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  may 2014 docid026305 rev 1 1/5 TN1181 technical note engineering model quality level introduction stmicroelectronics manufactures aerospace products at its eu ropean dedicated facility in rennes (france), certified by the esa- escc, dla qml-v and dla jans systems. in addition to the qualified prod ucts, often referred to as ?flight parts?, st proposes for most products (die - package combinations) an en gineering model (em) qua lity level, primarily intended to support development. the present document briefly describes the manufacturing and screening flow of this engineering model quality level. www.st.com
eligible products TN1181 2/5 docid026305 rev 1 1 eligible products any st aerospace qualified product can be proposed for the engineering model quality level, whether they are qua lified in the escc, in the ja ns or in the qml system. the em quality level is proposed by default fo r most die - package configurations, with some exceptions, mostly with legacy products and/or rare packages or pinout. each product datasheet provides the details of the available em (a) . non aerospace products may also be proposed for em quality level, with some specific adjustments not discussed in this document. a. contact an st sales office for die - pack age configurations not listed in the datasheets
docid026305 rev 1 3/5 TN1181 production flow 5 2 production flow the em overall simplified production flow is given in figure 1 below: figure 1. simplified production flow with respect to qualified flight models (fms), ems: ? use the same design and the same mask set. ? are diffused in the same diffusion line, using the same process. ? go through the same electrical wafer sort (ews). ? are submitted to the same wafer lot qualification test s, but without radiation tests. ? are assembled on the same space assembly line, using the simplified process flowchart and control plan summarized below. ? use the same packages and piece parts (wires, lid, etc.) ? use the same dice (design, mask set, diffusion line, etc.) ? are not optically sorted. ? are guaranteed against the same escc/smd elec trical test tables, in particular, over the full temperature range test (guaranteed by characterization + 100% final test at 25 c + go/no-go wafer lot qualification sampling at 3 temperatures). ? do not go through any package test (pind test, thermal cycles, etc.) ? are provided with a specific marking, with out agency logo, described in each product datasheet. ? are delivered only with gold-plated terminals. ? are provided with neither certificate of conformance nor traceability. the simplified em assembly and screening flow is summarized below: ? die-attach ? wire bonding ? sealing ? stabilization bake ? fine/gross leak test ? marking ? electrical test go/no-go at 25 c ?packing %jggvtjpo &mfdusjdbm 8bgfs4psu 8bgfs-pu 4qbdf 2vbmjgjdbujpo /p3bejbujpo
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revision history TN1181 4/5 docid026305 rev 1 3 revision history table 1. document revision history date revision changes 30-may-2014 1 initial release.
docid026305 rev 1 5/5 TN1181 5 please read carefully: information in this document is provided solely in connection with st products. stmicroelectronics nv and its subsidiaries (?st ?) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described he rein at any time, without notice. all st products are sold pursuant to st?s terms and conditions of sale. purchasers are solely responsible for the choice, selection and use of the st products and services described herein, and st as sumes no liability whatsoever relating to the choice, selection or use of the st products and services described herein. no license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. i f any part of this document refers to any third party products or services it shall not be deemed a license grant by st for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoev er of such third party products or services or any intellectual property contained therein. unless otherwise set forth in st?s terms and conditions of sale st disclaims any express or implied warranty with respect to the use and/or sale of st products including without limitation implied warranties of merchantability, fitness for a parti cular purpose (and their equivalents under the laws of any jurisdiction), or infringement of any patent, copyright or other intellectual property right. st products are not designed or authorized for use in: (a) safety critical applications such as life supporting, active implanted devices or systems wi th product functional safety requirements; (b) aeronautic applications; (c) automotive applications or environments, and/or (d) aerospace applications or environments. where st products are not designed for such use, the purchaser shall use products at purchaser?s sole risk, even if st has been informed in writing of such usage, unless a product is expressly designated by st as being intended for ?automotive, automotive safety or medical? industry domains according to st product design specifications. products formally escc, qml or jan qualified are deemed suitable for use in aerospace by the corresponding governmental agency. resale of st products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by st for the st product or service described herein and shall not create or extend in any manner whatsoev er, any liability of st. st and the st logo are trademarks or registered trademarks of st in various countries. information in this document supersedes and replaces all information previously supplied. the st logo is a registered trademark of stmicroelectronics. all other names are the property of their respective owners. ? 2014 stmicroelectronics - all rights reserved stmicroelectronics group of companies australia - belgium - brazil - canada - china - czech republic - finland - france - germany - hong kong - india - israel - ital y - japan - malaysia - malta - morocco - philippines - singapore - spain - sweden - switzerland - united kingdom - united states of america www.st.com


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