1. 2. 3. material content data sheet sales product name tle7239sl issued 28. august 2013 ma# MA000982078 package pg-ssop-24-5 weight* 147.31 mg construction element material group substances cas# if applicable weight [mg] average mass [%] sum [%] average mass [ppm] sum [ppm] chip inorganic material silicon 7440-21-3 7.437 5.05 5.05 50489 50489 leadframe inorganic material phosphorus 7723-14-0 0.016 0.01 106 non noble metal zinc 7440-66-6 0.062 0.04 423 non noble metal iron 7439-89-6 1.245 0.85 8454 non noble metal copper 7440-50-8 50.568 34.33 35.23 343284 352267 wire noble metal gold 7440-57-5 0.408 0.28 0.28 2772 2772 encapsulation organic material carbon black 1333-86-4 0.166 0.11 1128 plastics epoxy resin - 7.644 5.19 51890 inorganic material silicondioxide 60676-86-0 75.274 51.10 56.40 511002 564020 leadfinish non noble metal tin 7440-31-5 1.680 1.14 1.14 11403 11403 plating noble metal silver 7440-22-4 0.365 0.25 0.25 2480 2480 glue plastics acrylic resin - 0.537 0.36 3645 noble metal silver 7440-22-4 1.904 1.29 1.65 12924 16569 *deviation < 10% sum in total: 100,00 1000000 important remarks: infineon technologies ag provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. infineon technologies ag and infineon technologies ag suppliers consider certain information to be proprietary, and thus cas numbers and other limited information may not be available for release. all statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. company infineon technologies ag address 81726 mnchen internet www.infineon.com
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