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june 2014 docid025707 rev 2 1/21 TN1163 technical note description of wlcsp for microcontrollers and recommendations for use introduction this document describes the wlcsp (wafer level chip size package), and provides recommendation on how to use it. only wlc sp for microcontrollers are described herein. the competitive market of portable equipment, in particular the mobile phone market, is driven by the challenging development of highly integrated devices. to allow manufacturers of portable equipment to minimize the dimens ion of their devices, stmicroelectronics has developed wlcsp with reduced size, thickness and weight. the electrical performance of such components is improved by using shorter connections than in standard plastic packages such as t ssop, ssop or bga. the wlcsp family has been desi gned to fulfill the same qualit y levels and same reliability performance as standard semiconductor plas tic packages. as a consequence these new wlcsp can be considered as new surface mount devices which are assembled on a printed circuit board (pcb) without any special or additional process steps. in particular these packages do not require an y extra underfill to increase reliability performance or to protect the device. these packages are compat ible with existing pick -and-place equipment for board mounting. only lead-free rohs compliant wlcsp are available in mass production. the packages offe red in wlcsp are listed in table 1 . this document addresses the following topics: ? package description ? device marking ? packing specifications and labeling ? storage and shipping recommendations ? soldering assembly recommendations ? package changes and package quality www.st.com
contents TN1163 2/21 docid025707 rev 2 contents 1 list of wlcsp packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 2 package description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 2.1 overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 2.2 mechanical description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 2.3 device marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 3 packing specifications and la belling description . . . . . . . . . . . . . . . . 10 3.1 carrier tape . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 3.2 cover tape . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .11 3.3 reels . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .11 3.4 final packing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 3.5 labelling . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 3.6 storage and shipping recommendations . . . . . . . . . . . . . . . . . . . . . . . . . 13 4 soldering assembly recommendations . . . . . . . . . . . . . . . . . . . . . . . . 14 4.1 pcb design recommendations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 4.2 pcb assembly guidelines . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 4.2.1 protection against light exposure . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 4.2.2 underfilling . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 5 manual rework . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 5.1 rework procedure . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 5.2 component rework equipment . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 6 package changes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 7 package quality and reliability . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 7.1 electrical inspection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 7.2 visual inspection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 7.3 wlcsp reliability . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 8 conclusion . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
docid025707 rev 2 3/21 TN1163 contents 3 9 revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
list of tables TN1163 4/21 docid025707 rev 2 list of tables table 1. wlcsps for microcontrollers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 table 2. matrix 8 x 8 bump dimension wlcsp . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 table 3. tape cavity size . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 table 4. 7 and 13 inch reel dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 table 5. pcb design recommendation for 0.5 mm ball pitch packages . . . . . . . . . . . . . . . . . . . . . . 14 table 6. pcb design recommendation for 0.4 mm ball pitch packages . . . . . . . . . . . . . . . . . . . . . . 14 table 7. document revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
docid025707 rev 2 5/21 TN1163 list of figures 5 list of figures figure 1. wlcsp top and bump views . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 figure 2. matrix 8 x 8 bump array wlcsp . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 figure 3. wlcsp device marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 figure 4. typical tape dimensions for wlc sps . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 figure 5. 7 and 13 inch reel schematics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 figure 6. packing process . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 figure 7. soldering reflow profile used for all st wlcsp qu alifications . . . . . . . . . . . . . . . . . . . . . . 15 figure 8. comintec onyx32 semi-aut omatic equipment for component rewo rk. . . . . . . . . . . . . . . . 17
list of wlcsp packages TN1163 6/21 docid025707 rev 2 1 list of wlcsp packages table 1. wlcsps for microcontrollers package description pitch ( m) ball diameter ( m) wlcsp28 wlcsp28 package 400 270 wlcsp36 wlcsp36 package 400 250 wlcsp49 wlcsp49 package 400 250 wlcsp63 wlcsp63 package 400 270 wlcsp64 wlcsp64 package 500 320 wlcsp64 400 270 wlcsp72 wlcsp72 package 400 250 wlcsp66 wlcsp66 package 400 270 wlcsp90 wlcsp90 package 400 270 wlcsp104 wlcsp104 package 400 250 wlcsp143 wlcsp143 package 400 250 wlcsp168 wlcsp168 package 400 250
docid025707 rev 2 7/21 TN1163 package description 20 2 package description 2.1 overview st wlcsp packages are manufactured with a wafer level process by attaching solder balls on i/os pads of the active wafer side, thus allowing bumped dice to be produced. the i/o contacts can be either configured as a matrix or located in the periphery. a redistribution layer is used. lead-free balls are manufactured using sac (s nagcu) alloy with a near-eutectic melting point ranging 217 to 221 c. this material makes the package compatible with standard reflow processes. the ball diameter allows to use pick-and-plac e process compatible with existing equipment, in particular with equipment used for ball gr id array (bga) packages. it also makes it compatible with the pcb design rules used for standard ics. the devices available in wlcsp are delivered in tape and reel packing with the bumps turned down (placed on the bottom of the carrier tape cavity). the other face of the device is flat and allows picking it as for standard smd packages. caution: wlcsp must be handled with care as active silicon substrate is not protecte d against aggressive mechanical actions. vacuum plas tic pick-up tools are recommended for device handling. wlcsp devices are 100 % electrically tested after assembly . the device references are marked on the top flat side of the device (see figure 1 ). figure 1. wlcsp top and bump views
package description TN1163 8/21 docid025707 rev 2 2.2 mechanical description an example of wlcsp outline and mechanical dimensions is given in figure 2 and table 2 . die size and ball count are adapted to the connection requirements. refer to device datasheet for package mechanical data and outline. the wlcsp tolerances on ball diameter and ball height are very low. this constant ball shape insures a good coplanarity between ba lls. optical measurements performed through vertical focuses show a ball-plus -die coplanarity well below 50 m. figure 2. matrix 8 x 8 bump array wlcsp g typical device marking for the flat backside of the die is shown on figure 3 . wlcsp ball 1 is identified by the a1 pin marked on the flat backside of the die so that the orientation of the component can be easily determined before and after assembly. this dot has been designed so that it can be detected by standard vision systems. table 2. matrix 8 x 8 bump dimension wlcsp symbol typical (mm) a0.585 a2 0.230 c3.500 d0.320 e3.500 e1 0.500 d1 0.483 d2 0.448 e # e % ?$ ! ! !) d d
docid025707 rev 2 9/21 TN1163 package description 20 2.3 device marking the standard top-side laser marking contains: ? pin 1 identification ? st logo ? marking areas composed of: ? commercial product name ? traceability code ? wafer fab code ? testing and finishing production location codes ? country where the product was assembled figure 3. wlcsp device marking
packing specifications and labelling description TN1163 10/21 docid025707 rev 2 3 packing specifications and labelling description wlcsp devices are delivered in tape and reel to be fully compatible with standard high volume smd components. all tape and reel characteristics are compliant with eia-481-c and iec 60286-3 standards and eia 763 (783). 3.1 carrier tape the wlcsp are placed in carrier tapes with their ball side facing the bottom of the cavity so that the devices can be picked up by their flat side. no flipping of the package is required for mounting on the pcb. the devices are positi oned in the carrier tape with pin a1 on the sprocket hole side. an example of carrier tape mechanical dimensions is shown in figure 4. the standard tape width is 8 mm for die size sma ller than 3 mm (dimension b0). note: 12 mm carrier tape width may be used for larger die size to be in line with eia standards. figure 4. typical tape dimensions for wlcsps the cavities in the carrier tape have been designed to avoid damaging the components. no hole is present in the cavity to avoid any impa ct or any external contamination of the solder bumps. refer to table 3 for the cavity dimension according to the die size. the embossed carrier tape is in a black conducti ve material (surface resistivity within 10e4 and 10e8 /sq). using this material prevents the component from being damaged by electrostatic discharge and ensures the total discharge of the component prior to the placement on the pcb. conductivity is guarant eed to be constant and is not affected by shelf life or humidity. the material does no t break when bent and does not have any powder or flake residue that rubs off. !)c $o )) 0o % 7 !o &))) ) 0 0 9 9 ! $ ?-). 4 +o "o 3%#4)/.9 9 2 2 $%4!),! -easuredfromcentrelineofsprockethole tocentrelineofpocket #umulativetoleranceofsprocket holesis? -easuredfromcentrelineofsprocket holetocentrelineofpocket ) )) ))) )6 /thermaterialavailable !,,$)-%.3)/.3).-),,)-%42%35.,%33/4(%27)3%34!4%$ 7 & 0 %stimatedmaxlength meter"reel &ormingformat&latbed "o +o !o or !bump
docid025707 rev 2 11/21 TN1163 packing specifications and labelling description 20 3.2 cover tape the carrier tape is sealed with a transparent antistatic (surface resistivity ranging from 10e5 /sq to 10e12 /sq) polyester film cover tape us ing a heat activated adhesive. the cover tape tensile strength is higher than 10 n. the peeling force of the cover tape ranging fr om 0.1 n to 0.7 n in accordance with the testing method eia-481-c and iec 60286-3. co ver tape is peeled back in the direction opposite to the carrier tape travel. the angle between the cover tape and the carrier tape is between 165 and 180 , and the test is performed at a speed of 120 10 % mm/min. 3.3 reels the sealed carrier tape containing the wlcsp is reeled on 7 inch or 13 inch reels (see figure 5 and table 4 for reel mechanical dimensions). these reels are compliant with eia- 481-c standard. in particular, they are made of an antistatic polystyrene material. the reel color may vary depending on supplier. dice quantity per reel is 3000 (with typical package thickness equal to 650 m). in compliance with the iec 60286-3, each reel contains a maximum of 0.1 % empty cavities. two successive empty cavities are not allowed. a reel may contain devices coming from 2 different wafer lots. the reels have a minimum leader of 600 mm and a minimum trailer of 160 mm (in compliance with eia-481-c and iec 60286-3 standards). the leader makes up a portion of carrier tape with empty cavities and sealed by cover tape at the beginning of the reel (external side). it is affixed to the last turn of the carrier tape by using adhesive tape. the trailer is located at the end of the reel and consists of empty sealed cavities. table 3. tape cavity size die dimensions tape cavity dimension (a0 and b0) die with both sides 1.5 mm die side size + 70 m die with one side > 1.5 mm cavity dimensions must ensur e that component rotation cannot exceed 5 max.
packing specifications and labelling description TN1163 12/21 docid025707 rev 2 figure 5. 7 and 13 inch reel schematics -). # . 2%& ! 2%& 7 7 $ 530!4 -)..%!0/,)353! 2 !44%.4)/. %lectrostatic3ensitive$evices 3afe(andling2equired ,/+2%%, 2 !)c 7 table 4. 7 and 13 inch reel dimensions reel w1 (mm) (1)(2) w2 (mm) (2) w3 (mm) a (mm) c (mm) d n (mm) 7?? 12.8 (typ) 18.2 (max) 12 177.8 (typ.) 13.0 (3) 20.2 mm (min) 100.0 (typ) 16.8 (typ) 22.2 (max) 16 24.8 (typ) 30.2 (max) 24 32.8 (typ) 38.2 (max) 32 44.8 (typ) 50.2 (max) 44 13?? 8.4 (typ) 14.4 (max) 8 330.0 (typ.) 13.0 (4) 20.2 mm (min) 100.0 (typ) 12.4 (typ) 18.4 (max) 12 16.4 (typ) 22.4 (max) 16 24.4 (typ) 30.4 (max) 24 32.4 (typ) 38.4 (max) 32 44.4 (typ) 50.4 (max) 44 13.0 (5) 1. +0.6 mm, - 0.4 mm. 2. measured at the hub. 3. +0.5 mm, - 0.2 mm. 4. 0.25 mm. 5. + 0.5 mm, - 0.2 mm.
docid025707 rev 2 13/21 TN1163 packing specifications and labelling description 20 3.4 final packing each reel is heat-sealed under inert atmosphere in a transparent recyclable antistatic polyethylene bag (minimum of 4 mils mate rial thickness). reels are then packed in cardboard boxes. a full description of the packing process is shown in figure 6 . figure 6. packing process 3.5 labelling to trace each production lot and shipment lot, the 7 inch reels and the cardboard box are identified by labels that mention the devi ce part number, the shipped quantity and traceability information. the trace code printed on the labels ensures backward traceab ility from the lot received by the customer to each step of the process. it includes in/ out dates, as well as quantities during diffusion, assembly, test phase, and in th e final storage. likewis e, forward traceability is able to trace a lot history from the wafer fab to the customer location. 3.6 storage and shippi ng recommendations wlcsp reels are packed under inert n2 atmosphere in a sealed bag. for shipment and handling, reels are packed in a cardboard box. st consequently recommends the following shipping and storage conditions: ? relative humidity between 15 and 70 % ? temperature ranging from -55 to +150 c. ? components in a non opened sealed bag can be stored for 6 months after shipment. ? components in tape and reel must be protected from exposure to direct sunlight. note: moisture sensitivit y level (msl as per jedec j-std-020) is not applicable to wlcsp devices since there is no plastic encapsulation.
soldering assembly recommendations TN1163 14/21 docid025707 rev 2 4 soldering assembly recommendations 4.1 pcb design recommendations for optimum electrical performance and highly reliable solder joints, st recommends to follow the pcb design guidelines listed in table 5 and table 6 . pcb pad positioning and size must properly de signed to optimize the natural self-centering effect of the wlcsp on the pcb. note: a too thick gold layer fini shing on the pcb pad is not recommended since it results in low joint reliability. micro vias an alternative to routing on the top surface is to route out on buried layers. to achieve this, the pads must be connected to the lower layers using micro vias. 4.2 pcb assembly guidelines to mount a wlcsp on a pcb, st recommends the use of a solder stencil with an aperture of 330 x 330 m2 maximum and a stencil typical thickness of 125 m. wlcsp are fully compatible with the use of near-eutecti c sac solder paste with no-clean flux. st's recommendations for wlc sp board mounting are illustra ted on the soldering reflow profile shown in figure 7 : ? dwell time in the soldering zone (with temperature higher than 220 c) has to be kept as short as possible to prevent component and substrate damages. ? peak temperature must not exceed 260 c. ? controlled atmosphere (n 2 or n 2 h 2 ) is recommended during the whole reflow, especially when the temperature is above 150 c. wlcsp can withstand three times the prev ious recommended reflow profile to be compatible with a double reflow when smds are mounted on both sides of the pcb plus one additional repair. table 5. pcb design recommendation for 0.5 mm ball pitch packages pcb design list recommendation pcb pad design non-solder mask defined micro via underbump allowed pcb pad size ? = 300 m max (circular) - 250 m recommended solder mask opening ? = 340 m min (for 300 m diameter pad) table 6. pcb design recommendation for 0.4 mm ball pitch packages pcb design list recommendation pcb pad design non-solder mask defined micro via underbump allowed pcb pad size ? = 260 m max (circular) - 220 m recommended solder mask opening ? = 300 m min (for 260 m diameter pad)
docid025707 rev 2 15/21 TN1163 soldering assembly recommendations 20 a maximum of three soldering reflows are allowed for these lead-free packages (with repair step included). the use of a no-clean flux is highly reco mmended to avoid any cleaning operation. to prevent any bump cracks, ultrasonic cleaning methods are not recommended. figure 7. soldering reflow profile us ed for all st wlcsp qualifications 4.2.1 protection agai nst light exposure wlcsp, when placed in a non-opaque housing for specific customer application, may be exposed to various light sources such as incandescent light or sun light. the wlcsp light sensitivity may interfere with the device ope ration by generating unwelcome electrical currents/voltages, performance degradation, malfunction or shutdown.it is therefore mandatory to protect wlcsp with an opaque layer to prevent light from entering the semiconductor substrate through the top side (marking side) and the lateral edges of device. 4.2.2 underfilling underfilling is not required fo r wlcsps. however, the devic es can dispense with an underfill if the proc ess temperature do es not exceed 175 c and th e process time is short (typically 5 min.). !) 4emperature?# ?#max ?# ?# ?# ?# ?#smax tosec sec secmax ?#srecommended ?#smax 4imemin
manual rework TN1163 16/21 docid025707 rev 2 5 manual rework wlcsp can tolerate one repair in addition to the two reflows mentioned above. like other bga packages, the use of laser systems is the most suitable solution to repair wlcsp. manual hot gas soldering is acceptab le while iron solderin g is not recommended. the maximum temperature allowed for lead-free wlcsp manual rework is 260 c. the typical soldering profile shown figure 7 can be used. 5.1 rework procedure to perform manual rework on a wlcsp, follow the steps below: 1. remove the device to remove the device, heat must be applie d to melt the solder joints so that the component can be lifted from the board. large area bottom side preheaters may be used to raise the temperature of the board. this may help to minimize board warpage and the amount of heat that must be applied on the component. top heating may be applied to the component by using a laser or a convective hot gas nozzle. nozzle size must be selected to match the component footprint. after top heating has melted the solder, vacuum is applied through the pick-up nozzle, and the component is lifted from the board. the heat should be carefully directed at the component which must be removed to prevent adjacent components solder joints from being reflowed. shielding, control of the gas flow from the nozzle, and accurate temperature control are the key parameters. 2. remove the solder automatic tools are recommended due to space constraints and the need for accurate temperature control, typical cleaners are controlled non-contact gas heating and vacuuming tools. the objective is to remove the residual solder from the area without damaging the pads, solder masks or adjacent components, and to prepare the area for the insertion of the new component. 3. new device soldering a) place the new device there are several solutions to place the new device: ? use a mini-stencil and solder paste, then place the device. this is the solution recommended to ensure homogeneity of as sembly conditions if solder paste is used, even if small footprints and tight dimensions make this operation difficult. ? use no-clean flux on the area and place the device over the flux on the board. ? dip the wlcsp in no-clean flux, and place it on the board. b) reflow the solder joint by applying controlled heat to the component. the steps are similar to those required to remove a component. however, accurate temperature control is recommended to ensure good joint soldering. a alternative solution is to put the whole board in a furnace. see figure 7 for reflow profile recommendations.
docid025707 rev 2 17/21 TN1163 manual rework 20 5.2 component rework equipment the systems required to perform rework are ava ilable at various levels of automation. the methods and techniques used in more sophis ticated automatic system s can be copied for manual equipment. soldering irons must be avoided for these operations. tweezers or picking tools must be avoided since they ca n damage devices and create die chip-outs by compressing the wlcsp top or bottom sides (ball side). figure 8 . shows an example of semi-automatic eq uipment for component rework. for more information, refer to comintec web site at http://www.comintec.it. figure 8. comintec onyx32 semi-aut omatic equipment for component rework
package changes TN1163 18/21 docid025707 rev 2 6 package changes stmicroelectronics reserves the right to implement minor changes of geometry and manufacturing processes without prior notice. such changes will not affect electrical characteristics of the die, the pad layout or the maximum die size. however for confirmed orders, no variation will be made withou t prior customer?s approval. 7 package quality and reliability 7.1 electrical inspection all the critical parameters defined in the wl csp device datasheet are 100 % electrically characterized. the other parameters are guaranteed by technology, design rules or by continuous monitoring systems. 7.2 visual inspection a visual control is performed on all manufacturing lots according to jesd22_b101b specification. 7.3 wlcsp reliability as mentioned in section 2.1: overview , wlcsp packages must be handled with care as active silicon substrate is not protecte d against aggressive mechanical actions. if this is not the case, the wlcsp layers a nd/or silicon device layers may be physically damaged. this may increase th e sensitivity to humidity an d lead to long-term reliability electrical failures. assuming careful handling is ensured, wlcsp packages for microcontrollers are qualified to sustain 500 hrs of temperature humidi ty biased in jesd22-a101 conditions: 85c/85%rh. information on mission profiles extended above 500 hrs in jesd22-a101 conditions are available on demand. in any case, wlcsp packages are not recommended for use in harsh environments. molded packages should be selected for use in aggressive temperature & humidity mission profiles.
docid025707 rev 2 19/21 TN1163 conclusion 20 8 conclusion lead-free wlcsp have been developed by stmi croelectronics for electronic applications where integration and performanc e are designer?s main concerns. stmicroelectronics wlcsp key features are: ? remarkable board space saving: package size equal to die size and total height less than 650 m ? enhanced electrical performa nce: minimized parasitic inductance due to very short electrical paths. wlcsp are delivered in tape and reel and are fully compatible with other high volume smd components (standard plastic packages or csp/bga packages) in regards to existing pick- and-place equipment, standard solder reflow assembly equipment and standard pcb techniques.
revision history TN1163 20/21 docid025707 rev 2 9 revision history . table 7. document revision history date revision changes 16-dec-2013 1 initial release.document converted from package information pi0297 revision 5. 25-jun-2014 2 added wlcsp36, wlcsp66, wlcsp72, wlcsp104 and wlcsp168. updated figure 4: typical tape dimensions for wlcsps to indicate a1 bump position and removed note 1 related to a1 bump location. updated section 7 title and added section 7.3: wlcsp reliability .
docid025707 rev 2 21/21 TN1163 21 please read carefully: information in this document is provided solely in connection with st products. stmicroelectronics nv and its subsidiaries (?st ?) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described he rein at any time, without notice. all st products are sold pursuant to st?s terms and conditions of sale. purchasers are solely responsible for the choice, selection and use of the st products and services described herein, and st as sumes no liability whatsoever relating to the choice, selection or use of the st products and services described herein. no license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. i f any part of this document refers to any third party products or services it shall not be deemed a license grant by st for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoev er of such third party products or services or any intellectual property contained therein. unless otherwise set forth in st?s terms and conditions of sale st disclaims any express or implied warranty with respect to the use and/or sale of st products including without limitation implied warranties of merchantability, fitness for a parti cular purpose (and their equivalents under the laws of any jurisdiction), or infringement of any patent, copyright or other intellectual property right. st products are not designed or authorized for use in: (a) safety critical applications such as life supporting, active implanted devices or systems wi th product functional safety requirements; (b) aeronautic applications; (c) automotive applications or environments, and/or (d) aerospace applications or environments. where st products are not designed for such use, the purchaser shall use products at purchaser?s sole risk, even if st has been informed in writing of such usage, unless a product is expressly designated by st as being intended for ?automotive, automotive safety or medical? industry domains according to st product design specifications. products formally escc, qml or jan qualified are deemed suitable for use in aerospace by the corresponding governmental agency. resale of st products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by st for the st product or service described herein and shall not create or extend in any manner whatsoev er, any liability of st. st and the st logo are trademarks or registered trademarks of st in various countries. information in this document supersedes and replaces all information previously supplied. the st logo is a registered trademark of stmicroelectronics. all other names are the property of their respective owners. ? 2014 stmicroelectronics - all rights reserved stmicroelectronics group of companies australia - belgium - brazil - canada - china - czech republic - finland - france - germany - hong kong - india - israel - ital y - japan - malaysia - malta - morocco - philippines - singapore - spain - sweden - switzerland - united kingdom - united states of america www.st.com

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