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mlx81205/07 390108120502 page 1 of 18 product abstract rev. 4.7 11/2/2015 features ? microcontroller: mlx16 - fx risc cpu 16bit risc cpu with 20mips and power - saving - modes co - processor for fast multiplication and division flash and nvram memory with ecc in - circuit debug and emulation support ? supported bus interfaces: lin interface with integrated lin transceiver supporting lin 2.x, certified lin protocol software provided by melexis in - module programming (flash and nvram) via pin lin using a special melexis fast protocol pwm interface ? motor controller patented algorithms for senso r - less 3 - phase sine and trapezoidal motor control phase voltage integration filter for bemf voltage sensing at lowest speeds position dependent phase inductance sensing via shunt current measurements at stand still and low to medium speeds support of star and delta based motor configurations without the need for cen t e r star point support of 3 - phase switched reluctance motor control ? voltage regulator direct powered from 12v board net with low voltage detection operating voltage vs = 5v to 18v internal volt age regulator with possibility to use external regulator transistor very low standby current, < 50a in sleep mode, wake - up possible via lin or local sources ? pre - driver pre - driver (~27 ? rdson) for 3 n - fet half bridges with programmable inter - lock - delay and slope control for optimal emc and thermal performance during n - fet switching monitoring of drain - source voltages of the n - fets ? periphery full duplex spi, master/slave, double - buffered, programmable speed, dma access. full duplex uart 4 independent 16 bi t timer modules with capture and compare and additional software timer 3 programmable 12 bit pwm units with programmable frequencies 10 bit adc converter (2 s conversion time) and dma access on - chip temperature sensor with 10k accuracy system - clock - indepe ndent fully integrated watchdog 40 mhz clock from internal rc oscillator with pll optional crystal oscillator load dump and brown out interrupt function integrated shunt current amplifier with programmable gain applications the mlx81205/07 are designed to control bldc motors via external fet transistors for applications like oil pumps, water pumps, fuel pumps, blowers, compressors, and positioning actuators.
mlx81205/07 390108120502 page 2 of 18 product abstract rev. 4.7 11/2/2015 tab le of contents 1. family overview and ordering information ................................ ................................ ..... 3 2. functional diagram ................................ ................................ ................................ ......... 5 3. pin description ................................ ................................ ................................ ................ 6 4. electrical characteristics ................................ ................................ ................................ . 7 4.1 operating conditions ................................ ................................ ................................ ................................ ....... 7 4.2 absolute maximum ratings ................................ ................................ ................................ ............................. 7 5. application examples ................................ ................................ ................................ .. 9 5.1 sensor - less bldc motor control on the lin bus or via pwm - interface ................................ .......................... 9 5. 2 sensor - less bldc motor control with lin bus or via pwm interface with reverse ................................ .......... polarity protection in the battery path ................................ ................................ ................................ ............ 11 5.3 sensor based bldc motor control ................................ ................................ ................................ ............... 12 6. mechanical specification ................................ ................................ ............................. 13 6.1 qfn packages ................................ ................................ ................................ ................................ .............. 13 6.1.1. qfn32_wf 5x5 (32 leads) ................................ ................................ ................................ ......................... 13 6.1.2. qfn48_wf 7x7 (48 leads) ................................ ................................ ................................ ......................... 14 6.2 tqfp package (48 leads) ................................ ................................ ................................ ............................. 14 6.3 marking mlx81205/07 ................................ ................................ ................................ ................................ .. 15 7. standard information regarding manufacturability of melexis products .............................. with different soldering processes ................................ ................................ ................. 17 8. disclaimer ................................ ................................ ................................ ..................... 18
mlx81205/07 390108120502 page 3 of 18 product abstract rev. 4.7 11/2/2015 1. family overview and ordering information mlx81205 mlx81207 flash memory [kbyte] 32 32 ram [kbyte] 4 4 nvram [byte] 1 4x128 4x128 package qfn32 qfn48 tqfp48 support of active high side reverse polarity protection no yes current shunt measurement possibility high side high side spi no yes uart yes yes number of general purpose io pins 3 6 support of sensor based bldc motor control no yes bonded pins in package 32 37 pin compatibility ta ble 1 C family overview order code temperature range package delivery remark mlx81205 llw - bad - 000 - re - 40 - 150 c qfn32_wf 5x5 reel qfn with wettable flanks mlx81207 llw - bad - 000 - re - 40 - 150 c qfn48_wf 7x7 reel qfn with wetta ble flanks mlx81207 lpf - bad - 000 - tr - 40 - 150 c tqfp ep 48 7x7 tray mlx81207 lpf - bad - 000 - re - 40 - 150 c tqfp ep 48 7x7 reel table 2 C ordering information 1 one page of 128 byte is only writable in test mode and reserved for melexis calibration and test data
mlx81205/07 390108120502 page 4 of 18 product abstract rev. 4.7 11/2/2015 legend: m l x 8 1 2 x x l l w x x x 0 0 0 r e p r o d u c t n a m e : x x = 0 5 o r 0 7 t e m p e r a t u r e c o d e : l = - 4 0 t o 1 5 0 c p a c k a g e c o d e : l w = q f n _ w f , p f = t q f p e p d e l i v e r y f o r m : r e = r e e l , t r = t r a y o p t i o n c o d e : 0 0 0 = s t a n d a r d f i r m w a r e v e r s i o n : c h a r a c t e r [ a a . . . z z ] s i l i c o n v e r s i o n : c h a r a c t e r [ a . . . z ]
mlx81205/07 390108120502 page 5 of 18 product abstract rev. 4.7 11/2/2015 2. functional diagram figure 1 C block diagram colour legend: black: c ommon for mlx81205 and mlx81207 blue: additional pins or functionality for mlx81207 l i n - p h y s u p p l y r e g u l a t o r a u x . s u p p l y v s v d d d l i n r c - o s c . v d d a r t g g n d d w m o t o r c o n t r o l u n i t h s 2 c p 2 l s 2 v h s 1 c p 1 l s 1 t r e f e r e n c e v o l t a g e v r e f c l k o i o h v l e v e l s h i f t e r x t a l o s c d i v i d e r / p l l o s c 1 o s c 2 v b a t _ s 1 v b a t _ s 2 i o 2 i o 3 i o 4 i o 5 i o 1 u h s 0 c p 0 l s 0 s l o p e c o n t r o l l e d p r e - d r i v e r v d s m o n i t o r g n d a g n d d r v g n d c a p i / o r e g t i 0 t i 1 m e l e x i s i n t e g r a t e d l i n p r o t o c o l b o o t l o a d e r r a m m m u e e p r o m c p u d e b u g g e r f l a s h t e s t c o n t r o l l e r m l x 1 6 - f x c o r e i n t e r r r u p t c o n t r o l l e r c o m m o n t i m e r . . . . . . . . . . . . f m a i n c l o c k i n d e p e n d e n t w a t c h d o g s p i 1 2 b i t p w m m o d u l e 1 2 b i t p w m m o d u l e 1 2 b i t p w m m o d u l e 1 6 b i t t i m e r u n i t s w i t h d o u b l e c a p t u r e c o m p a r e 1 6 b i t t i m e r u n i t s w i t h d o u b l e c a p t u r e c o m p a r e 1 6 b i t t i m e r u n i t s w i t h d o u b l e c a p t u r e c o m p a r e 1 6 b i t t i m e r u n i t s w i t h d o u b l e c a p t u r e c o m p a r e v o l t a g e m o n i t o r t e m p p o r a d c d i v + m u x v s v r e f i s e n s h i s e n s l t e m p v b a t _ s 1 v b a t _ s 2 g n d _ s 1 g n d _ s 2 u v w t p h a s e i n t i o h v i o 1 . . . i o 9 1 0 b i t a d c s l o p e c o n t r o l l e d p r e - d r i v e r v d s m o n i t o r s l o p e c o n t r o l l e d p r e - d r i v e r v d s m o n i t o r s p i u a r t 8 b i t d a c p w m d f m a i n a d c d i g i t a l w a t c h d o g t o
mlx81205/07 390108120502 page 6 of 18 product abstract rev. 4.7 11/2/2015 3. pin description name type function mlx81205 mlx81207 vs p battery supp ly x x rtg o 3.3v external mos gate control x x vdda p 3.3v supply x x vddd p 1.8v regulator output x x gndd gnd digital ground x x gndcap gnd digital ground x gnddrv gnd driver ground x x gnda gnd analogue ground x x lin hvio connection to lin b us or pwm interface x x iohv hvio general purpose io pin x x ti0 i test input, debug interface x x ti1 i test input, debug interface x x to o test output, debug interface x x osc1 i quartz interface input x x osc2 o quartz interface output x x io1 l vio general purpose io pin (low voltage 3.3v) x x io2 lvio general purpose io pin (low voltage 3.3v) x x io3 lvio general purpose io pin (low voltage 3.3v) x io4 lvio general purpose io pin (low voltage 3.3v) x io5 lvio general purpose io pin (low vo ltage 3.3v) x clko hvo switch able 250khz clock output to vref level x t hvi reference input to bemf sensing blocks x x vref p clamped 8v or 12v ref. voltage for bootstrap x x cp2 hvio high side bootstrap capacitor driver 2 x x hs2 hvio n - fet high s ide gate driver 2 x x w hvi phase w input to hs2 buffer and bemf sensing blocks x x ls2 hvo n - fet low side gate driver 2 x x cp1 hvio high side bootstrap capacitor driver 1 x x hs1 hvio n - fet high side gate driver 1 x x v hvi phase v input to hs1 buff er and bemf sensing blocks x x ls1 hvo n - fet low side gate driver 1 x x cp0 hvio high side bootstrap capacitor driver 0 x x hs0 hvio n - fet high side gate driver 0 x x u hvi phase u input to hs0 buffer and bemf sensing blocks x x ls0 hvo n - fet low side gate driver 0 x x vbat_s1 hvi vs high side input for current sensing x x vbat_s2 hvi vs low side input for current sensing x x pin count 32 37 table 3 C pin description mlx81205 / mlx81207
mlx81205/07 390108120502 page 7 of 18 product abstract rev. 4.7 11/2/2015 4. electrical characteristics all voltage s are referenced to ground (gnd). positive currents flow into the ic. the absolute maximum ratings given in table below are limiting values that do not lead to a permanent damage of the device but exceeding any of these limits may do so. long term exposure to limiting values may affect the reliability of the device. reliable operation of the mlx81205/07 is only specified within the limits shown in table 4 . 4.1 operating conditions parameter symbol min max unit ic supply voltage vs 5.0 18 v operating ambient temperature tamb - 40 +125 (+150) 2 c table 4 C operating conditions 4.2 absolute maximum ratings parameter symbol condition min max unit ic supply voltage on pins vs, vbat_s1, vbat_s2 vs t = 2 min - 0.3 2 8 v t < 500 ms 3 45 vs.tr1 iso 7637 - 2 pulse 1 4 vs=13.5v, ta=(23 5)c - 100 v vs.tr2 iso 7637 - 2 pulse 2 4 vs=13.5v, ta=(23 5)c +75 v vs.tr3 iso 7637 - 2 pulses 3a, 3b 4 vs=13.5v, ta=(23 5)c - 150 +100 v vs.tr5 iso 7637 - 2 pulses 5b 4 vs=13.5v, ta=(23 5)c +65 +87 v lin bus vlin t<500ms - 25 40 v vlin.tr1 iso 7637 - 2 pulse 1 5 vs=13.5v, ta=(23 5)c - 100 vlin.tr2 iso 7637 - 2 pulse 2 5 vs=13.5v, ta=(23 5)c +75 vlin.tr3 iso 7637 - 2 pulses 3a, 3b 6 vs=13.5v, ta=(23 5)c - 150 +100 maximum reverse current into any pin 7 - 10 +10 ma maximum sum o f reverse currents into all pins 7 +10 ma dc voltage on lvio pins, osc<2:1> - 0.3 vdda+0.3 v dc voltage on pins hv i/o - 0.3 vs+0.3 v 2 with temperature applications at ta>125c a reduction of chip internal power dissipation by using an external supp ly transistor is m andatory . the extended temperature range is only allowed for a limited period of time, a mission profile has to be agreed by melexis as a mandatory part of the part submission warrant (psw) 3 o nly allowed, if fet drivers are dis abled, i.e. the high - side driver must not be stressed with v(cp) > 45v 4 iso 7637 test pulses are applied to vs via a reverse polarity diode and >22 f blocking capacitor 5 iso 7637 test pulses are applied to lin via a coupling capacitance of 1nf 6 iso 7637 test pulses are applied to lin via a coupling capacitance of 1 00p f 7 excluding pins hs0, hs1, hs2, u, v, w, ls0, ls1, ls2.
mlx81205/07 390108120502 page 8 of 18 product abstract rev. 4.7 11/2/2015 parameter symbol condition min max unit dc voltage on drivers supply pin vref - 0.3 18 v dc voltage on pi n clko - 0.3 vref+0.3 v dc voltage on drivers control pins ls<2:0> - 0.5 8 vref+0.3 v dc voltage on drivers pins cp<2:0> voltage on pins cp<2:0> must not exceed 45v. - 0.3 v + 13 v dc voltage on drivers pins hs<2:0> voltage on pins hs<2:0> m ust not exceed 45v - 0.5 9 10 vs + vref v dc voltage on phases related pins u,v,w voltage on pins u,v,w must not exceed 36v - 0.5 9 10 vs+1.5 v dc voltage on pha ses related pin t voltage on pin t must not exceed 36v - 0.3 vs+1.5 v positive dynamic disturbance on pin vbat_s1 11 vpdd spdd > 2 v/ s 4.5 v esd capability of pin lin to gnd esdbushb human body model 12 - 6 + 6 kv esd capability of pin vs to gnd esdvshb human body model 12 - 4 +4 kv esd capability of any other pins esdhb human body model 12 - 2 +2 kv esd capability ay any pin esdcdm charge device model 13 - 500 +500 v maximum latch C table 5 C absolute maximum ratings 8 during short tr ansient pulses smaller than 1us and while the ls driver is fully connecting the ls pin to gnd (i.e. lsi_n_drv[3:0]=0xf), the voltage on any ls<2:0> pin is allowed: - 1v ls<2:0> - 0.5: if the current flowing out of any ls<2:0> pin does not exceed 75ma. t he sum of all currents flowing out of the ls pins during these conditions must not exceed 150ma 9 during short transient pulses smaller than 1us, the voltage on any hs<2:0> pin and any u,v or w pin is allowed: - 1v hs<2:0>, u,v,w - 0.5: if the curren t flowing out of any pin hs<2:0>, u,v,w does not exceed 50ma 10 during short transient pulses smaller than 1us, the sum of all currents flowing out of pins hs<2:0> and u,v,w with - 1v < hs<2:0>, u,v,w < - 0.5 must not exceed 75ma 11 there might be ripple on the vbat_s1 pin due to parasitic elements in the supply line. positive voltage peaks with a slew rate larger than spdd should be limited to vpdd (see datasheet). this only applies if the high side current sensor is switched on 12 equivalent to discharging a 100pf capacitor through a 1.5k resistor conform to aec - q100 - 002 or esda/jedec jds - 001 13 esd cdm test confirm to aec - q100 - 011 or jedec22 - c101 14 simulated value for low conductance board (jedec)
mlx81205/07 390108120502 page 9 of 18 product abstract rev. 4.7 11/2/2015 5. application examples 15 the following sections show typical applica tion examples 5.1 sensor - less bldc motor control on the lin bus or via pwm - interface the below application example with mlx81205 realizes a sensor - less control of a bldc motor via three external power n - fet half bridges, with only a few external components. the high side n - fet driver is built with a bootstrap output stage. reverse polarity protection of the bridge is realized with an external power n - fet. an external temperature sensor is connected to the 10 bit adc via pin io1. the integrated window watchdog is monitoring application integrity. the communication interface can be either lin or pwm interface. pins lin and iohv can be used as wake - up sources and furthermore pin lin will be also used to program the flash memory. 15 all application examples are principal schematics only . details need to be worked out for each application separately, depending on application requirements
mlx81205/07 390108120502 page 10 of 18 product abstract rev. 4.7 11/2/2015 figure 2 C sensor - less bldc motor control with mlx81205 the motor currents are measured by a shunt resistor in battery path. in case current exceeds the programmed threshold, the bridge can be switched off automatically wit hout software interaction and in addition a software interrupt can be generated. the motor current can also be measured by the 10 bit adc. the patented melexis trusense technology combines two methods to determine the rotor position: - the measurement of the induced bemf voltage at medium and high speeds - the measurement of position depending on coil inductance variations at stand - still and low speeds v s v d d a v b a t m l x 8 1 2 0 5 g n d a g n d d v d d d v r e f c p 0 c p 1 t c p 2 t i 0 t i 1 t o l i n / p w m l i n u v w g n d l s 0 h s 0 u l s 1 h s 1 v v p r o t l s 2 h s 2 w v p r o t o s c 2 o s c 1 i o h v g n d d r v v b a t _ s 2 v b a t _ s 1 v b a t r t g i o 1 v c c 3 v c c 3 u v w l o w s h u n t v p r o t i o 2
mlx81205/07 390108120502 page 11 of 18 product abstract rev. 4.7 11/2/2015 as a result trusense allows operation of the motor in the widest dynamic speed range. the motor can be driven with block, trapezoidal or sine - wave currents. the motor start - up can be made independent of the load conditions according to the application requirements. in this example application the motor star point is not available. it is modelled with extern al resistors from the motor phases and connected to t input. alternatively an artificial ic internal reference point can be chosen as shown in the block diagram of the mlx81205/07 . 5.2 sensor - less bldc motor control with lin b us or via pwm interface with reve rse polarity protection in the battery path in the following sample application mlx81207 has been selected in order to benefit from the external high side reverse polarity protection possibility. all other remarks from the previous application example re main valid. figure 3 C typical sensor - less bldc motor control application example with mlx81207 v b a t m l x 8 1 2 1 0 m l x 8 1 2 1 5 l i n / p w m u v w g n d v p r o t v p r o t s h u n t v c c 3 v c c 3 m l x 8 1 2 0 7 v s v d d a g n d c a p g n d d i o 2 i o 5 i o 3 r t g v r e f c p 0 c p 1 t c p 2 t i 0 t i 1 t o c l k o l i n v b a t _ s 2 v b a t _ s 1 l s 0 h s 0 u l s 1 h s 1 v l s 2 h s 2 w i o 4 o s c 2 o s c 1 i o h v g n d a g n d d r v i o 1 u v w v p r o t v d d d g n d c a p g n d c a p
mlx81205/07 390108120502 page 12 of 18 product abstract rev. 4.7 11/2/2015 5.3 sensor based bldc motor control in sample application below, the chip mlx81207 is driving a bldc motor with 3 hall sensors. an exter nal p - fet is used to generate the 3.3v supply with a higher current capability in order to keep the power dissipation outside of the mlx81207 ic. figure 4 C typical sensor based bldc motor control app lication example with mlx81207 v s m l x 8 1 2 0 7 g n d c a p g n d d v r e f c p 0 c p 1 t c p 2 t i 0 t i 1 t o c l k o g n d v b a t _ s 2 v b a t _ s 1 l s 0 h s 0 u l s 1 h s 1 v v p r o t l s 2 h s 2 w v p r o t v h i g h s h u n t v c c h a l l g n d h a l l 1 h a l l 2 h a l l 3 v d d a r t g i o 2 i o 3 i o h v l i n / p w m l i n i o 1 o s c 2 o s c 1 i o 5 v c c 3 v b a t v c c 3 i o 4 g n d a g n d d r v v c c 3 u v w v p r o t v d d d g n d c a p g n d c a p
mlx81205/07 390108120502 page 13 of 18 product abstract rev. 4.7 11/2/2015 6. mechanical specification 16 6.1 qfn packages figure 5 - qfn package drawing 6.1.1. qfn32 _wf 5x5 (32 leads) symbol 17 a a1 a3 b d d2 e e2 e l tx ty n 18 nd 19 ne 19 min 0.80 0.00 0.20 0.18 5.00 3.50 5.00 3.50 0.50 0.35 0.16 0.10 32 8 8 nom 0.90 0.02 0.25 3.60 3.60 0.40 max 1.00 0.05 0.30 3.70 3.70 0.45 table 6 C qfn32 _wf 5x5 package dimensi ons 16 dimensions and tolerances conform to asme y14.5m - 1994 17 dimensions in millimetres, angles in degrees 18 n is the total number of terminals 19 nd and ne refer to number of terminals on each d and e side respectively
mlx81205/07 390108120502 page 14 of 18 product abstract rev. 4.7 11/2/2015 6.1.2. qfn48 _wf 7x7 (48 leads) symbol 17 a a1 a3 b d d2 e e2 e l tx ty n 18 n d 19 n e 19 min 0.80 0 0.20 0.18 7.00 5.00 7.00 5.00 0.50 0.40 0.165 0.100 48 12 12 nom 0.90 0.02 0.25 5.10 5.10 0.50 max 1.00 0.05 0.30 5.20 5.20 0.60 table 7 C qfn48 _wf 7x7 package dimensions 6.2 tqfp package (48 leads) a a1 a2 b b1 d d1 d2 e e1 e2 e l n ccc ddd min - 0.05 0.95 0.17 0.17 9.00 7.00 5 .00 9.00 7.00 5 .00 0.50 0.45 48 - - nom - - 1.00 0.22 0.20 0.60 - - max 1.2 0 0.15 1.05 0.27 0.23 0.75 0.08 0.08 notes: 1. all dimension ing and tolerances conform to asme y14.5m - 1994, 2. datum plane [ - | - | - ] located at mould parting line and coincident with lead, where lead exists, plastic body at bottom of parting line. 3. datum [a - b] and [ - d - ] to be determined at centreline between lead s where leads exist, plastic body at datum plane [ - | - | - ] 4. to be determined at seating plane [ - c - ] 5. dimensions d1 and e1 do not include mould protrusion. dimensions d1 and e1 do not include mould protrusion. allowable mou ld protrusion is 0.254 mm on d 1 and e1 dimensions. 6. 'n' is the total number of terminals 7. these dimensions to be determined at datum plane [ - | - | - ] 8. package top dimensions are smaller than bottom dimensions and top of package will not overhang bottom of package. 9. dimension b does not include dam bar protrusion, allowable dam bar protrusion shall be 0.08mm total in excess of the "b" dimension at maximum material condition, dam bar cannot be located on the lower radius of the foot. 10. controlling dimension millimetre. 11. maxim um allowable die thickness to be assembled in this package family is 0.38mm 12. this outline conforms to jedec publication 95 registration ms - 026, variation aba, abc & abd. 13. a1 is defined as the distance from the seating plane to the lowest point of th e package body. 14. dimension d2 and e2 represent the size of the exposed pad. the actual dimensions are specified in bonding diagram, and a re independent from die size. 15. exposed pad shall be coplanar with bottom of package within 0.05.
mlx81205/07 390108120502 page 15 of 18 product abstract rev. 4.7 11/2/2015 figure 6 C tqfp 7x7 drawing 6.3 markin g mlx81205/07 figure 7 C marking code m l x 8 1 2 0 7 x z z z z z z y y w w x x 1 l o t n u m b e r f i r m w a r e r e v i s i o n : c h a r a c t e r s [ a a . . . z z ] a s s e m b l y d a t e c o d e : w e e k n u m b e r a s s e m b l y d a t e c o d e : y e a r s i l i c o n r e v i s i o n : c h a r a c t e r [ a . . . z ] 8 1 2 0 5 x z z z z z z y y w w x x 1 l o t n u m b e r f i r m w a r e r e v i s i o n : c h a r a c t e r s [ a a . . . z z ] a s s e m b l y d a t e c o d e : w e e k n u m b e r a s s e m b l y d a t e c o d e : y e a r s i l i c o n r e v i s i o n : c h a r a c t e r [ a . . . z ] exposed pad need best possible contact to ground for exlectrical and thermal reasons
mlx81205/07 390108120502 page 16 of 18 product abstract rev. 4.7 11/2/2015 the exposed pad is connected to ic substrate via conductive glue and must be connected to pc b ground. figure 8 C mlx81205/07 pins i o h v i o 1 r t g g n d d v d d d v d d a v s g n d a l s 2 l s 1 l s 0 g n d d r v v r e f c p 0 h s 0 u c p 1 h s 1 v c p 2 h s 2 w v b a t _ s 1 v b a t _ s 2 t t i 1 t i 0 o s c 2 o s c 1 t o l i n 1 3 2 m l x 8 1 2 0 5 q f n 3 2 o n l y i o 2 i o h v i o 1 i o 2 i o 3 i o 4 i o 5 g n d c a p g n d d v d d d v d d a r t g v s g n d a l s 2 l s 1 l s 0 c l k o g n d d r v v r e f c p 0 h s 0 u c p 1 h s 1 v c p 2 h s 2 w v b a t _ s 1 v b a t _ s 2 t t i 1 t i 0 o s c 2 o s c 1 t o l i n 1 4 8 m l x 8 1 2 0 7 t q f p 4 8 n . c . n . c . n . c . n . c . n . c . n . c . n . c . n . c . n . c . n . c . n . c . i o h v i o 1 i o 2 i o 3 i o 4 i o 5 g n d d v d d d v d d a r t g v s g n d a l s 2 l s 1 l s 0 c l k o g n d d r v v r e f c p 0 h s 0 u c p 1 h s 1 v c p 2 h s 2 w v b a t _ s 1 v b a t _ s 2 t t i 1 t i 0 o s c 2 o s c 1 t o l i n 1 4 8 m l x 8 1 2 0 7 q f n 4 8 n . c . n . c . n . c . n . c . n . c . n . c . n . c . n . c . n . c . n . c . n . c . g n d c a p
mlx81205/07 390108120502 page 17 of 18 product abstract rev. 4.7 11/2/2015 7. standard information regarding manufacturability of melexis products with different soldering processes our products are classified and qualifi ed regarding soldering technology, solder ability and moisture sensitivity level according to following test methods: reflow soldering smds ( s urface m ount d evices) ipc/jedec j - std - 020 moisture/reflow sensitivity classification for non - hermetic solid state surface mount devices (classification reflow profiles according to table 5 - 2) eia/jedec jesd22 - a113 preconditioning of non - hermetic surface mount devices prior to reliability testing (reflow profiles according to table 2) wave soldering smds ( s urface m oun t d evices) and thds ( t hrough h ole d evices) en60749 - 20 resistance of plastic - encapsulated smds to combined effect of moisture and soldering heat eia/jedec jesd22 - b106 and en60749 - 15 resistance to soldering temperature for through - hole mounted devices iron soldering thds ( t hrough h ole d evices) en60749 - 15 resistance to soldering temperature for through - hole mounted devices solderability smds ( s urface m ount d evices) and thds ( t hrough h ole d evices) eia/jedec jesd22 - b102 and en60749 - 21 solderability for all so ldering technologies deviating from above mentioned standard conditions (regarding peak temperature, temperature gradient, temperature profile etc) additional classification and qualification tests have to be agreed upon with melexis. the application of wave soldering for smds is allowed only after consulting melexis regarding assurance of adhesive strength between device and board. melexis recommends reviewing on our web site the general guidelines soldering recommendation ( http://www.melexis.com/quality_soldering.aspx ) as well as trim&form recommendations (http://www.melexis.com/assets/trim - and - form - recommendations - 5565.aspx). melexis is contributing to global environmental conservation by promoting lead free sol utions. for more information on qualifications of rohs compliant products (rohs = european directive on the restriction of the use of certain hazardous substances) please visit the quality page on our website: http://www.melexis.com/quality.aspx
mlx81205/07 390108120502 page 18 of 18 product abstract rev. 4.7 11/2/2015 8. disclaimer devices sold by melexis are covered by the warranty and patent indemnification provisions appearing in its term of sale. melexis makes no warranty, express, statutory, implied, or by description regardi ng the information set forth herein or regarding the freedom of the described devices from patent infringement. melexis reserves the right to change specifications and prices at any time and without notice. therefore, prior to designing this product into a system, it is necessary to check with melexis for current information. this product is intended for use in normal commercial applications. applications requiring extended temperature range, unusual environmental requirements, or high reliability applicati ons, such as military, medical life - support or life - sustaining equipment are specifically not recommended without additional processing by melexis for each application. the information furnished by melexis is believed to be correct and accurate. however, melexis shall not be liable to recipient or any third party for any damages, including but not limited to personal injury, property damage, loss of profits, loss of use, interrupt of business or indirect, special incidental or consequential damages, of any kind, in connection with or arising out of the furnishing, performance or use of the technical data herein. no obligation or liability to recipient or any third party shall arise or flow out of melexis rendering of technical or other services. ? 2015 me lexis nv. all rights reserved.

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