100% material declaration data sheet TQG100 pk125 (v1.2.1) october 19, 2006 material declaration data sheet average weight: 0.7 g component substance description cas# or description % of component use in product component weight/ substance weight (in grams) component % of total silicon die 0.03787 5.41% silicon 7440-21-3 100.00 0.03787 die attach material 0.00504 0.72% silver 7440-22-4 78.00 0.0039312 epoxy (ep) trade secret 22.00 0.0011088 mold compound 0.46396 66.28% epoxy resin (ep) trade secret 9.00 0.0417564 phenolic resin trade secret 7.00 0.0324772 carbon black 1333-86-4 0.50 0.0023198 silica 60676-86-0 82.50 0.382767 bismuth 7440-69-9 max 1.00 0.0046396 leadframe 0.17885 25.55% copper 7440-50-8 98.85 0.176793225 chromium 7440-47-3 0.30 0.00053655 tin 7440-31-5 0.25 0.000447125 zinc 7440-66-6 0.60 0.0010731 leadframe plating 0.00455 0.65% silver 7440-22-4 100.00 0.00455 bond wire 0.00357 0.51% gold 7440-57-5 100.00 0.00357 ext. plating 0.00616 0.88% tin 7440-31-5 100.00 0.00616 pk125 (v1.2.1) october 19, 2006 www.xilinx.com 1 ? 2006 xilinx, inc. all rights reserved. a ll xilinx trademarks, registered trademarks, patents, and di sclaimers are as listed a t http://www.xilinx.com/legal.htm . all other trademarks and registered trademarks are the property of their respective owners. all specifications are subject to c hange without notice. xilinx believes this environmental information to be correct, but cannot guarantee its completeness or accuracy as it is based on data received from sources outside our company.
100% material declaration data sheet ? TQG100 2 www.xilinx.com revision history the following table shows the revi sion history for this document. date revision revision 2/09/06 1.0 initial release. 7/10/06 1.1 100% material declaration. 9/28/06 1.2 updated component descriptions. 10/19/06 1.2.1 editorial c hange; corrected typo in substance description. pk125 (v1.2.1) october 19, 2006
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