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to our customers, old company name in catalogs and other documents on april 1 st , 2010, nec electronics corporation merged with renesas technology corporation, and renesas electronics corporation took over all the business of both companies. therefore, although the old company name remains in this document, it is a valid renesas electronics document. we appreciate your understanding. renesas electronics website: http://www.renesas.com april 1 st , 2010 renesas electronics corporation issued by: renesas electronics corporation (http://www.renesas.com) send any inquiries to http://www.renesas.com/inquiry.
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without the prior written consent of renesas electronics. further, you may not use any renesas electronics product for any application for which it is not intended without the prior written consent of renesas electronics. re nesas electronics shall not be in any way liable for any damages or losses incurred by you or third partie s arising from the use of any renesas electronics product for a n application categorized as ?specific? or for which the product is not intende d where you have failed to obtain the prior writte n consent of renesas electronics. the quality grade of each renesas electronics product is ?standard? unless otherwise expressly specified in a renesas electr onics data sheets or data books, etc. ?standard?: computers; office equipmen t; communications e quipment; test and measurement equipment; audio and visual equipment; home electronic a ppliances; machine tools; personal electronic equipmen t; and industrial robots. ?high quality?: transportation equi pment (automobiles, trains, ships, etc.); traffic control systems; anti-disaster systems; an ti- crime systems; safety equipment; and medical equipment not specif ically designed for life support. ?specific?: aircraft; aerospace equipment; submersible repeaters; nuclear reactor control systems; medical equipment or systems for life support (e.g. artificial life support device s or systems), surgical im plantations, or healthcare intervention (e.g. excision, etc.), and any other applicati ons or purposes that pose a di rect threat to human life. 8. you should use the renesas electronics pr oducts described in this document within the range specified by renesas electronics , especially with respect to the maximum ra ting, operating supply voltage range, movement power volta ge range, heat radiation characteristics, installation and other product characteristics. renesas electronics shall have no liability for malfunctions o r damages arising out of the use of renesas electronics products beyond such specified ranges. 9. although renesas electronics endeavors to improve the quality and reliability of its produc ts, semiconductor products have specific characteristics such as the occurrence of failure at a certain rate a nd malfunctions under certain use conditions. fur ther, renesas electronics products are not subject to radiation resistance design. please be sure to implement safety measures to guard them against the possibility of physic al injury, and injury or damage caused by fire in the event of the failure of a renesas electronics product, such as safe ty design for hardware and software in cluding but not limited to redundancy, fire control and malfunction prevention, appropri ate treatment for aging degradation or an y other appropriate measures. because the evaluation of microcomputer software alone is very difficult , please evaluate the safety of the final products or system manufactured by you. 10. please contact a renesa s electronics sales office for details as to environmental matters such as the environmental compatibility of each renesas electronics product. please use renesas electronics products in compliance with all applicable laws and regulations that regul ate the inclusion or use of c ontrolled substances, including wi thout limitation, the eu rohs directive. renesas electronics assumes no liability for damage s or losses occurring as a result of your noncompliance with applicable laws and regulations. 11. this document may not be reproduced or duplicated, in any form, in w hole or in part, without prio r written consent of renes as electronics. 12. please contact a renesa s electronics sales office if you have any questi ons regarding the informat ion contained in this document or renesas electroni cs products, or if you have any other inquiries. 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the information in this document is subject to change without notice. mos integrated circuit pd16805 monolithic h bridge driver circuit document no. s11032ej4v0ds00 (4th edition) date published july 2001 n cp(k) printed in japan data sheet ? 1997 pd16805 is the monolithic and h bridge driver ic which consists of a cmos control circuit and a mos output stage. as compared with the driver of a mos process using the conventional bipolar transistor, reduction of consumption current and power consumption is possible. with this product, clockwise and the inversion, and the brake function are built in, and it is the best for the drive circuit of the motor for film winding up of a camera, and the motor for auto focus/zooms. the package has adopted the 16 pin sop and the 24 pin tssop, and corresponds to reduction of mounting area and mounting height. this product corresponds to the drive current to 1.0 a (dc). features ? high drive current i d(pulse) = 4.2 a max. at pw 200 ms (single pulse) i d(dc) = 1.0 a (dc) ? low-on resistance (sum of the upper and lower sides mos fet) r on = 0.4 ? typ. at i d = 1.0 a ? standby function that turns off charge pump circuit ? compact surface mount package 16-pin plastic sop (1.27 mm pitch) 24-pin plastic tssop (0.5 mm pitch) ordering information part number package pd16805gs 16-pin plastic sop (7.64 mm (300)) pd16805ma-6a5 24-pin plastic tssop (5.72 mm (225))
data sheet s11032ej4v0ds 2 pd16805 absolute maximum ratings (t a = 25 c, glass epoxy substrate 100 mm 100 mm 1 mm, 15% copper foil) parameter symbol conditions rating unit v dd control section ? 0.5 to +6.5/+8.0 note v supply voltage v m motor section ? 0.5 to +6.5/+8.0 note v v g pin applied voltage v g 15 v input voltage v in ? 0.5 to v dd +0.5 v h bridge drive current i d(dc) dc 1.0 a h bridge drive current i d(pulse) pw 200 ms (single pulse) 4.2 a/ch gs 1.0 w power consumption p t ma-6a5 0.7 w peak junction temperature t ch(max) 150 c storage temperature t stg ? 55 to +150 c note when the charge pump is used/when vg power-source supply from the exterior. recommended operating conditions (t a = 25 c, glass epoxy substrate 100 mm 100 mm 1 mm, 15% copper foil) parameter symbol conditions min. typ. max. unit during normal operation 3.0 v dd all input pins are low 2.5 v supply voltage v m 0.5 6.0/7.5 note 2 v charge pump capacitance c 1 to c 3 0.01 f v g pin applied voltage note 1 v g at the time of external input 11 14 v operating temperature t a ambient temperature ? 30 60 c notes 1. when voltage is impressed to vg terminal from the exterior 2. when the charge pump is used/when vg power-source supply from the exterior. electrical specifications (unless otherwise specified, v dd = recommended operating condition, v m = 0.5 to 6.0 v) parameter symbol conditions min. typ. max. unit i dd1 v dd = 5 v, t a = recommended conditions control pins at high level 0.6 2.0 ma v dd pin current i dd2 v dd = 5 v, t a = recommended conditions control pins at low level 0.3 10 a i m1 t a = reommended conditions control pins at low level 0.1 10 a v m pin current i m2 control pins at low level 1.0 a h bridge on resistance r on i d = 1 a, v dd = v m = 5 v c 1 = c 2 = c 3 = 0.01 f sum of the upper and lower sides mosfet 0.4 0.6 ? high-level input voltage v ih t a = recommended conditions 0.6 v dd v low-level input voltage v il t a = recommended conditions 0.2 v dd v charge pump circuit turn-on time t ong 0.5 1.0 ms h bridge output circuit turn-on time t onh 10 s h bridge output circuit turn-off time t offh v dd = v m = 5 v, t a = recommended conditions c 1 = c 2 = c 3 = 0.01 f i d = 1 a 5.0 s 35 50 65 k ? control pin input pull-down resistor r ind t a = recommended conditions 25 75 k ?
data sheet s11032ej4v0ds 3 pd16805 function table input signal in1 in2 inc stb function h h h h brake mode h l h h forward mode l h h h reverse mode l l h h stop mode x x l h stop mode x x x l standby mode on out1 v m off forward mode out2 off on off out1 v m on reverse mode out2 on off off out1 v m on brake mode out2 off on off out1 v m off stop mode out2 off off
data sheet s11032ej4v0ds 4 pd16805 terminal function ? ? ? ? pd16805gs package: 16 pin plastic sop c 2l c 1h c 1l v m v dd in1 in2 inc c 2h v g stby out2 pgnd out1 v m dgnd 1 2 3 4 5 6 7 8 16 15 14 13 12 11 10 9 terminal no. terminal name terminal function 1c 2l the capacitor connection terminal for charge pumps 2c 1h the capacitor connection terminal for charge pumps 3c 1l the capacitor connection terminal for charge pumps 4v m motor block supply voltage input terminal 5v dd control block supply voltage input terminal 6 in1 input terminal 7 in2 input terminal 8 inc input terminal 9 dgnd control block gnd terminal 10 v m motor block supply voltage input terminal 11 out1 output terminal 12 pgnd output block gnd terminal 13 out2 output terminal 14 stby standby terminal 15 v g gate input terminal 16 c 2h the capacitor connection terminal for charge pumps
data sheet s11032ej4v0ds 5 pd16805 terminal function ? ? ? ? pd16805ma-6a5 package: 24 pin plastic tssop c 2l c 1h c 1l v m v m nc nc nc v dd in1 in2 inc c 2h v g stby out2 out2 pgnd pgnd out1 out1 v m v m dgnd 1 2 3 4 5 6 7 8 9 10 11 12 24 23 22 21 20 19 18 17 16 15 14 13 terminal no. terminal name terminal function 1c 2l the capacitor connection terminal for charge pumps 2c 1h the capacitor connection terminal for charge pumps 3c 1l the capacitor connection terminal for charge pumps 4v m motor block supply voltage input terminal 5v m motor block supply voltage input terminal 6 nc no used terminal 7 nc no used terminal 8 nc no used terminal 9v dd control block supply voltage input terminal 10 in1 input terminal 11 in2 input terminal 12 inc input terminal 13 dgnd control block gnd terminal 14 v m motor block supply voltage input terminal 15 v m motor block supply voltage input terminal 16 out1 output terminal 17 out1 output terminal 18 pgnd output block gnd terminal 19 pgnd output block gnd terminal 20 out2 output terminal 21 out2 output terminal 22 stby standby terminal 23 v g gate input terminal 24 c 2h the capacitor connection terminal for charge pumps notice please connect all the terminals that have plural. (v m , out1, out2, pgnd) no used terminals are connected to ground.
data sheet s11032ej4v0ds 6 pd16805 block diagram 1 2 3 4 5 6 7 8 9 10 11 12 c2l c1h c1l v m v m nc nc nc v dd in1 in2 inc 24 23 22 21 20 19 18 17 16 15 14 13 c2h v g stby out2 out2 pgnd pgnd out1 out1 v m v m dgnd level shift circuit control circuit charge-pump circuit h-bridge circuit the connection diagram of pd16805ma-6a5 shows the block diagram. it of pd16805gs does not change, except that there are not nc and plural terminals. the plural terminal should connect all terminals.
data sheet s11032ej4v0ds 7 pd16805 the example of standard connection (1) using charge pump circuit 1 2 3 4 5 6 7 8 9 10 11 12 c2l c1h c1l v m v m nc nc nc v dd in1 in2 inc 24 23 22 21 20 19 18 17 16 15 14 13 c2h v g stby out2 out2 pgnd pgnd out1 out1 v m v m dgnd level shift circuit control circuit charge-pump circuit h-bridge circuit 0.01 f 0.01 f 0.01 f cpu cpu cpu cpu 10 f 0.5 to 6.0 v reg 3.0 to 6.0 v m (2) unusing charge pump circuit 1 2 3 4 5 6 7 8 9 10 11 12 c2l c1h c1l v m v m nc nc nc v dd in1 in2 inc 24 23 22 21 20 19 18 17 16 15 14 13 c2h v g stby out2 out2 pgnd pgnd out1 out1 v m v m dgnd level shift circuit control circuit charge-pump circuit h-bridge circuit cpu cpu cpu cpu 10 f 0.5 to 7.5 v reg 3.0 to 7.5 v m 11 to 14 v the connection diagram of pd16805ma-6a5 is shown by the inside of a figure. this circuit diagrams are an example of connection, and are not intended for use in actual design-ins. moreover, it recommendeds inserting an about several f capacitor between vm-gnd for surge voltage protection of the output stage.
data sheet s11032ej4v0ds 8 pd16805 typical characteristics (t a = 25 c) p t -t a characteristics ambient temperature t a ( c) 10 0 20304050607080 total power dissipation p t (w) 1.4 1.2 1.0 0.8 0.6 0.4 0.2 v g -i g characteristics gate supply voltage v g (v) 5 0101520 gate current i g ( a) 60 50 40 30 20 10 v g -r on characteristics gate supply voltage v g (v) 5 0101520 h-bridge on resistance r on ( ? ) 1.2 1.0 0.8 0.6 0.4 0.2 v dd = 5 v v dd = 5 v r on -t a characteristics ambient temperature t a ( c) ?5 0 25 50 75 100 h-bridge on resistance r on ( ? ) 1.2 1.0 0.8 0.6 0.4 0.2 0 ?0 i dr = 0.5 a v dd = v m = 5 v pd16805gs pd16805ma-6a5
data sheet s11032ej4v0ds 9 pd16805 package dimension ( pd16805gs) detail of lead end m 18 9 16 s s a b h k m l p j i g c e f n d item b c i 16-pin plastic sop (7.62 mm (300)) a d e f g h j p millimeters 1.27 (t.p.) 0.78 max. 5.6 0.2 10.2 0.2 0.1 0.1 0.42 1.65 0.15 7.7 0.3 1.55 + 0.08 ? 0.07 1.1 0.2 3 + 7 ? 3 note each lead centerline is located within 0.12 mm of its true position (t.p.) at maximum material condition. m l n 0.12 0.6 0.2 0.10 k 0.22 + 0.08 ? 0.07 p16gm-50-300b-6
data sheet s11032ej4v0ds 10 pd16805 package dimension ( pd16805ma-6a5) s 24-pin plastic tssop (5.72 mm (225)) note each lead centerline is located within 0.10 mm of its true position (t.p.) at maximum material condition. item millimeters a a' c d 6.65 0.10 6.5 0.1 0.1 0.05 f 0.5 (t.p.) g b 0.575 e 0.22 0.05 1.2 max. h 1.0 0.05 i 6.4 0.1 j 4.4 0.1 k 0.17 0.025 l 0.5 m 0.10 n 0.08 r 0.25 1.0 0.1 s 0.6 0.15 p24ma-50-6a5 p3 + 5 ? 3 24 13 1 12 m s n k f g l r s e p j dm c a b a' h i detail of lead end
data sheet s11032ej4v0ds 11 pd16805 recommended soldering conditions it is recommended to solder this under the conditions described below. for soldering methods and conditions other than those listed below, consult nec. for details of the recommended soldering conditions, refer to information document ?semiconductor device mounting technology manual? . pd16805gs soldering method soldering conditions recommended conditions symbol infrared reflow peak package temperature: 235 c, time: 30 seconds max. (210 c min.), number of times: 2 max. ir35-00-2 vps peak package temperature: 215 c, time: 40 seconds max. (200 c min.), number of times: 2 max. vp15-00-2 the number of storage days at 25 c, 65% rh after the dry pack has been opened pd16805ma-6a5 soldering method soldering conditions recommended conditions symbol infrared reflow package peak temperature: 235 c; duration: 30 sec. max. (210 c or above): number of times: max. 3; time limit: none note flux: rosin type flux with reduced chlorine content (chlorine 0.2 wt% or less) is recommended. ir35-00-3 vps package peak temperature: 215 c; duration: 40 sec. max. (200 c or above): number of times:3; time limit: none note flux: rosin type flux with reduced chlorine content (chlorine 0.2 wt% or less) is recommended. vp15-00-3 wave soldering package peak temperature: 260 c or less, duration: 10 sec. max.,. preparatory heating temperature: 120 c or less; number of times: 1 flux: rosin type flux with reduced chlorine content (chlorine 0.2 wt% or less) is recommended. ws60-00-1 note the number of storage days at 25 c, 65% rh after the dry pack has been opened caution use of more than one soldering method should be avoided.
data sheet s11032ej4v0ds 12 pd16805 [memo]
data sheet s11032ej4v0ds 13 pd16805 [memo]
data sheet s11032ej4v0ds 14 pd16805 [memo]
data sheet s11032ej4v0ds 15 pd16805 notes for cmos devices 1 precaution against esd for semiconductors note: strong electric field, when exposed to a mos device, can cause destruction of the gate oxide and ultimately degrade the device operation. steps must be taken to stop generation of static electricity as much as possible, and quickly dissipate it once, when it has occurred. environmental control must be adequate. when it is dry, humidifier should be used. it is recommended to avoid using insulators that easily build static electricity. semiconductor devices must be stored and transported in an anti-static container, static shielding bag or conductive material. all test and measurement tools including work bench and floor should be grounded. the operator should be grounded using wrist strap. semiconductor devices must not be touched with bare hands. similar precautions need to be taken for pw boards with semiconductor devices on it. 2 handling of unused input pins for cmos note: no connection for cmos device inputs can be cause of malfunction. if no connection is provided to the input pins, it is possible that an internal input level may be generated due to noise, etc., hence causing malfunction. cmos devices behave differently than bipolar or nmos devices. input levels of cmos devices must be fixed high or low by using a pull-up or pull-down circuitry. each unused pin should be connected to v dd or gnd with a resistor, if it is considered to have a possibility of being an output pin. all handling related to the unused pins must be judged device by device and related specifications governing the devices. 3 status before initialization of mos devices note: power-on does not necessarily define initial status of mos device. production process of mos does not define the initial operation status of the device. immediately after the power source is turned on, the devices with reset function have not yet been initialized. hence, power-on does not guarantee out-pin levels, i/o settings or contents of registers. device is not initialized until the reset signal is received. reset operation must be executed immediately after power-on for devices having reset function.
pd16805 m8e 00. 4 the information in this document is current as of june, 2001. the information is subject to change without notice. for actual design-in, refer to the latest publications of nec's data sheets or data books, etc., for the most up-to-date specifications of nec semiconductor products. not all products and/or types are available in every country. please check with an nec sales representative for availability and additional information. no part of this document may be copied or reproduced in any form or by any means without prior written consent of nec. nec assumes no responsibility for any errors that may appear in this document. nec does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from the use of nec semiconductor products listed in this document or any other liability arising from the use of such products. no license, express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of nec or others. descriptions of circuits, software and other related information in this document are provided for illustrative purposes in semiconductor product operation and application examples. the incorporation of these circuits, software and information in the design of customer's equipment shall be done under the full responsibility of customer. nec assumes no responsibility for any losses incurred by customers or third parties arising from the use of these circuits, software and information. while nec endeavours to enhance the quality, reliability and safety of nec semiconductor products, customers agree and acknowledge that the possibility of defects thereof cannot be eliminated entirely. to minimize risks of damage to property or injury (including death) to persons arising from defects in nec semiconductor products, customers must incorporate sufficient safety measures in their design, such as redundancy, fire-containment, and anti-failure features. nec semiconductor products are classified into the following three quality grades: "standard", "special" and "specific". the "specific" quality grade applies only to semiconductor products developed based on a customer-designated "quality assurance program" for a specific application. the recommended applications of a semiconductor product depend on its quality grade, as indicated below. customers must check the quality grade of each semiconductor product before using it in a particular application. "standard": computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots "special": transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support) "specific": aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems and medical equipment for life support, etc. the quality grade of nec semiconductor products is "standard" unless otherwise expressly specified in nec's data sheets or data books, etc. if customers wish to use nec semiconductor products in applications not intended by nec, they must contact an nec sales representative in advance to determine nec's willingness to support a given application. (note) (1) "nec" as used in this statement means nec corporation and also includes its majority-owned subsidiaries. (2) "nec semiconductor products" means any semiconductor product developed or manufactured by or for nec (as defined above). ? ? ? ? ? ?

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