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pc411l0nip0f series high speed 15mb/s, high cmr mini-flat package ? opic photocoupler 1 sheet no.: d2-a04902en date jun. 30. 2005 ?sharp corporation notice the content of data sheet is subject to change without prior notice. in the absence of confirmation by device specification sheets, sharp takes no responsibility for any defects that may occur in equipment using any sharp devices shown in catalogs, data books, etc. contact sharp in order to obtain the latest device specification sheets before usin g any sharp device. pc411l0nip0f series features 1. 5 pin mini-flat package 2. double transfer mold package (ideal for flow soldering) 3. high noise immunity due to high instantaneous com- mon mode rejection voltage (cm h : min. 15 kv/ s, cm l : min. ? 15 kv/ s) 4. high speed response (t phl : typ. 27 ns, t plh : typ. 35 ns) 5. isolation voltage between input and output (v iso(rms) : 3.75 kv) 6. lead-free and rohs directive compliant description pc411l0nip0f series contains a led optically cou- pled to an opic. it is packaged in a 5 pin mini-flat. input-output isolation voltage(rms) is 3.75 kv. high speed response (typ. 15 mb/s) and cmr is min. 15 kv/ s. 1. recognized by ul1577 (double protection isolation), file no. e64380 (as model no. pc411l ) 2. approved by vde, din en60747-5-2 ( ? ) (as an op- tion), file no. 40009162 (as model no. pc411l ) 3. package resin : ul flammability grade (94v-0) ( ? ) din en60747-5-2 : successor standard of din vde0884 agency approvals/compliance 1. programmable controller 2. inverter applications ? "opic"(optical ic) is a trademark of the sharp corporation. an opic consists of a light-detecting element and a signal-processi ng circuit integrated onto a single chip.
internal connection diagram truth table 1 6 5 4 3 amp. anode cathode gnd v o v cc 1 3 4 5 6 2 sheet no.: d2-a04901en outline dimensions (unit : mm) 1. mini-flat package [ex. pc411l0nip0f ] 2. mini-flat package (vde option) [ex. PC411L0YIP0F ] pc411l 1 3 4.4 0.2 5.3 0.3 2.6 0.2 0.1 0.1 3.6 0.3 1.27 0.25 1.27 0.25 0.4 0.1 0.5 + 0.4 ? 0.2 7.0 + 0.2 ? 0.7 epoxy resin 45? 6? 0.2 0.05 6 4 5 date code factory identification mark anode mark sharp mark "s" 1 3 4.4 0.2 5.3 0.3 2.6 0.2 0.1 0.1 3.6 0.3 1.27 0.25 1.27 0.25 0.4 0.1 0.5 + 0.4 ? 0.2 7.0 + 0.2 ? 0.7 epoxy resin 45? 6? 0.2 0.05 6 4 5 date code factory identification mark pc411l anode mark 4 vde identification mark sharp mark "s" pc411l0nip0f series input h l led on off output l h l : logic (0) h : logic (1) product mass : approx. 0.1g product mass : approx. 0.1g plating material : sncu (cu : typ. 2%)
date code (2 digit) a.d. 1990 1991 1992 1993 1994 1995 1996 1997 1998 1999 2000 2001 mark a b c d e f h j k l m n mark p r s t u v w x a b c mark 1 2 3 4 5 6 7 8 9 o n d month january february march april may june july august september october november december a.d 2002 2003 2004 2005 2006 2007 2008 2009 2010 2011 2012 2nd digit month of production 1st digit year of production 3 repeats in a 20 year cycle sheet no.: d2-a04902en pc411l0nip0f series factory identification mark factory identification mark no mark country of origin japan indonesia china * this factory marking is for identification purpose only. please contact the local sharp sales representative to see the actual status of the production. rank mark there is no rank mark indicator.
sheet no.: d2-a04902en electro-optical characteristics * 4 parameter symbol unit input forward voltage v f v reverse current i r a terminal capacitance c t t a = 25?c, v = 0, f = 1mhz pf output v oh high level supply current i cch ma low level supply current i ccl ma i fhl v o = 2.5v ma isolation resistance floating capacitance r iso c f ? t plh ns t phl rise time ? t w t psk fall time propagation delay skew distortion of pulse width t r t f instantaneous common mode rejection voltage (high level output) t a = 25?c, i f = 0, v cm = 1.0kv (p-p) t a = 25?c, i f = 12ma, v cm = 1.0kv (p-p) kv/ s instantaneous common mode rejection voltage (low level output) cm l "high low" input threshold current t a = 25?c, i f = 12ma t a = 25?c, v r = 5v i f = 12ma, c l = 15pf cmos logic level t r = t f < 1ns, pulse width 100ns duty = 50% min. 1.4 ? ? 5 10 10 20 13 0 ? ? ? ? 15 ? 15 ? max. 10 150 11.0 14.0 ? 40 ? ? ? ? 1.95 6.0 60 60 30 conditions "low high" propagation delay time "high low" propagation delay time response time cm h i f = 0, i o = ? 20 a i f = 0 i f = 12ma *4 it shall connect a by-pass capacitor of 0.01 f or more between v cc (pin 6 ) and gnd (pin 4 ) near the device. when it measures the transfer characteristics and the output side characteristics. *5 distortion of pulse width ? tw = | t phl ? t plh | t a = 25?c, dc500v, 40 to 60%rh t a = 25?c, v = 0v, f = 1mhz typ. ? low level output voltage v ol i f = 12ma, i o = 20 a mv ? 100 1.5 60 v 4 ? 5 2.6 2.1 3.5 pf ? 1.0 0.6 10 11 ? 4 3 ? 1.6 27 35 8 20 ? 20 (unless otherwise specified t a = ? 40 to 85?c, v cc = 4.5 to 5.5v, typ. at t a = 25?c, v cc = 5v) high level output voltage *5 transfer characteristics absolute maximum ratings (t a = 25 ?c ) parameter symbol unit forward current ma *1 reverse voltage v output voltage v output current ma operating temperature storage temperature ?c isolation voltage ?c *2 *3 soldering temperature i f v r v o i o v iso (rms) t opr t stg t sol ?c *1 when ambient temperature goes above 70?c, the power dissipation goes down at 0.6ma/?c. (fig.3) *2 40 to 60 %rh, ac for 1minute *3 for 10s rating 20 5 supply voltage v v cc 0 to + 6.0 ? 0.5 to +5.5 2 ? 40 to + 85 ? 55 to + 125 260 3.75 kv input output 4 pc411l0nip0f series
sheet no.: d2-a04902en model line-up pc411l0nip0f package model no. din en60747-5-2 taping 3 000 pcs/ reel ?????? PC411L0YIP0F approved 5 please contact a local sharp sales representative to inquire about production status. pc411l0nip0f series
sheet no.: d2-a04902en 6 pc411l0nip0f series fig.1 test circuit for propagation delay time and rise time, fall time fig.2 test circuit for instantaneous common mode rejection voltage c l i f sw a b v cc = 5v 0.1 f v o v cm amp. + ? gnd gnd ? v ol v ol ? v oh v oh v cm 1kv cm h v o sw at a, i f = off cm l v o sw at b, i f = on ? c l : includes the probe and wiring capacitance. 1 6 5 4 3 c l i f v cc = 5v 0.1 f v o amp. t r = t f < 1ns pulse width : 100ns duty 50% t plh t phl t f t r 10% 90% v o v oh 2.5v cmos v ol 50% i f output input i f o ? c l : includes the probe and wiring capacitance. 1 6 5 4 3
sheet no.: d2-a04902en 7 pc411l0nip0f series fig.7 low level supply current vs. ambient temperature fig.8 propagation delay time vs. input current fig.5 input threshold current vs. ambient temperature fig.6 high level supply current vs. ambient temperature ? 25 0 25 50 75 100 ? 50 low level supply current i ccl (ma) 2 4 6 1 3 5 0 ambient temperature t a ( c) v cc = 5v i f = 12ma propagation delay time (ns) 0 20 50 40 ? 10 10 30 ? 2 0 input current (ma) 5101 5202530 0 t plh t phl t w v cc = 5v, c l = 15pf t a = 25?c fig.3 forward current vs. ambient temperature fig.4 forward current vs. forward voltage 20 15 10 5 0 forward current i f (ma) ambient temperature t a ( c) ? 25 0 25 50 100 125 ? 40 75 85 70 forward voltage v f (v) forward current i f (ma) 1 1.2 1.4 1.6 1.8 2 2.2 1 10 100 0.1 50?c 0?c ? 20?c t a = 85?c 25?c ? 40?c ? 25 0 25 50 75 100 ? 50 input threshold current i fhl (ma) 2 4 6 1 3 5 0 ambient temperature t a ( c) v cc = 5v ? 25 0 25 50 75 100 ? 50 high level supply current i cch (ma) 2 4 6 1 3 5 0 ambient temperature t a ( c) v cc = 5v
sheet no.: d2-a04902en fig.10 low level output voltage vs. ambient temperature fig.9 high-level output voltage vs. ambient temperature 8 pc411l0nip0f series ? 25 0 25 50 75 100 ? 50 6 5.5 5 4.5 4 ambient temperature t a ( c) high level output voltage v oh (v) i f = 0 i o = ? 20 a v cc = 5v ? 25 0 25 50 75 100 ? 50 0 0.5 1 1.5 2 2.5 3 ambient temperature t a ( c) low level output voltage v ol (mv) i f = 12ma i o = 20 a v cc = 5v remarks : please be aware that all data in the graph are just for reference and not for guarantee.
sheet no.: d2-a04902en ? for additional design assistance, please review our corresponding optoelectronic application notes. 9 pc411l0nip0f series design considerations transistor of detector side in bipolar configuration may be damaged by static electricity due to its minute de- sign. when handling these devices, general countermeasure against static electricity should be taken to avoid breakdown of devices or degradation of characteristics. notes about static electricity in order to stabilize power supply line, we should certainly recommend to connect a by-pass capacitor of 0.01 f or more between v cc and gnd near the device. in case that some sudden big noise caused by voltage variation is provided between primary and secondary terminals of photocoupler some current caused by it is floating capacitance may be generated and result in false operation since current may go through led or current may change. if the photocoupler may be used under the circumstances where noise will be generated we recommend to use the bypass capacitors at the both ends of led. the detector which is used in this device, has parasitic diode between each pins and gnd. there are cases that miss operation or destruction possibly may be occurred if electric potential of any pin becomes below gnd level even for instant. therefore it shall be recommended to design the circuit that electric potential of any pin does not become below gnd level. this product is not designed against irradiation and incorporates non-coherent led. design guide parameter forward current supply voltage operating temperature symbol i f v cc t opr min. 10 ? 40 4.5 typ. ? ? 5 unit ma c v max. 16 70 5.5 degradation in general, the emission of the led used in photocouplers will degrade over time. in the case of long term operation, please take the general led degradation (50% degradation over 5 years) into the design consideration. please decide the input current which become 2 times of max. i fhl . recommended foot print (reference) 0.8 1.5 6.3 1.27 1.27 (unit : mm) recommended operating conditions
sheet no.: d2-a04902en manufacturing guidelines reflow soldering: reflow soldering should follow the temperature profile shown below. soldering should not exceed the curve of temperature profile and time. please don't solder more than twice. soldering method flow soldering : due to sharp's double transfer mold construction submersion in flow solder bath is allowed under the below listed guidelines. flow soldering should be completed below 260?c and within 10s. preheating is within the bounds of 100 to 150?c and 30 to 80s. please don't solder more than twice. hand soldering hand soldering should be completed within 3s when the point of solder iron is below 400?c. please don't solder more than twice. other notices please test the soldering method in actual condition and make sure the soldering works fine, since the impact on the junction between the device and pcb varies depending on the tooling and soldering conditions. 10 1234 300 200 100 0 0 (?c) terminal : 260?c peak ( package surface : 250?c peak) preheat 150 to 180?c, 120s or less reflow 220?c or more, 60s or less (min) pc411l0nip0f series
sheet no.: d2-a04902en solvent cleaning: solvent temperature should be 45?c or below immersion time should be 3 minutes or less ultrasonic cleaning: the impact on the device varies depending on the size of the cleaning bath, ultrasonic output, cleaning time, size of pcb and mounting method of the device. therefore, please make sure the device withstands the ultrasonic cleaning in actual conditions in advance of mass production. recommended solvent materials: ethyl alcohol, methyl alcohol and isopropyl alcohol in case the other type of solvent materials are intended to be used, please make sure they work fine in ac- tual using conditions since some materials may erode the packaging resin. cleaning instructions this product shall not contain the following materials. and they are not used in the production process for this product. regulation substances : cfcs, halon, carbon tetrachloride, 1.1.1-trichloroethane (methylchloroform) specific brominated flame retardants such as the pbbos and pbbs are not used in this product at all. this product shall not contain the following materials banned in the rohs directive (2002/95/ec). ?ead, mercury, cadmium, hexavalent chromium, polybrominated biphenyls (pbb), polybrominated di- phenyl ethers (pbde). presence of odc 11 pc411l0nip0f series
sheet no.: d2-a04902en 12 tape and reel package package materials carrier tape : a-pet (with anti-static material) cover tape : pet (three layer system) reel : ps carrier tape structure and dimensions a 12.0 0.3 b 5.5 0.1 c 1.75 0.1 d 8.0 0.1 e 2.0 0.1 h 7.4 0.1 i 0.3 0.05 j 3.1 0.1 k 4.0 0.1 f 4.0 0.1 g 1.5 + 0.1 ? 0 f e i d j g b a c h 5? max. k h dimensions list (unit : mm) a 370 b 13.5 1.5 c 80 1.0 d 13 0.5 e 21 1.0 f 2.0 0.5 g 2.0 0.5 dimensions list (unit : mm) a c e g f b d pull-out direction [packing : 3 000pcs/reel] reel structure and dimensions direction of product insertion pc411l0nip0f series package specification
?the circuit application examples in this publication are provided to explain representative applications of sharp devices and are not intended to guarantee any circuit design or license any intellectual property rights. sharp takes no responsibility for any problems related to any intellectual property right of a third party resulting from the use of sharp's devices. ?contact sharp in order to obtain the latest device specification sheets before using any sharp device. sharp reserves the right to make changes in the specifications, characteristics, data, materials, structure, and other contents described herein at any time without notice in order to improve design or reliability. manufacturing locations are also subject to change without notice. ?observe the following points when using any devices in this publication. sharp takes no responsibility for damage caused by improper use of the devices which does not meet the conditions and absolute maximum ratings to be used specified in the relevant specification sheet nor meet the following conditions: (i) the devices in this publication are designed for use in general electronic equipment designs such as: --- personal computers --- office automation equipment --- telecommunication equipment [terminal] --- test and measurement equipment --- industrial control --- audio visual equipment --- consumer electronics (ii) measures such as fail-safe function and redundant design should be taken to ensure reliability and safety when sharp devices are used for or in connection with equipment that requires higher reliability such as: - -- transportation control and safety equipment (i.e., aircraft, trains, automobiles, etc.) --- traffic signals --- gas leakage sensor breakers --- alarm equipment --- various safety devices, etc. (iii) sharp devices shall not be used for or in connection with equipment that requires an extremely high level of reliability and safety such as: --- space applications --- telecommunication equipment [trunk lines] --- nuclear power control equipment - -- medical and other life support equipment (e.g., scuba). ?if the sharp devices listed in this publication fall within the scope of strategic products described in the foreign exchange and foreign trade law of japan, it is necessary to obtain approval to export such sharp devices. ?this publication is the proprietary product of sharp and is copyrighted, with all rights reserved. under the copyright laws, no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, for any purpose, in whole or in part, without the express written permission of sharp. express written permission is also required before any use of this publication may be made by a third party. ?contact and consult with a sharp representative if there are any questions about the contents of this publication. 13 sheet no.: d2-a04902en important notices pc411l0nip0f series [e229]

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