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1 channel compact high side switch ics 1.3a current limit high side switch ics bd2232g bd2233g general description bd2232g and bd2233g are low on - resistance n- channel mosfet high - side power switches, optimized for universal serial bus (usb) applicati ons. bd2232g and bd2233g are equipped with the function of over - current detection, thermal shutdown, under - voltage lockout and soft - start. features built - in low o n- resistance (typ 110m) n-c hannel mosfet over - current detection thermal shutdown open - drain fault flag output flag output delay under - voltage lockout soft - start circuit output discharge function control i nput logic ? active - high : bd2232g ? active - low: bd2 23 3g applications usb h ub in consumer a ppliances, pc, pc p eripheral e quipment, and so forth key specifications ? i nput v oltage r ange: 2.7v to 5.5v ? on -r esistance: 100m (typ) ? over - current t hreshold: 1.15 a (m in ) , 1.4 a (m ax ) ? s tandby current: 0.01 a ( typ ) ? operat ing temperature range : -40 c to +85 c package w(typ) d(typ) h (max) typical application circuit lineup over - current detection control input logic p ackage orderable part number min typ max 1150ma 1275ma 1400 ma high ssop5 reel of 3000 bd2232g -g tr 1150ma 1275ma 1400ma low ssop5 reel of 3000 bd2233g -g tr ssop5 2.90mm x 2.80mm x 1.25mm 10k to 100k c l c in in gnd en out /oc 5v (typ) + - 3.3v product structure silicon monolithic integrated circuit this product has not designed protection against radioactive rays 1/ 23 www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 14 ? 001 tsz02201 - 0e3e0h300220 -1-2 21.aug.2014 rev.003 datashee t downloaded from: http:///
bd2232g bd2233g data s heet block diagram pin configuration s pin description pin no. symbol i/o function 1 in - switch input and the supply voltage for the ic 2 gnd - ground 3 en, /en i enable input en: high level input turns on the switch. (bd22 32 g) /en: low level input turns on the switch. (bd22 33 g) 4 /oc o over - current detection terminal. low level output during over - current or over - temperature condition open - drain fault flag output 5 out o switch output over - current protection under - voltage lockout en (/en) in /oc gnd out /en delay counter charge pump thermal shutdown bd22 32 g top view bd22 33 g top view in gnd en 1 2 3 4 5 /oc out in gnd /en 1 2 3 4 5 /oc out 2/ 23 www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 tsz02201 - 0e3e0h300220 -1-2 21.aug.2014 rev.003 downloaded from: http:///
bd2232g bd2233g data s heet absolute maximum ratings ( ta = 25 c) parameter symbol rating unit in s upply v oltage v in - 0.3 to + 6.0 v en(/en) i nput v oltage v en , v /en - 0.3 to + 6.0 v /oc v oltage v /oc - 0.3 to + 6.0 v /oc s ink c urrent i /oc 5 ma out v oltage v out - 0.3 to v in + 0.3 v storage t emperature t stg - 55 to + 150 c power d issipation pd 0.67 (n ote 1) w (note 1) mounted on 70mm x 70mm x 1.6mm glass epoxy board. reduce 5.4mw per 1 c above 25 c cautio n: operating the ic over the absolute maximum ratings may damage the i c. the damage can either be a short circuit between pins or an open cir cuit between pins and the internal circuitry. therefore, it is important to co nsider circuit protection measures, such as adding a fuse, in case the ic is operated over the absolute maximum ratings. recommended operating conditions parameter symbol rating unit min typ max in o perating v oltage v in 2.7 5.0 5.5 v operating t emperature t opr - 40 - + 85 c electrical characteristics bd22 32 g (v in = 5v, ta= 25 c , unless otherwise specified.) dc characteristics parameter symbol limit unit conditions min typ max operating current i dd - 110 160 a v en = 5v, v out = open standby current i stb - 0.01 5 a v en = 0v, v out = open en i nput v oltage v en h 2.0 - - v high input v en l - - 0.8 v low input en i nput l eakage i en -1 +0.01 +1 a v en = 0v or 5v on -r esistance r on - 100 145 m i out = 500ma over -c urrent t hreshold i th 1150 1275 1400 ma short c ircuit o utput c urrent i sc 500 - - ma v out = 0v, rms output discharge resistance r disc 30 60 120 i disc = 1ma /oc o utput l ow v oltage v /oc - - 0.4 v i /oc = 0.5ma uvlo t hreshold v tuv h 2.1 2.3 2.5 v v in incre asing v tuv l 2.0 2.2 2.4 v v in decreasing ac characteristics parameter symbol limit unit conditions min typ max output r ise t ime t on1 - 1 6 ms r l = 100 output turn on t ime t on2 - 1.5 10 ms r l = 100 output f all t ime t off1 - 1 20 s r l = 100 o utput turn off t ime t off2 - 3 40 s r l = 100 /oc d elay t ime t /oc 10 15 20 ms 3/ 23 www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 tsz02201 - 0e3e0h300220 -1-2 21.aug.2014 rev.003 downloaded from: http:///
bd2232g bd2233g data s heet electrical characteristics - continued bd22 33 g (v in = 5v, ta= 25 c , unless otherwise specified.) dc characteristics parameter symbol limit unit conditions min typ max operating current i dd - 110 160 a v /en = 0v , v out = open standby current i stb - 0.01 5 a v /en = 5v , v out = open /en i nput v oltage v /en h 2.0 - - v high input v /en l - - 0.8 v low input /en i nput l eakage i /en -1 +0.01 +1 a v /en = 0v or 5v on -r esist ance r on - 100 145 m i out = 500ma over -c urrent t hreshold i th 1150 1275 1400 ma short c ircuit o utput c urrent i sc 500 - - ma v out = 0v, rms output discharge resistance r disc 30 60 120 i disc = 1ma /oc o utput l ow v oltage v /oc - - 0.4 v i /oc = 0.5ma uv lo t hreshold v tuv h 2.1 2.3 2.5 v v in increasing v tuv l 2.0 2.2 2.4 v v in decreasing ac characteristics parameter symbol limit unit conditions min typ max output r ise t ime t on1 - 1 6 ms r l = 100 output turn on t ime t on2 - 1.5 10 ms r l = 100 out put f all t ime t off1 - 1 20 s r l = 100 output turn off t ime t off2 - 3 40 s r l = 100 /oc d elay t ime t /oc 10 15 20 ms 4/ 23 www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 tsz02201 - 0e3e0h300220 -1-2 21.aug.2014 rev.003 downloaded from: http:///
bd2232g bd2233g data s heet measurement circuit in gnd en(/en) out /oc v in v en(/en) a 1f in gnd en(/en) out /oc v in v en(/en) a 1f r l a. operating current b. en, /en i nput v oltage, o utput r ise / f all t ime in gnd en(/en) out /oc v in v en(/en) a 1f i out 10k in gnd en(/en) out /oc v in v en(/en) a 1f i oc c. on-r esistance, o ver -c urrent d etection d. /oc output low voltage figure 1. measurement circuit timing diagram t on1 t off1 90% 10% 10% t on2 t off2 v enh v enl 90% v en v out t on1 t off1 90% 10% 10% t on2 t off2 v /enl v /enh 90% v /en v out figure 2. o utput rise / fall time (bd2232g) figure 3. output r ise / f all t ime ( bd2233g ) 5/ 23 www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 tsz02201 - 0e3e0h300220 -1-2 21.aug.2014 rev.003 downloaded from: http:///
bd2232g bd2233g data s heet typical performance curves figure 4. operating c urrent vs supply voltage ( en, /en e nable ) 0 20 40 60 80 100 120 140 2 3 4 5 6 supply voltage : v in [v] operating current : i dd [a] ta=25 c figure 5. operating c urrent vs ambient temperature ( en, /en e nable ) 0 20 40 60 80 100 120 140 -50 0 50 100 ambient temperature : ta[ ] operating current : i dd [a] v in =5.0v figure 6. standby current vs supply voltage ( en, /en d isable ) 0.0 0.2 0.4 0.6 0.8 1.0 2 3 4 5 6 supply voltage : v in [v] standby current : i stb [a] ta=25 c figur e 7. standby current vs ambient temperature ( en, /en d isable ) 0.0 0.2 0.4 0.6 0.8 1.0 -50 0 50 100 ambient temperature : ta[ ] standby current : i stb [a] v in =5.0v operating current: i dd [a] ambient temperature: ta [ c] supply voltage: v in [v] ambient temperature: ta [ c] standby current: i stb [a] standby c urrent: i stb [a] operating current: i dd [a] supply voltage: v in [v] 6/ 23 www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 tsz02201 - 0e3e0h300220 -1-2 21.aug.2014 rev.003 downloaded from: http:///
bd2232g bd2233g data s heet typical performance curves - continued figure 8. en, /en i nput v oltage vs supply voltage (v enh , v enl , v /enh , v /enl ) figure 9. en, /en i nput v oltage vs ambient temperature (v enh , v enl , v /enh , v /enl ) figure 10. on - resistance vs supply voltage figure 11. on - resistance vs ambient temperature 0.0 0.5 1.0 1.5 2.0 2 3 4 5 6 supply voltage : v in [v] enable input voltage : v en [v] ta=25 c low to high high to low supply voltage: v in [v] e nable input voltage : v en , v /en [v] 0.0 0.5 1.0 1.5 2.0 -50 0 50 100 ambient temperature : ta[ ] enable input voltage : v en [v] ambient temperature: ta [ c] e nable input voltage : v en , v /en [v] v in =5.0v low to high high to low 0 50 100 150 200 2 3 4 5 6 supply voltage : v in [v] on resistance : r on [m] supply voltage: v in [v] on - resistance: r on [m ?] ta=25 c 0 50 100 150 200 -50 0 50 100 ambient temperature : ta[ ] on resistance : r on [m] ambient temperature: ta [ c] on - resistance: r on [m ?] v in =5.0v 7/ 23 www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 tsz02201 - 0e3e0h300220 -1-2 21.aug.2014 rev.003 downloaded from: http:///
bd2232g bd2233g data s heet typical performance curves - continued figure 14. short c ircuit o utput c urrent vs supply voltage 0.6 0.7 0.8 0.9 1.0 1.1 1.2 2 3 4 5 6 supply voltage : v in [v] short circuit output current: i sc [a] ta=25 c figure 15. short c ircuit o utput c urrent v s ambient temperature 0.6 0.7 0.8 0.9 1.0 1.1 1.2 -50 0 50 100 ambient temperature : ta[ ] short circuit output current: i sc [a] v in =5.0v supply voltage: v in [v] ambient temperature: ta [ c] figure 12. over -current t hreshold vs supply voltage 0.9 1.0 1.1 1.2 1.3 1.4 1.5 2 3 4 5 6 supply voltage : v in [v] over current threshold:i th [a] ta=25 c figure 13. over -current t hreshold vs ambie nt temperature 0.9 1.0 1.1 1.2 1.3 1.4 1.5 -50 0 50 100 ambient temperature : ta[ ] over current threshold:i th [a] v in =5.0v supply voltage: v in [v] ambient temperature: ta [ c] over - current threshold: i th [a] over - current threshold: i th [a] 8/ 23 www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 tsz02201 - 0e3e0h300220 -1-2 21.aug.2014 rev.003 downloaded from: http:///
bd2232g bd2233g data s heet typical performance curves - continued figure 1 6. /oc o utput l ow v oltage vs supply voltage 0 20 40 60 80 100 2 3 4 5 6 supply voltage : v in [v] /oc output low voltage:v /oc [mv] ta=25 c figure 17. /oc o utput l ow v oltage vs ambient temperature 0 20 40 60 80 100 -50 0 50 100 ambient temperature : ta[ ] /oc output low voltage:v /oc [mv] v in =5.0v supply voltage: v in [v] ambient temperature: ta [ c] /oc output low voltage: v /oc [m v] /oc output low voltage: v / oc [m v] figure 18. uvlo t hreshold voltage vs ambient temperature 2.0 2.1 2.2 2.3 2.4 2.5 -50 0 50 100 ambient temperature : ta[ ] uvlo threshold : v tu vh , v tu vl [v] v tuvh v tuvl ambient temperature: ta [ c] uvlo threshold: v tuvh, v tuvl [v] figure 19. uvlo hysteresis voltage vs ambient temperature 0.0 0.2 0.4 0.6 0.8 1.0 -50 0 50 100 ambient temperature : ta[ ] uvlo hysteresis voltage:v h sy [v] ambient temperature: ta [ c] uvlo hysteresis voltage: v h ys [v] 9/ 23 www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 tsz02201 - 0e3e0h300220 -1-2 21.aug.2014 rev.003 downloaded from: http:///
bd2232g bd2233g data s heet typical performance curves - continued figure 20. output r ise t ime vs supply voltage 0.0 1.0 2.0 3.0 4.0 5.0 2 3 4 5 6 supply voltage : v in [v] rise time : t on1 [ms] ta=25 c supply voltage: v in [v] output rise time: t on1 [m s] figure 21. output r ise t ime vs amb ient temperature 0.0 1.0 2.0 3.0 4.0 5.0 -50 0 50 100 ambient temperature : ta[ ] rise time : t on1 [ms] vin=5.0v ambient temperature: ta [ c] output rise time: t on1 [m s] figure 22. output t urn on t ime vs supply voltage 0.0 1.0 2.0 3.0 4.0 5.0 2 3 4 5 6 supply voltage : v in [v] turn on time : t on2 [ms] ta=25 c figure 23. output t urn on t ime vs ambient temp erature 0.0 1.0 2.0 3.0 4.0 5.0 -50 0 50 100 ambient temperature : ta[ ] turn on time : t on2 [ms] v in =5.0v supply voltage: v in [v] ambient temperature: ta [ c] output turn on time: t on2 [m s] output turn on time: t on2 [m s] 10 / 23 www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 tsz02201 - 0e3e0h300220 -1-2 21.aug.2014 rev.003 downloaded from: http:///
bd2232g bd2233g data s heet typical performance curves - continued figure 24. output f all t ime vs supply voltage 0.0 1.0 2.0 3.0 4.0 5.0 2 3 4 5 6 supply voltage : v in [v] fall time : t off1 [s] ta=25 c figure 25. output f all t ime vs ambient t emperature 0.0 1.0 2.0 3.0 4.0 5.0 -50 0 50 100 ambient temperature : ta[ ] fall time : t off1 [s] v in =5.0v supply voltage: v in [v] ambient temperature: ta [ c] output fall time: t off1 [ s ] output fall time: t off1 [ s ] figure 26. output t urn off t ime vs supply vol tage figure 27. output t urn off t ime v s ambient temperature 0.0 1.0 2.0 3.0 4.0 5.0 6.0 2 3 4 5 6 supply voltage : v in [v] turn off time : t off2 [s] ta=25 c supply voltage: v in [v] output turn off time: t off2 [ s ] 0.0 1.0 2.0 3.0 4.0 5.0 6.0 -50 0 50 100 ambient temperature : ta[ ] turn off time : t off2 [s] v in =5.0v ambient temperature: ta [ c] output turn off time: t off2 [ s ] 11 / 23 www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 tsz02201 - 0e3e0h300220 -1-2 21.aug.2014 rev.003 downloaded from: http:///
bd2232g bd2233g data s heet typical performance curves - continued figure 28. /oc d elay t ime vs supply voltage 10 12 14 16 18 20 2 3 4 5 6 supply voltage : v in [v] /oc ddlay time : t /oc [ms] ta=25 c /oc delay time: t /oc [m s] supply voltage: v in [v] figure 29. /oc d elay t ime vs ambient temperature 10 12 14 16 18 20 -50 0 50 100 ambient temperature : ta[ ] /oc ddlay time : t /oc [ms] v in =5.0v /oc delay tim e: t /oc [m s] ambient temperature: ta [ c] figure 30. output discharge r esistance vs supply voltage 0 50 100 150 200 2 3 4 5 6 supply voltage : v in [v] disc on resistance : r d isc [ ] ta=25 c supply voltage: v in [v] output discharge resistance : r disc [] figure 31. output discharge r esistance vs ambien t t emperature 0 50 100 150 200 -50 0 50 100 ambient temperature : ta[ ] disc on resistance : r d isc [] v in =5.0v ambient temperature: ta [ c] output discharge resistance : r disc [] 12 / 23 www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 tsz02201 - 0e3e0h300220 -1-2 21.aug.2014 rev.003 downloaded from: http:///
bd2232g bd2233g data s heet typical wave forms (bd2232g) time(1 s/div.) figure 33. output fall characteristic time ( 1ms/div.) figure 34. inrush current r esponse time ( 5ms/div.) figure 35. over -c urrent r esponse ramp ed l oad v in =5v r l =20 time(1ms/div.) figure 32. output rise characteristic v en (5v/div.) v /oc (5v/div.) v out (5v/div.) i out (0.5a/div.) v in =5v r l =20 c l =47 f c l =100 f c l =220 f v in =5v r l =20 v in =5v v en (5v/div.) v /oc (5v/div.) v out (5v/div.) i out (0.5a/div.) v /oc (5v/div.) v out (5v/div.) i out (0.5a/div.) v en (5v/div.) v /oc (5v/div.) i out (0.2a/div.) 13 / 23 www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 tsz02201 - 0e3e0h300220 -1-2 21.aug.2014 rev.003 downloaded from: http:///
bd2232g bd2233g data s heet typical wave forms - continue d time ( 5ms/div.) figure 36. over -c urrent r esponse enable to short c ircuit time ( 100ms/div.) figure 37. over -c urrent r esponse enable to short c ircuit time ( 5ms/div.) figure 38. over -c urrent r esponse 1l oad connected at en time ( 10ms/div.) figure 39. uvlo r esponse when i ncreasing v in v in =5v v in =5v v in =5v r l =20 v en (5v/div.) v /oc (5v/div.) v out (5v/div.) i out (0.5a/div.) v en (5v/div.) v /oc (5v/div.) v out (5v/div.) i out (0.5a/div.) v in (5v/div.) v out (5v/div.) i out (0.2a/div.) v out (5v/div.) v /oc (5v/div.) i out (1.0a/div.) 14 / 23 www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 tsz02201 - 0e3e0h300220 -1-2 21.aug.2014 rev.003 downloaded from: http:///
bd2232g bd2233g data s heet typical wave forms - continued time ( 10ms/div.) figure 40. uvlo r esponse when d ecreasing v in r l =20 v in (5v/div.) v out (5v/div.) i out (0.2a/div.) 15 / 23 www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 tsz02201 - 0e3e0h300220 -1-2 21.aug.2014 rev.003 downloaded from: http:///
bd2232g bd2233g data s heet typical application circuit controller 10k to 100k c l c in in gnd en(/en) out /oc 5v (typ) + - application information when excessive current flows due to output short - circuit or so, ringing occurs because of inductance between power source line to ic, and may cause bad influences on ic operations. in order to avoid this case, connect a bypass capacitor across in terminal and gnd terminal of ic. 1f or higher is recommended. in order to decrease voltage fluctuations from power source line to ic , conn ect a low esr capacitor in parallel with c in. 10 f to 100 f or higher is effective . pull up /oc output by 10k to 100k resistance. set up value which satisfies the application as c l . this application circuit does not guarantee its operation. when using t he circuit with changes to the external circuit constants, make sure to l eave an adequate margin for external components including ac/dc characteristics as well as dispersion of the ic. functional description 1. switch operation in terminal and out terminal are connected to the drain and the source of switch m osfet respectively. and the in terminal is used also as power source input to internal control circuit. when the switch is turned on from en, /en control input, in terminal and out terminal are connected by a 100m (typ) switch. at on state, the switch is bidirectional, therefore, when the potential of out terminal is higher than that of in terminal, current flows from out terminal to in terminal. 2. thermal s hutdown c ircuit ( tsd) if over - current would continue, the temperature of the ic would increase drastically. i f the junction temperature is beyond 135 c (typ) in the condition of over - current detection, thermal shutdown circuit operates and makes power switch turn off and outputs fault flag (/oc). then, when the junction temperature decreases lower than 115 c (typ), power switch is turned on and fault flag (/oc) is cancelled. unless the increasing of the chips temperature is removed or the output of power switch is turned off, this operation repea ts. the thermal shutdown circuit operates when the switch is on ( en, /en signal is active). 3. over -c urrent d etection ( ocd) the over - current detection circuit limits current (i sc ) and outputs fault flag (/oc) when current flowing in each switch mosfet ex ceeds a specified value. the over - current detection circuit works when the switch is on ( en, /en signal is active). there are three types of response against over -current. (1) when the switch is turned on while the output is in shortcircuit statu s when the sw itch is turned on while the output is in shortcircuit status or so, the switch gets in current limit status immediately. (2) when the output shortcircuits while the switch is on when the output shortcircuits or high - current load is connected while the switch is on, very large current will flow until the over - current limit circuit reacts. when the current detection and limi t circuit works, current limitation is carried out. (3) when the output current increases gradually when the output current increases gradually, current limitation does no t work until the output current exceeds the over - current detection value. when it exceeds the detection value, current li mitation is carried out. 4. under -v oltage l ockout (uvlo) uvlo circuit prevents the switch from turning on until the v in exceeds 2.3v (typ). if the v in drops below 2.2v(typ) while the switch turns on, then uvlo shuts off the power switch. uvlo has hysteresis of 100mv(typ) . under - voltage lockout circuit works when the switch is on ( en, /en signal is active). 16 / 23 www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 tsz02201 - 0e3e0h300220 -1-2 21.aug.2014 rev.003 downloaded from: http:///
bd2232g bd2233g data s heet 5. fault flag (/oc) output fault flag output is an n - mos open drain output. at detection of over - current or thermal shutdown, output is low - level. o ver - current detection has delay filter . this delay filter prevents instantaneous current detection such as in ru sh current at switch on, hot plug from being informed to outside. . if fault flag output is unused, /oc pin should be connected to open or ground line. 6. output discharge function when the switch is turned o ff from d isable control input or uvlo function, the 6 0 (typ.) discharge circuit between out and gnd turns on. by turning on this switch, electric charge at capacitive load is discharged. but when the voltage of in declines extremely, then the out pin becomes hi -z without uvlo function . figure 41. over -current d etection v en v out i out v /oc output s hort circuit thermal s hutdown /oc d elay time figure 42. o ver -c urrent detection, t hermal shutdown timing (bd2232g) v /en v out i out v /oc output s hort circuit thermal s hutdown /oc d elay time figure 43. o ver -c urrent detection, t hermal shutdown timing (bd2233g) v out i out v /oc t /oc over cur rent detection i sc over current load removed i th 17 / 23 www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 tsz02201 - 0e3e0h300220 -1-2 21.aug.2014 rev.003 downloaded from: http:///
bd2232g bd2233g data s heet power dissipation (ssop5 package) figure 44. power dissipation curve (pd- ta curve) i/o e quivalence circuit symbol pin no. e quivalen ce circuit en (/en) 3 en (/en) out 5 out /oc 4 /oc 70mm x 70mm x 1.6mm glass epoxy board 85 0 100 200 300 400 500 600 700 0 25 50 75 100 125 150 a mbient tempera ture : ta [ ] power dissipation : pd [mw] power dissipation : p d [ mw ] ambient temperature : ta[c] 18 / 23 www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 tsz02201 - 0e3e0h300220 -1-2 21.aug.2014 rev.003 downloaded from: http:///
bd2232g bd2233g data s heet operational notes 1. reverse c onnection of p ower s upply connecting the power supply in reverse polarity can damage the ic. take pr ecautions against reverse polarity when connecting the power supply, such as mounting an external diode between the power supply and the ic s power supply pins . 2. power s upply l ines design the pcb layout pattern to provide low impedance supply lines. s eparate the ground and supply lines of the digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog block . furthermore, connect a capacitor to ground at all power supply pins . consider the effect of temperature and aging on the capacitance value when using electrolytic capacitors. 3. g round voltage ensure that no pins are at a voltage below that of the ground pin at any time, ev en during transient condition. 4. g round w iring pattern when using both small - signal and large - current ground traces, the two ground traces should be routed separately but connected to a s ingle ground at the reference point of the application board to avoid fluctuations in the small - signal ground caused by large currents. also ensure that the ground traces of ex ternal components do not cause variations on the ground voltage. the ground lines must be as short and thick as possibl e to reduce line impedance. 5. thermal c onsideration should by any chance the power dissipation rating be exceeded the rise in temperature of the chip may result in deterioration of the properties of the chip. the absolute maximum rating of t he pd stated in this specification is when the ic is mounted on a 70mm x 70mm x 1.6mm glass epoxy board. in case of exceeding this absolute maximum rating, increase the board size and copper area to prevent exceeding the pd rating. 6. recommended o perating c onditions these conditions represent a range within which the expected characteristics of the ic can be approximately obtained . the electrical characteristics are guaranteed under the conditions of each parameter . 7. in r ush current when power is first supplied to the ic, it is possible that the inter nal logic may be unstable and inrush current may flow instantaneously due to the internal powering sequence and delays , especially if the ic has more than one power supply. therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and routing of connections. 8. operation u nder s trong e lectromagnetic f ield operating the ic in the presence of a strong electromagnetic field may cause the ic to malfunction . 9. testing on a pplication b oards when testing the ic on an application board, connecting a capacitor directly to a low - impedance output pin may subject the ic to stress. always discharge capacitors completely af ter each process or step. the ics power supply should always be turned off completely before connecting or removing it from the test setup during the inspection process. to prevent damage from static discharge, ground the ic during assem bly and use similar precautions during transport an d storage. 10. inter- pin short and mounting errors ensure that the direction and position are correct when mounting the ic on the pcb. incorrect mounting may result in damaging the ic. avoid nearby pins being shorted to each other especially to ground, power supply and output pin . inter - pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and unintentional solder bridge deposited in between pins during assembly to name a few . 19 / 23 www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 tsz02201 - 0e3e0h300220 -1-2 21.aug.2014 rev.003 downloaded from: http:///
bd2232g bd2233g data s heet operational notes - continu ed 11. unused input pins input pins of an ic are often connected to the gate of a mos transistor. t he gate has extremely high impedance and extremely low capacitance. if left unconnected, the electric field from the outside can easily charge it. the small char ge acquired in this way is enough to produce a significant effect on the conduction through the transistor and cause unexpected operation of the ic. so unless otherwise specified, unused inpu t pins should be connected to the power supply or ground line. 12. r egarding the i nput p in of the ic this monolithic ic contains p+ isolation and p substrate layers between adjacent elements in order to keep them isolated. p - n junctions are formed at the intersection of the p layers with t he n layers of other elements, cre ating a parasitic diode or transistor. for example (refer to figure below): when gnd > pin a and gnd > pin b, the p - n junction operates as a parasitic diode. when gnd > pin b, the p - n junction operates as a parasitic transistor. parasitic diodes inevita bly occur in the structure of the ic. the operation of parasitic diodes can result in mutual interference among circuits, operational faults, or physical damage. therefore , conditions that cause these diodes to operate, such as applying a voltage lower tha n the gnd voltage to an input pin (and thus to the p substrate) should be avoided. fig ure 45. example of monolithic ic structure 13. ceramic capacitor when using a ceramic capacitor, determine the dielectric constant considering the change of capacitance w ith temperature and the decrease in nominal capacitance due to dc bias and oth ers. 14. thermal s hutdown circuit(tsd) this ic has a built - in thermal shutdown circuit that prevents heat damage to the ic. normal operat ion should always be within the ics power dissipation rating. if however the rating is exceeded for a continued period, the junction temperature (tj) will rise which will activate the tsd circuit t hat will turn off all output pins. when the tj falls below the tsd threshold, the circuits are automat ically restored to normal operation. note that the tsd circuit operates in a situation that exceeds the absol ute maximum ratings and therefore, under no circumstances, should the tsd circuit be used in a set design or for any purpose other than protecting the ic from heat damage. 15. thermal design perform thermal design in which there are adequate margins by taking into account t he p ower dissipation (pd) in actual states of use. n n p + p n n p + p substrate gnd n p + n n p + n p p substrate gnd gnd parasitic elements pin a pin a pin b pin b b c e parasitic elements gnd parasitic elements c be transistor (npn) resistor n region close-by parasitic elements 20 / 23 www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 tsz02201 - 0e3e0h300220 -1-2 21.aug.2014 rev.003 downloaded from: http:///
bd2232g bd2233g data s heet ordering information b d 2 2 3 2 g - g t r part n umber package g: ssop5 packaging and forming specification g: halogen free package tr : embossed tape and reel b d 2 2 3 3 g - g t r part n umber package g: ssop5 packaging and forming specification g: halogen free pack age tr : embossed tape and reel marking diagram part number part number marking bd2232g j1 bd2233g j7 part number marking ssop5 ( top view) lot number 21 / 23 www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 tsz02201 - 0e3e0h300220 -1-2 21.aug.2014 rev.003 downloaded from: http:///
bd2232g bd2233g data s heet physical dimension , tape and reel information package name ssop5 22 / 23 www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 tsz02201 - 0e3e0h300220 -1-2 21.aug.2014 rev.003 downloaded from: http:///
bd2232g bd2233g data s heet revision history date revision changes 11 . mar .201 3 001 ne w release 25.jun.2013 002 modified y - axis of figure 4. o rdering information is revised. 21 .aug .201 4 003 o rdering information is revised. applied the rohm standard style and improved understandability . improved symbol name. improved the spell of y - axis in figure 26 and 27. add figure 14 and 15. add output discharge function explanation at page17 . 23 / 23 www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 tsz02201 - 0e3e0h300220 -1-2 21.aug.2014 rev.003 downloaded from: http:///
datasheet d a t a s h e e t notice C ge rev.002 ? 2013 rohm co., ltd. all rights reserved. notice precaution on using rohm products 1. our products are designed and manufac tured for application in ordinary elec tronic equipments (such as av equipment, oa equipment, telecommunication equipment, home electroni c appliances, amusement equipment, etc.). if you intend to use our products in devices requiring ex tremely high reliability (such as medical equipment (note 1) , transport equipment, traffic equipment, aircraft/spacecra ft, nuclear power controllers, fuel c ontrollers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (specific applications), please consult with the rohm sale s representative in advance. unless otherwise agreed in writing by rohm in advance, rohm shall not be in any way responsible or l iable for any damages, expenses or losses incurred by you or third parties arising from the use of any ro hms products for specific applications. (note1) medical equipment classification of the specific applications japan usa eu china class class class b class class | class 2. rohm designs and manufactures its products subject to strict quality control system. however, semiconductor products can fail or malfunction at a certain rate. please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe desi gn against the physical injury, damage to any property, which a failure or malfunction of our products may cause. the following are examples of safety measures: [a] installation of protection circuits or other protective devices to improve system safety [b] installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. our products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditio ns, as exemplified below. accordin gly, rohm shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of an y rohms products under any special or extraordinary environments or conditions. if you intend to use our products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and c onfirmation of product performance, reliability, etc, prior to use, must be necessary: [a] use of our products in any types of liquid, incl uding water, oils, chemicals, and organic solvents [b] use of our products outdoors or in places where the products are exposed to direct sunlight or dust [c] use of our products in places where the products ar e exposed to sea wind or corrosive gases, including cl 2 , h 2 s, nh 3 , so 2 , and no 2 [d] use of our products in places where the products are exposed to static electricity or electromagnetic waves [e] use of our products in proximity to heat-producing components, plastic cords, or other flammable items [f] sealing or coating our products with resin or other coating materials [g] use of our products without cleaning residue of flux (ev en if you use no-clean type fluxes, cleaning residue of flux is recommended); or washing our products by using water or water-soluble cleaning agents for cl eaning residue after soldering [h] use of the products in places subject to dew condensation 4. the products are not subjec t to radiation-proof design. 5. please verify and confirm characteristics of the final or mounted products in using the products. 6. in particular, if a transient load (a large amount of load applied in a short per iod of time, such as pulse. is applied, confirmation of performance characteristics after on-boar d mounting is strongly recomm ended. avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading c ondition may negatively affect product performance and reliability. 7. de-rate power dissipation (pd) depending on ambient temper ature (ta). when used in seal ed area, confirm the actual ambient temperature. 8. confirm that operation temperat ure is within the specified range described in the product specification. 9. rohm shall not be in any way responsible or liable for fa ilure induced under deviant condi tion from what is defined in this document. precaution for mounting / circuit board design 1. when a highly active halogenous (chlori ne, bromine, etc.) flux is used, the resi due of flux may negatively affect product performance and reliability. 2. in principle, the reflow soldering method must be used; if flow soldering met hod is preferred, please consult with the rohm representative in advance. for details, please refer to rohm mounting specification downloaded from: http:///
datasheet d a t a s h e e t notice C ge rev.002 ? 2013 rohm co., ltd. all rights reserved. precautions regarding application examples and external circuits 1. if change is made to the constant of an external circuit, pl ease allow a sufficient margin considering variations of the characteristics of the products and external components, including transient characteri stics, as well as static characteristics. 2. you agree that application notes, re ference designs, and associated data and in formation contained in this document are presented only as guidance for products use. theref ore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. rohm shall not be in any way responsible or liable for any damages, exp enses or losses incurred by you or third parties arising from the use of such information. precaution for electrostatic this product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. please take proper caution in your manufacturing process and storage so that voltage exceeding t he products maximum rating will not be applied to products. please take special care under dry condit ion (e.g. grounding of human body / equipment / solder iron, isolation from charged objects, se tting of ionizer, friction prevention and temperature / humidity control). precaution for storage / transportation 1. product performance and soldered connections may deteriora te if the products are stor ed in the places where: [a] the products are exposed to sea winds or corros ive gases, including cl2, h2s, nh3, so2, and no2 [b] the temperature or humidity exceeds those recommended by rohm [c] the products are exposed to di rect sunshine or condensation [d] the products are exposed to high electrostatic 2. even under rohm recommended storage c ondition, solderability of products out of recommended storage time period may be degraded. it is strongly recommended to confirm sol derability before using products of which storage time is exceeding the recommended storage time period. 3. store / transport cartons in the co rrect direction, which is indicated on a carton with a symbol. otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. use products within the specified time after opening a humidity barrier bag. baking is required before using products of which storage time is exceeding the recommended storage time period. precaution for product label qr code printed on rohm products label is for rohms internal use only. precaution for disposition when disposing products please dispose them proper ly using an authorized industry waste company. precaution for foreign exchange and foreign trade act since our products might fall under cont rolled goods prescribed by the applicable foreign exchange and foreign trade act, please consult with rohm representative in case of export. precaution regarding intellectual property rights 1. all information and data including but not limited to application example contained in this document is for reference only. rohm does not warrant that foregoi ng information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. rohm shall not be in any way responsible or liable for infringement of any intellectual property rights or ot her damages arising from use of such information or data.: 2. no license, expressly or implied, is granted hereby under any intellectual property rights or other rights of rohm or any third parties with respect to the information contained in this document. other precaution 1. this document may not be reprinted or reproduced, in whol e or in part, without prior written consent of rohm. 2. the products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of rohm. 3. in no event shall you use in any wa y whatsoever the products and the related technical information contained in the products or this document for any military purposes, incl uding but not limited to, the development of mass-destruction weapons. 4. the proper names of companies or products described in this document are trademarks or registered trademarks of rohm, its affiliated companies or third parties. downloaded from: http:///
datasheet datasheet notice C we rev.001 ? 2014 rohm co., ltd. all rights reserved. general precaution 1. before you use our pro ducts, you are requested to care fully read this document and fully understand its contents. rohm shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny rohms products against warning, caution or note contained in this document. 2. all information contained in this docume nt is current as of the issuing date and subj ec t to change without any prior notice. before purchasing or using rohms products, please confirm the la test information with a rohm sale s representative. 3. the information contained in this doc ument is provi ded on an as is basis and rohm does not warrant that all information contained in this document is accurate an d/or error-free. rohm shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information. downloaded from: http:///

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