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chr3663 - qeg rohs compliant ref. : dschr3663 - qeg1192 - 11 jul 11 1 / 18 specifications subject to change without notice united monolithic semiconductors s.a.s. route dpartementale 128 - bp46 - 91401 orsay cedex france tel.: +33 (0) 1 69 33 03 08 - fax: +33 (0) 1 69 33 03 09 17 - 24ghz integrated down converter gaas monolithic microwave ic in smd package description the chr3663 - qeg is a multifunction part, which integrates a balanced cold fet mixer, a multiplier by two, and a rf lna including gain control. it is designed for a wide range of applications, typically commercial communication systems and ism . the circuit is manufactured with a robust high volume phemt process, 0.25m gate length. it is available in lead - free smd package. main features broadband rf performance 17 - 24ghz 11db conversion gain 15 dbc image rejection 3 dbm input ip3 15db gain control 24lqfn4x5 msl1 main characteristics tamb = +25c, vd = 4.5v symbol parameter min typ max unit f rf rf frequency range 17 .0 24.0 ghz f lo lo frequency range 7 .0 14.0 ghz f if if frequency range dc 3.5 ghz g c conversion gain 11 db esd protections: electrostatic discharge sensitive device observe handling precautions! ums r3663 yyww ? ? -16 -14 -12 -10 -8 -6 -4 -2 0 2 4 6 8 10 12 14 16 17 18 19 20 21 22 23 24 25 26 rf frequency (ghz) conversion gain (db) gcmax_sup@2ghz gcmin_sup@2ghz gcmax_inf@2ghz gcmin_inf@2ghz
chr3663 - qeg 17 C 24 ghz down converter ref. : dschr3663 - qeg1192 - 11 jul 11 2 / 18 specifications subject to change without notice route dpartementale 128, bp46 - 91401 orsay cedex - france tel.: +33 (0) 1 69 33 03 08 - fax: +33 (0) 1 69 33 03 09 electrical characteristics tamb = +25c, vd = vdl = 4.5v symbol parameter min typ max unit f rf rf frequency range 17 .0 24.0 ghz f lo lo frequency range 7 .0 14.0 ghz f if if frequency range dc 3.5 ghz g c conversion gain@ min. attenuation (1) 8.5 11 .0 db ? lo lo input power 0 dbm iip3 input ip3@ min. att. 0 3 dbm 2lo/rf 2lo leakage at rf port @ max. gain - 40 dbm vd, vdl dc drain voltage 4.5 v id drain current 3 8 0 ma vgl lna dc gate voltage - 0.4 v gc2, gc3 gain control dc voltage - 2 .0 +0,6 v vgm mixer dc gate voltage - 0.7 v these values are representative of onboard measurements as defined on the drawing at parag ra p h evaluation mother board . (1) an external combiner 90 is required on i / q. note: id not affected by gc2, gc3.
17 C 24 ghz down converter chr3663 - qeg ref. : dschr3663 - qeg1192 - 11 jul 11 3 / 18 specifications subject to change without notice route dpartementale 128, bp46 - 91401 orsay cedex - france tel.: +33 (0) 1 69 33 03 08 - fax: +33 (0) 1 69 33 03 09 absolute maximum ratings (1) tamb = +25c symbol parameter values unit vd maximum drain bias voltage 5 v id maximum drain bias current 450 ma vgl ,vgm lna , mixer dc gate voltage - 2 .0 to +0.4 v gc1, 2 gain control voltage - 2.5 to + 0.8 v p_rf maximum peak input power overdrive 10 dbm p_lo maximum lo input power 10 dbm tch maximum channel temperature 175 c ta operating temperature range - 40 to +85 c tstg storage temperature range - 55 to +125 c (1) operation of this device above anyone of these paramaters may cause permanent damage.
chr3663 - qeg 17 C 24 ghz down converter ref. : dschr3663 - qeg1192 - 11 jul 11 4 / 18 specifications subject to change without notice route dpartementale 128, bp46 - 91401 orsay cedex - france tel.: +33 (0) 1 69 33 03 08 - fax: +33 (0) 1 69 33 03 09 device thermal performances all the figures given in this section are obtained assuming that the qfn device is cooled down only by conduction through the package thermal pad (no convection mode considered). the temperature is monitored at the package back - side interface (tcase) as shown below. the system maximum temperature must be adjusted in order to guarantee that tcase remains below than the maximum value specified in the next table. so, the system pcb must be designed to comply with this requirement. a derating must be applied on the dissipated power if the tcase temperature can not be maintained below than the maximum temperature specified in order to guarantee the nominal device life time (mttf) (see the curve pdiss. ma x) . recommanded max. junction temperature (tj max) : 143 c junction temperature absolute maximum rating : 175 c max. continuous dissipated power @ tcase= 85 c : 1,71 w => pdiss derating above tcase (1) = 85 c : 29 mw/c junction-case thermal resistance (rth j-c) (2) : <34 c/w min. package back side operating temperature (3) : -40 c max. package back side operating temperature (3) : 85 c min. storage temperature : -55 c max. storage temperature : 125 c (1) derating at junction temperature constant = tj max (2) rth j-c is calculated for a worst case where the hotter junction of the mmic is considered. (3) tcase=package back side temperature measured under the die-attach-pad (see the drawing below). 5.6 device thermal specification : chr3663-qeg 0 0,2 0,4 0,6 0,8 1 1,2 1,4 1,6 1,8 -50 -25 0 25 50 75 100 125 tcase (c) pdiss. max. (w) pdiss. max. (w) tcase example of qfn 16l 3x3 back-side view, temperature reference point (tcase) location.
17 C 24 ghz down converter chr3663 - qeg ref. : dschr3663 - qeg1192 - 11 jul 11 5 / 18 specifications subject to change without notice route dpartementale 128, bp46 - 91401 orsay cedex - france tel.: +33 (0) 1 69 33 03 08 - fax: +33 (0) 1 69 33 03 09 typical measured performances tamb = +25c, vd = vdl = 4.5v, v gl = - 0.4v, vgm = - 0.7v, p_lo = 0 dbm these values are representative of onb oard measurements (on connector access plane s) as defined on the drawing 97625 page 1 6 . the board loss es are estimated from 1.5 to 2 .0 db in the frequency range. figure 1 : conversion gain in supradyne mode versus frequency f_rf = 2xf_lo + f_if , f_if = 2 .0 & 3.5 ghz , gc2 = gc3 = - 1.5 & 0.5v figure 2 : conversion gain in infradyne mode versus frequency f_rf = 2xf_lo - f_if, f_if = 2 .0 & 3.5 ghz , gc2 = gc3 = - 1.5 & 0.5v -16 -14 -12 -10 -8 -6 -4 -2 0 2 4 6 8 10 12 14 16 17 18 19 20 21 22 23 24 25 26 rf frequency (ghz) conversion gain (db) gcmax_sup@2ghz gcmin_sup@2ghz gcmax_sup@3,5ghz gcmin_sup@3,5ghz -16 -14 -12 -10 -8 -6 -4 -2 0 2 4 6 8 10 12 14 16 17 18 19 20 21 22 23 24 25 26 rf frequency (ghz) conversion gain (db) gcmax_inf@2ghz gcmin_inf@2ghz gcmax_inf@3,5ghz gcmin_inf@3,5ghz
chr3663 - qeg 17 C 24 ghz down converter ref. : dschr3663 - qeg1192 - 11 jul 11 6 / 18 specifications subject to change without notice route dpartementale 128, bp46 - 91401 orsay cedex - france tel.: +33 (0) 1 69 33 03 08 - fax: +33 (0) 1 69 33 03 09 figure 3 : dynamic range (gcmax C gcmin) versus frequency f_rf = 2xf_lo - f_if & f_rf = 2xf_lo+f_if, f_if = 2 .0 ghz figure 4 : drain currents versus frequency f_rf = 2xf_lo - f_if , freq_if = 2 .0 ghz, gc2 = gc3 = - 1.5v 0 2 4 6 8 10 12 14 16 18 20 22 24 26 28 30 17 18 19 20 21 22 23 24 25 26 rf frequency (ghz) dynamic range (db) dynamicrange_sup@2ghz dynamicrange_inf@2ghz 100 120 140 160 180 200 220 240 260 280 300 16 17 18 19 20 21 22 23 24 25 26 frequency (ghz) drain current (db) idl@p_rf=-20dbm id@p_lo=0dbm
17 C 24 ghz down converter chr3663 - qeg ref. : dschr3663 - qeg1192 - 11 jul 11 7 / 18 specifications subject to change without notice route dpartementale 128, bp46 - 91401 orsay cedex - france tel.: +33 (0) 1 69 33 03 08 - fax: +33 (0) 1 69 33 03 09 figure 5 : conversion gain versus rf power & frequency f_rf = 2xf_lo+f_if, f_if = 2.0 ghz, gc2 = gc3 = - 1.5v figure 6 : conversion gain versus rf power & gain control f_rf = 2xf_lo+f_if, f_rf = 20 ghz, f_if = 2.0 ghz 5 6 7 8 9 10 11 12 13 14 15 -26 -24 -22 -20 -18 -16 -14 -12 -10 -8 -6 -4 -2 0 2 4 6 input power (dbm) conversion gain (db) f_rf=16ghz f_rf=18ghz f_rf=20ghz f_rf=22ghz f_rf=24ghz f_rf=26ghz -16 -14 -12 -10 -8 -6 -4 -2 0 2 4 6 8 10 12 14 16 -26 -24 -22 -20 -18 -16 -14 -12 -10 -8 -6 -4 -2 0 2 4 6 input power (dbm) conversion gain (db) gcx=-1,5v gcx=-0,5v gcx=-0,3v gcx=-0,1v gcx=+0,5v"
chr3663 - qeg 17 C 24 ghz down converter ref. : dschr3663 - qeg1192 - 11 jul 11 8 / 18 specifications subject to change without notice route dpartementale 128, bp46 - 91401 orsay cedex - france tel.: +33 (0) 1 69 33 03 08 - fax: +33 (0) 1 69 33 03 09 figure 7 : input ip3 versus rf frequency & rf power (double carrier) f_rf = 2xf_lo - f_if, f_if = 3.5 ghz, gc2 = gc3 = - 1.5v figure 8 : input ip3 versus gain control & rf power (double carrier) f_rf = 2xf_lo - f_if, f_rf = 20.5 ghz, f_if = 3.5 ghz 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 -20 -15 -10 input power (dbm) input ip3 (dbm) f_rf=17,5ghz f_rf=20,5ghz f_rf=23,5ghz 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 -20 -15 -10 input power (dbm) input ip3 (dbm) gcx=-1,5v gcx=-0,5v gcx=-0,3v
17 C 24 ghz down converter chr3663 - qeg ref. : dschr3663 - qeg1192 - 11 jul 11 9 / 18 specifications subject to change without notice route dpartementale 128, bp46 - 91401 orsay cedex - france tel.: +33 (0) 1 69 33 03 08 - fax: +33 (0) 1 69 33 03 09 temperature measurements t = [ - 40, +25, 8 5 ] c, vd = vdl = 4.5v, v gl = - 0.4v, vgm = - 0.7v, p_lo = 0 dbm figure 9 : conversion gain in supradyne mode versus temperature & frequency f_rf = 2xf_lo + f_if, f_if = 2 .0 ghz , gc2 = gc3 = - 1.5 & 0.5v figure 10 : conversion gain in infradyne mode versus temperature & frequency f_rf = 2xf_lo - f_if, f_if = 2 .0 ghz , gc2 = gc3 = - 1.5 & 0.5v -16 -14 -12 -10 -8 -6 -4 -2 0 2 4 6 8 10 12 14 16 17 18 19 20 21 22 23 24 25 26 rf frequency (ghz) conversion gain (db) gcmax_sup@-40c gcmin_sup@-40c gcmax_sup@25c gcmin_sup@25c gcmax_sup@85c gcmin_sup@85c -16 -14 -12 -10 -8 -6 -4 -2 0 2 4 6 8 10 12 14 16 17 18 19 20 21 22 23 24 25 26 rf frequency (ghz) conversion gain (db) gcmax_inf@-40c gcmin_inf@-40c gcmax_inf@25c gcmin_inf@25c gcmax_inf@85c gcmin_inf@85c
chr3663 - qeg 17 C 24 ghz down converter ref. : dschr3663 - qeg1192 - 11 jul 11 10 / 18 specifications subject to change without notice route dpartementale 128, bp46 - 91401 orsay cedex - france tel.: +33 (0) 1 69 33 03 08 - fax: +33 (0) 1 69 33 03 09 figure 11 : image rejection on output i f_if = 2 .0 ghz, gc2 = gc3 = - 1.5v figure 12 : image rejection on output q f_if = 2 .0 ghz, gc2 = gc3 = - 1.5v 0 5 10 15 20 25 30 35 40 7 8 9 10 11 12 13 14 lo frequency (ghz) image rejection (dbc) im_rej_i@-40c im_rej_i@25c im_rej_i@85c 0 5 10 15 20 25 30 35 40 7 8 9 10 11 12 13 14 lo frequency (ghz) image rejection (dbc) im_rej_q@-40c im_rej_q@25c im_rej_q@85c
17 C 24 ghz down converter chr3663 - qeg ref. : dschr3663 - qeg1192 - 11 jul 11 11 / 18 specifications subject to change without notice route dpartementale 128, bp46 - 91401 orsay cedex - france tel.: +33 (0) 1 69 33 03 08 - fax: +33 (0) 1 69 33 03 09 figure 13 : input ip3 versus temperature & rf power (double carrier) f_rf = 2xf_lo - f_if, f_rf = 20.5ghz, f_if = 3.5 ghz, gc2 = gc3 = - 1.5v the following values are representative of onboard measurements of the noise f igure where board losses have been deembedded (result given on package access planes) . figure 14 : noise f igure in supradyne mode vs temperature & frequency f_rf = 2xf_lo+f_if, f_if = 2 .0 ghz , gc2 = gc3 = - 1.5v 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 -20 -15 -10 input power (dbm) input ip3 (dbm) t=-40c t=25c t=75c 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 16 17 18 19 20 21 22 23 24 25 26 rf frequency (ghz) noise figure (db) nf_sup@-40c nf_sup@25c nf_sup@85c
chr3663 - qeg 17 C 24 ghz down converter ref. : dschr3663 - qeg1192 - 11 jul 11 12 / 18 specifications subject to change without notice route dpartementale 128, bp46 - 91401 orsay cedex - france tel.: +33 (0) 1 69 33 03 08 - fax: +33 (0) 1 69 33 03 09 figure 15 : noise f igure in infradyne mode vs temperature & frequency f_rf = 2xf_lo - f_if, f_if = 2 .0 ghz , gc2 = gc3 = - 1.5v 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 16 17 18 19 20 21 22 23 24 25 26 rf frequency (ghz) noise figure (db) nf_inf@-40c nf_inf@25c nf_inf@85c
17 C 24 ghz down converter chr3663 - qeg ref. : dschr3663 - qeg1192 - 11 jul 11 13 / 18 specifications subject to change without notice route dpartementale 128, bp46 - 91401 orsay cedex - france tel.: +33 (0) 1 69 33 03 08 - fax: +33 (0) 1 69 33 03 09 package outline (1) 1 - nc 9 - vgl 17 - nc 25 - gnd exposed pad 2 - nc 10 - vdl 18 - nc 3 - nc 11 - vgm 19 - nc 4 - gnd (2) 12 - vd 20 - if_i out 5 - rf in 13 - nc 21 - gnd (2) 6 - gnd (2) 14 - gnd (2) 22 - if_q out 7 - gc3 15 - lo in 23 - nc 8 - gc2 16 - gnd (2) 24 - nc (1) the package outline drawing included to this data - sheet is given for indication. refere to the application note an0017 available at http://www.ums - gaas.com for exact package dimensions. (2) it is strongly recommended to ground on the pcb board all the pins referenced as gnd.
chr3663 - qeg 17 C 24 ghz down converter ref. : dschr3663 - qeg1192 - 11 jul 11 14 / 18 specifications subject to change without notice route dpartementale 128, bp46 - 91401 orsay cedex - france tel.: +33 (0) 1 69 33 03 08 - fax: +33 (0) 1 69 33 03 09 evaluation mother board ? compatible with the proposed footprint. ? based on typically ro4003 / 8mils or equivalent. ? using a microstrip to coplanar transition to access the package. ? recommended for the implementation of this product on a module board. ? decoupling capacitors of 10nf ? 1 0% are recommended for all dc accesses. ? (see application note an0017 for details). gc3 gc2 vgl vdl vgm vd decoupling capacitors = 10nf hybrid coupler anaren 90 2 - 4ghz
17 C 24 ghz down converter chr3663 - qeg ref. : dschr3663 - qeg1192 - 11 jul 11 15 / 18 specifications subject to change without notice route dpartementale 128, bp46 - 91401 orsay cedex - france tel.: +33 (0) 1 69 33 03 08 - fax: +33 (0) 1 69 33 03 09 notes due to esd protection circuits on rf and lo inputs, an external capacitance might be requested to isolate the product from external voltage that could be present on these accesses in the application. esd protections are also implemented on gate accesses. the dc connections do not include any decoupling capacitor in package, therefore it is mandatory to provide a good external dc decoupling on the pc board, as close as possible to the package. rf in gnd if_q if_i nc vdl gc3 gc2 vgl vgm vd 20 22 23 21 24 1 2 3 4 5 6 8 9 10 11 12 14 15 16 17 18 19 7 13 x2 lo in nc nc nc nc gnd gnd nc gnd gnd nc nc nc rf in gnd if_q if_i nc vdl gc3 gc2 vgl vgm vd 20 22 23 21 24 1 2 3 4 5 6 8 9 10 11 12 14 15 16 17 18 19 7 13 x2 lo in nc nc nc nc gnd gnd nc gnd gnd nc nc nc gnd if_q if_i nc vdl gc3 gc2 vgl vgm vd 20 22 23 21 24 1 2 3 4 5 6 8 9 10 11 12 14 15 16 17 18 19 7 13 x2 lo in nc nc nc nc gnd gnd nc gnd gnd nc nc nc
chr3663 - qeg 17 C 24 ghz down converter ref. : dschr3663 - qeg1192 - 11 jul 11 16 / 18 specifications subject to change without notice route dpartementale 128, bp46 - 91401 orsay cedex - france tel.: +33 (0) 1 69 33 03 08 - fax: +33 (0) 1 69 33 03 09 dc schematic lna: 4.5v, 110ma lo buffer: 4.5v, 270ma 510 ? 100 ? 725 ? 1.6k ? 510 ? 220 ? 190 ? 40 ? 4x75 m 1k ? 25 ? differential amplifier differential multiplier buffer 1 buffer 2 100 ? 185 ? 8 ? 16 ? 960 ? 2x75 m 25 ? 960 ? 1k ? 100 ? 15 ? 40 ? 40 ? vd = 4.5v, 270ma 90ma 30ma 65ma 85ma 200 ? 50 ? 50 ? mixer 510 ? 100 ? 725 ? 1.6k ? 510 ? 220 ? 190 ? 40 ? 4x75 m 1k ? 25 ? differential amplifier differential multiplier buffer 1 buffer 2 100 ? 185 ? 8 ? 16 ? 960 ? 2x75 m 25 ? 960 ? 1k ? 100 ? 15 ? 40 ? 40 ? vd = 4.5v, 270ma 90ma 30ma 65ma 85ma 200 ? 50 ? 50 ? mixer vd =4.5v, 110ma 52ma gc3 64 ? 310 ? 2k ? 45 ? 22 ? 1.3k ? 1.8k ? 17 ? vg ~ - 0.35v 3.4k ? 3.4k ? 1x100 m 1x100 m 1x100 m 1x100 m 1x100 m 1x100 m 17ma 41ma gc2 1.5k ? vd =4.5v, 110ma 52ma gc3 64 ? 64 ? 310 ? 2k ? 45 ? 22 ? 1.3k ? 1.8k ? 17 ? vg ~ - 0.35v 3.4k ? 3.4k ? 3.4k ? 1x100 m 1x100 m 1x100 m 1x100 m 1x100 m 1x100 m 17ma 41ma gc2 1.5k ?
17 C 24 ghz down converter chr3663 - qeg ref. : dschr3663 - qeg1192 - 11 jul 11 17 / 18 specifications subject to change without notice route dpartementale 128, bp46 - 91401 orsay cedex - france tel.: +33 (0) 1 69 33 03 08 - fax: +33 (0) 1 69 33 03 09 notes:
chr3663 - qeg 17 C 24 ghz down converter ref. : dschr3663 - qeg1192 - 11 jul 11 18 / 18 specifications subject to change without notice route dpartementale 128, bp46 - 91401 orsay cedex - france tel.: +33 (0) 1 69 33 03 08 - fax: +33 (0) 1 69 33 03 09 recommended package footprint refer to the application note an0017 available at http://www.ums - gaas.com for package foot print recommendations and exact package dimensions. smd mounting procedure for the mounting process standard techniques involving solder paste and a suitable reflow process can be used. for further details, see application note an0017. recommended environmental management refer to the application note an0019 available at http://www.ums - gaas.com for environmental data on ums package products. recommended esd ma nagement refer to the application note an0020 available at http://www.ums - gaas.com for esd sensitivity and handling recommendations for the ums package products. ordering information qfn 4x5 rohs compliant package: chr3663 - qeg/xy stick: xy = 20 tape & reel: xy = 21 information furnished is believed to be accurate and reliable. however united monolithic semiconductors s.a.s. assumes no responsibility for th e consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. no license is granted by implication or otherwise under any patent or patent rights of united monolithic semicondu ctors s.a.s. . specifications mentioned in this publication are subject to change without notice. this publication supersedes and replaces all information previously supplied. united monolithic semiconductors s.a.s. products are not authorised for use as cr itical components in life support devices or systems without express written approval from united monolithic semiconductors s.a.s.

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