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chr3364 - qeg rohs compliant ref. : dschr3364 - qeg1192 - 11 jul 11 1 / 14 specifications subject to change without notice united monolithic semiconductors s.a.s. route dpartementale 128 - bp46 - 91401 orsay cedex france tel.: +33 (0) 1 69 33 03 08 - fax: +33 (0) 1 69 33 03 09 17 - 24ghz down converter gaas monolithic microwave ic in smd leadless package description the chr3364 - qeg is a multifunction monolithic receiver, which integrates a balanced cold fet mixer, a lo chain with buffers associated to a time two multiplier, and a rf low noise amplifier including gain control. it is designed for a wide range of applications, from military to commercial communication systems. the circuit is manufactured with a phemt process, 0.25m gate length, via holes through the substrate, air bridges and electron beam gate lithography. it is sup plied in rohs compliant smd package. main features noise figure main electrical characteristics tamb. = + 25c symbol parameter min typ max unit f rf rf frequency range 17.0 24.0 ghz f lo lo frequency range 6.5 14.0 ghz f if if frequency range dc 3.5 ghz c g conversion gain 11.0 db ums r3364 yyww ?? 0 1 2 3 4 5 6 7 8 9 10 17 18 19 20 21 22 23 24 noise figure (db) rf frequency (ghz) usb lsb
chr3364 - qeg 17 - 24ghz down converter ref. : dschr3364 - qeg1192 - 11 jul 11 2 / 14 specifications subject to change without notice route dpartementale 128, bp46 - 91401 orsay cedex - france tel.: +33 (0) 1 69 33 03 08 - fax: +33 (0) 1 69 33 03 09 electrical characteristics tamb.= +25c, v d = vdl = 4 . 0 v symbol parameter min typ max unit f rf rf frequency range 17 24 ghz f lo lo frequency range 6.5 14 ghz f if if frequency range dc 3.5 ghz c g conversion gain 1 1 db nf noise figure for if> 0.1ghz 2.7 db im_rej image rejection (1) 17 dbc p lo lo input power 0 dbm iip3 input ip3 1 dbm 2lo/rf 2lo leakage at rf port - 40 dbc vd, vdl dc drain voltage 4.0 v id drain current on vd pin for lo buffer 245 ma idl drain current on vdl pin for lna 75 ma vgl lna dc gate voltage (2 ) - 0.5 v vgm mixer dc gate voltage - 0.7 v these values are representative of onboard measurements as defined on the drawing in paragraph "evaluation mother board". (1) an external combiner 90 is required on i / q. (2) typical vgl value for idl = 75 ma see in paragraph biasing option other possibility to optimise differently the performances absolute maximum ratings (1) tamb.= +25c symbol parameter values unit v d, vdl drain bias voltage 5 v i d+idl drain bias current 430 ma v gl lna gate bias voltage - 2 to +0.4 v v gm mixer gate bias voltage - 2 to +0.4 v p rf maximum peak rf input power overdrive (2) +10 dbm p lo maximum peak lo input power overdrive (2) +10 dbm tj junction temperature 175 c ta operating temperature range - 40 to +85 c tstg storage temperature range - 55 to +15 0 c (1) operation of this device above anyone of these parameters may cause permanent damage. (2) duration < 1s.
17 - 24ghz down converter chr3364 - qeg ref. : dschr3364 - qeg1192 - 11 jul 11 3 / 14 specifications subject to change without notice route dpartementale 128, bp46 - 91401 orsay cedex - france tel.: +33 (0) 1 69 33 03 08 - fax: +33 (0) 1 69 33 03 09 device thermal performances all the figures given in this section are obtained assuming that the qfn device is cooled down only by conduction through the package thermal pad (no convection mode considered). the temperature is monitored at the package back - side interface (tcase) as shown below. the system maximum temperature must be adjusted in order to guarantee that tcase remains below than the maximum value specified in the next table. so, the system pcb must be designed to comply with this requirement. a der ating must be applied on the dissipated power if the tcase temperature can not be maintained below than the maximum temperature specified (see the curve pdiss. max) in order to guarantee the nominal device life time (mttf). recommended max. junction temperature (tj max) : 124 c junction temperature absolute maximum rating : 175 c max. continuous dissipated power (pdiss. max.) : 1.3 w => pdiss. max. derating above tcase (1) = 85 c : 33 mw/c junction-case thermal resistance (rth j-c) (2) : <30 c/w minimum tcase operating temperature (3) : -40 c maximum tcase operating temperature (3) : 85 c minimum storage temperature : -55 c maximum storage temperature : 150 c (1) derating at junctio n temperature co nstant = tj max. (2) rth j-c is calculated fo r a wo rst case co nsidering the ho t t e s t junc t io n o f the m m ic and all the devices biased. (3) tcase=p ackage back side temperature measured under the die-attach-pad (see the drawing belo w). 6.0 device thermal specification : chr3364-qeg 0 0.2 0.4 0.6 0.8 1 1.2 1.4 - 50 - 25 0 25 50 75 100 125 150 pdiss. max. @tj chr3364 - qeg 17 - 24ghz down converter ref. : dschr3364 - qeg1192 - 11 jul 11 4 / 14 specifications subject to change without notice route dpartementale 128, bp46 - 91401 orsay cedex - france tel.: +33 (0) 1 69 33 03 08 - fax: +33 (0) 1 69 33 03 09 typical board measure ments tamb = +25c, vd = vdl = 4.0v, vgl = - 0.5v, vgm = - 0.7v, p lo = 0dbm the values shown on the following pages are representative of on - board measurements where results are given on package access planes. noise figure in supradyne and infradyne mode versus rf frequency f rf = 2xf lo f if , f if = 2.0ghz 0 1 2 3 4 5 6 7 8 9 10 17 18 19 20 21 22 23 24 noise figure (db) rf frequency (ghz) usb lsb
17 - 24ghz down converter chr3364 - qeg ref. : dschr3364 - qeg1192 - 11 jul 11 5 / 14 specifications subject to change without notice route dpartementale 128, bp46 - 91401 orsay cedex - france tel.: +33 (0) 1 69 33 03 08 - fax: +33 (0) 1 69 33 03 09 typical board measurements tamb = +25c, vd = vdl = 4.0v, vgl = - 0.5 v, vgm = - 0.7v, p lo = 0dbm conversion gain in supradyne and infradyne mode versus rf frequency f rf = 2xf lo f if , f if = 3.5ghz image rejection versus rf frequency f rf = 2xf lo f if , f if = 3.5ghz 0 2 4 6 8 10 12 14 16 18 15 16 17 18 19 20 21 22 23 24 25 26 27 28 conversion gain (db) rf frequency (ghz) usb conv. gain lsb conv. gain 0 5 10 15 20 25 30 35 15 16 17 18 19 20 21 22 23 24 25 26 27 28 image rejection (db) rf frequency (ghz) usb lsb
chr3364 - qeg 17 - 24ghz down converter ref. : dschr3364 - qeg1192 - 11 jul 11 6 / 14 specifications subject to change without notice route dpartementale 128, bp46 - 91401 orsay cedex - france tel.: +33 (0) 1 69 33 03 08 - fax: +33 (0) 1 69 33 03 09 typical board measurements tamb = +25c, vd = vdl = 4.0v, vgl = - 0.5v, vgm = - 0.7v, p lo = 0dbm input ip3 in supradyne mode versus rf frequency f rf = 2xf lo +f if , f if = 3.5ghz input ip3 in infradyne mode versus rf frequency f rf = 2xf lo - f if , f if = 3.5ghz - 5 - 4 - 3 - 2 - 1 0 1 2 3 4 5 6 7 8 9 10 - 27 - 25 - 23 - 21 - 19 - 17 - 15 - 13 - 11 - 9 input ip3 (dbm) input power dcl (dbm) 19.5ghz 21.5ghz 23.5ghz 24.5ghz 26.5ghz - 5 - 4 - 3 - 2 - 1 0 1 2 3 4 5 6 7 8 9 10 - 27 - 25 - 23 - 21 - 19 - 17 - 15 - 13 - 11 - 9 input ip3 (dbm) input power dcl (dbm) 19.5ghz 21.5ghz 23.5ghz 24.5ghz 26.5ghz
17 - 24ghz down converter chr3364 - qeg ref. : dschr3364 - qeg1192 - 11 jul 11 7 / 14 specifications subject to change without notice route dpartementale 128, bp46 - 91401 orsay cedex - france tel.: +33 (0) 1 69 33 03 08 - fax: +33 (0) 1 69 33 03 09 typical board measurements tamb = +25c, vd = vdl = 4.0v, vgl = - 0.5 v, vgm = - 0.7v, p lo = 0dbm imd3 in supradyne mode versus rf frequency f rf = 2xf lo +f if , f if = 3.5ghz lo & rf return loss versus frequency 20 30 40 50 60 70 - 27 - 25 - 23 - 21 - 19 - 17 - 15 - 13 - 11 - 9 imd3 (dbc) input power dcl (dbm) 19.5ghz 21.5ghz 23.5ghz 24.5ghz 26.5ghz - 20 - 18 - 16 - 14 - 12 - 10 - 8 - 6 - 4 - 2 0 0 5 10 15 20 25 30 return losses (db) frequency (ghz) rf lo
chr3364 - qeg 17 - 24ghz down converter ref. : dschr3364 - qeg1192 - 11 jul 11 8 / 14 specifications subject to change without notice route dpartementale 128, bp46 - 91401 orsay cedex - france tel.: +33 (0) 1 69 33 03 08 - fax: +33 (0) 1 69 33 03 09 temperature board measurements t = [ - 40, +25, +85] c, vd = vdl = 4.0v, vgl = - 0.5 v, vgm = - 0.7v, p lo = 0dbm conversion gain in supradyne mode versus rf frequency f rf = 2xf lo +f if , f if = 3.5ghz conversion gain in infradyne mode versus rf frequency f rf = 2xf lo - f if , f if = 3.5ghz 0 2 4 6 8 10 12 14 16 18 15 16 17 18 19 20 21 22 23 24 25 26 27 28 conversion gain (db) rf frequency (ghz) - 40 c +25 c +85 c 0 2 4 6 8 10 12 14 16 18 15 16 17 18 19 20 21 22 23 24 25 26 27 28 conversion gain (db) rf frequency (ghz) - 40 c +25 c +85 c
17 - 24ghz down converter chr3364 - qeg ref. : dschr3364 - qeg1192 - 11 jul 11 9 / 14 specifications subject to change without notice route dpartementale 128, bp46 - 91401 orsay cedex - france tel.: +33 (0) 1 69 33 03 08 - fax: +33 (0) 1 69 33 03 09 temperature board measurements t = [ - 40, +25, +85] c, vd = vdl = 4.0 v, vgl = - 0.5 v, vgm = - 0.7v, p lo = 0dbm input ip3 in supradyne mode versus rf frequency f rf = 2xf lo +f if , f if = 3.5ghz - 5 - 4 - 3 - 2 - 1 0 1 2 3 4 5 6 7 8 9 10 - 27 - 25 - 23 - 21 - 19 - 17 - 15 - 13 - 11 - 9 input ip3 (dbm) input power dcl (dbm) 85 c @19.5ghz 25 c @19.5ghz - 40 c @19.5ghz 85 c @23.5ghz 25 c @23.5ghz - 40 c @23.5ghz
chr3364 - qeg 17 - 24ghz down converter ref. : dschr3364 - qeg1192 - 11 jul 11 10 / 14 specifications subject to change without notice route dpartementale 128, bp46 - 91401 orsay cedex - france tel.: +33 (0) 1 69 33 03 08 - fax: +33 (0) 1 69 33 03 09 package outline (1) matt tin, lead free (green) 1 - nc 9 - v gl 17 - nc units : mm 2 - nc 1 0 - vdl 18 - nc from the standard : jedec mo - 220 3 - nc 1 1 - vgm 19 - nc (vggd) 4 - gnd (2) 1 2 - vd 2 0 - if_i out 25 - gnd 5 - rf in 1 3 - nc 2 1 - gnd (2) 6 - gnd (2) 1 4 - gnd (2) 2 2 - if_q out 7 - nc 1 5 - lo in 2 3 - nc 8 - nc 1 6 - gnd (2) 2 4 - nc (1) the package outline drawing included to this data - sheet is given for indication. refer to the application note an0017 ( http://www.ums - gaas.com ) for exact package dimensions. (2) it is strongly recommended to ground all pins marked gnd through the pcb board. ensure that the pcb board is designed to provide the best possible ground to the package.
17 - 24ghz down converter chr3364 - qeg ref. : dschr3364 - qeg1192 - 11 jul 11 11 / 14 specifications subject to change without notice route dpartementale 128, bp46 - 91401 orsay cedex - france tel.: +33 (0) 1 69 33 03 08 - fax: +33 (0) 1 69 33 03 09 evaluation mother board compatible with the proposed footprint. based on typically ro4003 / 8mils or equivalent. using a micro - strip to coplanar transition to access the package. recommended for the implementation of this product on a module board. decoupling capacitors of 10nf 10% are recommended for all dc accesses. see application note an0017 for details. hybrid coupler 90 2 - 4ghz
chr3364 - qeg 17 - 24ghz down converter ref. : dschr3364 - qeg1192 - 11 jul 11 12 / 14 specifications subject to change without notice route dpartementale 128, bp46 - 91401 orsay cedex - france tel.: +33 (0) 1 69 33 03 08 - fax: +33 (0) 1 69 33 03 09 notes due to esd protection circuits on rf and lo in put, an external capacitance might be requested to isolate the product from external voltage that could be present on the se accesses. esd protections are also implemented on gate accesses. the dc connections do not include any decoupling capacitor in package, therefore it is mandatory to provide a good external dc decoupling (10nf) on the pc board, as close as possible to the package. bias ing options in order to improve the conversion gain or the input ip3, the biasing could be tuned . vgl voltage allows controlling idl current . table below gives the typical value for main characteristics vd=vdl= 4.0v idl= 75ma vd=vdl= 4.5v idl= 110ma conversion gain (db) 11 12.5 noise figure (db) 2.7 2.6 input ip3 (dbm) +1 +3 vgl (v) - 0.5 - 0.4 id (ma) 245 250 id +idl (ma) 320 360 total dc power consumption (mw) 1280 1620 gnd if_q if_i nc vdl nc nc vgl vgm vd 20 22 23 21 24 1 2 3 4 5 6 8 9 10 11 12 14 15 16 17 18 19 7 13 x2 lo in nc nc nc nc gnd gnd nc gnd gnd nc nc nc rf in
17 - 24ghz down converter chr3364 - qeg ref. : dschr3364 - qeg1192 - 11 jul 11 13 / 14 specifications subject to change without notice route dpartementale 128, bp46 - 91401 orsay cedex - france tel.: +33 (0) 1 69 33 03 08 - fax: +33 (0) 1 69 33 03 09 dc schematic lna: 4v, 75 ma lo buffer: 4v, 245 ma 64 ? 310 ? 2k ? 45 ? vd =4.0v 22 ? 2.8k ? 3.3k ? 17 ? vg ~ - 0.5v 15ma 25ma 35ma 510 ? 100 ? 725 ? 1.6k ? 510 ? 220 ? 190 ? 40 ? 1k ? 25 ? 100 ? 185 ? 8 ? 16 ? 960 ? 25 ? 960 ? 1k ? 100 ? 15 ? 15 ? 40 ? 40 ? vd =4.0v 80ma 25ma 60ma 80ma 5.5 ? 5.5 ?
chr3364 - qeg 17 - 24ghz down converter ref. : dschr3364 - qeg1192 - 11 jul 11 14 / 14 specifications subject to change without notice route dpartementale 128, bp46 - 91401 orsay cedex - france tel.: +33 (0) 1 69 33 03 08 - fax: +33 (0) 1 69 33 03 09 recommended package footprint refer to the application note an0017 available at http://www.ums - gaas.com for package foot print recommendations. smd mounting procedure for the mounting process standard techniques involving solder paste and a suitable reflow process can be used. for further details, see application note an0017. recommended environmental management refer to the application note an0019 available at http://www.ums - gaas.com for environmental data on ums package products. recommended esd management refer to the application not e an0020 available at http://www.ums - gaas.com for esd sensitivity and handling recommendations for the ums package products. ordering information qfn 4x5 rohs compliant package: chr3364 - qeg /xy stick: xy = 20 tape & reel: xy = 21 information furnished is believed to be accurate and reliable. however united monolithic semiconductors s.a.s. assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. no license is granted by implication or otherwise under any patent or patent righ ts of united monolithic semiconductors s.a.s. . specifications mentioned in this publication are subject to change without notice. this publication supersedes and replaces all information previously supplied. united monolithic semiconductors s.a.s. products are not authorised for use as critical components in life support devices or systems without express written approval from united monolithic semiconductors s.a.s.

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