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  this is information on a product in full production. january 2015 docid027306 rev 1 1/8 FERD30SM100DJF field effect rectifier datasheet ? production data features ? st proprietary process ? reduce leakage current ? low forward voltage drop ? high frequency operation ? ecopack ? 2 compliant component description the FERD30SM100DJF is based on a proprietary technology that achieves the best in class v f /i r trade-off for a given silicon surface. this 100 v rectifier has been optimized for use in confined applications where both efficiency and thermal performance are key. tm: powerflat is a trademark of stmicroelectronics . $ $ $ $ . . $ $ 3rzhu)/$7?[ table 1. device summary symbol value i f(av) 30 a v rrm 100 v t j (max) +175 c v f (typ) 0.395 v www.st.com
characteristics FERD30SM100DJF 2/8 docid027306 rev 1 1 characteristics to evaluate the conduction losses use the following equation: p = 0.562 x i f(av) + 0.0057 i f 2 (rms) table 2. absolute ratings (limiting values, at 25 c, unless otherwise specified, anode terminals short-circuited) symbol parameter value unit v rrm repetitive peak reverse voltage 100 v i f(rms) forward rms current 45 a i f(av) average forward current, = 0.5 t c = 100 c 30 a i fsm surge non repetitive forward current t p = 10 ms sinusoidal 180 a t stg storage temperature range -65 to + 175 c t j (1) maximum operating junction temperature 175 c 1. condition to avoid thermal runaway for a diode on its own heatsink dptot dtj < 1 rth(j-a) table 3. thermal resistance symbol parameter value (max) unit r th(j-c) junction to case 2.6 c/w table 4. static electrical characteristics (anode terminals short-circuited) symbol parameter test conditions min. typ. max. unit i r (1) reverse leakage current t j = 25 c v r = v r rm - - 150 a t j = 125 c - 8 16 ma t j = 125 c v r = 70 v - - 9 v f (2) forward voltage drop t j = 25 c i f = 5 a - - 0.48 v t j = 125 c - 0.395 0.435 t j = 25 c i f = 10a --0.595 t j = 125 c - 0.51 0.555 t j = 25 c i f = 30 a -0.97 t j = 125 c - 0.665 0.735 1. pulse test: t p = 5 ms, < 2% 2. pulse test: t p = 380 s, < 2%
docid027306 rev 1 3/8 FERD30SM100DJF characteristics 8 figure 1. average forward power dissipation versus average forward current figure 2. average forward current versus ambient temperature ( = 0.5)                 /  /  /  /  /  3 ) $9 :  , ) $9 $ 7 / ws7 ws              7 dpe ?& 5 wk md  5 wk mf  , ) $9 $  7 / ws7 ws figure 3. relative variation of thermal impedance junction to case versus pulse duration figure 4. reverse leakage current versus reverse voltage applied (typical values)           ( ( ( ( (  w 3 v 6lqjohsxovh = wk mf 5 wk mf  ( ( ( (   9 5 9 , 5 p$  7 m  ?& 7 m  ?& 7 m  ?& 7 m  ?& 7 m  ?& figure 5. junction capacitance versus reverse voltage applied (typical values) figure 6. forward voltage drop versus forward current (typical values)     & s)  9 5 9 ) 0+] 9 26&  p9 506 7 m  ?&               , ) $  7 m  ?& 9 ) 9 7 m  ?& 7 m  ?&
characteristics FERD30SM100DJF 4/8 docid027306 rev 1 figure 7. thermal resistance junction to ambient versus copper surface under tab (typical values) 0 25 50 75 100 125 150 012345678910 r t h ( j - a ) (c/w) s cu (cm2) epoxy printed board fr4, copper thickness = 35 m
docid027306 rev 1 5/8 FERD30SM100DJF package information 8 2 package information ? epoxy meets ul94, v0 ? cooling method: by conduction (c) in order to meet environmental requirements, st offers these devices in different grades of ecopack ? packages, depending on their level of environmental compliance. ecopack ? specifications, grade definitions and product status are available at: www.st.com . ecopack ? is an st trademark. figure 8. powerflat-8l dimensions (definitions) table 5. powerflat-8l dimensions (values) ref. dimensions millimeters inches min. typ. max. min. typ. max. a 0.80 1.00 0.031 0.039 a1 0.02 0.05 0.001 0.002 a2 0.25 0.010 b 0.30 0.50 0.012 0.020 d 5.20 0.205 d2 4.11 4.31 0.162 0.170 e 1.27 0.050 e 6.15 0.242 e2 3.50 3.70 0.138 0.146 l 0.50 0.80 0.020 0.031 k 1.275 1.575 0.050 0.062 d2 e2 k l b e d e a a1 a2
package information FERD30SM100DJF 6/8 docid027306 rev 1 figure 9. footprint (dimensions in mm) 1.27 0.62 0.95 0.98 6.29 4.33 3.86 5.35 4.41
docid027306 rev 1 7/8 FERD30SM100DJF ordering information 8 3 ordering information 4 revision history table 6. ordering information order code marking package weight base qty delivery mode FERD30SM100DJF f30sm 100 powerflat 5x6 95 mg 3000 tape and reel table 7. document revision history date revision changes 09-jan-2015 1 initial release.
FERD30SM100DJF 8/8 docid027306 rev 1 important notice ? please read carefully stmicroelectronics nv and its subsidiaries (?st?) reserve the right to make changes, corrections, enhancements, modifications, and improvements to st products and/or to this document at any time without notice. purchasers should obtain the latest relevant in formation on st products before placing orders. st products are sold pursuant to st?s terms and conditions of sale in place at the time of o rder acknowledgement. purchasers are solely responsible for the choice, selection, and use of st products and st assumes no liability for application assistance or the design of purchasers? products. no license, express or implied, to any intellectual property right is granted by st herein. resale of st products with provisions different from the information set forth herein shall void any warranty granted by st for such product. st and the st logo are trademarks of st. all other product or service names are the property of their respective owners. information in this document supersedes and replaces information previously supplied in any prior versions of this document. ? 2015 stmicroelectronics ? all rights reserved


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