100% material declaration data sheet CS48 pk148 (v1.2) september 28, 2006 ma terial declaration data sheet average weight: 0.2 g component substance description cas# or description % of component use in product component weight/ substance weight (in grams) component % of total silicon die 0.00562 2.81% silicon 7440-21-3 100.00 0.00562 die attach material 0.0018 0.59% silver 7440-22-4 78.00 0.001404 resin (ep) trade secret 22.00 0.000396 encapsulant 0.0947 47.35% epoxy resins trade secret 6.00 0.005682 phenolic resins trade secret 6.00 0.005682 carbon black 1333-86-4 0.50 0.0004735 sio2 filler 60676-86-0 84.00 0.079548 bismuth 7440-69-9 max 1.00 0.000947 metal hydroxide trade secret 2.50 0.0023675 laminate 0.0301 15.05% bismaleimide/triazin e board 13676-54-5 / 25722-66-1 72.685 0.021878185 copper 7440-50-8 9.880 0.00297388 nickel 7440-02-0 7.270 0.00218827 gold 7440-57-5 1.160 0.00034916 antimony pentoxide 1314-60-9 0.005 0.000001505 brominated resin 68541-56-0 9.000 0.002709 bond wire 0.00036 0.18% gold 7440-57-5 100.00 0.00036 solder balls 0.06804 34.02% tin 7440-31-5 63.00 0.0428652 lead 7439-92-1 37.00 0.0251748 pk148 (v1.2) september 28, 2006 www.xilinx.com 1 ? 2006 xilinx, inc. all rights reserved. a ll xilinx trademarks, registered trademarks, patents, and di sclaimers are as listed a t http://www.xilinx.com/legal.htm . all other trademarks and registered trademarks are the property of their respective owners. all specifications are subject to c hange without notice. xilinx believes this environmental information to be correct, but cannot guarantee its completeness or accuracy as it is based on data received from sources outside our company.
100% material declaration data sheet ? CS48 2 www.xilinx.com revision history the following table shows the revi sion history for this document. date revision revision 4/06/06 1.0 initial release. 7/21/06 1.1 100% material declaration. 9/28/06 1.2 updated component descriptions and weights. pk148 (v1.2) september 28, 2006
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