tqp3m901 9 high linearity lna gain block applications ? ? mobile infrastructure ? lte ? / ? wcdma ? / ? cdma ? / ? edge ? general purpose wireless product features ? ? ? ? ? 22? db gain a t 1900 ? mhz ? 1.3 ? db noise figure a t 1900 ? mhz ? +3 9.5? dbm output ip3 ? 50? ohm cascadable gain block ? unconditionally stable ? high input power capability ? +5 ? v single sup ply, 85ma current ? 3 ? x ? 3 ? mm qfn package 16 pin 3 ??x3 ? mm qfn package functional block diagram 7 8 6 5 14 13 15 16 12 11 10 9 1 2 3 4 backside pad - rf/dc gnd pin 1 reference mark n/c rf in n/c n/c n/c rf out / v dd n/c n/c n/c n/c n/c n/c n/c n/c n/c n/c ordering information part no. description tqp3m901 9 high linearity lna gain block tqp3m9019 - pcb_if 50 ? ? ? 500 mhz evaluation board tqp3m9019 - pcb_r f 0.5 ? ? ? 4 ghz evaluation board standard t/ ? r size = 2500 pieces on a 7 ? reel pin configuration pin no. label 2 rf in 11 rf out ?/?v general description the tqp3m9019 is a cascadable, high lineari ty gain block amplifier in a low - cost surface - mount package. at 1.9 ? ghz, the amplifier typically provides 22 ? db gain, +39.5 dbm oip3, and 1.3 ? db noise figure while only drawing 115 ma current. the device is housed in a leadfree / ? green ? / ? rohs - compliant ind ustry - standard 16 - pin 3 ? x ? 3 ? mm qfn package. the tqp3m9019 has the benefit of having high gain across a broad range of frequencies while also providing very low noise. this allows the device to be used in both receiver and transmitter chains for high perfo rmance systems. the amplifier is internally matched using a high performance e - phemt process and only requires an external rf choke and blocking/bypass capacitors for operation from a single +5 ? v supply. the internal active bias circuit also enables stable operation over bias and temperature variations. the tqp3m9019 covers the 0.02 ? ? ? 4 ghz frequency band and is targeted for wireless infrastructure or other applications requiring high linearity and / ? or low noise figure. datasheet: rev . l 08/13 /1 4 - 1 of 9 - disclaimer: subject to change without notice ? 2014 triquint www.triquint.com
tqp3m901 9 high linearity lna gain block recommended operating condition s parameter min typ max units supply voltage (v dd ) + 4.75 + 5.0 + 5.25 v t case ? absolute maximum ratings parameter rating storage temperature ? ? rf input power, cw, 50, t=25 ? ? ? ? ? electrical specifications test conditions unless otherwise noted: v dd =+5 ? v, temp . = +25 ? c, 50? system parameter conditions min typ max units operational frequency range 20 4000 mhz test frequency 19 00 mhz gain 20 2 2 2 3 db input return loss 1 0 db output return loss 1 3 db output p1db +2 2 dbm output ip3 pout= + g % p w r q h i 1 mhz +3 6 +3 9.5 dbm noise figure 1.3 db current, i dd 12 5 1 5 0 ma thermal resistance, - 2 of 9 - disclaimer: subject to change without notice ? 2014 triquint www.triquint.com
tqp3m901 9 high linearity lna gain block tqp3m9019 - pcb_ if?/? rf evaluation board u1 c2 l2 c6 b1 c1 j3 j4 u1 j2 rf output j4 gnd j3 v dd 1 2 3 j1 rf input l2 c6 c2 c1 notes: 1. see evaluation board pcb information section for material and stack -up. 2. components shown on the silkscreen but not on the schematic are not used. 3. b1 (0 jumper) is not shown on the schematic and may be replaced with copper trace in the target application layout. 4. the recommended component values are dependent upon the frequency of operation. 5. all components are of 0603 size unless otherwise specified. bill of material ? tqp3m90 19 - pcb_ if?/? rf reference des. tqp3m9019 - pcb_rf 500 mhz ?? ? 4000 mhz tqp3m9019 - pcb_if 50 mhz ?? ? 500 mhz u1 tqp3m9019 tqp3m9019 c2, c6 100 pf 10 0 0 pf c1 0.01 uf 0.01 uf l2 68 nh 330 nh b1 do not place do not place l1, d1, c3, c4 0 ? 0 ? note : perform ances can be optimized at frequency of interest by using recommended component values shown in the table below. inductors are wirewound coilcraft. reference designation frequency (mhz) 50 200 500 2000 2500 3500 c2, c6 0.01 uf 1000 pf 100 pf 22 pf 22 pf 22 pf l2 470 nh 220 nh 82 nh 22 nh 18 nh 15 nh datasheet: rev . l 08/13 /1 4 - 3 of 9 - disclaimer: subject to change without notice ? 2014 triquint www.triquint.com
tqp3m901 9 high linearity lna gain block typical performance ? tqp3m9019 - pcb_rf test conditions unless otherwise noted: v dd =+5?v, i dd =125?ma, temp.= +25 ? c, 50? system parameter typical value units frequency 500 900 1900 2700 3500 4000 mhz gain 25.6 24.6 22 20.5 19 18.3 db input return loss 11 10.5 10 11.5 8 6 db output return loss 10.5 12 13 9 10 11 db output p1db +22.4 +22.3 +22 +21.7 +21.4 +20.8 dbm oip3 (1) +41.8 +40.6 +40.6 +38.5 +38.8 +37.9 dbm noise figure (2) 0.9 0.9 1.3 1.7 2.1 2.4 db notes: 1. oip3 measured with two tones at an output power of +4 dbm / tone separated by 1 mhz. 2. noise figure data listed in the table above includes pcb losses . ~ 0.1db at 2 ghz . performance plots ? tqp3m9019 - pcb_rf test conditions unless otherwise noted: v dd =+5?v, i dd =125?ma, temp.= +25 ? c, 50? system 15 18 21 24 27 0.5 1 1.5 2 2.5 3 3.5 4 gain (db) frequency (ghz) gain vs. frequency +85 c +25 c ?20 ?40 ?20 ?40 -20 -15 -10 -5 0 0.5 1 1.5 2 2.5 3 3.5 4 |s22| (db) frequency (ghz) output return loss vs. frequency +85 c +25 c ?20 c ?40 c 0 1 2 3 4 500 1000 1500 2000 2500 3000 3500 4000 nf (db) frequency (mhz) noise figure vs. frequency over temp +85 c +25 c ?40 c datasheet: rev . l 08/13 /1 4 - 4 of 9 - disclaimer: subject to change without notice ? 2014 triquint www.triquint.com
tqp3m901 9 high linearity lna gain block performance plots ? tqp3m9019 - pcb_rf test conditions unless otherwise noted: v dd =+5?v, i =125?ma, temp.= ? 50? system 25 30 35 40 45 50 0 2 4 6 8 oip3 (dbm) pout?/?tone (dbm) output ip3 vs. pout?/?tone ?20 ?40 25 30 35 40 45 50 0.5 1 1.5 2 2.5 3 3.5 4 oip3 (dbm) frequency (ghz) output ip3 vs. frequency +85 c +25 c ?20 c ?40 c pout=+4 dbm/tone 1 mhz tone spacing 25 30 35 40 45 50 0 2 4 6 8 oip3 (dbm) pout ? / ? tone (dbm) output ip3 vs. pout?/ ? tone 3.5 ghz 2.7 ghz 1.9 ghz 0.9 ghz 17 19 21 23 25 0.5 1 1.5 2 2.5 3 3.5 4 p1db (dbm) frequency (ghz) p1db vs. frequency +85 c +25 c ?20 c ?40 c 105 110 115 120 125 130 3.25 3.5 3.75 4 4.25 4.5 4.75 5 5.25 i dd (ma) v dd (v) i dd vs. v dd temp.=+25 c cw signal 105 110 115 120 125 130 -40 -15 10 35 60 85 i dd (ma) temperature ( c) i dd vs. temperature datasheet: rev . l 08/13 /1 4 - 5 of 9 - disclaimer: subject to change without notice ? 2014 triquint www.triquint.com
tqp3m901 9 high linearity lna gain block typical performance ? tqp3m9019 - pcb_if test conditions unless otherwise noted: v dd =+5v, i dd = 12 5 ma typ., temp= +25c parameter conditions typical values units frequency 70 100 200 500 mhz gain 27 26.8 26.4 25 .8 db input return loss 12 13 13 13 db output return loss 11 11 12 13 db output p1db +21.6 +21.9 +21.9 +22.2 dbm oip3 pout = + 3 dbm/tone, ?f= performance plots ? tqp3m9019 - pcb_if test conditions unless otherwise noted: v dd =+5v, temp . = +25c ?20 ?40 -20 -15 -10 -5 0 0 100 200 300 400 500 gain (db) frequency (mhz) gain vs. frequency +85 c +25 c ?20 c ?40 c -20 -15 -10 -5 0 0 100 200 300 400 500 |s22| (db) frequency (mhz) output return loss vs. frequency +85 c +25 c ?20 c ?40 c 30 35 40 45 50 0 100 200 300 400 500 oip3 (dbm) pout / tone (dbm) oip3 vs. pout/tone pout=3 dbm/tone 1 mhz tone spacing, +85 c +25 c ?40 c 18 20 22 24 26 0 100 200 300 400 500 p1db (db) frequency (mhz) p1db vs. frequency +85 c +25 c ?40 c 0.0 0.5 1.0 1.5 2.0 2.5 0 100 200 300 400 500 nf (db) frequency (mhz) noise figure vs. frequency +85 c +25 c ?40 c datasheet: rev . l 08/13 /1 4 - 6 of 9 - disclaimer: subject to change without notice ? 2014 triquint www.triquint.com
tqp3m901 9 high linearity lna gain block pin configuration and description 7 8 6 5 14 13 15 16 12 11 10 9 1 2 3 4 backside pad - rf/dc gnd pin 1 reference mark n/c rf in n/c n/c n/c rf out / v dd n/c n/c n/c n/c n/c n/c n/c n/c n/c n/c pin no. label description 2 rf in rf i nput matched to 50 ohms. external dc block is required. 11 rf out ?/?v dd rf output mat ched to 50 ohms . bias voltage and e xternal dc block required . all other pins n/c no internal connect ion. provide grounded pcb land pads for optimal isolation and mounting integrity . backside pad rf/dc gnd rf/dc ground. use recommended via pattern to m inimize inductance and thermal resistance. see pcb mounting pattern . evaluation board pcb information triquint pcb 1076342 material and stack - up 1 oz. cu bottom layer nelco n-4000-13 core nelco n-4000-13 1 oz. cu top layer 1 oz. cu inner layer 1 oz. cu inner layer 0.062" 0.006" finished board thickness 0.014" 0.014" 50 ohm line dimensions: width = 0.029?, spacing = 0.035? datasheet: rev . l 08/13 /1 4 - 7 of 9 - disclaimer: subject to change without notice ? 2014 triquint www.triquint.com
tqp3m901 9 high linearity lna gain block package marking and dimensions packa ge marking: part number ? ?901 ? ? ? yyww lot code ? ? ? axxxx top view side view bottom view 3.000.05 3.000.05 .20 ref. 0.000-0.050 pin #1 identification chamfer 0.300 x 45 1.700.05 exp.dap 0.230.05 0.50 bsc 1.50 ref. 1.700.05 exp.dap 0.850.05 pin 1 locator exposed pad (ep) 0.380.05 notes: 1. all dimensions are in millimeters. angles are in degrees. 2. dimension and tolerance formats conform to asme y14.4m - 1994. 3. the terminal #1 identifier and terminal numb ering conform to jesd 95 - 1 spp - 012. pcb mounting pattern component side 3 0.30 (0.01) 16x 0.50 (0.02) 0.57 (0.02) 1.70 (0.07) 1.70 (0.07) package outline 0.25 (0.01) 0.10 (0.00) 0.50 (0.02) 0.50 (0.02) 1.00 (0.04) 5x ?0.25 (0.01) 1.00 (0.04) notes: 1. all dimensions are in millimeters (inches). angles are in degrees. 2. use 1 oz. copper minimum for top and bottom layer metal. 3. ground/thermal vias are required for the proper operatio n of this device. we recommend a 0.35mm (#80/.0135") diameter bit for drilling via holes and a final plated thru diameter of 0.25mm (0.10?). 4. ensure good package backside exposed pad (ep) solder attach for best electrical and thermal performance. 9019 yyww axxxx datasheet: rev . l 08/13 /1 4 - 8 of 9 - disclaimer: subject to change without notice ? 2014 triquint www.triquint.com
tqp3m901 9 high linearity lna gain block produc t compliance information esd sensitivity ratings caution! esd - sensitive device esd rating: class 1a value: 250 v to < 500 v test: human body model (hbm) standard: esda?/? jedec standard js - 001- 2012 esd rating: class c3 value: 1000 v test: charged device model (cdm) standard: jedec standard jesd22 - c101 f solderability compatible with both lead - free (260 ? c max. reflow temperature) and tin/lead (245 c max. reflow temperature) soldering processes. contact plating: annealed matte t in rohs compliance this part is compliant with eu 2002/95/ec rohs directive (restrictions on the use of certain hazardous substances in electrical and electronic equipment). this product also has the following attributes: ? lead free ? halogen free (chlo rine, bromine) ? antimony free ? tbbp - a (c 15 h 12 br 4 0 2 ) free ? pfos free ? svhc free msl rating msl rating : level 1 test: 260? c convection reflow standard: jedec standard ipc/jedec j - std - 020 contact information for the latest specifications, additional product information, worldwide sales and distribution locations, and information about triquint: web: www.triquint.com tel: +1.503.615.9000 email: info - sales@tqs.com fax: +1.503.615.8902 for technical questions and application information: email: sjcapplications.engineering@tqs.com important notice the information contained herein is believed to be reliable. triquint makes no warranties regarding the information contained herein. triquint assumes no responsibility or liability whatsoever for any of the information contained herein. triquint assumes no responsibility or liability whatsoever f or the use of the information contained herein. the information contained herein is provided "as is, where is" and with all faults, and the entire risk associated with such information is entirely with the user. all information contained herein is subjec t to change without notice. customers should obtain and verify the latest relevant information before placing orders for triquint products. the information contained herein or any use of such information does not grant, explicitly or implicitly, to any p arty any patent rights, licenses, or any other intellectual property rights, whether with regard to such information itself or anything described by such information. triquint products are not warranted or authorized for use as critical components in med ical, life - saving, or life - sustaining applications, or other applications where a failure would reasonably be expected to cause severe personal injury or death. datasheet: rev . l 08/13 /1 4 - 9 of 9 - disclaimer: subject to change without notice ? 2014 triquint www.triquint.com
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