1. 2. 3. material content data sheet sales product name bfp 520f h6327 issued 20. april 2015 ma# ma001351310 package pg-tsfp-4-1 weight* 1.87 mg construction element material group substances cas# if applicable weight [mg] average mass [%] sum [%] average mass [ppm] sum [ppm] chip non noble metal tin 7440-31-5 0.001 0.03 269 noble metal gold 7440-57-5 0.002 0.10 1041 inorganic material silicon 7440-21-3 0.014 0.77 0.90 7715 9025 leadframe inorganic material silicon 7440-21-3 0.000 0.01 79 non noble metal titanium 7440-32-6 0.001 0.04 395 non noble metal chromium 7440-47-3 0.002 0.12 1184 non noble metal copper 7440-50-8 0.734 39.30 39.47 393028 394686 wire noble metal gold 7440-57-5 0.007 0.35 0.35 3543 3543 encapsulation organic material carbon black 1333-86-4 0.010 0.52 5180 plastics epoxy resin - 0.208 11.14 111376 inorganic material silicondioxide 60676-86-0 0.750 40.15 51.81 401472 518028 leadfinish non noble metal tin 7440-31-5 0.050 2.65 2.65 26527 26527 plating noble metal silver 7440-22-4 0.090 4.82 4.82 48191 48191 *deviation < 10% sum in total: 100.00 1000000 important remarks: infineon technologies ag provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. infineon technologies ag and infineon technologies ag suppliers consider certain information to be proprietary, and thus cas numbers and other limited information may not be available for release. all statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. this product is in compliance with eu directive 2011/65/eu (rohs) and does not use any exemption. company infineon technologies ag address 81726 mnchen internet www.infineon.com
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