1. 2. 3. material content data sheet sales product name ba 895 h6327 issued 29. august 2013 ma# MA000770644 package pg-scd80-2-1 weight* 1.89 mg construction element material group substances cas# if applicable weight [mg] average mass [%] sum [%] average mass [ppm] sum [ppm] chip non noble metal arsenic 7440-38-2 0.000 0.00 33 noble metal gold 7440-57-5 0.006 0.32 3230 inorganic material silicon 7440-21-3 0.052 2.76 3.08 27585 30848 leadframe inorganic material silicon 7440-21-3 0.000 0.01 79 non noble metal titanium 7440-32-6 0.001 0.04 395 non noble metal chromium 7440-47-3 0.002 0.12 1185 non noble metal copper 7440-50-8 0.744 39.33 39.50 393310 394969 wire non noble metal copper 7440-50-8 0.002 0.12 0.12 1165 1165 encapsulation organic material carbon black 1333-86-4 0.010 0.51 5085 plastics epoxy resin - 0.164 8.64 86448 inorganic material silicondioxide 60676-86-0 0.789 41.70 50.85 416982 508515 leadfinish non noble metal tin 7440-31-5 0.036 1.90 1.90 19027 19027 plating noble metal silver 7440-22-4 0.086 4.55 4.55 45476 45476 *deviation < 10% sum in total: 100,00 1000000 important remarks: infineon technologies ag provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. infineon technologies ag and infineon technologies ag suppliers consider certain information to be proprietary, and thus cas numbers and other limited information may not be available for release. all statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. company infineon technologies ag address 81726 mnchen internet www.infineon.com
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