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tmcs www.vishay.com vishay polytech revision: 26-oct-17 1 document number: 40177 for technical questions, contact: polytech@vishay.com this document is subject to change without notice. the products described herein and this document are subject to specific disclaimers, set forth at www.vishay.com/doc?91000 solid tantalum surface mount chip capacitors, molded case, standard industrial grade performance / electrical characteristics operating temperature: -55 c to +125 c ? (above 85 c, voltage derating is required) capacitance range: 0.1 f to 68 f capacitance tolerance: 10 %, 20 % voltage rating: 4 v dc to 35 v dc features ? suitable for automatic mounting ? excellent frequency characteristics ? excellent impedance characteristics ? terminations: 100 % matte tin ? qualified to eia-717 ? msl level: 1 ? material categorization: ? for definitions of compliance please see www.vishay.com/doc?99912 applications ? industrial ? general purpose available available ordering information tmcs c 1c 106 m tr (2) f type case code dc voltage rating at +85 c capacitance (f) capacitance tolerance packaging polarity (optional) terminal code see ratings and case codes table 0g = 4 v 0j = 7 v 1a = 10 v 1c = 16 v 1d = 20 v 1e = 25 v 1v = 35 v this is expressed in picofarads. the first two digits are the significant figures. the third is the number of zeros to follow. k = 10 % m = 20 % tr = 7" reel, cathodes close to perforation side halogen-free (special order), not applicable for e case f = lead (pb)-free terminations dimensions in inches [millimeters] case code eia size l w h l a a 3216-18 0.126 0.008 [3.2 0.2] 0.063 0.008 [1.6 0.2] 0.063 0.008 [1.6 0.2] 0.028 0.012 [0.7 0.3] 0.047 0.008 [1.2 0.2] b 3528-21 0.138 0.008 [3.5 0.2] 0.110 0.008 [2.8 0.2] 0.075 0.008 [1.9 0.2] 0.030 0.012 [0.8 0.3] 0.087 0.008 [2.2 0.2] c 5832-27 0.228 0.008 [5.8 0.2] 0.126 0.008 [3.2 0.2] 0.100 0.008 [2.5 0.2] 0.051 0.012 [1.3 0.3] 0.087 0.008 [2.2 0.2] e 7343-30 0.287 0.008 [7.3 0.2] 0.169 0.012 [4.3 0.3] 0.112 0.008 [2.8 0.2] 0.051 0.012 [1.3 0.3] 0.094 0.008 [2.4 0.2] anode indication belt mark l h w e ca s e a a w ll a, b, c ca s e a ll
tmcs www.vishay.com vishay polytech revision: 26-oct-17 2 document number: 40177 for technical questions, contact: polytech@vishay.com this document is subject to change without notice. the products described herein and this document are subject to specific disclaimers, set forth at www.vishay.com/doc?91000 note ? marking code repeats every four years in alphabetical order (letter of i, i, o, and o are excluded) ratings and case codes f 4 v 7 v 10 v 16 v 20 v 25 v 35 v 0.10 a 0.15 a 0.22 a 0.33 a 0.47 ab 0.68 ab 1.0 a b 1.5 a b c 2.2 a b c 3.3 a b c 4.7 b c e 6.8 b c e 10 b c e 15 c e 22 c e 33 c e 47 e 68 e marking simplified cap codes, cases a, b capacitance f capacitance code capacitance f capacitance code 0.10 104 3.3 335 0.15 154 4.7 475 0.22 224 6.8 685 0.33 334 10 106 0.47 474 15 156 0.68 684 22 226 1.0 105 33 336 1.5 155 47 476 2.2 225 68 686 date code year month 123456789101112 2013 a b c d e f g h j k l m 2014 n p q r s t u v w x y z 2015 a b c d e f g h j k l m 2016 n p q r s t u v w x y z 2017 a b c d e f g h j k l m 2018 n p q r s t u v w x y z 2019 a b c d e f g h j k l m 2020 n p q r s t u v w x y z a7 a s implified code of nominal capacitance (a7: 10 f) anode indication belt mark + a, b case date code 16 a + c, e case date code anode indication belt mark rated voltage (16 v) nominal capacitance value (10 f)
tmcs www.vishay.com vishay polytech revision: 26-oct-17 3 document number: 40177 for technical questions, contact: polytech@vishay.com this document is subject to change without notice. the products described herein and this document are subject to specific disclaimers, set forth at www.vishay.com/doc?91000 standard ratings capacitance (f) case code part number max. dcl at +25 c (a) max. df at +25 c 120 hz (%) max. esr at +25 c 100 khz ( ? ) max. ripple, 100 khz i rms (a) 4 v dc at +85 c, 2.5 v dc at +125 c 3.3 a tmcsa0g335(1)trf 0.5 6.0 4.0 0.140 10 b tmcsb0g106(1)trf 0.5 6.0 1.7 0.238 33 c tmcsc0g336(1)trf 1.3 6.0 1.1 0.302 68 e tmcse0g686(1)trf 2.7 6.0 0.6 0.447 7 v dc at +85 c, 4 v dc at +125 c 2.2 a tmcsa0j225(1)trf 0.5 6.0 4.4 0.133 6.8 b tmcsb0j685(1)trf 0.5 6.0 2.8 0.185 22 c tmcsc0j226(1)trf 1.5 6.0 1.1 0.302 47 e tmcse0j476(1)trf 3.3 6.0 0.9 0.365 10 v dc at +85 c, 6.3 v dc at +125 c 1.5 a tmcsa1a155(1)trf 0.5 6.0 4.4 0.133 4.7 b tmcsb1a475(1)trf 0.5 6.0 2.8 0.185 15 c tmcsc1a156(1)trf 1.5 6.0 2.2 0.213 33 e tmcse1a336(1)trf 3.3 6.0 0.9 0.365 16 v dc at +85 c, 10 v dc at +125 c 1.0 a tmcsa1c105(1)trf 0.5 4.0 6.6 0.109 3.3 b tmcsb1c335(1)trf 0.5 6.0 3.9 0.157 10 c tmcsc1c106(1)trf 1.6 6.0 1.7 0.243 22 e tmcse1c226(1)trf 3.5 6.0 0.9 0.365 20 v dc at +85 c, 13 v dc at +125 c 0.68 a tmcsa1d684(1)trf 0.5 4.0 9.7 0.090 2.2 b tmcsb1d225(1)trf 0.5 6.0 3.9 0.157 6.8 c tmcsc1d685(1)trf 1.4 6.0 1.7 0.243 15 e tmcse1d156(1)trf 3.0 6.0 0.9 0.365 25 v dc at +85 c, 16 v dc at +125 c 0.47 a tmcsa1e474(1)trf 0.5 4.0 16.5 0.069 1.5 b tmcsb1e155(1)trf 0.5 6.0 3.9 0.157 4.7 c tmcsc1e475(1)trf 1.2 6.0 2.8 0.189 10 e tmcse1e106(1)trf 2.5 6.0 2.0 0.245 35 v dc at +85 c, 22 v dc at +125 c 0.10 a tmcsa1v104(1)trf 0.5 4.0 38.5 0.045 0.15 a tmcsa1v154(1)trf 0.5 4.0 38.5 0.045 0.22 a tmcsa1v224(1)trf 0.5 4.0 38.5 0.045 0.33 a tmcsa1v334(1)trf 0.5 4.0 22.0 0.060 0.47 b tmcsb1v474(1)trf 0.5 4.0 19.8 0.070 0.68 b tmcsb1v684(1)trf 0.5 4.0 8.8 0.104 1.0 b tmcsb1v105(1)trf 0.5 4.0 3.9 0.157 1.5 c tmcsc1v155(1)trf 0.5 6.0 5.0 0.141 2.2 c tmcsc1v225(1)trf 0.8 6.0 5.0 0.141 3.3 c tmcsc1v335(1)trf 1.2 6.0 3.9 0.160 4.7 e tmcse1v475(1)trf 1.6 6.0 2.8 0.207 6.8 e tmcse1v685(1)trf 2.4 6.0 1.7 0.266 note ? part number definition: (1) tolerance: for 10 % tolera nce, specify k; for 20 % tolerance, change to m recommended voltage de rating guidelines (for temperature below +85 c) capacitor voltage rating operating voltage 4.0 2.0 7.0 3.5 10 5.0 16 8.0 20 10 25 12.5 35 17.5
tmcs www.vishay.com vishay polytech revision: 26-oct-17 4 document number: 40177 for technical questions, contact: polytech@vishay.com this document is subject to change without notice. the products described herein and this document are subject to specific disclaimers, set forth at www.vishay.com/doc?91000 note ? test conditions per jis c5101-1 power dissipation case code maximum permissible power dissipation at +25 c (w) in free air a 0.078 b 0.096 c 0.100 e 0.120 standard packaging quantity case code units per 7" reel a 2000 b 2000 c 500 e 500 performance characteristics item condition post test performance temperature ? characteristics measure the specified characteristics in each stage specified initial value -55 c +85 c +125 c capacitance change - -10 % to 0 % 0 % to +10 % 0 % to +12 % dissipation factor (%) 44 5 5 66 7 7 leakage current not more than 0.01 cv or 0.5 a whichever is greater - not more than 0.1 cv or 5 a whichever is greater not more than 0.125 cv or 6.25 a whichever is greater solder heat resistance solder dip: 260 c 5 c ? a, b case: 10 s 1 s ? c, e case: 5 s 0.5 s ? reflow 260 c, 10 s 1 s capacitance change within 5 % of initial value dissipation factor shall not exceed initial specified value leakage current shall not exceed initial specified value moisture ? resistance ? no load leave at 40 c and 90 % to ? 95 % rh for 500 h capacitance change within 5 % of initial value dissipation factor shall not exceed initial specified value leakage current shall not exceed initial specified value high ? temperature ? load 85 c. the rated voltage is applied for 2000 h capacitance change within 10 % of initial value dissipation factor shall not exceed initial specified value leakage current shall not exceed 125 % of initial specified value thermal shock leave at -55 c, normal temperature, 125 c, and normal temperature for 30 min, 3 min, 30 min, and 3 min. ? repeat this operation 20 times running capacitance change within 5 % of initial value dissipation factor shall not exceed initial specified value leakage current shall not exceed initial specified value moisture ? resistance ? load leave at 40 c and 90 % to 95 % rh. the rated voltage applied for 500 h capacitance change within 10 % of initial value dissipation factor shall not exceed 150 % of initial specified value leakage current shall not exceed 125 % of initial specified value failure rate 85 c. the rated voltage is applied through a protective resistor of 1 ? /v 1 % / 1000 h
molded guide www.vishay.com vishay polytech revision: 11-apr-16 1 document number: 40218 for technical questions, contact: tantalum@vishay.com this document is subject to change without notice. the products described herein and this document are subject to specific disclaimers, set forth at www.vishay.com/doc?91000 guide for tantalum and niobium solid electrolyte chip capacitors introduction tantalum electrolytic capacitors are the preferred choice in applications where volumetric efficiency, stable electrical parameters, high reliab ility, and long service life are primary considerations. the stability and resistance to elevated temperatures of the tantalum / tantalum oxide / manganese dioxide system make solid tantalum capacitors an appropriate choice for toda y's surface mount assembly technology. vishay sprague has been a pioneer and leader in this field, producing a large variety of tantalum capacitor types for consumer, industrial, automotive, military, and aerospace electronic applications. tantalum is not found in its pure state. rather, it is commonly found in a number of oxide minerals, often in combination with columbium ore. this combination is known as tantalite when its contents are more than one-half tantalum. important sources of tantalite include australia, brazil, canada, china, an d several african countries. synthetic tantalite concentrates produced from tin slags in thailand, malaysia, and brazil are also a significant raw ma terial for tantalum production. electronic applications, an d particularly capacitors, consume the largest share of world tantalum production. other important applications for tantalum include cutting tools (tantalum carbide), high temperature super alloys, chemical processing equipment, medical implants, and military ordnance. vishay sprague is a major user of tantalum materials in the form of powder and wire for capacitor elements and rod and sheet for high temperatu re vacuum processing. the basics of tantalum capacitors most metals form crystalline oxides which are non-protecting, such as rust on iron or black oxide on copper. a few metals form dens e, stable, tightly adhering, electrically insulating oxides. these are the so-called valve metals and include titanium, zi rconium, niobium, tantalum, hafnium, and aluminum. only a few of these permit the accurate control of oxide thickness by electrochemical means. of these, the most valuable for the electronics industry are aluminum and tantalum. capacitors are basic to all kinds of electrical equipment, from radios and television sets to missile controls and automobile ignitions. their function is to store an electrical charge for later use. capacitors consist of two co nducting surfaces, usually metal plates, whose function is to conduct electricity. they are separated by an insulating material or dielectric. the dielectric used in all tantalum electrolytic capacitors is tantalum pentoxide. tantalum pentoxide compound possesses high-dielectric strength and a high-dielectric constant. as capacitors are being manufactured, a film of tantalum pentox ide is applied to their electrodes by means of an electrolytic process. the film is applied in various thic knesses and at various voltages and although transparent to begin with, it takes on different colors as light refracts through it. this coloring occurs on the tantalum electrodes of all types of tantalum capacitors. rating for rating, tantalum capacitors tend to have as much as three times better capacitance / volume efficiency than aluminum electrolytic capacitors. an approximation of the capacitance / volume efficiency of other types of capacitors may be inferred from the following table, which shows the dielectric constant ranges of the various materials used in each type. note that tantalum pentoxide has a dielectric constant of 26, some three times greater than that of aluminum oxide. this, in addition to the fact that extremely thin films can be deposited du ring the electrolytic process mentioned earlier, makes the tantalum capacitor extremely efficient with respect to the number of microfarads available per unit volume. th e capacitance of any capacitor is determined by the su rface area of the two conducting plates, the distance between the plates, and the dielectric constant of the insulating material between the plates. in the tantalum electrolytic capacitor, the distance between the plates is very small since it is only the thickness of the tantalum pentoxide film. as the dielectric constant of the tantalum pentoxide is high, the capacitance of a tantalum capacitor is high if the area of the plates is large: ? ? where c = capacitance e = dielectric constant a = surface area of the dielectric t = thickness of the dielectric tantalum capacitors contain either liquid or solid electrolytes. in solid electrolyte capacitors, a dry material (manganese dioxide) forms the cathode plate. a tantalum lead is embedded in or welded to the pellet, which is in turn connected to a termination or lead wire. the drawings show the construction details of the surface mount types of tantalum capacitors sh own in this catalog. comparison of capacitor ? dielectric constants dielectric e dielectric constant air or vacuum 1.0 paper 2.0 to 6.0 plastic 2.1 to 6.0 mineral oil 2.2 to 2.3 silicone oil 2.7 to 2.8 quartz 3.8 to 4.4 glass 4.8 to 8.0 porcelain 5.1 to 5.9 mica 5.4 to 8.7 aluminum oxide 8.4 tantalum pentoxide 26 ceramic 12 to 400k c ea t ------ - =
molded guide www.vishay.com vishay polytech revision: 11-apr-16 2 document number: 40218 for technical questions, contact: tantalum@vishay.com this document is subject to change without notice. the products described herein and this document are subject to specific disclaimers, set forth at www.vishay.com/doc?91000 solid electrolyte tantalum capacitors solid electrolyte capacitors contain manganese dioxide, which is formed on the tantalum pentoxide dielectric layer by impregnating the pellet with a solution of manganous nitrate. the pellet is then heated in an oven, and the manganous nitrate is converted to manganese dioxide. the pellet is next coated with graphite, followed by a layer of metallic silver, which provides a conductive surface between the pellet and the leadframe. molded chip tantalum capacitor encases the element in plastic resins, such as epoxy materials. afte r assembly, the capacitors are tested and inspected to assure long life and reliability. it offers excellent reliability and high stability for consumer and commercial el ectronics with the added feature of low cost. surface mount designs of so lid tantalum capacitors use lead frames as shown in the accompanying drawings. tantalum capacitors for all design considerations solid electrolyte designs are the least expensive for a given rating and are used in many applications where their very small size for a given unit of capacitance is of importance. also important are their good low temperature performance characteristics and freedom from corrosive electrolytes. datasheets covering the va rious types and styles of capacitors for consumer and entertainment electronics and industry applications are available where detailed performance characterist ics must be specified. molded chip capacitor, all types except tmctx / tmcj / nmc molded chip capacitor with built-in fuse, type tmctx molded chip capacitor 0603 size, type tmcj s intered tantalum mno 2 carbon / s ilver coating epoxy encap s ulation tantalum wire s upporter s ilver adhe s ive s olderable cathode termination s olderable anode termination leadframe tantalum wire epoxy encap s ulation leadframe s olderable anode termination s olderable cathode termination fu s ible ribbon carbon / s ilver coating s intered tantalum s upporter s ilver adhe s ive mno 2 epoxy encap s ulation s olderable anode termination s olderable cathode termination leadframe s ilver adhe s ive s intered tantalum mno 2 carbon / s ilver coating tantalum wire
molded guide www.vishay.com vishay polytech revision: 11-apr-16 3 document number: 40218 for technical questions, contact: tantalum@vishay.com this document is subject to change without notice. the products described herein and this document are subject to specific disclaimers, set forth at www.vishay.com/doc?91000 molded chip capacitor niobium, type nmc solid tantalum capacitors - molded case series tmcs tmcm tmcr tmcu tmcp tmcj product ? image type solid tantalum surface mount chip capacitors, molded case features standard industrial grade standard industrial grade extended range low esr low profile 0805 size 0603 size temperature ? range -55 c to +125 c capacitance ? range 0.1 f to 68 f 0.47 f to 470 f 10 f to 330 f 0.1 f to 220 f 0.1 f to 47 f 0.68 f to 22 f voltage ? range 4 v to 35 v 2.5 v to 35 v 7 v to 35 v 2.5 v to 35 v 2.5 v to 25 v 2.5 v to 20 v capacitance ? tolerance 10 %, 20 % 20 % leakage ? current 0.01 cv or 0.5 a, whichever is greater dissipation ? factor 4 % to 6 % 4 % to 30 % 6 % to 30 % 4 % to 30 % 6 % to 30 % 20 % case sizes a, b, c, e a, b, c, e b, c, e ua, ub p j termination ? finish 100 % tin case ua: 100 % tin case ub: ni / pd / au 100 % tin s intered niobium carbon / s ilver coating mno 2 s olderable anode termination s olderable cathode termination leadframe s ilver adhe s ive epoxy encap s ulation tantalum wire s upporter
molded guide www.vishay.com vishay polytech revision: 11-apr-16 4 document number: 40218 for technical questions, contact: tantalum@vishay.com this document is subject to change without notice. the products described herein and this document are subject to specific disclaimers, set forth at www.vishay.com/doc?91000 solid tantalum capacitors - molded case series tmctx tmch thc product image type solid tantalum surface mount chip capacitors, molded case features built-in fuse high reliability high reliability, high temperature +150 c temperature range -55 c to +125 c -55 c to +150 c capacitance range 1.0 f to 68 f 0.1 f to 100 f 0.33 f to 47 f voltage range 10 v to 35 v 4 v to 35 v 10 v to 35 v capacitance tolerance 10 %, 20 % leakage current 0.01 cv or 0.5 a, whichever is greater 0.005 cv or 0.25 a, whichever is greater dissipation factor 4 % to 6 % 4 % to 8 % 4 % to 6 % case sizes b, c, e, f a, b, c, e, p a, b, c, e termination finish 100 % tin solid niobium capacitors - molded case series nmc nmcu product image type solid niobium surface mount chip capacitors, molded case features flame retardant flame retardant, low profile temperature range -55 c to +105 c capacitance range 10 f to 470 f 4.7 f to 47 f voltage range 2.5 v to 10 v capacitance tolerance 20 % leakage current 0.02 cv or less dissipation factor 8 % to 30 % 30 % case sizes a, b, c, e ua, ub termination finish 100 % tin case ua: 100 % tin case ub: ni / pd / au
molded guide www.vishay.com vishay polytech revision: 11-apr-16 5 document number: 40218 for technical questions, contact: tantalum@vishay.com this document is subject to change without notice. the products described herein and this document are subject to specific disclaimers, set forth at www.vishay.com/doc?91000 plastic tape and reel packaging dimensions in millimeters case code j, p, a, ua, b, ub c, e, f tape width 8 12 a + 0 / - 3 ? 180 b + 1 / 0 ? 60 c 0.2 ? 13 d 0.5 ? 21 e 0.5 2.0 w 0.3 9.0 13.0 tape size in millimeters case code a 0.2 b 0.2 w 0.3 f 0.1 e 0.1 p 1 0.1 t max. j 1.0 1.8 8.0 3.5 1.75 4.0 1.3 p 1.4 2.2 8.0 3.5 1.75 4.0 1.6 a 1.9 3.5 8.0 3.5 1.75 4.0 2.5 ua 1.9 3.5 8.0 3.5 1.75 4.0 1.7 b 3.1 3.8 8.0 3.5 1.75 4.0 2.5 ub 3.1 3.8 8.0 3.5 1.75 4.0 1.7 c 3.7 6.3 12.0 5.5 1.75 8.0 3.1 e 4.8 7.7 12.0 5.5 1.75 8.0 3.4 f 6.2 7.5 12.0 5.5 1.75 8.0 4.1 label d e w b a c perforation direction of tape flow inserting direction t a f p 1 w b e ? 1.5 pocket + 0.1 0 4.0 0.1 2.0 0.1 perforation s ymbol: r marking s ide (upper) mounting terminal s ide (lower)
molded guide www.vishay.com vishay polytech revision: 11-apr-16 6 document number: 40218 for technical questions, contact: tantalum@vishay.com this document is subject to change without notice. the products described herein and this document are subject to specific disclaimers, set forth at www.vishay.com/doc?91000 recommended reflow profiles capacitors should with stand reflow profile as per j-std-020 standard profile feature lead (pb)-free assembly preheat / soak temperature min. (t s min. ) 130 c temperature max. (t s max. ) 160 c time (t s ) from (t s min. to t s max. ) 60 s to 120 s ramp-up ramp-up rate (t l to t p ) 3 c/s max. liquidus temperature (t l ) 200 c time (t l ) maintained above t l 50 s max. peak package body temperature (t p ) max. depends on case size - see table below time (t p ) within 5 c of the peak maximum temperature 10 s max. ramp-down rate (t p to t l ) 6 c/s max. time from 25 c to pe ak temperature 8 min max. peak package body temperature (t p ) case code peak package body temperature (t p ) lead (pb)-free process j, p, ua, a, ub, b, c 260 c e, f 250 c pad dimensions in millimeters case / dimensions capacitor size pad dimensions l w g (max.) z (min.) x (min.) y (ref.) j 1.6 0.8 0.7 2.5 1.0 0.9 p 2.0 1.25 0.5 2.6 1.2 1.05 ua, a 3.2 1.6 1.1 3.8 1.5 1.35 ub, b 3.5 2.8 1.4 4.1 2.7 1.35 c 5.8 3.2 2.9 6.9 2.7 2.0 e 7.3 4.3 4.1 8.2 2.9 2.05 f 7.3 5.8 4.1 8.2 4.0 2.05 25 temperature (c) time (s) t s t l time 25 c to peak t l t p t c - 5 c t p t s max. t s min. preheat area max. ramp-up rate = 3 c/s max. ramp-down rate = 6 c/s capacitor pattern l y z g xw
molded guide www.vishay.com vishay polytech revision: 11-apr-16 7 document number: 40218 for technical questions, contact: tantalum@vishay.com this document is subject to change without notice. the products described herein and this document are subject to specific disclaimers, set forth at www.vishay.com/doc?91000 guide to application 1. ac ripple current: the maximum allowable ripple current shall be determi ned from the formula: where, p = power dissipation in w at +25 c as given in the tables in the product datasheets. r esr = the capacitor equivalent series resistance at the specified frequency. 2. ac ripple voltage: the maximum allowable ripple voltage shall be determi ned from the formula: or, from the formula: where, p = power dissipation in w at +25 c as given in the tables in the product datasheets. r esr = the capacitor equivalent series resistance at the specified frequency. z = the capacitor impedance at the specified frequency. 2.1 the tantalum capacitors must be used in such a condition that the sum of the working voltage and ripple voltage peak values does not exceed the rated voltage as shown in figure below. 3. temperature derating: power dissipation is affected by the heat sinking capability of the mounting surface. if these capacitors are to be operated at temperatures above +25 c, the permissible ripple current (or voltage) shall be calculated using the derating coefficient as shown in the table below: 4. reverse voltage: the capacitors are not intended for use with reverse voltage app lied. if the application of an reverse voltage is unavoidable, it must not exceed the following values: at 25 c: 10 % of the rated voltage or 1 v, whichever is smaller. at 85 c: 5 % of the rated voltage or 0.5 v, whichever is smaller. 5. mounting precautions: 5.1 limit pressure on capaci tor installation with mounter: pressure must not exceed 4.9 n with a tool end diameter of 1.5 mm when applied to the capacitors using an absorber, centering tweezers, or similar (maximum permitted pressurization time: 5 s). an excessively low absorber setting position would result in not only the application of undue force to the capacitors but capacitor and other component scattering, circuit board wi ring breakage, and / or cracking as well, particularly when the capacitors are mounted together with other chips having a height of 1 mm or less. 5.2 flux selection 5.2.1 select a flux that contains a minimum of chlorine and amine. 5.2.2 after flux use, the chlorine and amine in the flux remain must be removed. 5.3 cleaning after mounting: the following solvents are usable when cleaning the capacitors after mounting. never use a highly active solvent. ? halogen organic solvent (hcfc225, etc.) ? alcoholic solvent (ipa, ethanol, etc.) ? petroleum solvent, alkali saponifying agent, water, etc. circuit board cleaning must be conducted at a temperature of not higher than 50 c and for an immersion time of not longer than 30 minutes. when an ultrasonic cleaning method is used, cleaning must be conducted at a frequency of 48 khz or lower, at an vibrator output of 0.02 w/cm 3 , at a temperature of not higher than 40 c, and for a time of 5 minutes or shorter. notes ? care must be exercised in cleaning process so that the mounted capacitor will not co me into contact with any cleaned object or the like or will not get rubbed by a stiff brush or similar. if such precautions are not taken particularly when the ultrasonic cleaning method is employed, terminal breakage may occur. ? when performing ultrasonic cleaning under conditions other than stated above, conduct adequate advance checkout. maximum ripple current temperature derating factor temperature tmc nmc ? 25 c 1.0 1.0 85 c 0.9 0.9 105 c 0.65 0.4 125 c 0.4 - i rms p r esr ------------ = v rms z p r esr ------------ = v rms i rms x z = voltage rated voltage ripple voltage operating voltage working voltage time (s)
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