 crowbar concept. this topology has been developed to protect two-battery voltage slics. it allows both positive and negative firing thresholds to be programmed. the lcp12 has two gates (gn and gp). gn is biased to negative battery voltage -vbat, while gp is biased to the positive battery voltage +vb. when a negative surge occurs on one wire (l1 for example), a current ign flows through the base of the transistor t1 and then injects a current in the gate of the thyristor th1 which turns-on. all the surge current flows through the ground. after the surge, when the current flowing through th1 becomes less negative than the negative holding current i h- , th1 switches off. this holding current i h- is temperature dependent as per figure 4 when a positive surge occurs on one wire (l1 for example), a current igp flows through the base of the transistor t2 and then injects a current in the gate of the thyristor th2 which fires. all the surge current flows through the ground. after the surge, when the current flowing through th2 becomes less positive than the positive holding current i h+ , th2 switches off. this holding current i h+ , typically 20 ma at 25 c, is temperature dependent and the same figure 4 also applies. the capacitors cn and cp are used to speed up the crowbar structure firing during the fast rise or fall edges. this allows minimization of the dynamic breakover voltage at the slic tip and ring inputs during fast surges. please note that these capacitors are generally available around the slic. to be efficient they have to be as close as possible to the lcp12 gate pins (gn and gp) and to the reference ground track (or plan). the optimized value for cn and cp is 220 nf. the series resistors rs shown in figure 7 represent the fuse resistors or the ptcs which are needed to withstand the power contact or the power induction tests imposed by the country standards. taking this factor into account, the actual lightning surge current flowing through the lcp12 is equal to: i surge = vsurge / (rg + rs) with v surge = peak surge voltage imposed by the standard. rg = series resistor of the surge generator rs = series resistor of the line card (e.g. ptc) cp gn tip ring gp gnd -vbat +vb cn rs1 rs2 l 1 l 2 gnd v tip th1 th2 t1 t2 ign igp v ring
technical information lcp12 6/10 docid17500 rev 4 for a line card with 50 of series resistors which has to be qualified under gr-1089 1000 v 10/1000 s surge, the present current through the lcp12 is equal to: i surge = 1000 / (10 + 50) = 17 a the lcp12 topology is particularly optimized for the new telecom applications such as fiber in the loop, wll systems, and decentralized central office, for example. figure 8. protection of slic with positive and negative battery voltages figure 8 shows the classical protection topology for slic using both positive and negative battery voltages. with such a topology the slic is protected against surge over +vb and lower than -vbat. in this case, +vb can be programmed up to +120 v while -vbat can be programmed down to -120 v. gn gp gnd tip ring -vbat +vb lcp12 220nf slic rs (*) rs (*) line line card tip ring 220nf rs (*) = ptc or resistor fuse
docid17500 rev 4 7/10 lcp12 package information 10 3 package information ? epoxy meets ul94, v0 ? lead-free package in order to meet environmental requirements, st offers these devices in different grades of ecopack ? packages, depending on their level of environmental compliance. ecopack ? specifications, grade definitions and product status are available at: www.st.com . ecopack ? is an st trademark. figure 9. so-8 wide dimension definitions l k d a1 e1 a a2 b 8 4 1 5 e c e
package information lcp12 8/10 docid17500 rev 4 figure 10. so-8 wide footprint in mm (inches) table 8. so-8 wide dimension values ref. dimensions millimeters inches min. max. min. max. a 1.70 1.90 2.10 0.07 0.07 0.08 a1 0.05 0.10 0.25 0.00 0.00 0.01 a2 1.65 1.80 1.75 0.06 0.07 0.07 b 0.38 0.43 0.48 0.01 0.02 0.02 c 0.15 0.20 0.25 0.01 0.01 0.01 d 5.14 5.24 5.34 0.02 0.021 0.21 e 5.20 5.30 5.40 0.02 0.021 0.21 e1 7.70 7.80 8.25 0.30 0.031 0.32 e 1.27 0.05 0.05 k 8.00 0.14 0.31 l 0.55 0.75 0.85 0.02 0.03 0.03 4.33 (0.170) 1.27 (0.050) 0.52 (0.020) 8.38 (0.330) 5.78 (0.228)
docid17500 rev 4 9/10 lcp12 ordering information 10 4 ordering information 5 revision history table 9. ordering information order code marking package weight base qty delivery mode LCP12-150b1rl lcp12 so-8 wide 0.125g 1500 tape and reel table 10. document revision history date revision changes 14-may-2010 1 initial release. 23-feb-2012 2 updated dimensions in table 8 . standardized nomenclature for gn and gp. 18-jun-2012 3 updated dimension d in so-8 wide. 20-mar-2014 4 updated description , table 6 and package information formatting.
lcp12 10/10 docid17500 rev 4 please read carefully: information in this document is provided solely in connection with st products. stmicroelectronics nv and its subsidiaries (?st ?) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described he rein at any time, without notice. all st products are sold pursuant to st?s terms and conditions of sale. purchasers are solely responsible for the choice, selection and use of the st products and services described herein, and st as sumes no liability whatsoever relating to the choice, selection or use of the st products and services described herein. no license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. i f any part of this document refers to any third party products or services it shall not be deemed a license grant by st for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoev er of such third party products or services or any intellectual property contained therein. unless otherwise set forth in st?s terms and conditions of sale st disclaims any express or implied warranty with respect to the use and/or sale of st products including without limitation implied warranties of merchantability, fitness for a particular purpose (and their equivalents under the laws of any jurisdiction), or infringement of any patent, copyright or other intellectual property right. st products are not designed or authorized for use in: (a) safety critical applications such as life supporting, active implanted devices or systems with product functional safety requirements; (b) aeronautic applications; (c) automotive applications or environments, and/or (d) aerospace applications or environments. where st products are not designed for such use, the purchaser shall use products at purchaser?s sole risk, even if st has been informed in writing of such usage, unless a product is expressly designated by st as being intended for ?automotive, automotive safety or medical? industry domains according to st product design specifications. products formally escc, qml or jan qualified are deemed suitable for use in aerospace by the corresponding governmental agency. resale of st products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by st for the st product or service described herein and shall not create or extend in any manner whatsoev er, any liability of st. st and the st logo are trademarks or registered trademarks of st in various countries. information in this document supersedes and replaces all information previously supplied. the st logo is a registered trademark of stmicroelectronics. all other names are the property of their respective owners. ? 2014 stmicroelectronics - all rights reserved stmicroelectronics group of companies australia - belgium - brazil - canada - china - czech republic - finland - france - germany - hong kong - india - israel - ital y - japan - malaysia - malta - morocco - philippines - singapore - spain - sweden - switzerland - united kingdom - united states of america www.st.com


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