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www.rohm.com tsz02201-0gmg0g200600-1-2 ?2013 rohm co., ltd. all rights reserved. 1/50 14.july.2016.rev004 tsz22111 ? 14 ? 001 datashee t operational amplifiers low supply current input/output full swing operational amplifier bd12730g bd12732xxx bd12734xxx general description bd12730g/bd12732xxx/bd12734xxx are input/output full swing operational amplifiers. they have the features of low operating supply voltage, low supply current, low input referred noise voltage and high phase margin. these are suitable for audio applications and battery management. features ? low operating supply voltage ? input/output full swing ? low supply current ? high phase margin ? low input referred noise voltage applications ? audio application ? battery management ? general purpose key specifications ? operating supply voltage (single supply): +1.8v to +5.5v ? operating temperature range: -40c to +85c ? input offset voltage: 5mv (max) ? supply current: bd12730g(single) 550a (max) bd12732xxx(dual) 900a (max) bd12734xxx(quad) 1800a (max) ? input referred noise voltage: 10 hz nv/ (typ) ? adequate phase margin: 75(typ) packages w(typ) x d(typ) x h(max) ssop5 2.90mm x 2.80mm x 1.25mm sop8 5.00mm x 6.20mm x 1.71mm sop-j8 4.90mm x 6.00mm x 1.65mm ssop-b8 3.00mm x 6.40mm x 1.35mm tssop-b8 3.00 mm x 6.40mm x 1.20mm msop8 2.90mm x 4.00mm x 0.90mm tssop-b8j 3.00mm x 4.90mm x 1.10mm sop14 8.70mm x 6.20mm x 1.71mm sop-j14 8.65 mm x 6.00mm x 1.65mm ssop-b14 5.00 mm x 6.40mm x 1.35mm tssop-b14j 5. 00mm x 6.40mm x 1.20mm pin configuration bd12730g : ssop5 pin no. pin name 1 +in 2 gnd 3 -in 4 out 5 v+ 1 - + 2 3 4 5 gnd -in +in v+ out product structure silicon monolithic integrated circuit this product has no designed protec tion against radioactive rays. downloaded from: http:///
datasheet www.rohm.com tsz02201-0gmg0g200600-1-2 ?2013 rohm co., ltd. all rights reserved. 2/50 14.july.2016.rev004 tsz22111 ? 15 ? 001 bd12730g bd12732xxx bd12734xxx bd12732f : sop8 bd12732fj : sop-j8 bd12732fv : ssop-b8 bd12732fvt : tssop-b8 bd12732fvm : msop8 bd12732fvj : tssop-b8j pin no. pin name 1 out1 2 -in1 3 +in1 4 gnd 5 +in2 6 -in2 7 out2 8 v+ bd12734f : sop14 bd12734fj : sop-j14 bd12734fv : ssop-b14 bd12734fvj : tssop-b14j pin no. pin name 1 out1 2 -in1 3 +in1 4 v+ 5 +in2 6 -in2 7 out2 8 out3 9 -in3 10 +in3 11 gnd 12 +in4 13 -in4 14 out4 ordering information b d 1 2 7 3 x x x x - x x part number bd12730g bd12732xxx bd12734xxx package g : ssop5 f : sop8 fj : sop-j8 fv : ssop-b8 fvt : tssop-b8 fvm : msop8 fvj : tssop-b8j f : sop14 fj : sop-j14 fv : ssop-b14 fvj : tssop-b14j packaging and forming specification tr: embossed tape and reel (ssop5/msop8) e2: embossed tape and reel (sop8/sop-j8/ssop-b8/tssop-b8/ tssop-b8j/sop14/sop-j14/ssop-b14/ tssop-b14j) v+ ch1 - + ch4 - + ch3 ch2 - + - + 1 2 3 4 14 13 12 11 5 6 7 10 9 8 out4 out3 -in4 +in4 gnd +in3 -in3 out1 out2 -in1 +in1+in2 -in2 + ch2 - + ch1 - + 1 2 3 4 8 7 6 5 gnd out1 -in1 +in1 out2 v+ +in2 -in2 downloaded from: http:///
datasheet www.rohm.com tsz02201-0gmg0g200600-1-2 ?2013 rohm co., ltd. all rights reserved. 3/50 14.july.2016.rev004 tsz22111 ? 15 ? 001 bd12730g bd12732xxx bd12734xxx line-up operating temperature channels package orderable part number -40c to +85c 1ch ssop5 reel of 3000 bd12730g-tr 2ch sop8 reel of 2500 bd12732f-e2 sop-j8 reel of 2500 bd12732fj-e2 ssop-b8 reel of 2500 bd12732fv-e2 tssop-b8 reel of 3000 bd12732fvt-e2 msop8 reel of 3000 bd12732fvm-tr tssop-b8j reel of 2500 bd12732fvj-e2 4ch sop14 reel of 2500 bd12734f-e2 sop-j14 reel of 2500 bd12734fj-e2 ssop-b14 reel of 2500 bd12734fv-e2 tssop-b14j reel of 2500 bd12734fvj-e2 absolute maximum ratings (t a =25c) parameter symbol rating unit bd12730g bd12732xxx bd12734xxx supply voltage v+ +7.0 v power dissipation p d ssop5 0.67 (note 1,9) - - w sop8 - 0.68 (note 2,9) - sop-j8 - 0.67 (note 1,9) - ssop-b8 - 0.62 (note 3,9) - tssop-b8 - 0.62 (note 3,9) - msop8 - 0.58 (note 4,9) - tssop-b8j - 0.58 (note 4,9) - sop14 - - 0.56 (note 5,9) sop-j14 - - 1.02 (note 6,9) ssop-b14 - - 0.87 (note 7,9) tssop-b14j - - 0.85 (note 8,9) differential input voltage (note 10) v id 3.0 v input common-mode voltage range v icm gnd to v+ v input current (note 11) i i 10 ma operating supply voltage v opr +1.8 to +5.5 v operating temperature t opr - 40 to +85 c storage temperature t stg - 55 to +150 c maximum junction temperature t jmax +150 c (note 1) to use at temperature above t a =25c, reduce by 5.4mw/c. (note 2) to use at temperature above t a =25c, reduce by 5.5mw/c. (note 3) to use at temperature above t a =25c, reduce by 5.0mw/c. (note 4) to use at temperature above t a =25c, reduce by 4.7mw/c. (note 5) to use at temperature above t a =25c, reduce by 4.5mw/c. (note 6) to use at temperature above t a =25c, reduce by 8.2mw/c. (note 7) to use at temperature above t a =25c, reduce by 7.0mw/c. (note 8) to use at temperature above t a =25c, reduce by 6.8mw/c. (note 9) mounted on a fr4 glass epoxy pcb 70mm70mm1.6mm (copper foil area less than 3%). (note 10) differential input voltage is the voltage differ ence between the inverting and non-inverting inputs. the input pin voltage is set to more than gnd. (note 11) an excessive input current will flow when input voltages of more than supply voltage(v+)+0.6v or less than gnd-0.6v are applied. the input current can be set to less than the rated current by adding a limiting resistor. caution: operating the ic over the absolute maximum ratings ma y damage the ic. the damage can either be a short circuit betwee n pins or an open circuit between pins and the internal circuitry. therefore, it is important to consider circuit protection measures, such as ad ding a fuse, in case the ic is operated over the absolute maximum ratings. downloaded from: http:///
datasheet www.rohm.com tsz02201-0gmg0g200600-1-2 ?2013 rohm co., ltd. all rights reserved. 4/50 14.july.2016.rev004 tsz22111 ? 15 ? 001 bd12730g bd12732xxx bd12734xxx electrical characteristics bd12730g (unless otherwise s pecified v+=+5v, gnd=0v, t a =25c) parameter symbol limit unit conditions min typ max supply current i dd - 320 550 a r l = , +in=2.5v input offset voltage (note 12) v io - 1 5 mv - input bias current (note 12) i b - 50 250 na - input offset current (note 12) i io - 5 100 na - large signal voltage gain a v 60 85 - db r l =2k ? (note 13) common-mode rejection ratio cmrr 55 70 - db - power supply rejection ratio psrr 70 85 - db - maximum output voltage (high) v oh1 4.9 4.95 - v r l =20k ? (note 13) v oh2 4.75 4.85 - v r l =2k ? (note 13) maximum output voltage (low) v ol1 - 0.05 0.1 v r l =20k ? (note 13) v ol2 - 0.15 0.25 v r l =2k ? (note 13) output source current i source - 12 - ma out=0v output sink current i sink - 5 - ma out=5v input common-mode voltage range v icm 0 - 5 v cmrr>55db gain bandwidth gbw - 1 - mhz f=10khz unity gain frequency f t - 1 - mhz r l =2k ? (note 13) phase margin - 75 - deg r l =2k ? (note 13) input referred noise voltage v n - 10 - hz nv/ f=1khz - 1.2 - vrms r s =100 ? , din-audio slew rate sr - 0.4 - v/s r l =2k ? (note 13) (note 12) absolute value (note 13) output load resistance connect to a half of v+ downloaded from: http:///
datasheet www.rohm.com tsz02201-0gmg0g200600-1-2 ?2013 rohm co., ltd. all rights reserved. 5/50 14.july.2016.rev004 tsz22111 ? 15 ? 001 bd12730g bd12732xxx bd12734xxx electrical characteristics C continued bd12732xxx (unless otherwise specified v+=+5v, gnd=0v, t a =25c) parameter symbol limit unit conditions min typ max supply current i dd - 580 900 a r l = , +in=2.5v all op-amps input offset voltage (note 14) v io - 1 5 mv - input bias current (note 14) i b - 50 250 na - input offset current (note 14) i io - 5 100 na - large signal voltage gain a v 60 85 - db r l =2k ? (note 15) common-mode rejection ratio cmrr 55 70 - db - power supply rejection ratio psrr 70 85 - db - maximum output voltage (high) v oh1 4.9 4.95 - v r l =20k ? (note 15) v oh2 4.75 4.85 - v r l =2k ? (note 15) maximum output voltage (low) v ol1 - 0.05 0.1 v r l =20k ? (note 15) v ol2 - 0.15 0.25 v r l =2k ? (note 15) output source current i source - 12 - ma out=0v output sink current i sink - 5 - ma out=5v input common-mode voltage range v icm 0 - 5 v cmrr>55db gain bandwidth gbw - 1 - mhz f=10khz unity gain frequency f t - 1 - mhz r l =2k ? (note 15) phase margin - 75 - deg r l =2k ? (note 15) input referred noise voltage v n - 10 - hz nv/ f=1khz - 1.2 - vrms r s =100 ? , din-audio slew rate sr - 0.4 - v/s r l =2k ? (note 15) channel separation cs - 90 - db f=1khz, r l =2k ? (note 15) out=1.2vrms (note 14) absolute value (note 15) output load resistance connect to a half of v+ downloaded from: http:///
datasheet www.rohm.com tsz02201-0gmg0g200600-1-2 ?2013 rohm co., ltd. all rights reserved. 6/50 14.july.2016.rev004 tsz22111 ? 15 ? 001 bd12730g bd12732xxx bd12734xxx electrical characteristics C continued bd12734xxx (unless otherwise specified v+=+5v, gnd=0v, t a =25c) parameter symbol limit unit conditions min typ max supply current i dd - 1200 1800 a r l = , +in=2.5v all op-amps input offset voltage (note 16) v io - 1 5 mv - input bias current (note 16) i b - 50 250 na - input offset current (note 16) i io - 5 100 na - large signal voltage gain a v 60 85 - db r l =2k ? (note 17) common-mode rejection ratio cmrr 55 70 - db - power supply rejection ratio psrr 70 85 - db - maximum output voltage (high) v oh1 4.9 4.95 - v r l =20k ? (note 17) v oh2 4.75 4.85 - v r l =2k ? (note 17) maximum output voltage (low) v ol1 - 0.05 0.1 v r l =20k ? (note 17) v ol2 - 0.15 0.25 v r l =2k ? (note 17) output source current i source - 12 - ma out=0v output sink current i sink - 5 - ma out=5v input common-mode voltage range v icm 0 - 5 v cmrr>55db gain bandwidth gbw - 1 - mhz f=10khz unity gain frequency f t - 1 - mhz r l =2k ? (note 17) phase margin - 75 - deg r l =2k ? (note 17) input referred noise voltage v n - 10 - hz nv/ f=1khz - 1.2 - vrms r s =100 ? , din-audio slew rate sr - 0.4 - v/s r l =2k ? (note 17) channel separation cs - 133 - db f=1khz, r l =2k ? (note 17) out=1.2vrms (note 16) absolute value (note 17) output load resistance connect to a half of v+ downloaded from: http:///
datasheet www.rohm.com tsz02201-0gmg0g200600-1-2 ?2013 rohm co., ltd. all rights reserved. 7/50 14.july.2016.rev004 tsz22111 ? 15 ? 001 bd12730g bd12732xxx bd12734xxx description of electrical characteristics described here are the terms of electric characteristics us ed in this datasheet. items and symbols used are also shown. note that item name, symbol and their meaning may differ from those on other manufac turers document or general documents. 1. absolute maximum ratings absolute maximum rating items indicate the condition which must not be exceeded. app lication of voltage in excess of absolute maximum rating or use out of absolute maximum rated temperature environment may cau se deterioration of characteristics. (1) supply voltage (v+/gnd) indicates the maximum voltage that can be applied between the v+ terminal and gnd terminal without deterioration or destruction of characteristics of internal circuit. (2) differential input voltage (v id ) indicates the maximum voltage that can be applied between non-inverting and inverting terminals without damaging the ic. (3) input common-mode voltage range (v icm ) indicates the maximum voltage that can be applied to the non- inverting and inverting terminals without deterioration or destruction of electrical characteristics. input common-mode voltage range of the maximum rati ngs does not assure normal operation of ic. for normal operation, use the ic wi thin the input common-mode voltage range characteristics. (4) power dissipation (p d ) indicates the power that can be consumed by the ic when mounted on a specific board at the ambient temperature 25c (normal temperature). as for package product, p d is determined by the temperature t hat can be permitted by the ic in the package (maximum junction temperature) and the thermal resistance of the package. 2. electrical characteristics (1) supply current (i dd ) indicates the current that flows within the ic under specified no-load conditions. (2) input offset voltage (v io ) indicates the voltage difference between non-inverting termi nal and inverting terminals. it can be translated into the input voltage difference required for setting the output voltage at 0 v. (3) input bias current (i b ) indicates the current that flows into or out of the input terminal. it is defined by the average of input bias currents at the non-inverting and inverting terminals. (4) input offset current (i io ) indicates the difference of input bias current bet ween the non-inverting and inverting terminals. (5) large signal voltage gain (a v ) indicates the amplifying rate (gain) of output voltage against the voltage difference between non-inverting terminal and inverting terminal. it is normally the amplifying rate (gain) with reference to dc voltage. a v = (output voltage) / (differential input voltage) (6) common-mode rejection ratio (cmrr) indicates the ratio of fluctuation of input offset voltage when the input common mode voltage is changed. it is normally the fluctuation of dc. cmrr = (change of input common-mode voltage)/(input offset fluctuation) (7) power supply rejection ratio (psrr) indicates the ratio of fluctuation of input offset voltage when supply voltage is changed. it is normally the fluctuation of dc. psrr = (change of power supply voltage)/(input offset fluctuation) (8) maximum output voltage (high/low level output voltage) (v oh /v ol ) indicates the voltage range of the output under specified load condition. it is typically divided into maximum output voltage high and low. maximum output voltage high indica tes the upper limit of out put voltage. maximum output voltage low indicates the lower limit. (9) output source curr ent/ output sink current (i source / i sink ) the maximum current that can be output from the ic under specif ic output conditions. t he output source current indicates the current flowing out from the ic, and the output sink current indica tes the current flowing into the ic. (10) input common-mode voltage range (v icm ) indicates the input voltage range where ic normally operates. (11) gain bandwidth (gbw) the product of the open-loop voltage gai n and the frequency at which the voltage gain decreases 6db/octave. (12) unity gain frequency (f t ) indicates a frequency where the voltage gain of operational amplifier is 1. (13) phase margin ( ) indicates the margin of phase from 180 de gree phase lag at unity gain frequency. (14) input referred noise voltage (v n ) indicates a noise voltage generated inside the operational amplifier equivalent by ideal voltage source connected in series with input terminal. (15) slew rate (sr) indicates the ratio of the change in output voltage wi th time when a step input signal is applied. (16) channel separation (cs) indicates the fluctuation in the output voltage of the driven channel with reference to the change of output voltage of the channel which is not driven. downloaded from: http:///
datasheet www.rohm.com tsz02201-0gmg0g200600-1-2 ?2013 rohm co., ltd. all rights reserved. 8/50 14.july.2016.rev004 tsz22111 ? 15 ? 001 bd12730g bd12732xxx bd12734xxx typical performance curves bd12730g 0 1 2 3 4 5 6 123456 supply voltage [v] maximum output voltage (high) [v] 0 50 100 150 200 250 300 350 400 -50 -25 0 25 50 75 100 ambient temperature [ ] supply current [a] 0 50 100 150 200 250 300 350 400 123456 supply voltage [v] supply current [a] 0.0 0.2 0.4 0.6 0.8 0 25 50 75 100 125 150 ambient temperature [ ] power dissipation [w] figure 2. supply current vs supply voltage figure 3. supply current vs ambient temperature figure 4. maximum output voltage (high) vs supply voltage (r l =20k ? ) -40 25 figure 1. power dissipation vs ambient temperature (derating curve) 85 (*) the data above are measurement values of typical sample, it is not guaranteed. bd12730g 85 5.0v 1.8v 3.0v -40 25 85 downloaded from: http:///
datasheet www.rohm.com tsz02201-0gmg0g200600-1-2 ?2013 rohm co., ltd. all rights reserved. 9/50 14.july.2016.rev004 tsz22111 ? 15 ? 001 bd12730g bd12732xxx bd12734xxx typical performance curves C continued bd12730g 0 1 2 3 4 5 6 123456 supply voltage [v] maximum output voltage (high) [v] 0 3 6 9 12 15 18 - 5 0- 2 502 55 07 51 0 0 ambient temperature [ ] maximum output voltage (low) [mv] 0 3 6 9 12 15 18 123456 supply voltage [v] maximum output voltage (low) [mv] 0 1 2 3 4 5 6 -50 -25 0 25 50 75 100 ambient temperature [ ] maximum output voltage (high) [v] figure 7. maximum output voltage (low) vs ambient temperature (r l =20k ? ) (*) the data above are measurement values of typical sample, it is not guaranteed. figure 6. maximum output voltage (low) vs supply voltage (r l =20k ? ) figure 5. maximum output voltage (high) vs ambient temperature (r l =20k ? ) 1.8v 3.0v 5.0v 85 -40 25 figure 8. maximum output voltage (high) vs supply voltage (r l =2k ? ) -40 85 1.8v 3.0v 5.0v 25 downloaded from: http:///
datasheet www.rohm.com tsz02201-0gmg0g200600-1-2 ?2013 rohm co., ltd. all rights reserved. 10/50 14.july.2016.rev004 tsz22111 ? 15 ? 001 bd12730g bd12732xxx bd12734xxx typical performance curves C continued bd12730g -3 -2 -1 0 1 2 3 123456 supply voltage [v] input offset voltage [mv] 0 20 40 60 80 100 120 - 5 0- 2 5 0 2 55 07 51 0 0 ambient temperature [c] maximum output voltage (low) [v] 0 20 40 60 80 100 120 123456 supply voltage [v] maximum output voltage (low) [mv] 0 1 2 3 4 5 6 - 5 0- 2 5 0 2 55 07 51 0 0 ambient temperature [ ] maximum output voltage (high) [v] figure 11. maximum output voltage (low) vs ambient temperature (r l =2k ? ) (*) the data above are measurement values of typical sample, it is not guaranteed. figure 10. maximum output voltage (low) vs supply voltage (r l =2k ? ) figure 9. maximum output voltage (high) vs ambient temperature (r l =2k ? ) 1.8v 3.0v 5.0v -40 figure 12. input offset voltage vs supply voltage 1.8v 3.0v 5.0v 25 -40 85 25 85 downloaded from: http:///
datasheet www.rohm.com tsz02201-0gmg0g200600-1-2 ?2013 rohm co., ltd. all rights reserved. 11/50 14.july.2016.rev004 tsz22111 ? 15 ? 001 bd12730g bd12732xxx bd12734xxx typical performance curves C continued bd12730g -15 -10 -5 0 5 10 15 - 5 0- 2 5 0 2 5 5 0 7 51 0 0 ambient temperature [c] input offset current [na] 0 10 20 30 40 50 60 - 5 0- 2 5 0 2 5 5 0 7 51 0 0 ambient temperature [ ] input bias current [na] -5 -4 -3 -2 -1 0 1 2 3 4 5 - 10123456 input voltage [v] input offset voltage [mv] -5 -4 -3 -2 -1 0 1 2 3 4 5 -50 -25 0 25 50 75 100 ambient temperature [c] input offset voltage [mv] figure 15. input bias current vs ambient temperature (*) the data above are measurement values of typical sample, it is not guaranteed. figure 14. input common mode voltage range (v+=5v) figure 13. input offset voltage vs ambient temperature 1.8v 3.0v 5.0v -40 figure 16. input offset current vs ambient temperature 1.8v 3.0v 5.0v 25 85 1.8v 5.0v 3.0v downloaded from: http:///
datasheet www.rohm.com tsz02201-0gmg0g200600-1-2 ?2013 rohm co., ltd. all rights reserved. 12/50 14.july.2016.rev004 tsz22111 ? 15 ? 001 bd12730g bd12732xxx bd12734xxx typical performance curves C continued bd12730g -40 -20 0 20 40 60 80 1.e-01 1.e+00 1.e+01 1.e+02 1.e+03 1.e+04 frequency [hz] voltage gain [db] -100 -50 0 50 100 150 200 phase [deg] 40 50 60 70 80 90 100 -50 -25 0 25 50 75 100 ambient temperature [c] power supply rejection ratio [db] 40 50 60 70 80 90 100 - 5 0- 2 502 55 07 51 0 0 ambient temperature [c] common mode rejection ratio [db] 40 50 60 70 80 90 100 -50 -25 0 25 50 75 100 ambient temperature [ ] large signal voltage gain [db] figure 19. power supply rejection ratio vs ambient temperature (v+=1.8v to 5.0v) (*) the data above are measurement values of typical sample, it is not guaranteed. figure 18. common mode rejection rati o vs ambient temperature figure 17. large signal voltage gain vs ambient temperature (r l =2k ? ) 1.8v 3.0v 5.0v figure 20. voltage gain ? phase vs frequency (v+=5v, r l =2k ? , t a =25c) 10 2 10 3 10 4 10 5 10 6 10 7 gain phase 1.8v 3.0v 5.0v downloaded from: http:///
datasheet www.rohm.com tsz02201-0gmg0g200600-1-2 ?2013 rohm co., ltd. all rights reserved. 13/50 14.july.2016.rev004 tsz22111 ? 15 ? 001 bd12730g bd12732xxx bd12734xxx typical performance curves C continued bd12730g 0 20 40 60 80 100 10 100 1000 10000 load capacitance [pf] phase margin [deg] 0 0.4 0.8 1.2 1.6 2 10 100 1000 10000 load capacitance [pf] unity gain frequency [mhz] . 0 0.2 0.4 0.6 0.8 1 -50 -25 0 25 50 75 100 ambient temperature [ ] slew rate h-l [v/s] 0 0.2 0.4 0.6 0.8 1 - 5 0- 2 50 2 55 07 51 0 0 ambient temperature [ ] slew rate l-h [v/s] (*) the data above are measurement values of typical sample, it is not guaranteed. figure 22. slew rate h-l vs ambient temperature (r l =2k ? ) figure 21. slew rate l-h vs ambient temperature (r l =2k ? ) 1.8v 3.0v 5.0v 1.8v 3.0v 5.0v figure 23. unity gain frequency vs load capacitance (v+=5v, t a =25c) figure 24. phase margin vs load capacitance (v+=5v, t a =25c) downloaded from: http:///
datasheet www.rohm.com tsz02201-0gmg0g200600-1-2 ?2013 rohm co., ltd. all rights reserved. 14/50 14.july.2016.rev004 tsz22111 ? 15 ? 001 bd12730g bd12732xxx bd12734xxx typical performance curves C continued bd12730g 0.0 0.4 0.8 1.2 1.6 2.0 123456 supply voltage [v] input referred noise voltage [vrms] . (*) the data above are measurement values of typical sample, it is not guaranteed. figure 26. total harmonic distortion + noise vs output voltage (v+=5v, r l =2k ? , t a =25c) figure 25. input referred noise voltage vs supply voltage (t a =25c) 0.0001 0.0010 0.0100 0.1000 1.0000 0.01 0.10 1.00 10.00 output voltage [vrm s ] total harmonic distortion + noise [%] . 1khz 20hz 20khz downloaded from: http:///
datasheet www.rohm.com tsz02201-0gmg0g200600-1-2 ?2013 rohm co., ltd. all rights reserved. 15/50 14.july.2016.rev004 tsz22111 ? 15 ? 001 bd12730g bd12732xxx bd12734xxx typical performance curves C continued bd12732xxx 0 1 2 3 4 5 6 123456 ambient temperature [ ] maximum output voltage (high) [v] 0 100 200 300 400 500 600 700 800 -50 -25 0 25 50 75 100 ambient temperature [ ] supply current [a] 0 100 200 300 400 500 600 700 800 123456 supply voltage [v] supply current [a] 0.0 0.2 0.4 0.6 0.8 0 25 50 75 100 125 150 ambient temperature [c] power dissipation [w] (*) the data above are measurement values of typical sample, it is not guaranteed. -40 25 85 figure 28. supply current vs supply voltage figure 29. supply current vs ambient temperature figure 30. maximum output voltage (high) vs supply voltage (r l =20k ? ) -40 25 figure 27. power dissipation vs ambient temperature (derating curve) 85 bd12732f 85 5.0v 1.8v 3.0v bd12732fj bd12732fv bd12732fvt bd12732fvm bd12732fvj downloaded from: http:///
datasheet www.rohm.com tsz02201-0gmg0g200600-1-2 ?2013 rohm co., ltd. all rights reserved. 16/50 14.july.2016.rev004 tsz22111 ? 15 ? 001 bd12730g bd12732xxx bd12734xxx typical performance curves C continued bd12732xxx 0 1 2 3 4 5 6 123456 supply voltage [v] maximum output voltage (high) [v] 0 3 6 9 12 15 18 -50 -25 0 25 50 75 100 ambient temperature [ ] maximum output voltage (low) [mv] 0 3 6 9 12 15 18 123456 supply voltage [v] maximum output voltage (low) [mv] 0 1 2 3 4 5 6 - 5 0- 2 502 55 07 51 0 0 ambient temperature [ ] maximum output voltage (high) [v] (*) the data above are measurement values of typical sample, it is not guaranteed. figure 33. maximum output voltage (low) vs ambient temperature (r l =20k ? ) figure 32. maximum output voltage (low) vs supply voltage (r l =20k ? ) figure 31. maximum output voltage (high) vs ambient temperature (r l =20k ? ) 1.8v 3.0v 5.0v 85 -40 25 figure 34. maximum output voltage (high) vs supply voltage (r l =2k ? ) -40 85 1.8v 3.0v 5.0v 25 downloaded from: http:///
datasheet www.rohm.com tsz02201-0gmg0g200600-1-2 ?2013 rohm co., ltd. all rights reserved. 17/50 14.july.2016.rev004 tsz22111 ? 15 ? 001 bd12730g bd12732xxx bd12734xxx typical performance curves C continued bd12732xxx -3 -2 -1 0 1 2 3 123456 supply voltage [v] input offset voltage [mv] 0 20 40 60 80 100 120 - 5 0- 2 5 0 2 55 07 51 0 0 ambient temperature [ ] maximum output voltage low [mv] 0 20 40 60 80 100 120 123456 supply voltage [v] maximum output voltage (low) [mv] 0 1 2 3 4 5 6 - 5 0- 2 5 0 2 55 07 51 0 0 ambient temperature [ ] maximum output voltage (high) [v] (*) the data above are measurement values of typical sample, it is not guaranteed. figure 37. maximum output voltage (low) vs ambient temperature (r l =2k ? ) figure 36. maximum output voltage (low) vs supply voltage (r l =2k ? ) figure 35. maximum output voltage (high) vs ambient temperature (r l =2k ? ) 1.8v 3.0v 5.0v -40 figure 38. input offset voltage vs supply voltage 1.8v 3.0v 5.0v 25 -40 85 25 85 downloaded from: http:///
datasheet www.rohm.com tsz02201-0gmg0g200600-1-2 ?2013 rohm co., ltd. all rights reserved. 18/50 14.july.2016.rev004 tsz22111 ? 15 ? 001 bd12730g bd12732xxx bd12734xxx typical performance curves C continued bd12732xxx -15 -10 -5 0 5 10 15 -50 -25 0 25 50 75 100 ambient temperature [c] input offset current [na] -5 -4 -3 -2 -1 0 1 2 3 4 5 - 10123456 input voltage [v] input offset voltage [mv] -5 -4 -3 -2 -1 0 1 2 3 4 5 - 5 0- 2 50 2 55 07 51 0 0 ambient temperature [ ] input offset voltage [mv] 0 10 20 30 40 50 60 -50 -25 0 25 50 75 100 ambient temperature [ ] input bias current [na] (*) the data above are measurement values of typical sample, it is not guaranteed. figure 41. in p ut bias current vs ambient tem p erature figure 40. input common mode voltage range (v+=5v) figure 39. input offset voltage vs ambient temperature 1.8v 3.0v 5.0v -40 figure 42. input offset current vs ambient temperature 1.8v 3.0v 5.0v 25 85 3.0v 1.8v 5.0v downloaded from: http:///
datasheet www.rohm.com tsz02201-0gmg0g200600-1-2 ?2013 rohm co., ltd. all rights reserved. 19/50 14.july.2016.rev004 tsz22111 ? 15 ? 001 bd12730g bd12732xxx bd12734xxx typical performance curves C continued bd12732xxx -40 -20 0 20 40 60 80 1.e-01 1.e+00 1.e+01 1.e+02 1.e+03 1.e+04 frequency [hz] voltage gain [db] -100 -50 0 50 100 150 200 phase [deg] 40 50 60 70 80 90 100 -50 -25 0 25 50 75 100 ambient temperature [ ] power supply rejection ratio [db] 40 50 60 70 80 90 100 - 5 0- 2 5 0 2 55 07 51 0 0 ambient temperature [c] common mode rejection ratio [db] 40 50 60 70 80 90 100 -50 -25 0 25 50 75 100 ambient temperature [ ] large signal voltage gain [db] (*) the data above are measurement values of typical sample, it is not guaranteed. figure 45. power supply rejection ratio vs ambient temperature (v+=1.8v to 5.0v) figure 44. common mode rejection rati o vs ambient temperature figure 43. large signal voltage gain vs ambient temperature (r l =2k ? ) 1.8v 3.0v 5.0v figure 46. voltage gain ? phase vs frequency (v+=5v, r l =2k ? , t a =25c) 10 2 10 3 10 4 10 5 10 6 10 7 gain phase 1.8v 3.0v 5.0v downloaded from: http:///
datasheet www.rohm.com tsz02201-0gmg0g200600-1-2 ?2013 rohm co., ltd. all rights reserved. 20/50 14.july.2016.rev004 tsz22111 ? 15 ? 001 bd12730g bd12732xxx bd12734xxx typical performance curves C continued bd12732xxx 0 20 40 60 80 100 10 100 1000 10000 load capacitance [pf] phase margin [deg] 0 0.2 0.4 0.6 0.8 1 - 5 0- 2 5 0 2 5 5 0 7 51 0 0 ambient temperature [ ] slew rate h-l [v/s] 0 0.2 0.4 0.6 0.8 1 - 5 0- 2 50 2 55 07 51 0 0 ambient temperature [ ] slew rate l-h [v/s] 0 0.4 0.8 1.2 1.6 2 10 100 1000 10000 load capacitance [pf] unity gain frequency [mhz] . (*) the data above are measurement values of typical sample, it is not guaranteed. figure 48. slew rate h-l vs ambient temperature (r l =2k ? ) figure 47. slew rate l-h vs ambient temperature (r l =2k ? ) 1.8v 3.0v 5.0v 1.8v 3.0v 5.0v figure 49. unity gain frequency vs load capacitance (v+=5v, t a =25c) figure 50. phase margin vs load capacitance ( v+=5v , t a =25c ) downloaded from: http:///
datasheet www.rohm.com tsz02201-0gmg0g200600-1-2 ?2013 rohm co., ltd. all rights reserved. 21/50 14.july.2016.rev004 tsz22111 ? 15 ? 001 bd12730g bd12732xxx bd12734xxx typical performance curves C continued bd12732xxx 80 90 100 110 120 123456 supply voltage [v] channel separation [db] 0.0 0.4 0.8 1.2 1.6 2.0 123456 supply voltage [v] input referred noise voltage [vrms] . (*) the data above are measurement values of typical sample, it is not guaranteed. figure 52. total harmonic distortion + noise vs output voltage (v+=5v, r l =2k ? , t a =25c) figure 51. input referred noise voltage vs supply voltage (t a =25c) figure 53. channel separation vs supply voltage 85oc 25oc -40oc 0.0001 0.0010 0.0100 0.1000 1.0000 0.01 0.10 1.00 10.00 output voltage [vrm s ] total harmonic distortion + noise [%] . 1khz 20hz 20khz downloaded from: http:///
datasheet www.rohm.com tsz02201-0gmg0g200600-1-2 ?2013 rohm co., ltd. all rights reserved. 22/50 14.july.2016.rev004 tsz22111 ? 15 ? 001 bd12730g bd12732xxx bd12734xxx typical performance curves C continued bd12734xxx 0 1 2 3 4 5 6 123456 supply voltage [v] maximum output voltage (high) [v] 0 200 400 600 800 1000 1200 1400 1600 -50 -25 0 25 50 75 100 ambient temperature [ ] supply current [a] 0 200 400 600 800 1000 1200 1400 1600 123456 supply voltage [v] supply current [a] 0.0 0.2 0.4 0.6 0.8 1.0 1.2 0 25 50 75 100 125 150 ambient temperature [ ] power dissipation [w] -40 25 85 figure 55. supply current vs supply voltage figure 56. supply current vs ambient temperature figure 57. maximum output voltage (high) vs supply voltage (r l =20k ? ) -40 25 figure 54. power dissipation vs ambient temperature (derating curve) 85 (*) the data above are measurement values of typical sample, it is not guaranteed. bd12734f 85 5.0v 1.8v 3.0v bd12734fvj bd12734fv bd12734fj downloaded from: http:///
datasheet www.rohm.com tsz02201-0gmg0g200600-1-2 ?2013 rohm co., ltd. all rights reserved. 23/50 14.july.2016.rev004 tsz22111 ? 15 ? 001 bd12730g bd12732xxx bd12734xxx typical performance curves C continued bd12734xxx 0 1 2 3 4 5 6 123456 supply voltage [v] maximum output voltage (high) [v] 0 3 6 9 12 15 18 -50 -25 0 25 50 75 100 ambient temperature [ ] maximum output voltage (low) [mv] 0 3 6 9 12 15 18 123456 supply voltage [v] maximum output voltage (low) [mv] 0 1 2 3 4 5 6 - 5 0- 2 5 0 2 55 07 51 0 0 ambient temperature [ ] maximum output voltage (high) [v] figure 60. maximum output voltage (low) vs ambient temperature (r l =20k ? ) (*) the data above are measurement values of typical sample, it is not guaranteed. figure 59. maximum output voltage (low) vs supply voltage (r l =20k ? ) figure 58. maximum output voltage (high) vs ambient temperature (r l =20k ? ) 1.8v 3.0v 5.0v 85 -40 25 figure 61. maximum output voltage (high) vs supply voltage (r l =2k ? ) -40 85 1.8v 3.0v 5.0v 25 downloaded from: http:///
datasheet www.rohm.com tsz02201-0gmg0g200600-1-2 ?2013 rohm co., ltd. all rights reserved. 24/50 14.july.2016.rev004 tsz22111 ? 15 ? 001 bd12730g bd12732xxx bd12734xxx typical performance curves C continued bd12734xxx -3 -2 -1 0 1 2 3 123456 supply voltage [v] input offset voltage [mv] 0 20 40 60 80 100 120 -50 -25 0 25 50 75 100 ambient temperature [ ] maximum output voltage (low) [mv] 0 20 40 60 80 100 120 123456 supply voltage [v] maximum output voltage (low) [mv] 0 1 2 3 4 5 6 - 5 0- 2 5 0 2 55 07 51 0 0 ambient temperature [ ] maximum output voltage (high) [v] figure 64. maximum output voltage (low) vs ambient temperature (r l =2k ? ) (*) the data above are measurement values of typical sample, it is not guaranteed. figure 63. maximum output voltage (low) vs supply voltage (r l =2k ? ) figure 62. maximum output voltage (high) vs ambient temperature (r l =2k ? ) 1.8v 3.0v 5.0v -40 figure 65. input offset voltage vs supply voltage 1.8v 3.0v 5.0v 25 -40 85 25 85 downloaded from: http:///
datasheet www.rohm.com tsz02201-0gmg0g200600-1-2 ?2013 rohm co., ltd. all rights reserved. 25/50 14.july.2016.rev004 tsz22111 ? 15 ? 001 bd12730g bd12732xxx bd12734xxx typical performance curves C continued bd12734xxx -15 -10 -5 0 5 10 15 - 5 0- 2 50 2 55 07 51 0 0 ambient temperature [c] input offset current [na] 0 10 20 30 40 50 60 - 5 0- 2 50 2 55 07 51 0 0 ambient temperature [ ] input bias current [na] -5 -4 -3 -2 -1 0 1 2 3 4 5 - 10123456 input voltage [v] input offset voltage [mv] -5 -4 -3 -2 -1 0 1 2 3 4 5 - 5 0- 2 5 0 2 5 5 0 7 51 0 0 ambient temperature [ ] input offset voltage [mv] figure 68. input bias current vs ambient temperature (*) the data above are measurement values of typical sample, it is not guaranteed. figure 67. input common mode voltage range (v+=5v) figure 66. input offset voltage vs ambient temperature 1.8v 3.0v 5.0v -40 figure 69. input offset current vs ambient temperature 1.8v 3.0v 5.0v 25 85 1.8v 5.0v 3.0v downloaded from: http:///
datasheet www.rohm.com tsz02201-0gmg0g200600-1-2 ?2013 rohm co., ltd. all rights reserved. 26/50 14.july.2016.rev004 tsz22111 ? 15 ? 001 bd12730g bd12732xxx bd12734xxx typical performance curves C continued bd12734xxx -40 -20 0 20 40 60 80 1.e-01 1.e+00 1.e+01 1.e+02 1.e+03 1.e+04 frequency [hz] voltage gain [db] -100 -50 0 50 100 150 200 phase [deg] 40 50 60 70 80 90 100 -50 -25 0 25 50 75 100 ambient temperature [ ] power supply rejection ratio [db] 40 60 80 100 120 140 - 5 0- 2 5 0 2 55 07 51 0 0 ambient temperature [c] common mode rejection ratio [db] 40 50 60 70 80 90 100 -50 -25 0 25 50 75 100 ambient temperature [ ] large signal voltage gain [db] figure 72. power supply rejection ratio vs ambient temperature (v+=1.8v to 5.0v) (*) the data above are measurement values of typical sample, it is not guaranteed. figure 71. common mode rejection rati o vs ambient temperature figure 70. large signal voltage gain vs ambient temperature (r l =2k ? ) 1.8v 3.0v 5.0v figure 73. voltage gain ? phase vs frequency (v+=5v, r l =2k ? , t a =25c) 10 2 10 3 10 4 10 5 10 6 10 7 gain phase 1.8v 3.0v 5.0v downloaded from: http:///
datasheet www.rohm.com tsz02201-0gmg0g200600-1-2 ?2013 rohm co., ltd. all rights reserved. 27/50 14.july.2016.rev004 tsz22111 ? 15 ? 001 bd12730g bd12732xxx bd12734xxx typical performance curves C continued bd12734xxx 0 20 40 60 80 100 10 100 1000 10000 load capacitance [pf] phase margin [deg] 0 0.4 0.8 1.2 1.6 2 10 100 1000 10000 load capacitance [pf] unity gain frequency [mhz] . 0 0.2 0.4 0.6 0.8 1 -50 -25 0 25 50 75 100 ambient temperature [ ] slew rate h-l [v/s] 0 0.2 0.4 0.6 0.8 1 - 5 0- 2 50 2 55 07 51 0 0 ambient temperature [ ] slew rate l-h [v/s] (*) the data above are measurement values of typical sample, it is not guaranteed. figure 75. slew rate h-l vs ambient temperature (r l =2k ? ) figure 74. slew rate l-h vs ambient temperature (r l =2k ? ) 1.8v 5.0v 1.8v 3.0v 5.0v figure 76. unity gain frequency vs load capacitance (v+=5v, t a =25c) figure 77. phase margin vs load capacitance (v+=5v, t a =25c) 3.0v downloaded from: http:///
datasheet www.rohm.com tsz02201-0gmg0g200600-1-2 ?2013 rohm co., ltd. all rights reserved. 28/50 14.july.2016.rev004 tsz22111 ? 15 ? 001 bd12730g bd12732xxx bd12734xxx typical performance curves C continued bd12734xxx 80 90 100 110 120 123456 supply voltage [v] channel separation [db] 0.0 0.4 0.8 1.2 1.6 2.0 123456 supply voltage [v] input referred noise voltage [vrms] . (*) the data above are measurement values of typical sample, it is not guaranteed. figure 79. total harmonic distortion + noise vs output voltage (v+=5v, r l =2k ? , t a =25c) figure 78. input referred noise voltage vs supply voltage (t a =25c) -40 25 85 figure 80. channel separation vs supply voltage 0.0001 0.0010 0.0100 0.1000 1.0000 0.01 0.10 1.00 10.00 output voltage [vrms] total harmonic distortion + noise [%] . 1khz 20hz 20khz downloaded from: http:///
datasheet www.rohm.com tsz02201-0gmg0g200600-1-2 ?2013 rohm co., ltd. all rights reserved. 29/50 14.july.2016.rev004 tsz22111 ? 15 ? 001 bd12730g bd12732xxx bd12734xxx application information null method condition for test circuit 1 v+, gnd, v rl , e k , v icm unit: v parameter v f s1 s2 s3 v+ gnd v rl r l ? e k v icm calculation input offset voltage v f1 on on off 5.0 0 - open -2.5 2.5 1 large signal voltage gain v f2 on on on 5.0 0 2.5 2k -4.5 2.5 2 v f3 -0.5 common mode rejection ratio (input common-mode voltage range) v f4 on on off 5.0 0 - open -2.5 0 3 v f5 5.0 power supply rejection ratio v f6 on on off 5.0 0 - open -0.9 0.9 4 v f7 1.8 calculation 1. input offset voltage (v io ) 2. large signal voltage gain (a v ) 3. common-mode rejection ratio (cmrr) 4. power supply rejection ratio (psrr) figure 81. test circuit 1 v+ r f =50k ? r i =10k ? 0.1f r s =50 ? r l sw2 500k ? 500k ? 0.01f e k 15v dut gnd v rl 50k ? v icm sw1 0.1f r i =10k ? vo v f r s =50 ? 1000pf 0.1f -15v null sw3 v io |v f1 | = 1+r f /r s [v] a v |v f2 -v f3 | = ? e k (1+r f /r s ) [db] 20log cmrr |v f4 - v f5 | = v icm ( 1+r f /r s ) [db] 20log psrr |v f6 - v f7 | = v+ (1+ r f /r s ) [db] 20log downloaded from: http:///
datasheet www.rohm.com tsz02201-0gmg0g200600-1-2 ?2013 rohm co., ltd. all rights reserved. 30/50 14.july.2016.rev004 tsz22111 ? 15 ? 001 bd12730g bd12732xxx bd12734xxx application information C continued switch condition for test circuit 2 sw no. sw1 sw2 sw3 sw4 sw5 sw 6 sw7 sw8 sw9 sw10 sw11 sw12 supply current off off on off on off off off off off off off maximum output voltage r l =10k ? off on off off on off off on off off on off output current off on off off on off off off off on off off slew rate off off on off off off on on off off off on unity gain frequency on off off on on off off on off off off on figure 83. slew rate input output wave vh vl input wave t input voltage vh vl ? t ? v output wave sr= ? v/ ? t t output voltage 90% 10% figure 82. test circuit 2 figure 84. test circuit 3 (channel separation) r2=100k ? r1=1k ? v+ gnd out1 =1vrms in r1//r2 r2=100k ? r1=1k ? v+ gnd out2 r1//r2 cs=20log 100out1 out2 sw5 sw3 sw1 sw2 sw9 sw10 sw11 sw8 sw6 sw7 cl sw12 sw4 r1 1k r l gnd v+ vo -in +in v rl r2 100k downloaded from: http:///
datasheet www.rohm.com tsz02201-0gmg0g200600-1-2 ?2013 rohm co., ltd. all rights reserved. 31/50 14.july.2016.rev004 tsz22111 ? 15 ? 001 bd12730g bd12732xxx bd12734xxx application example voltage follower inverting amplifier non-inverting amplifier figure 86. inverting amplifier circuit figure 87. non-inverting amplifier circuit for inverting amplifier, input voltage (in) is amplified by a voltage gain and depends on the ratio of r1 and r2. the out-of-phase output volt age is shown in the next expression out=-(r2/r1) ? in this circuit has input impedance equal to r1. for non-inverting amplifier, input voltage (in) is amplified by a voltage gain, which depends on the ratio of r1 and r2. the output voltage (out) is -inphase with the input voltage (in) and is shown in the next expression. out=(1 + r2/r1) ? in effectively, this circuit has high input impedance since its input side is the same as that of the operational amplifier. figure 85. voltage follower voltage gain is 0db. using this circuit, the output voltage (out) is configured to be equal to the input voltage (in). this circuit also stabilizes the output voltage (out) due to high input impedance and low output im pedance. computation for output voltage (out) is shown below. out=in gnd out in v+ gnd r2 v+ in out r1 r2 r1 gnd r1 // r2 in out v+ downloaded from: http:///
datasheet www.rohm.com tsz02201-0gmg0g200600-1-2 ?2013 rohm co., ltd. all rights reserved. 32/50 14.july.2016.rev004 tsz22111 ? 15 ? 001 bd12730g bd12732xxx bd12734xxx power dissipation power dissipation (total loss) indicates the power that the ic can consume at t a =25c (normal temperature). as the ic consumes power, it heats up, causing its temperature to be higher than the ambient temperature. the allowable temperature that the ic can accept is limited. this depends on the circuit configuration, manufac turing process, and consumable power. power dissipation is determined by the allowable temperature within the ic (maximum junction temperature) and the thermal resistance of the package used (heat dissipation capabilit y). maximum junction temperature is typically equal to the maximum storage temperature. the heat gener ated through the consumption of power by the ic radiates from the mold resin or lead frame of the package. thermal resistance, represented by the symbol ja c/w, indicates this heat dissipation capability. similarly, the temperature of an ic inside its package can be estimated by thermal resistance. figure 88(a) shows the model of the thermal resistance of a package. the equation below shows how to compute for the thermal resistance ( ja ), given the ambient temperature (t a ), maximum junction temperature (t jmax ), and power dissipation (p d ). ja = (t jmax t a ) / p d c/w the derating curve in figure 88(b) indicates the power that t he ic can consume with reference to ambient temperature. power consumption of the ic begins to attenuate at cert ain temperatures. this gradient is determined by thermal resistance ( ja ), which depends on the chip size, power consumpti on, package, ambient temperature, package condition, wind velocity, etc. this may also vary even when the sa me of package is used. thermal reduction curve indicates a reference value measured at a specified condition. figure 88(c) to shows an ex ample of the derating curve for bd12730g, bd12732xxx and bd12734xxx. (c) bd12730g (d) bd12732xxx 05 0 75 100 125 150 25 ambient temperature t a [ c ] power dissipation of lsi [w] p dmax ja2 < ja1 p1 p2 ja2 ja1 t jmax power dissipation of ic 0.0 0.2 0.4 0.6 0.8 0 25 50 75 100 125 150 ambient temperature [ ] power dissipation [w] 85 bd12730g (note 18) 0.0 0.2 0.4 0.6 0.8 0 25 50 75 100 125 150 ambient temperature [c] power dissipation [w] 85 bd12732f (note 19) bd12732fj (note 18) bd12732fv (note 20) bd12732fvt (note 20) bd12732fvm (note 21) bd12732fvj (note 21) ja =(t jmax -t a )/ p d c/w a mbient temperature t a [ c ] chip surface temperature t j [ c ] (a) thermal resistance (b) derating curve downloaded from: http:///
datasheet www.rohm.com tsz02201-0gmg0g200600-1-2 ?2013 rohm co., ltd. all rights reserved. 33/50 14.july.2016.rev004 tsz22111 ? 15 ? 001 bd12730g bd12732xxx bd12734xxx when using the unit above t a =25c, subtract the value above per c . permissible dissipation is the value when fr4 glass epoxy board 70mm 70mm 1.6mm (copper foil area below 3%) is mounted (note 18) (note 19) (note 20) (note 21) (not e 22) (note 23) (note 24) (note 25) unit 5.4 5.5 5.0 4.7 4.5 8.2 7.0 6.8 mw/c figure 88. thermal resistance and derating curve (e) bd12734xxx 0.0 0.2 0.4 0.6 0.8 1.0 1.2 0 25 50 75 100 125 150 ambient temperature [ ] power dissipation [w] 85 bd12734f (note 22) bd12734fvj (note 25) bd12734fv (note 24) bd12734fj (note 23) downloaded from: http:///
datasheet www.rohm.com tsz02201-0gmg0g200600-1-2 ?2013 rohm co., ltd. all rights reserved. 34/50 14.july.2016.rev004 tsz22111 ? 15 ? 001 bd12730g bd12732xxx bd12734xxx operational notes 1. reverse connection of power supply connecting the power supply in reverse polarity can damage the ic. take precautions against reverse polarity when connecting the power supply, such as mounting an external diode between the power supply and the ics power supply pins. 2. power supply lines design the pcb layout pattern to provide low impedanc e supply lines. separate the ground and supply lines of the digital and analog blocks to prevent noise in the ground and s upply lines of the digital bloc k from affecting the analog block. furthermore, connect a capacitor to ground at all powe r supply pins. consider the effect of temperature and aging on the capacitance value when using electrolytic capacitors. 3. ground voltage ensure that no pins are at a voltage below that of t he ground pin at any time, even during transient condition. 4. ground wiring pattern when using both small-signal and large-current ground traces , the two ground traces should be routed separately but connected to a single ground at the refe rence point of the application board to avoid fluctuations in the small-signal ground caused by large currents. also ensure that the ground trac es of external components do not cause variations on the ground voltage. the ground lines must be as short and thick as possible to reduce line impedance. 5. thermal consideration should by any chance the power dissipation rating be exceed ed the rise in temperature of the chip may result in deterioration of the properti es of the chip. the absolute maximum rating of the p d stated in this spec ification is when the ic is mounted on a 70mm x 70mm x 1.6mm glass epoxy b oard. in case of exceeding this absolute maximum rating, increase the board size and copper area to prevent exceeding the p d rating. 6. recommended operating conditions these conditions represent a range within which the expect ed characteristics of the ic can be approximately obtained. the electrical characteristics are guaranteed under the conditions of each parameter. 7. inrush current when power is first supplied to the ic, it is possible that the internal logic may be unstable and inrush current may flow instantaneously due to the internal powering sequence and delays, especially if the ic has more than one power supply. therefore, give special consideration to power c oupling capacitance, power wiring, width of ground wiring, and routing of connections. 8. operation under strong electromagnetic field operating the ic in the presence of a strong electromagnetic field may cause the ic to malfunction. 9. testing on application boards when testing the ic on an application board, connecting a capacitor directly to a low-impedance output pin may subject the ic to stress. always discharge capacitors comp letely after each process or step. the ics power supply should always be turned off completely before connecting or removing it from the test setup during the inspection process. to prevent damage from static discharge, ground the ic during assemb ly and use similar precautions during transport and storage. 10. inter-pin short and mounting errors ensure that the direction and position are correct when mounting the ic on the pc b. incorrect mounting may result in damaging the ic. avoid nearby pins being shorted to each ot her especially to ground, power supply and output pin. inter-pin shorts could be due to many reasons such as meta l particles, water droplets (in very humid environment) and unintentional solder bridge deposited in between pins during assembly to name a few. 11. unused input pins input pins of an ic are of ten connected to the gate of a mos transistor. the gat e has extremely high impedance and extremely low capacitance. if left unconnected, the electr ic field from the outside can easily charge it. the small charge acquired in this way is enough to produce a signifi cant effect on the conduction through the transistor and cause unexpected operation of the ic. so, unless otherwise specified, unused input pins should be connected to the power supply or ground line. downloaded from: http:///
datasheet www.rohm.com tsz02201-0gmg0g200600-1-2 ?2013 rohm co., ltd. all rights reserved. 35/50 14.july.2016.rev004 tsz22111 ? 15 ? 001 bd12730g bd12732xxx bd12734xxx operational notes C continued 12. regarding the input pin of the ic this monolithic ic contains p+ isolat ion and p substrate layers between adjac ent elements in order to keep them isolated. p-n junctions are formed at the intersection of t he p layers with the n layers of other elements, creating a parasitic diode or transistor. for example (refer to figure below): when gnd > pin a and gnd > pin b, the p-n junction operates as a parasitic diode. when gnd > pin b, the p-n junction operates as a parasitic transistor. parasitic diodes inevitably occur in the structure of the ic. the operation of parasitic diodes can result in mutual interference among circuits, operational faults, or physical damage. therefore, conditions that cause these diodes to operate, such as applying a voltage lower than the gnd voltage to an input pin (and thus to the p substrate) should be avoided. figure 89. example of monolithic ic structure 13. applied voltage to the input terminal for normal circuit operation of voltage comparator, please input voltage for its input terminal within input common mode voltage v+ + 0.3v. then, regardless of power supply voltage, gnd-0.3v can be applied to input terminals without deterioration or destru ction of its characteristics. 14. power supply (single / dual) the operational amplifiers op erate when the voltage supplied is between v+ and gnd. therefore, the single supply operational amplifiers can be used as dual supply operational amplifiers as well. 15. power dissipation (pd) using the unit in excess of the rated power dissipation may cause deterioration in electrical characteristics due to a rise in chip temperature, including reduced current capabilit y. therefore, please take into consideration the power dissipation (pd) under actual operating conditions and apply a sufficient margin in thermal design. refer to the thermal derating curves for more information. 16. ic handling applying mechanical stress to the ic by deflecting or bendi ng the board may cause fluct uations in the electrical characteristics due to piezo resistance effects. 17. the ic destruction caused by capacitive load the transistors in circuits may be damaged when v+ termi nal and gnd terminal is shor ted with the charged output terminal capacitor.when ic is used as a operational amplif ier or as an application circuit, where oscillation is not activated by an output capacitor, the output capacitor must be kept below 0.1 f in order to prevent the damage mentioned above. 18. latch up be careful in the application of input voltage that exceeds the v+ and gnd. for cmos device, sometimes latch up operation occurs. also protect the ic from abnormal noise. 19. decoupling capacitor insert a decoupling capacitor between v+ and gnd fo r a stable operation of the operational amplifier. downloaded from: http:///
datasheet www.rohm.com tsz02201-0gmg0g200600-1-2 ?2013 rohm co., ltd. all rights reserved. 36/50 14.july.2016.rev004 tsz22111 ? 15 ? 001 bd12730g bd12732xxx bd12734xxx operational notes C continued 20. unused circuits when there are unused op-amps, it is recommended that they are connected as in figure 90, setting t he non-inverting input terminal to a potential within the input common-mode voltage range (v icm ). figure 90. example of application circuit for unused op-amp keep this potential in v icm v icm gnd v+ downloaded from: http:///
datasheet www.rohm.com tsz02201-0gmg0g200600-1-2 ?2013 rohm co., ltd. all rights reserved. 37/50 14.july.2016.rev004 tsz22111 ? 15 ? 001 bd12730g bd12732xxx bd12734xxx physical dimension, tape and reel information package name ssop5 downloaded from: http:///
datasheet www.rohm.com tsz02201-0gmg0g200600-1-2 ?2013 rohm co., ltd. all rights reserved. 38/50 14.july.2016.rev004 tsz22111 ? 15 ? 001 bd12730g bd12732xxx bd12734xxx physical dimension, tape and reel information - continued package name sop8 ? order quantity needs to be multiple of the minimum quantity. embossed carrier tape tapequantity direction of feed the direction is the 1pin of product is at the upper left when you hold reel on the left hand and you pull out the tape on the right hand 2500pcs e2 () direction of feed reel 1pin (unit : mm) pkg : sop8 drawing no. : ex112-5001-1 (max 5.35 (include.burr)) downloaded from: http:///
datasheet www.rohm.com tsz02201-0gmg0g200600-1-2 ?2013 rohm co., ltd. all rights reserved. 39/50 14.july.2016.rev004 tsz22111 ? 15 ? 001 bd12730g bd12732xxx bd12734xxx physical dimension, tape and reel information - continued package name sop-j8 ? order quantity needs to be multiple of the minimum quantity. embossed carrier tape tapequantity direction of feed the direction is the 1pin of product is at the upper left when you hold reel on the left hand and you pull out the tape on the right hand 2500pcs e2 () direction of feed reel 1pin downloaded from: http:///
datasheet www.rohm.com tsz02201-0gmg0g200600-1-2 ?2013 rohm co., ltd. all rights reserved. 40/50 14.july.2016.rev004 tsz22111 ? 15 ? 001 bd12730g bd12732xxx bd12734xxx physical dimension, tape and reel information - continued package name ssop-b8 ? order quantity needs to be multiple of the minimum quantity. embossed carrier tape tapequantity direction of feed the direction is the 1pin of product is at the upper left when you hold reel on the left hand and you pull out the tape on the right hand 2500pcs e2 () direction of feed reel 1pin downloaded from: http:///
datasheet www.rohm.com tsz02201-0gmg0g200600-1-2 ?2013 rohm co., ltd. all rights reserved. 41/50 14.july.2016.rev004 tsz22111 ? 15 ? 001 bd12730g bd12732xxx bd12734xxx physical dimension, tape and reel information - continued package name tssop-b8 direction of feed reel ? order quantity needs to be multiple of the minimum quantity. embossed carrier tape tapequantity direction of feed the direction is the 1pin of product is at the upper left when you hold reel on the left hand and you pull out the tape on the right hand 3000pcs e2 () 1pin downloaded from: http:///
datasheet www.rohm.com tsz02201-0gmg0g200600-1-2 ?2013 rohm co., ltd. all rights reserved. 42/50 14.july.2016.rev004 tsz22111 ? 15 ? 001 bd12730g bd12732xxx bd12734xxx physical dimension, tape and reel information - continued package name msop8 direction of feed reel ? order quantity needs to be multiple of the minimum quantity. embossed carrier tape tapequantity direction of feed the direction is the 1pin of product is at the upper right when you hold reel on the left hand and you pull out the tape on the right hand 3000pcs tr () 1pin downloaded from: http:///
datasheet www.rohm.com tsz02201-0gmg0g200600-1-2 ?2013 rohm co., ltd. all rights reserved. 43/50 14.july.2016.rev004 tsz22111 ? 15 ? 001 bd12730g bd12732xxx bd12734xxx physical dimension, tape and reel information - continued package name tssop-b8j direction of feed reel ? order quantity needs to be multiple of the minimum quantity. embossed carrier tape tapequantity direction of feed the direction is the 1pin of product is at the upper left when you hold reel on the left hand and you pull out the tape on the right hand 2500pcs e2 () 1pin downloaded from: http:///
datasheet www.rohm.com tsz02201-0gmg0g200600-1-2 ?2013 rohm co., ltd. all rights reserved. 44/50 14.july.2016.rev004 tsz22111 ? 15 ? 001 bd12730g bd12732xxx bd12734xxx physical dimension, tape and reel information - continued package name sop14 ? order quantity needs to be multiple of the minimum quantity. embossed carrier tape tapequantity direction of feed the direction is the 1pin of product is at the upper left when you hold reel on the left hand and you pull out the tape on the right hand 2500pcs e2 () direction of feed reel 1pin (unit : mm) pkg : sop14 drawing no. : ex113-5001 (max 9.05 (include.burr)) downloaded from: http:///
datasheet www.rohm.com tsz02201-0gmg0g200600-1-2 ?2013 rohm co., ltd. all rights reserved. 45/50 14.july.2016.rev004 tsz22111 ? 15 ? 001 bd12730g bd12732xxx bd12734xxx physical dimension, tape and reel information - continued package name sop-j14 ? order quantity needs to be multiple of the minimum quantity. embossed carrier tape tapequantity direction of feed the direction is the 1pin of product is at the upper left when you hold reel on the left hand and you pull out the tape on the right hand 2500pcs e2 () direction of feed reel 1pin downloaded from: http:///
datasheet www.rohm.com tsz02201-0gmg0g200600-1-2 ?2013 rohm co., ltd. all rights reserved. 46/50 14.july.2016.rev004 tsz22111 ? 15 ? 001 bd12730g bd12732xxx bd12734xxx physical dimension, tape and reel information - continued package name ssop-b14 ? order quantity needs to be multiple of the minimum quantity. embossed carrier tape tapequantity direction of feed the direction is the 1pin of product is at the upper left when you hold reel on the left hand and you pull out the tape on the right hand 2500pcs e2 () direction of feed reel 1pin downloaded from: http:///
datasheet www.rohm.com tsz02201-0gmg0g200600-1-2 ?2013 rohm co., ltd. all rights reserved. 47/50 14.july.2016.rev004 tsz22111 ? 15 ? 001 bd12730g bd12732xxx bd12734xxx physical dimension, tape and reel information - continued package name tssop-b14j ? order quantity needs to be multiple of the minimum quantity. embossed carrier tape tapequantity direction of feed the direction is the 1pin of product is at the upper left when you hold reel on the left hand and you pull out the tape on the right hand 2500pcs e2 () direction of feed reel 1pin downloaded from: http:///
datasheet www.rohm.com tsz02201-0gmg0g200600-1-2 ?2013 rohm co., ltd. all rights reserved. 48/50 14.july.2016.rev004 tsz22111 ? 15 ? 001 bd12730g bd12732xxx bd12734xxx msop8(top view) part number marking lot number 1pin mark marking diagram tssop-b8j(top view) part number marking lot numbe r 1pin mark tssop-b8(top view) part number marking lot number 1pin mark ssop-b8(top view) part number marking lot number 1pin mark sop-j8(top view) part number marking lot number 1pin mark sop8(top view) part number marking lot number 1pin mark part number marking ssop5(top view) lot number downloaded from: http:///
datasheet www.rohm.com tsz02201-0gmg0g200600-1-2 ?2013 rohm co., ltd. all rights reserved. 49/50 14.july.2016.rev004 tsz22111 ? 15 ? 001 bd12730g bd12732xxx bd12734xxx marking diagram - continued product name package type marking bd12730 g ssop5 k7 bd12732 f sop8 d2732 fj sop-j8 d2732 fv ssop-b8 2732 fvt tssop-b8 d2732 fvm msop8 d2732 fvj tssop-b8j d2732 bd12734 f sop14 bd12734f fj sop-j14 d2734 fv ssop-b14 d2734 fvm tssop-b14j d2734 tssop-b14j (top view) part number marking lot numbe r 1pin mark sop-j14(top view) part number marking lot number 1pin mark sop14(top view) part number marking lot numbe r 1pin mark ssop-b14(top view) part number marking lot number 1pin mark downloaded from: http:///
datasheet www.rohm.com tsz02201-0gmg0g200600-1-2 ?2013 rohm co., ltd. all rights reserved. 50/50 14.july.2016.rev004 tsz22111 ? 15 ? 001 bd12730g bd12732xxx bd12734xxx revision history date revision changes 30.nov.2013 001 new release 11.feb.2013 002 added bd12732f and bd12734f 1.apr.2014 003 bd12732fj/fv/fvt/fvm/fvj and bd12734fj/fv/fvj package variation added 4.july.2016 004 change operating voltage range before:1.8v to 5v after:1.8v to 5.5v, correction of erroneous description(p.28) 14.july.2016 005 key specifications : temperature range operating temperature range(p.1) line-up : t opr operating temperature(p.3) delete land pattern data(p.50) correction of erroneous description (p.49 diagr-m diagram) downloaded from: http:///
notice-p ga -e rev.003 ? 201 5 rohm co., ltd. all rights reserved. notice precaution on using rohm products 1. our products are designed and manufactured for application in ordinary electronic equipments (such as av equipment, oa equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). if you intend to use our products in devices requiring extremely h igh reliability (such as medical equipment (note 1) , transport equipment, traffic equipment, aircraft/spacecraft, nuclear powe r controllers, fuel controllers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property ( specific applications ), please consult with the rohm sales representative in adv ance. unless otherwise agreed in writing by rohm in advance, rohm s hall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arisin g from the use of any rohm s products for specific applications. (note1) medical equipment classification of the specific appl ications japan usa eu china class class class b class class ? class 2. rohm designs and manufactures its products subject to stri ct quality control system. however, semiconductor products can fail or malfunction at a certain rate. please be sure to implement, at your own responsibilities, adequ ate safety measures including but not limited to fail-safe desig n against the physical injury, damage to any property, whic h a failure or malfunction of our products may cause. the followi ng are examples of safety measures: [a] installation of protection circuits or other protective devic es to improve system safety [b] installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. our products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditions, as exemplified be low. accordingly, rohm shall not be in any way responsible or liable for any damages, expenses or losses arising from th e use of any rohms products under any special or extraordinary environments or conditions. if yo u intend to use our products under any special or extraordinary environments or conditions (as exemplified belo w), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be n ecessary: [a] use of our products in any types of liquid, including water, oils, chemicals, and organi c solvents [b] use of our products outdoors or in places where the products are exposed to direct sunlight or dust [c] use of our products in places where the products are e xposed to sea wind or corrosive gases, including cl 2 , h 2 s, nh 3 , so 2 , and no 2 [d] use of our products in places where the products are exposed t o static electricity or electromagnetic waves [e] use of our products in proximity to heat-producing component s, plastic cords, or other flammable items [f] sealing or coating our products with resin or other coating materials [g] use of our products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of flux is recommended); or washing our products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] use of the products in places subject to dew condensation 4. the products are not subject to radiation-proof design. 5. please verify and confirm characteristics of the final or mou nted products in using the products. 6 . in particular, if a transient load (a large amount of load appl ied in a short period of time, such as pulse. is applied, confirmation of performance characteristics after on-board mou nting is strongly recommended. avoid applying power exceeding normal rated power; exceeding the power rating u nder steady-state loading condition may negatively affec t product performance and reliability. 7 . de -rate power dissipation depending on ambient temperature. wh en used in sealed area, confirm that it is the use in the range that does not exceed the maximum junction temperature. 8 . confirm that operation temperature is within the specified range desc ribed in the product specification. 9 . rohm shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in this document. precaution for mounting / circuit board design 1. when a highly active halogenous (chlorine, bromine, etc .) flux is used, the residue of flux may negatively affect prod uct performance and reliability. 2. in principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method mus t be used on a through hole mount products. i f the flow soldering method is preferred on a surface-mount p roducts , please consult with the rohm representative in advance. for details, please refer to rohm mounting specification downloaded from: http:///
notice-p ga -e rev.003 ? 201 5 rohm co., ltd. all rights reserved. precautions regarding application examples and external circuits 1. if change is made to the constant of an external circuit, p lease allow a sufficient margin considering variations o f the characteristics of the products and external components, inc luding transient characteristics, as well as static characteristics. 2. you agree that application notes, reference designs, and a ssociated data and information contained in this docum ent are presented only as guidance for products use. therefore, i n case you use such information, you are solely responsible for it and you must exercise your own independ ent verification and judgment in the use of such information contained in this document. rohm shall not be in any way respon sible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such informat ion. precaution for electrostatic this product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. please take pr oper caution in your manufacturing process and storage so t hat voltage exceeding the products maximum rating will not be applied to products. please take special care under dry co ndition (e.g. grounding of human body / equipment / solder iro n, isolation from charged objects, setting of ionizer, friction prevention and temperature / humidity control). precaution for storage / transportation 1. product performance and soldered connections may deteriorate i f the products are stored in the places where: [a] the products are exposed to sea winds or corrosive gases, in cluding cl2, h2s, nh3, so2, and no2 [b] the temperature or humidity exceeds those recommended by rohm [c] the products are exposed to direct sunshine or condensation [d] the products are exposed to high electrostatic 2. even under rohm recommended storage condition, solderabil ity of products out of recommended storage time period may be degraded. it is strongly recommended to confirm so lderability before using products of which storage time is exceeding the recommended storage time period. 3. store / transport cartons in the correct direction, which is indi cated on a carton with a symbol. otherwise bent leads may occur due to excessive stress applied when dropping of a c arton. 4. use products within the specified time after opening a humi dity barrier bag. baking is required before using products of which storage time is exceeding the recommended storage tim e period. precaution for product label a two-dimensional barcode printed on rohm products label is f or rohm s internal use only. precaution for disposition when disposing products please dispose them properly usi ng an authorized industry waste company. precaution for foreign exchange and foreign trade act since concerned goods might be fallen under listed items of export control prescribed by foreign exchange and foreign trade act, please consult with rohm in case of export. precaution regarding intellectual property rights 1. all information and data including but not limited to appl ication example contained in this document is for reference only. rohm does not warrant that foregoing information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. 2. rohm shall not have any obligations where the claims, a ctions or demands arising from the combination of the products with other articles such as components, circuits, systems or ex ternal equipment (including software). 3. no license, expressly or implied, is granted hereby under any inte llectual property rights or other rights of rohm or any third parties with respect to the products or the information contai ned in this document. provided, however, that rohm will not assert it s intellectual property rights or other rights against you or you r customers to the extent necessary to manufacture or sell products containing the products, subject to th e terms and conditions herein. other precaution 1. this document may not be reprinted or reproduced, in whole or in part, without prior written consent of rohm. 2. the products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of rohm. 3. in no event shall you use in any way whatsoever the pr oducts and the related technical information contained in the products or this document for any military purposes, includi ng but not limited to, the development of mass-destruction weapons. 4. the proper names of companies or products described in this document are trademarks or registered trademarks of rohm, its affiliated companies or third parties. downloaded from: http:///
datasheet datasheet notice ? we rev.001 ? 2015 rohm co., ltd. all rights reserved. general precaution 1. before you use our pro ducts, you are requested to care fully read this document and fully understand its contents. rohm shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny rohms products against warning, caution or note contained in this document. 2. all information contained in this docume nt is current as of the issuing date and subj ec t to change without any prior notice. before purchasing or using rohms products, please confirm the la test information with a rohm sale s representative. 3. the information contained in this doc ument is provi ded on an as is basis and rohm does not warrant that all information contained in this document is accurate an d/or error-free. rohm shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information. downloaded from: http:///

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