- patented trench schottky technology - low power loss, high efficiency - ideal for automated placement - high surge current capability - halogen-free according to iec 61249-2-21 definition molding compound, ul flammability classification rating 94v-0 packing code with suffix "g" means green compound (halogen-free) terminal: matte tin plated leads, solderable per jesd22-b102 meet jesd 201 class 2 whisker test symbol unit v rrm v i f(av) a t j = 25c v f t j = 125c v f t j = 25c a t j = 125c ma r jl r ja t j c t stg c document number: ds_d1411075 version: c15 mechanical data case: do-214ac (sma) do-214ac (sma) features 3a, 60v trench schottk y rectifier - moisture sensitivity level: level 1, per j-std-020 - compliant to rohs directive 2011/65/eu and in accordance to weee 2002/96/ec weight: 0.06g (approximately) maximum repetitive peak reverse voltage maximum average forward rectified current 3 maximum ratings and electrical characteristics (t a =25c unless otherwise noted) parameter TSSA3U60 a3u60 12 30 typical thermal resistance peak forward surge current, 8.3 ms single half sine-wave superimposed on rated load i fsm 0.48 0.54 maximum instantaneous reverse current at rated reverse voltage i r 0.50 v typ. max. maximum instantaneous forward voltage (note 1) i f = 3a 0.41 a storage temperature range - 55 to +150 note 1: pulse test with pulse width=300 s, 1% duty cycle marking code operating temperature range - 55 to +150 70 c/w polarity: indicated by cathode band TSSA3U60 27 60 60 - 500
(t a =25c unless otherwise noted) document number: ds_d1411075 version: c15 TSSA3U60 taiwan semiconductor e3 clip sma 1,800 / 7" plastic reel e2 clip sma 7,500 / 13" plastic reel ratings and chatacteristics curves ordering information packing code suffix package packing TSSA3U60 g TSSA3U60 e3g TSSA3U60 e3 g green compound part no. packing code preferred part no. part no. packing code packing code suffix description example 0 1 2 3 4 0 25 50 75 100 125 150 average forward current (a) lead temperature ( o c) fig.1 forward current derating curve with heatsink 5mm x 5mm pad pcb 0.1 1 10 100 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 instantaneous forward current (a) forward voltage (v) fig. 2 typical forward characteristics t j =25 c t j =100 c t j =125 c t j =150 c 0.001 0.01 0.1 1 10 100 10 20 30 40 50 60 70 80 90 100 instantaneous reverse current (ma) percent of rated peak reverse voltage (%) fig. 3 typical reverse characteristics t j =25 c t j =100 c t j =125 c t j =150 c 10 100 1000 10000 0 1 10 100 junction capacitance (pf) a reverse voltage (v) fig.4 typical junction capacitance f=1.0mhz vsig=50mvp-p
min max min max a 1.27 1.58 0.05 0.062 b 4.06 4.6 0.16 0.181 c 2.29 2.84 0.09 0.111 d 1.99 2.5 0.078 0.098 e 0.9 1.41 0.035 0.056 f 4.95 5.33 0.195 0.21 g 0.1 0.2 0.004 0.008 h 0.15 0.31 0.006 0.012 p/n = marking code g = green compound yw = date code f = factory code document number: ds_d1411075 version: c15 TSSA3U60 taiwan semiconductor unit (mm) 1.68 package outline dimensions dim. unit(mm) unit(inch) c d a b1.52 unit (inch) 0.066 symbol 2.41 do-214ac (sma) 0.060 0.155 marking diagram e 3.93 5.45 0.095 0.215 suggested pad layout 0 20 40 60 80 1 10 100 current (a) number of cycles at 60 hz fig. 5 maximum non-repetitive forward surge current 8.3ms single half sine wave
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