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| SOP-8FD packaging information reference pattern layout dimension unit: mm packaging information / reference pattern layout dimensions 3.90.1 6.00.2 0.4 min 0 0.11 1.45 1.550.2 (2.4)
SOP-8FD reel taping specifications taping specifications unit: mm 1,000pcs/reel r type :[device orientation : right] standard feed direction of feed SOP-8FD power dissipation power dissipation data for the SOP-8FD is shown in this page. the value of power dissipation varies with the mount board conditions. please use this data as one of reference data taken in the described condition. 40.0 2.54 1.4 28.9 1. measurement condition (reference data) condition: mount on a board ambient: natural convection soldering: lead (pb) free board: dimensions 40 x 40 mm (1600 mm2 in one side) copper (cu) traces occupy 50% of the board area in top and back faces package heat-sink is tied to the copper traces material: glass epoxy (fr-4) thickness: 1.6 mm through-hole: 4 x 0.8 diameter evaluation board (unit: mm) 2. power dissipation vs. ambient temperature (85 ) board mount (tj max = 125 ) p 3. power dissipation vs. ambient temperature (105 ) board mount (tj max = 125 ) ambient temperature power dissipation pd mw thermal resistance (/w) 25 1500 85 600 66.67 d-ta? 0 200 400 600 800 1 000 1200 1400 1600 25 45 65 85 105 125 pd-ta 0 200 400 600 800 000 1200 400 1600 25 45 65 85 105 125 ambient temperature power dissipation pd mw thermal resistance (/w) 25 1500 105 300 66.67 1 1 S?p?pdmw ? ?ta ? ?ta S?p?pdmw ambient tem p erature ta power dissipation pd mw pd vs. ta power dissipation pd mw pd vs. ta ambient tem p erature ta rohs ? rohs com p liance ? ? item material note ?? ?? y?` /flammability rating resin epoxy resin ul94v-0 `??` ~? lead frame copper alloy ?I U?`?? lead plating lead(pb) free solder plating ? ? die attach epoxy ???? au bonding wire ?? si si ?? `` marking laser marking SOP-8FD SOP-8FD perspective ver.00 |
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