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| Datasheet File OCR Text: |
| 0.020 0.508 l2 dimension in millimeters 2.184 min. a s y m b o l nom. 2.286 max. 2.388 max. dimensions in inches 0.086 min. nom. 0.090 0.094 0.005 ----- 0.000 a1 0.000 0.127 ----- 0.045 0.041 0.035 a2 0.889 1.143 1.041 0.035 0.030 0.025 b 0.635 0.889 0.762 0.045 0.033 0.030 b1 0.762 1.143 0.840 0.024 0.020 0.018 c 0.450 0.610 0.508 0.024 0.018 c1 0.450 0.610 0.245 0.240 0.235 d 5.969 6.223 6.096 0.265 0.260 0.250 e 6.350 6.731 6.604 e 2.286 bsc e1 4.572 bsc 0.410 0.395 0.370 h 9.398 10.414 10.033 0.080 0.060 0.050 l 1.270 2.032 1.520 l1 0.050 0.040 0.035 l3 0.889 1.270 1.016 0.090 bsc 0.180 bsc b2 4.953 0.195 5.340 5.461 0.210 0.215 semiconductor, ltd. alpha & omega note 1. package body sizes exclude mold flash and gate burrs. mold flash should be less than 6 mils. 2. dimension l is measured in gauge plane 3. tolerance 0.10 mm unless otherwise specified 4. controlling dimension is millimeter. converted inch dimensions are not necessarily exact. 5. refer to jedec to-252 (aa) unit: mm recommended land pattern 6.25 min. 6.80 min. 6.60 3.00 min. 1.50 min. 2.286 4.572 bsc 0.205 d1 5.210 5.249 5.380 0.207 0.212 d2 0.762 0.030 0.170 e1 4.318 0.070 e2 1.778 4.826 4.901 0.190 0.193 0.040 ----- 0.025 l4 0.635 1.016 ----- 0.115ref. 2.921 ref. 0.508 0.020 0.408 0.608 0.024 0.016 1.678 1.878 0.066 0.074 0.662 0.862 0.026 0.034
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