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? 2015 microchip technology inc. ds70005120a-page 1 rn52 features: fully qualified bluetooth? version 3.0 module, fully compatible with bluetooth version 2.1+edr, 1.2, and 1.1 embedded bluetooth profiles: a2dp, avrcp, hfp/hsp and spp audio decoders: sbc, aac, aptx enhanced hands free voice capability narrowband and wideband codecs with cvc dsp software configurable through commands over uart console interface stereo analog differential audio output and input for highest quality audio external audio codecs supported via s/pdif and i2s interface integrated amplifier for driving 16 ? speakers dedicated gpio pins enable mcus to access control and status functions efficiently spp data connection interface over uart supports wireless iap profile advertising which is discoverable by ios devices (iap protocol imple- mentation on an external host microcontroller required) certifications: fcc, ic, ce, bluetooth sig postage stamp sized form factor: 13.5 x 26.0 x 2.7 mm castellated smt pads for easy and reliable pcb mounting environmentally friendly, rohs compliant bluetooth sig qdid 58578 applications: high-quality wireless stereo headsets automotive hands free audio kits wireless audio docking station for smartphones high-quality wireless speakers voip handsets remote control for media player medical data devices rn52 block diagram: pcb antenna bluetooth 3.0 rf baseband rn52 uart usb i 2 s s/pdif 11 gpio pins 1 aio 16-bit risc mcu audio dsp 16-bit stereo codec 16-mbit flash 2 leds mic mic speake r speake r rn52 bluetooth ? audio module downloaded from: http:///
rn52 ds70005120a-page 2 ? 2015 microchip technology inc. 1.0 device overview microchips rn52 bluetooth audio module provides a highly integrated solution for delivering high-quality ste- reo audio in a small form factor. it combines a class 2 bluetooth radio with an embedded dsp processor. the module is programmed and controlled with a simple ascii command set. the rn52 module complies with bluetooth specifica- tion version 3.0. it integrates an rf radio and a base- band controller making it a complete bluetooth subsystem. the rn52 supports a variety of profiles including a2dp, avrcp, hsp/hfp, spp and iap. it provides a uart interface, several user programmable i/o pins, stereo speaker outputs, microphone inputs, digital audio interface and a usb port. standard rn52 and its variants support a2dp, avrcp, hfp, spp and iap in the capacity of bluetooth slave role. rn52src supports a2dp, avrcp, hfp in the capacity of bluetooth master role. rn52 supports wireless iap profile advertising which is discoverable by ios devices. an external host micro- controller is required to implement the iap protocol and communicate with the authentication coprocessor while using the rn52 as a data pipe only to transfer the iap protocol data over bluetooth back and forth with the apple device. a pic ? microcontroller can be used to implement the iap protocol using the microchip mfi library. table 1-1 provides the general specifications for the module. tab l e 1 - 2 and ta b l e 1 - 3 provide the modules weight, dimensions and electrical characteristics. figure 1-1 shows the modules dimensions and figure 1-2 shows recommended landing pattern and layout. table 1-1: general specifications specification description standard bluetooth ? 3.0, class 2 frequency band 2.4 ~ 2.48 ghz modulation method gfsk, pi/4-dqpsk, 8 dpsk maximum data rate 3 mbps rf input impedance 50 ohms interface uart, gpio, aio, usb, i2s, s/pdif, speaker, microphone operation range 10 meters (33 feet) sensitivity -85 dbm at 0.1 % ber rf tx power 4 dbm table 1-2: weight and dimensions specification description dimensions 26.0 mm x 13.5 mm x 2.7 mm weight 1.2 g table 1-3: electrical characteristics specification description supply voltage 3.0-3.6v dc working current depends on profiles, 30 ma typical standby current (disconnected) < 0.5 ma temperature -40oc to +85oc esd jesd22-a224 class 0 product humidity 10% ~ 90% non-condensing downloaded from: http:///
? 2015 microchip technology inc. ds70005120a-page 3 rn52 figure 1-1: module dimensions figure 1-2: recommended pcb footprint figure 1-3 shows the pinout and ta bl e 1 - 4 describes the modules pins. 0.002.55 0.853.75 4.95 6.15 7.35 8.55 9.75 10.9512.65 13.50 0.0 26.00 pcb outline: +/- 0.13 mm pcb thickness: +/- 0.100 mm tolerances: (top view) dimensions are in millimeters 21.20 21.40 20.0018.80 17.60 16.40 15.20 14.00 12.80 11.60 10.40 9.208.00 6.80 5.60 4.40 3.20 2.00 (side view) 26.0021.40 0.700.00 0.00 0.80 2.70 0.7512.75 0.8mm 1.6mm 0.80mm dimensions are in millimeters 0.002.55 0.853.75 4.95 6.15 7.35 8.55 9.75 10.9512.65 13.50 0.0 26.0021.20 21.40 20.0018.80 17.60 16.40 15.20 14.00 12.80 11.60 10.40 9.208.00 6.80 5.60 4.40 3.20 2.00 3.254.65 6.05 7.45 8.85 10.25 20.70ground pads 0.8 x 1.0 mm host ground plane edge(see mounting details) (top view) downloaded from: http:///
rn52 ds70005120a-page 4 ? 2015 microchip technology inc. figure 1-3: pin diagram table 1-4: pin description (1) (sheet 1 of 3) pin symbol i/o type description directio n defau lt 1 gnd ground. ground. 2 gpio3 digital driving this pin high during bootup will put the module in device firmware update (dfu) mode. the device will enter dfu mode in 3 seconds. the pin should only be asserted high before the device enters dfu mode and not after. (usb device powers vbus. pio3 requires 47k to ground and 22k to usb vbus if usb vbus is supplying power to the main board.) during runtime, if the pin is driven high, the device will reset and reboot. note: device will reset within 500 ms after the io is driven high. a reset pulse of 100 ms is recom- mended. if io continues to be driven high after reset, the device will naturally enter dfu mode. the device will enter dfu mode in 3 seconds. input low 3 gpio2 digital reserved, event indicator pin. a microcontroller can enter command mode and poll the state register using the q action command output high 4 aio0 bidirectional analog programmable input/output line i/o downloaded from: http:///
? 2015 microchip technology inc. ds70005120a-page 5 rn52 5 gpio4 digital factory reset mode. to reset the module to the factory defaults, gpio4 should be high on power-up and then toggle low, high, low, high with a 1 second wait between the transitions. during runtime, the module will enter voice com- mand mode if this pin is driven low. reserved. not available for reconfiguring as a general purpose io pin. input low 6 gpio5 bidirectional with program- mable strength internal pull-up/down programmable i/o i/o high 7 gpio12 bidirectional with program- mable strength internal pull-up/down programmable i/o i/o high 8 gpio13 bidirectional with program- mable strength internal pull-up/down programmable i/o i/o high 9 gpio11 bidirectional with program- mable strength internal pull-up/down programmable i/o i/o high 10 gpio10 bidirectional with program- mable strength internal pull-up/down programmable i/o i/o high 11 gpio9 digital when you drive this signal low, the modules uart goes into command mode. if this signal is asserted high, the uart is in data mode. reserved input high 12 usbd- bidirectional usb data minus i/o 13 usbd+ bidirectional usb data plus with selectable internal 1.5 kohm pull-up resistor i/o 14 uart_rts cmos output, tri-state, with weak internal pull-up uart request to send active low output 15 uart_cts cmos input with weak internal pull-down uart clear to send active low input 16 uart_tx cmos output, tri-state, with weak internal pull-up uart data output output 17 uart_rx cmos input with weak internal pull-down uart data input input 18 gnd ground ground 19 gpio7 bidirectional with program- mable strength internal pull-up/down driving this pin low sets the uart baud rate to 9,600. by default, the pin is high with a baud rate of 115,200 i/o high 20 gpio6 bidirectional with program- mable strength internal pull-up/down programmable i/o i/o high 21 pwren analog pull high to power up rn52 input low 22 vdd 3.3-v power input 3.3v power input 23 pcm_in cmos input, with weak internal pull down synchronous data input, configurable for spdif_in or sd_in (i 2 s) input table 1-4: pin description (1) (sheet 2 of 3) pin symbol i/o type description directio n defau lt downloaded from: http:///
rn52 ds70005120a-page 6 ? 2015 microchip technology inc. 24 pcm_out cmos output, with weak internal pull down synchronous data output, configurable for spdif_out or sd_out (i 2 s) output 25 pcm_sync bidirectional with weak internal pull down synchronous data sync; ws (i 2 s) output 26 pcm_clk cmos input, with weak internal pull down synchronous data clock; sck (i 2 s) output 27 gnd ground ground 28 spi_ss cmos input with weak internal pull-up chip select for synchronous serial interface active low input 29 spi_miso cmos output, tri-state, with weak internal pull-down serial peripheral interface (spi) output output 30 spi_clk input with weak internal pull-down spi clock input 31 spi_mosi cmos input, with weak internal pull-down spi input input 32 led1 open drain output drives an led. for the rn-52-ek board, this signal drives the red led output 33 led0 open drain output drives an led. for the rn-52-ek board, this signal drives the blue led output 34 mic_bias analog microphone bias output 35 mic_l+ analog microphone input positive, left input 36 mic_r+ analog microphone input positive, right input 37 mic_l- analog microphone input negative, left input 38 mic_r- analog microphone input negative, right input 39 agnd analog ground connection for audio 40 spk_r- analog speaker output negative (right side) output 41 spk_l- analog speaker output negative (left side) output 42 spk_r+ analog speaker output positive (right side) output 43 spk_l+ analog speaker output positive (left side) output 44 gnd ground ground 45 gnd ground rf ground 46 gnd ground rf ground 47 gnd ground rf ground 48 gnd ground rf ground 49 gnd ground rf ground 50 gnd ground rf ground note 1: all gpio pins default to input with weak pull-down. 2: refer to the bluetooth audio module command reference users guide (ds50002154) and the rn52src bluetooth audio module command reference users guide (ds50002343) for more information about the behavior of the pin and optional features that can be enabled. table 1-4: pin description (1) (sheet 3 of 3) pin symbol i/o type description directio n defau lt downloaded from: http:///
? 2015 microchip technology inc. ds70005120a-page 7 rn52 1.1 audio interface circuit description the rn52 audio interface circuit consists of: analog audio interface with differential audio inputs and outputs digital audio interface with configurable s/pdif and i 2 s interface (a2dp audio output only) the audio input circuitry has a dual audio input that can be configured as single-ended or fully differential and programmed for microphone or line input. it has an analog and digital programmable gain stage so that it can be optimized for different microphones. see figure 1-5 . 1.1.1 digital audio interface the stereo audio codec interface has a digital audio interface. it supports the i2s and s/pdif interfaces. the rn52 i2s interface is i2s master and provides the bit clock and phase sync clock. the i2s or s/pdif interface can be configured through command console. the typical application interface can be seen in figure 1-4 . the audio resolution supported is 24-bit and the max channel size is 32-bit. the supported sample rates are 8khz, 32khz, 44.1khz and 48khz. the audio resolu- tion and the sample rate can be configured using the uart console command. refer the rn52 command specification for more information. figure 1-4: i2s and spdif connections 1.1.2 analog audio interface the audio input circuitry has a dual audio input that can be configured as single-ended or fully differential and programmed for microphone or line input. it has an analog and digital programmable gain stage so that it can be optimized for different microphones. the micro- phone inputs mic_l+, mic_l-, mic_r+ and mic_r- are shown in figure 1-6 . the audio output circuitry consists of a differential speaker output preceded by a gain stage and a class ab amplifier. the speaker outputs spk_l+, spk_l-, spk_r+ and spk_r- are shown in figure 1-6 . the fully differential architecture in the analog signal path results in low noise sensitivity and good power supply rejection while effectively doubling the signal amplitude. it operates from a 1.5v single power supply and uses a minimum of external components. the typical application interface is shown in figure 1-5 . rn52 i2s master sdox sdix sckx ssx dac/adc/codec/dsp i2s slave sdix sdox sckx ssx serial clock frame sync. pulse rn52 s/pdif gnd s/pdif out s/pdif in vdd dac/adc/codec/dsp s/pdif gnd s/pdif in s/pdif out vdd in downloaded from: http:///
rn52 ds70005120a-page 8 ? 2015 microchip technology inc. figure 1-5: rn52 audio in terface block diagram figure 1-6: stereo codec audio input/output stages spk_l+ spk_l- spk_r+ spk_r- mic_l+ mic_l- mic_r+ mic_r- mic_bias rn52 audio pa mic & bias system mainboard s/pdif & i 2 s spk_l+ spk_l- mic_l+ mic_l- input amplier output amplier spk_r+ spk_r- mic_r+ mic_r- input amplier output amplier ? -adc ? -adc lp filter lp filter digital circuitry dac dac rn52 downloaded from: http:///
? 2015 microchip technology inc. ds70005120a-page 9 rn52 1.1.3 analog-to-digital converter (adc) the adc consists of two second-order sigma delta (sd) converters, resulting in two separate channels with identical functionality. each adc supports the following sample rates: 8 khz 16 khz 32 khz 44.1 khz 48 khz the adc analog amplifier is a two-stage amplifier. the first stage selects the correct gain for either micro- phone or line input. see figure 1-7 . figure 1-7: adc analog amplifier block diagram 1.1.4 digital-to-analog converter (dac) the dac consists of two third-order sd converters, resulting in two separate channels with identical func- tionality. each dac supports the following sample rates: 8 khz 16 khz 32 khz 44.1 khz 48 khz 1.1.4.1 speaker output the speaker output is capable of driving a speaker with an impedance of at least 8 ohms directly. the overall gain of the speaker output is approximately -21 db to 0 db in 1.5 db steps. 1.1.4.2 microphone input the rn52 audio input is intended for use from 1 a at 94 db spl to about 10 a at 94 db spl, which requires microphones with sensitivity between C40 and C60 dbv. the rn52 microphone mode input impedance is typically 6 kohm. the line mode input impedance is typ- ically between 6 kohm and 30 kohm. the overall gain of the microphone input is approximately -3 db to 42 db in 1.5 db steps. mic_bias requires a minimum load to maintain regulation. mic_bias maintains regulation within 0.199 and 1.229 ma. therefore, if you use a microphone with specifications below these limits, the microphone output must be pre-loaded with a large value resistor to ground. ? + ? + p n gain 0:7 line mode/microphone mode bypass or 24-db gain -3 to 18 db gain p n downloaded from: http:///
rn52 ds70005120a-page 10 ? 2015 microchip technology inc. table 1-5: digital to analog converter parameter conditions min typ max unit resolution 16 bits ouput sample rate, f sample 8 4 8 k h z signal to noise ratio, snr f in = 1 khz b/w = 20 hz 20 khz a-weighted thd+n < 0.01% 0dbfs signal load = 100 k ? f sample 9 5d b 8 khz 95 db 16 khz 95 db 32 khz 95 db 44.1 khz 95 db 48 khz 95 db analog gain analog gain resolution = 3 db 0 -21 db output voltage full-scale swing (differential) 750 mv rms allowed load resistive 16(8) o.c. ? capacitive 500 pf thd + n 100 k ? load 0.01 % thd + n 16 k ? load 0.1 % snr (load = 16 ? , 0 dbfs input relative to digital silence) 95 db table 1-6: analog to digital converter parameter conditions min typ max unit resolution 16 bits input sample rate, f sample 8 44.1 khz signal to noise ratio, snr f in = 1 khz b/w = 20 hz 20 khz a-weighted thd+n < 1% 150 mv pk-pk input f sample 8 khz 79 db 16 khz 76 db 32 khz 75 db 44.1 khz 75 db analog gain analog gain resolution = 3 db 42 db input full scale at maximum gain (differential) 4 mv rms input full scale at minimum gain (differential) 800 mv rms 3 db bandwidth 20 khz microphone mode input impedance 6.0 k ? thd + n (microphone input) @ 30 mv rms input 0.04 % downloaded from: http:///
? 2015 microchip technology inc. ds70005120a-page 11 rn52 1.2 general purpose io (gpio) ports user programmable bidirectional gpio ports are pro- vided. the gpio ports can be used as typical digital io ports. the directionality of the gpios can be config- ured through console commands. the gpios can also be read or asserted using the console commands. the digital input and output voltage levels are provided in table 1-7 . table 1-7: digital input and output voltage levels voltage information min typ max unit input voltage levels v il input logic level low -0.3 0.25 x v dd v v ih input logic level high 0.625 x v dd v dd + 0.3 v output voltage levels v ol output logic level low, iol = 4.0 ma 0 0.125 v v oh output logic level high, ioh = -4.0 ma 0.75 x v dd v dd v downloaded from: http:///
rn52 ds70005120a-page 12 ? 2015 microchip technology inc. 1.3 power consumption the power consumption of the rn52 for various connection states are provided in figure 1-8 . table 1-8: powe r consumption role connection audio packet type description current (ma) stand-by active connection 0.07 page scan interval = 1280 ms 0.5 inquiry and page scan inquiry scan = 1280 ms page scan = 1280 ms 0.88 rn52 a2dp acl no traffic 15 rn52 a2dp acl audio stream rx 21 rn52 a2dp acl sniff = 40 ms 1.7 rn52 a2dp acl sniff = 1280 ms 0.26 rn52 hfp esco-ev3 26 rn52 hfp esco-ev3 setting s1 27 rn52 hfp esco-2ev3 setting s2 28 rn52 hfp esco-2ev3 setting s3 25 rn52 hfp esco-ev5 22 rn52 hfp sco-hv1 42 rn52 hfp sco-hv3 28 rn52 hfp sco-hv3 sniff = 30 ms 22 rn52src a2dp acl no traffic 4.4 rn52src a2dp acl audio stream tx 9.2 rn52src a2dp acl sniff = 40 ms 1.9 rn52src a2dp acl sniff = 1280 ms 0.2 rn52src hfp esco-ev3 24 rn52src hfp esco-ev3 setting s1 23 rn52src hfp esco-2ev3 setting s2 22 rn52src hfp esco-2ev3 setting s3 17 rn52src hfp esco-ev5 17 rn52src hfp sco-hv1 42 rn52src hfp sco-hv3 23 rn52src hfp sco-hv3 sniff = 30 ms 22 downloaded from: http:///
? 2015 microchip technology inc. ds70005120a-page 13 rn52 2.0 applications the following sections provide information on design- ing with the rn52 module, including restoring factory defaults, using the led interface, minimizing radio interference, solder reflow profile, typical application, etc. 2.1 minimizing radio interference when laying out the host pcb for the rn52 module, the areas under the antenna and shielding connections should not have surface traces, ground planes or exposed via (see figure 2-1 ). for optimal radio perfor- mance, the rn52 modules antenna end should protrude at least 31 mm beyond any metal enclosure. figure 2-2 shows examples of good, bad, and acceptable positioning of the rn52 on the host pcb. figure 2-1: minimizing radio interference figure 2-2: pcb example layout 21.4 mm 4.6 mm (top view) dimensions are in millimeters keep area around antenna(approximately 31 mm) clear of metallic structures for best performance 31 mm 31 mm edge of ground plain rn52 rn52 rn52 rn52 good acceptable acceptable bad downloaded from: http:///
rn52 ds70005120a-page 14 ? 2015 microchip technology inc. 2.2 led interface the rn52 includes two pads dedicated to driving the led indicators. the firmware can control both termi- nals, and the battery charger can set led0. the termi- nals are open-drain outputs; therefore, the led must be connected from a positive supply rail to the pad in series with a current limiting resistor. you should oper- ate the led pad (led0 or led1 pins) with a pad volt- age below 0.5v. in this case, the pad can be thought of as a resistor, ron. the resistance, together with the external series resistor, sets the current, i led , in the led. the current is also dependent on the external voltage, v dd , as shown in figure 2-3 . figure 2-3: led interface the leds can be used to indicate the modules con- nection status. table 2-1 describes the led functions. 2.3 device firmware updates the module has a device firmware update (dfu) mode in which you use the usb interface to update the firmware. implementing the dfu feature is highly rec- ommended because firmware updates offer new fea- tures and enhance the modules functionality. follow the reference design shown in figure 2-7 to support this mode. figure 2-4: usb dfu port and gpio3 schematic 2.4 restore factory defaults with gpio4 the gpio4 pin should be connected to a switch, jumper or resistor so it can be accessed. this pin is used to reset the module to its factory default settings, which is critical in situations where the module has been misconfigured. to reset the module to the factory defaults, gpio4 should be high on power-up and then toggle low, high, low, high with a 1 second wait between the transitions. 2.5 power control and regulation the vdd pin controls the power to the rn52 module. the vdd pin should be used to turn the rn52 module on and off, if the hardware power cycle feature is desired. the pwren pin provides the power enable functional- ity. this pin is internally connected as an enable pin to the voltage regulator and can only be used to turn on the voltage regulator after vdd power is provided to the rn52 module. the pwren pin cannot be used to turn the voltage regulator off. on later versions of the firmware, the rn52 also pro- vides a module reset gpio pin, which resets the rn52 module when asserted high, and also provides a con- sole command which can be used to perform a module reset. table 2-1: status led functions blue led red led description flashing flashing the rn52 module is discoverable. off flashing the module is connected. flashing off the module is connectable. note: a 47 k ? pull-down resistor (r2 in figure 2-4 ) is required on gpio3 even if you do not use the usb for dfu. vdd led forward voltage, v f resistor voltage drop, v r pad voltage, v pad r led | led led0 or led1 r on = 20 gnd 5 d+ 3 d- 2 vbus 1 mtab 6 j2 vbus(3.3v) usbd-usbd+ 47k r2 22k r1 gpio3 mbr120 d1 10nf c4 usb mini b connector (jae dx2r005hn2e700) downloaded from: http:///
? 2015 microchip technology inc. ds70005120a-page 15 rn52 2.6 solder reflow profile the lead-free solder reflow temperature and times are: temperature C 230 c, 60 seconds maximum, peak 245 c maximum preheat temperature C 165 15 c, 90 to 120 seconds time C single pass, one time to reflow solder the module onto a pcb, use an rohs- compliant solder paste equivalent to nihon almit paste or omnix om-310 solder paste from alpha met- als. see tab l e 2 - 2 . figure 2-5 and figure 2-6 show the solder reflow temperature profiles. figure 2-5: solder reflow temperature profile note: use no-clean flux and do not water wash. table 2-2: paste so lder recommendations manufacturer part number metal composition liquidus temperature alpha metals http://www.alphametals.com omnix om-310 sac305 (96.5% sn, 3% ag, 0.5% cu) ~220c nihon almit co. ltd http://almit.co.jp lfm-70w inp 88% sn, 3.5% ag, 0.5% bi, 8% in ~215c downloaded from: http:///
rn52 ds70005120a-page 16 ? 2015 microchip technology inc. figure 2-6: solder reflow curve downloaded from: http:///
? 2015 microchip technology inc. ds70005120a-page 17 rn52 2.7 typical application schematic figure 2-7 shows a typical application circuit with ldo, stereo audio/microphone pa, usb/uart, avrcp switches and led0/led1. figure 2-7: typical appl ication circuit for a2dp audio streaming and avrcp remote control vbus vbus reset 18 3v 3out 16 usbdp 14 usbdm 15 gnd 17 cbus2 10 cbus1 21 vccio 1 cbus3 11 cbus4 9 cbus0 22 g n d 20 ri 3 dcd 7 dsr 6 dtr 31 cts 8 rts 32 rxd 2 txd 30 vcc 19 osci 27 osco 28 agnd 2 4 test 26 gnd 4 thpad 33 ft232rq u1 gnd 5 d+ 3 d- 2 vbus 1 mtab 6 usb mini b / csr uart j1 1 2 3 4 5 6 j4 spi master spi _mi so spi _mosi spi _sck spi _ss 3.3v uart_rxuart_tx uart_ctsuart_rts vin 1 gnd 2 vout 3 tab 4 tc1262- 3.3v u2 1uf c6 1uf c7 vbus 3.3v 100nf c3 100nf c1 100nf c2 blue led d3 red led d2 s2 vol down s3 play / pause s6 next s1 prev s4 vol up btn_vol up btn_vol down btn_next btn_pl ay btn_previ ous 47r r8 470 r9 3.3v gnd 5 d+ 3 d- 2 vbus 1 mtab 6 usb mini b / rsvd usb j2 gpio4 5 gpio5 6 gpio12 7 gpio13 8 gpio11 9 gpio10 10 gpio9 11 usbd- 12 usbd+ 13 uart_rts 14 uart_cts 15 uart_tx 16 pcm_cl k 26 spi _ss 28 spi_miso 29 spi_sck 30 pcm_in 23 vdd 22 led0 33 mic_bias 34 mic_l+ 35 mic_r+ 36 mic_l- 37 mic_r- 38 pcm_out 24 gpio7 19 pcm_sy nc 25 spi_mosi 31 led1 32 pwr en 21 gpio6 20 uart_rx 17 ai o0 4 gpio2 3 agnd 39 spkr_r- 40 gnd 1 gnd 18 gnd 27 gnd 44 gpio3 2 spkr_l- 41 gnd 50 gnd 49 gnd 48 gnd 47 gnd 46 gnd 45 spkr_r+ 42 spkr_l + 43 m1rn52 module pi o7 pi o6 led0 led1 led0 led1 vbus usbd-usbd+ spi _mi so spi _mosi spi _sck spi _ss 3.3v spkr_r- spkr_l - spkr_r+ spkr_l + s5 wake 3.3v pcm_cl k pcm_sync pcm_out pcm_i n spkr_r- spkr_l - spkr_r+ spkr_l + vbus 47k r2 22k r1 pi o3 1uf c21 1uf c22 1uf c13 1uf c14 1uf c12 2k2 r7 2k2 r6 47nf c847nf c10 47nf c11 47nf c9 mi c_l mi c_r 1uf c18 22k r17 22k r1547k r11 22k r13 47k r1447k r10 47k r16 22k r12 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 j3ext connector pcm_cl k pcm_sync pcm_out pcm_i n 3.3v in1+ 3 in1- 2 vo2 9 bypass 4 in2- 8 in2+ 7 shutdown 6 gnd 5 vdd 10 vo1 1 pad 11 u4tpa6112 100uf c23 100uf c20 100uf c17 100uf c19 10uf c15 100nf c16 mbr120 d1 10nf c4 vbus pi o9 3.3v btn_voldown btn_previ ous btn_play btn_next btn_volup pi o2 pi o6 pi o7 1 2 j8 mi cl 1 2 j6 mi cr mi c_l mi c_r 1 2 j11battery vbus 1 2 3 4 5 6 7 8 9 10 11 12 j10 1 2 3 4 5 6 7 8 9 10 j7 pi o4 pwren pwren spkr_r- spkr_l - spkr_r+ spkr_l + mi c_bi as mi c_l + mi c_r+ mi c_l - mi c_r- mi c_l + mi c_r+ mi c_l - mi c_r- mi c_bi as ai o0 uart_rxuart_tx uart_cts uart_rts usbd- usbd+ btn_vol up btn_vol down btn_next btn_play btn_previ ous pi o3 pi o9 pi o2 pi o4 ai o0 mi c_l + mi c_r+ mi c_l - mi c_r- mi c_bi as 3 5 4 2 1 j5 mic 3 5 4 2 1 j9headphones 2k2 r70 uart_rx uart_tx device firmware update downloaded from: http:///
rn52 ds70005120a-page 18 ? 2015 microchip technology inc. 3.0 bluetooth sig certification the rn52 bluetooth audio module has been certified by bluetooth sig and the qualified design id is 58578 and the declaration id is d023391. the qualified design listing certificate can be accessed on www.microchip.com/rn52 or at the bluetooth sig list- ings website. 4.0 regulatory approval this section outlines the regulatory information for the rn52 module for the following countries: united states canada europe australia new zealand 4.1 united states the rn52 module has received federal communica- tions commission (fcc) cfr47 telecommunications, part 15 subpart c intentional radiators modular approval in accordance with part 15.212 modular transmitter approval. modular approval allows the end user to integrate the rn52 module into a finished prod- uct without obtaining subsequent and separate fcc approvals for intentional radiation, provided no changes or modifications are made to the module cir- cuitry. changes or modifications could void the users authority to operate the equipment. the end user must comply with all of the instructions provided by the grantee, which indicate installation and/or operating conditions necessary for compliance. the finished product is required to comply with all appli- cable fcc equipment authorizations regulations, requirements and equipment functions not associated with the transmitter module portion. for example, com- pliance must be demonstrated to regulations for other transmitter components within the host product; to requirements for unintentional radiators (part 15 sub- part b unintentional radiators), such as digital devices, computer peripherals, radio receivers, etc.; and to additional authorization requirements for the non-transmitter functions on the transmitter module (i.e., verification, or declaration of conformity) (e.g., transmitter modules may also contain digital logic func- tions) as appropriate. 4.1.1 labeling and user information requirements the rn52 module has been labeled with its own fcc id number, and if the fcc id is not visible when the module is installed inside another device, then the out- side of the finished product into which the module is installed must also display a label referring to the enclosed module. this exterior label can use wording as follows: a users manual for the product should include the following statement: additional information on labeling and user information requirements for part 15 devices can be found in kdb publication 784748 available at the fcc office of engi- neering and technology (oet) laboratory division knowledge database (kdb) http://apps.fcc.gov/oetcf/ kdb/index.cfm . 4.1.2 rf exposure all transmitters regulated by fcc must comply with rf exposure requirements. oet bulletin 65, evaluating compliance with fcc guidelines for human exposure to radio frequency electromagnetic fields, provides assistance in determining whether proposed or existing transmitting facilities, operations or devices comply with limits for human exposure to radio frequency contains transmitter module fcc id: t9j-rn52 or contains fcc id: t9j-rn52 this device complies with part 15 of the fcc rules. operation is subject to the following two conditions: (1) this device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation this equipment has been tested and found to comply with the limits for a class b digital device, pursuant to part 15 of the fcc rules. these limits are designed to provide reasonable protection against harmful interference in a residential installation. this equip- ment generates, uses and can radiate radio fre- quency energy, and if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. however, there is no guarantee that interference will not occur in a particular installation. if this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the follow- ing measures: reorient or relocate the receiving antenna. increase the separation between the equipment and receiver. connect the equipment into an outlet on a circuit different from that to which the receiver is con- nected. consult the dealer or an experienced radio/tv technician for help. downloaded from: http:///
? 2015 microchip technology inc. ds70005120a-page 19 rn52 (rf) fields adopted by the federal communications commission (fcc). the bulletin offers guidelines and suggestions for evaluating compliance. if appropriate, compliance with exposure guidelines for mobile and unlicensed devices can be accomplished by the use of warning labels and by providing users with information concerning minimum separation dis- tances from transmitting structures and proper installa- tion of antennas. the following statement must be included as a cau- tion statement in manuals and oem products to alert users of fcc rf exposure compliance: if the rn52 module is used in a portable application (i.e., the antenna is less than 20 cm from persons during operation), the integrator is responsible for per- forming specific absorption rate (sar) testing in accordance with fcc rules 2.1091. 4.1.3 helpful web sites federal communications commission (fcc): http://www.fcc.gov fcc office of engineering and technology (oet) laboratory division knowledge database (kdb): http://apps.fcc.gov/oetcf/kdb/index.cfm 4.2 canada the rn52 module has been certified for use in canada under industry canada (ic) radio standards specifica- tion (rss) rss-210 and rssgen. modular approval permits the installation of a module in a host device without the need to recertify the device. 4.2.1 labeling and user information requirements labeling requirements for the host device (from sec- tion 3.2.1, rss-gen, issue 3, december 2010): the host device shall be properly labeled to identify the module within the host device. the industry canada certification label of a module shall be clearly visible at all times when installed in the host device, otherwise the host device must be labeled to display the industry canada certification number of the module, preceded by the words contains transmit- ter module, or the word contains, or similar wording expressing the same meaning, as follows: user manual notice for license-exempt radio appara- tus (from section 7.1.3 rss-gen, issue 3, december 2010): user manuals for license-exempt radio appara- tus shall contain the following or equivalent notice in a conspicuous location in the user manual or alternatively on the device or both: transmitter antenna (from section 7.1.2 rss-gen, issue 3, december 2010): user manuals for transmit- ters shall display the following notice in a conspicuous location: the above notice may be affixed to the device instead of displayed in the user manual. 4.2.2 helpful web sites industry canada: http://www.ic.gc.ca/ to satisfy fcc rf exposure requirements for mobile and base station transmission devices, a separation distance of 20 cm or more should be maintained between the antenna of this device and persons during operation. to ensure compliance, operation at closer than this distance is not recommended. the antenna(s) used for this transmitter must not be co-located or operating in conjunction with any other antenna or transmitter. contains transmitter module ic: 6514a-rn52 this device complies with industry canada license- exempt rss standard(s). operation is subject to the following two conditions: (1) this device may not cause interference, and (2) this device must accept any interference, including interference that may cause undesired operation of the device. le prsent appareil est conforme aux cnr d'indus- trie canada applicables aux appareils radio exempts de licence. l'exploitation est autorise aux deux con- ditions suivantes: (1) l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit accepter tout brouillage radiolectrique subi, mme si le brouillage est susceptible d'en compromettre le fonctionnement. under industry canada regulations, this radio trans- mitter may only operate using an antenna of a type and maximum (or lesser) gain approved for the trans- mitter by industry canada. to reduce potential radio interference to other users, the antenna type and its gain should be so chosen that the equivalent isotrop- ically radiated power (e.i.r.p.) is not more than that necessary for successful communication. conformment la rglementation d'industrie can- ada, le prsent metteur radio peut fonctionner avec une antenne d'un type et d'un gain maximal (ou infrieur) approuv pour l'metteur par industrie can- ada. dans le but de rduire les risques de brouillage radiolectrique l'intention des autres utilisateurs, il faut choisir le type d'antenne et son gain de sorte que la puissance isotrope rayonne quivalente (p.i.r.e.) ne dpasse pas l'intensit ncessaire l'tablissement d'une communication satisfaisante. downloaded from: http:///
rn52 ds70005120a-page 20 ? 2015 microchip technology inc. 4.3 europe the rn52 module is an r&tte directive assessed radio module that is ce marked and has been manufactured and tested with the intention of being integrated into a final product. the rn52 module has been tested to r&tte directive 1999/5/ec essential requirements for health and safety (article (3.1(a)), electromagnetic compatibility (emc) (article 3.1(b)), and radio (article 3.2) and are summarized in table 3-1: european compliance test- ing. a notified body opinion has also been issued. all test reports are available on the rn52 product web page at http://www.microchip.com . the r&tte compliance association provides guidance on modular devices in document technical guidance note 01 available at http://www.rtteca.com/ html/download_area.htm . 4.3.1 labeling and user information requirements the label on the final product which contains the rn52 module must follow ce marking requirements. the r&tte compliance association technical guidance note 01 provides guidance on final product ce marking. 4.3.2 antenna requirements from r&tte compliance association document technical guidance note 01: provided the integrator installing an assessed radio module with an integral or specific antenna and installed in conformance with the radio mod- ule manufacturers installation instructions requires no further evaluation under article 3.2 of the r&tte directive and does not require fur- ther involvement of an r&tte directive notified body for the final product. [section 2.2.4] 4.3.3 helpful web sites a document that can be used as a starting point in understanding the use of short range devices (srd) in europe is the european radio communications committee (erc) recommendation 70-03 e, which can be downloaded from the european radio communications office (ero) at: http://www.ero.dk/ . additional helpful web sites are: radio and telecommunications terminal equipment (r&tte): http://ec.europa.eu/enterprise/rtte/index_en.htm european conference of postal and telecommunications administrations (cept): http://www.cept.org european telecommunications standards institute (etsi): http://www.etsi.org european radio communications office (ero): http://www.ero.dk the radio and telecommunications terminal equipment compliance association (r&tte ca): http://www.rtteca.com/ note: to maintain conformance to the testing listed in table 4-1 , the module shall be installed in accordance with the installa- tion instructions in this data sheet and shall not be modified. when integrating a radio module into a completed product the integrator becomes the manufacturer of the final product and is therefore responsible for demonstrating compliance of the final product with the essential requirements of the r&tte directive. table 4-1: european compliance testing certification standards article laboratory report number date safety en 60950-1:2006+a11:2009+a1:2010 (3.1(a)) worldwide testing services (taiwan) co., ltd. w6m21301-13004-l 2/23/2013 health en 50371:2002-03 w6m21301-13004-50371 5/31/2013 emc en 301 489-1 v1.8.1 (2008-04) (3.1(b)) w6m21301-13004-e-16 2/7/2013 en 301 489-17 v2.1.1 (2009-05) radio en 300 328 v1.7.1 (2006-10) (3.2) w6m21301-13004-t-45 5/31/2013 notified body opinion eurofins product service gmbh u9m-1304-2756-c-v01 6/13/2013 downloaded from: http:///
? 2015 microchip technology inc. ds70005120a-page 21 rn52 4.4 australia the australia radio regulations do not provide a modu- lar approval policy similar to the united states (fcc) and canada (ic). however, rn52 module rf transmit- ter test reports can be used in part to demonstrate com- pliance in accordance with acma radio communications short range devices standard 2004 (the short range devices standard calls up the as/nzs 4268:2008 industry standard). the rn52 module test reports can be used as part of the product certification and compliance folder. for more informa- tion on the rf transmitter test reports, contact microchip technology australia sales office. to meet overall australian final product compliance, the developer must construct a compliance folder contain- ing all relevant compliance test reports, e.g. rf, emc, electrical safety and doc (declaration of conformity), etc. it is the responsibility of the integrator to know what is required in the compliance folder for acma compli- ance. all test reports are available on the rn52 product web page at http://www.microchip.com . for more infor- mation on australia compliance, refer to the australian communications and media authority web site: http://www.acma.gov.au/ . 4.4.1 helpful web sites the australian communications and media authority: www.acma.gov.au/ . 4.5 new zealand the new zealand radio regulations do not provide a modular approval policy similar to the united states (fcc) and canada (ic). however, rn52 module rf transmitter test reports can be used in part to demon- strate compliance against the new zealand general user radio license for short range devices. new zealand radio communications (radio standards) notice 2010 calls up the as / nzs 4268:2008 industry standard. the rn52 module test reports can be used as part of the product certification and compliance folder. all test reports are available on the rn52 prod- uct web page at http://www.microchip.com . for more information on the rf transmitter test reports, contact microchip technology sales office. information on the new zealand short range devices license can be found in the following web links: http://www.rsm.govt.nz/cms/licensees/types-oflicence/ general-user-licences/short-range-devices and http://www.rsm.govt.nz/cms/policy-and-planning/spec- trum-policy-overview/legislation/gazette-notices/prod- uct-compliance/radiocommunications-radiostandards- notice-2010 . to meet overall new zealand final product compliance, the developer must construct a compliance folder con- taining all relevant compliance test reports e.g. rf, emc, electrical safety and doc (declaration of confor- mity) etc. it is the responsibility of the developer to know what is required in the compliance folder for new zealand radio communications. for more information on new zealand compliance, refer to the web site: http://www.rsm.govt.nz/ . 4.5.1 helpful web sites radio spectrum ministry of economic development: http://www.rsm.govt.nz/ . downloaded from: http:///
rn52 ds70005120a-page 22 ? 2015 microchip technology inc. 5.0 ordering information table 5-1 provides ordering information for the rn52 module. go to http://www.microchip.com for current pricing and a list of distributors carrying microchip products. table 5-1: orderi ng information (1) part number description rn52-i/rm standard application firmware (a2dp/avrcp/spp) (master). note 1: for other configurations, contact microchip directly. downloaded from: http:///
? 2015 microchip technology inc. ds70005120a-page 23 rn52 6.0 revision history revision a (september 2015) this replaces roving networks document rn52 bluetooth audio module data sheet, version 1.1r 3/20/13. downloaded from: http:///
rn52 ds70005120a-page 24 ? 2015 microchip technology inc. notes: downloaded from: http:///
? 2015 microchip technology inc. ds70005120a-page 25 information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. it is your responsibility to ensure that your application meets with your specifications. microchip makes no representations or warranties of any kind whether express or implied, written or oral, statutory or otherwise, related to the information, including but not limited to its condition, quality, performance, merchantability or fitness for purpose . microchip disclaims all liability arising from this information and its use. use of microchip devices in life support and/or safety applications is entirely at the buyers risk, and the buyer agrees to defend, indemnify and hold harmless microchip from any and all damages, claims, suits, or expenses resulting from such use. no licenses are conveyed, implicitly or otherwise, under any microchip intellectual property rights unless otherwise stated. trademarks the microchip name and logo, the microchip logo, dspic, flashflex, flexpwr, jukeblox, k ee l oq , k ee l oq logo, kleer, lancheck, medialb, most, most logo, mplab, optolyzer, pic, picstart, pic 32 logo, righttouch, spynic, sst, sst logo, superflash and uni/o are registered trademarks of microchip tec hnology incorporated in the u.s.a. and other countries. the embedded control solutions company and mtouch are registered trademarks of microchip technology incorporated in the u.s.a. analog-for-the-digital age, bodycom, chipkit, chipkit logo, codeguard, dspicdem, dspicdem.net, ecan, in-circuit serial programming, icsp, inter-chip connectivity, kleernet, kleernet logo, miwi, motorbench, mpasm, mpf, mplab certified logo, mplib, mplink, multitrak, netdetach, omniscient code generation, picdem, picdem.net, pickit, pictail, righttouch logo, real ice, sqi, serial quad i/o, total endurance, tsharc, usbcheck, varisense, viewspan, wiperlock, wireless dna, and zena are trademarks of microchip tec hnology incorporated in the u.s.a. and other countries. sqtp is a service mark of microchip technology incorporated in the u.s.a. silicon storage technology is a registered trademark of microchip technology inc. in other countries. gestic is a registered trademark of microchip technology germany ii gmbh & co. kg, a subsidiary of microchip technology inc., in other countries. all other trademarks mentioned herein are property of their respective companies. ? 2015, microchip technology incorporated, printed in the u.s.a., all rights reserved. isbn: 978-1-63277-794-2 note the following details of the code protection feature on microchip devices: microchip products meet the specification cont ained in their particular microchip data sheet. microchip believes that its family of products is one of the most secure families of its kind on the market today, when used i n the intended manner and under normal conditions. there are dishonest and possibly illegal methods used to breach the code protection feature. all of these methods, to our knowledge, require using the microchip products in a manner outside the operating specif ications contained in microchips data sheets. most likely, the person doing so is engaged in theft of intellectual property. microchip is willing to work with the customer who is concerned about the integrity of their code. neither microchip nor any other semiconduc tor manufacturer can guarantee the security of their code. code protection does not mean that we are guaranteeing the product as unbreakable. code protection is constantly evolving. we at microchip are co mmitted to continuously improvin g the code protection features of our products. attempts to break microchips code protection feature may be a violation of the digital millennium copyright act. if such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that act. microchip received iso/ts-16949:2009 certification for its worldwide headquarters, design and wafer fabrication facilities in chandler and tempe, arizona; gresham, oregon and design centers in california and india. the company?s quality system processes and procedures are for its pic ? mcus and dspic ? dscs, k ee l oq ? code hopping devices, serial eeproms, microperipherals, nonvolatile memory an d analog products. in addition, microchip?s quality system for the design and manufacture of development systems is iso 9001:2000 certified. quality management s ystem certified b y dnv == iso/ ts 1 6 9 4 9 == downloaded from: http:///
ds70005120a-page 26 ? 2015 microchip technology inc. americas corporate office 2355 west chandler blvd. chandler, az 85224-6199 tel: 480-792-7200 fax: 480-792-7277 technical support: http://www.microchip.com/ support web address: www.microchip.com atlanta duluth, ga tel: 678-957-9614 fax: 678-957-1455 austin, tx tel: 512-257-3370 boston westborough, ma tel: 774-760-0087 fax: 774-760-0088 chicago itasca, il tel: 630-285-0071 fax: 630-285-0075 cleveland independence, oh tel: 216-447-0464 fax: 216-447-0643 dallas addison, tx tel: 972-818-7423 fax: 972-818-2924 detroit novi, mi tel: 248-848-4000 houston, tx tel: 281-894-5983 indianapolis noblesville, in tel: 317-773-8323 fax: 317-773-5453 los angeles mission viejo, ca tel: 949-462-9523 fax: 949-462-9608 new york, ny tel: 631-435-6000 san jose, ca tel: 408-735-9110 canada - toronto tel: 905-673-0699 fax: 905-673-6509 asia/pacific asia pacific office suites 3707-14, 37th floor tower 6, the gateway harbour city, kowloon hong kong tel: 852-2943-5100 fax: 852-2401-3431 australia - sydney tel: 61-2-9868-6733 fax: 61-2-9868-6755 china - beijing tel: 86-10-8569-7000 fax: 86-10-8528-2104 china - chengdu tel: 86-28-8665-5511 fax: 86-28-8665-7889 china - chongqing tel: 86-23-8980-9588 fax: 86-23-8980-9500 china - dongguan tel: 86-769-8702-9880 china - hangzhou tel: 86-571-8792-8115 fax: 86-571-8792-8116 china - hong kong sar tel: 852-2943-5100 fax: 852-2401-3431 china - nanjing tel: 86-25-8473-2460 fax: 86-25-8473-2470 china - qingdao tel: 86-532-8502-7355 fax: 86-532-8502-7205 china - shanghai tel: 86-21-5407-5533 fax: 86-21-5407-5066 china - shenyang tel: 86-24-2334-2829 fax: 86-24-2334-2393 china - shenzhen tel: 86-755-8864-2200 fax: 86-755-8203-1760 china - wuhan tel: 86-27-5980-5300 fax: 86-27-5980-5118 china - xian tel: 86-29-8833-7252 fax: 86-29-8833-7256 asia/pacific china - xiamen tel: 86-592-2388138 fax: 86-592-2388130 china - zhuhai tel: 86-756-3210040 fax: 86-756-3210049 india - bangalore tel: 91-80-3090-4444 fax: 91-80-3090-4123 india - new delhi tel: 91-11-4160-8631 fax: 91-11-4160-8632 india - pune tel: 91-20-3019-1500 japan - osaka tel: 81-6-6152-7160 fax: 81-6-6152-9310 japan - tokyo tel: 81-3-6880- 3770 fax: 81-3-6880-3771 korea - daegu tel: 82-53-744-4301 fax: 82-53-744-4302 korea - seoul tel: 82-2-554-7200 fax: 82-2-558-5932 or 82-2-558-5934 malaysia - kuala lumpur tel: 60-3-6201-9857 fax: 60-3-6201-9859 malaysia - penang tel: 60-4-227-8870 fax: 60-4-227-4068 philippines - manila tel: 63-2-634-9065 fax: 63-2-634-9069 singapore tel: 65-6334-8870 fax: 65-6334-8850 taiwan - hsin chu tel: 886-3-5778-366 fax: 886-3-5770-955 taiwan - kaohsiung tel: 886-7-213-7828 taiwan - taipei tel: 886-2-2508-8600 fax: 886-2-2508-0102 thailand - bangkok tel: 66-2-694-1351 fax: 66-2-694-1350 europe austria - wels tel: 43-7242-2244-39 fax: 43-7242-2244-393 denmark - copenhagen tel: 45-4450-2828 fax: 45-4485-2829 france - paris tel: 33-1-69-53-63-20 fax: 33-1-69-30-90-79 germany - dusseldorf tel: 49-2129-3766400 germany - karlsruhe tel: 49-721-625370 germany - munich tel: 49-89-627-144-0 fax: 49-89-627-144-44 italy - milan tel: 39-0331-742611 fax: 39-0331-466781 italy - venice tel: 39-049-7625286 netherlands - drunen tel: 31-416-690399 fax: 31-416-690340 poland - warsaw tel: 48-22-3325737 spain - madrid tel: 34-91-708-08-90 fax: 34-91-708-08-91 sweden - stockholm tel: 46-8-5090-4654 uk - wokingham tel: 44-118-921-5800 fax: 44-118-921-5820 worldwide sales and service 07/14/15 downloaded from: http:///

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