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| so t362-1_fp ? k oninklijk e philips electronics n.v . 2004. all r ights reser v ed. pdf 8 october 2004 1 of 1 philips semiconductors pc board footprint dimensions in mm ay by d1 d2 gy hy p1 8.900 6.100 1.400 0.280 c 0.400 12.270 7.000 gx 9.150 hx 14.100 0.500 sot362-1 solder land occupied area footprint information for reflow soldering of TSSOP48 package ay by gy c hy hx gx p1 generic footprint pattern refer to the package outline drawing for actual layout p2 (0.125) (0.125) d1 d2 (4x) p2 0.560 http://
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