june 2015 docid027918 rev 2 1 / 5 for further information contact your local stmicroelectronics sales office www.st.com STWLC03 dual mode qi/pma wireless power receiver data brief features ? up to 7.5 w output power ? qi and/or pma standard communication protocol ? integrated high efficiency synchronous rectifier ? 1 mhz programmable buck converter with input current and input voltage regulation loop ? buck converter efficiency up to 92% ? simplified li - ion/polymer charger function ? 32 - bit, 16 mhz embedded microcontrolle r with 16 kbyte rom and 2 kbyte ram memory ? 2 kbyte nvm memory for customization ? 10 - bit, 8 channel a/d converter ? integrated driver for external supply voltage switch ? four configurable gpios ? integrated 5 v ldo for auxiliary features ? precise voltage and c urrent measurements for fod function ? transmitter presence detection ? integrated driver for external resonant switch ? i 2 c interface ? rx coil ntc protection ? thermal protection ? flip chip 77 bumps (3.12x4.73 mm) applications ? cellular phones ? pdas ? navigation systems ? medical and healthcare instrumentation description the STWLC03 is a high - end wpc and pma compliant wireless power receiver ic. it includes a wireless power receiver, a programmable buck converter with simplified basic li - polymer/li - ion battery charger function and the embedded microcontroller, which allows a very wide range of customization an d different standard supports. the integrated nvm memory stores the customized parameters via jtag or i 2 c interface of the device. thanks to the integrated synchronous rectifier, it achieves high efficiency operations. the buck converter contains the confi gurable soft - start, input current and input voltage regulation loops to optimize the function in a wireless charging enviroment. if the wireless power is not available, the device can be supplied from an external supply and can connect this supply (5 v ada pter/usb) to v out through an external switch. the embedded microcontroller communicates with the host platform through the i 2 c. the device contains blocks for the frequency detection and the driver for the external switch for the resonant frequency change. the package is a csp suitable for very compact applications and it has a quad spi interface with the external flash memory for firmware development purposes. table 1: device s ummary order code package packing STWLC03jr flip chip 77 bumps (3.12x4.73 mm) tape and reel
package information STWLC03 2 / 5 docid027918 rev 2 1 package information in order to meet environmental requirements, st offers these devices in different grades of ecopack ? packages, depending on their level of environmental compliance. ecopack ? speci fications, grade definitions and product status are available at: www.st.com . ecopack ? is an st trademark. 1.1 flip chip 77 bumps (3.12x4.73 mm) package information figure 1 : flip chip 77 bumps (3.12x4.73 mm) package outline
STWLC03 package information docid027918 rev 2 3 / 5 table 2: flip chip 77 bumps (3.12x4.73 mm) package mechanical data dim. mm min. typ. max. a 0.50 0.55 0.60 a1 0.17 0.20 0.23 a2 0.28 0.30 0.32 b 0.23 0.26 0.29 d 4.67 4.70 4.73 d1 4.00 e 3.06 3.09 3.12 e1 2.40 e 0.40 sd 0.20 se 0.20 fd 0.352 fe 0.346 $ 0.05 ccc 0.075 the terminal a1 on the bump side is identified by a distinguishing feature (for instance by a circular "clear area", typically 0.1 mm diameter) and/or a missing bump. the terminal a1 on the backside of the product is identified by a distinguishing feature (for instance by a circular "clear area", typically between 0.1 and 0.5 mm diameter, depending on the die size). figure 2 : flip chip 77 bumps (3.12x4.73 mm) recommended footprint
revision history STWLC03 4 / 5 docid027918 rev 2 2 revision history table 3: document revision history date revision changes 04 - jun - 2015 1 initial release. 05 - jun - 2015 2 updated the title and the description.
STWLC03 docid027918 rev 2 5 / 5 important notice C please read carefully stmicroelectronics nv and its subsidiaries (st) reserve the right to make changes, corrections, enhancements, modifications , and improvements to st products and/or to this document at any time without notice. purchasers should obtain the latest relevant information on st products before placing orders. st products are sold pursuant to sts terms and conditions of sale in place at the time of or der acknowledgement. purchasers are solely responsible for the choice, selection, and use of st products and s t assumes no liability for application assistance or the design of purchasers products. no license, express or implied, to any intellectual property right is granted by st herein. resale of st products with provisions different from the information se t forth herein shall void any warranty granted by st for such product. st and the st logo are trademarks of st. all other product or service names are the property of their respective owners. information in this document supersedes and replaces information previously supplied in any prior versions of this document. ? 2015 stmicroelectronics C all rights reserved
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