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1 channel high side switch ics 1.1a current limit high side switch ics bd6519fj general description bd6519fj is s ingle channel high side switch ic with over - current protection for u niversal s erial b us (usb) power supply line . these are low on -r esistan ce n-c hannel power mosfet s with low supply current. these ics have built - in over -current pro tection circuit, thermal shutdown circuit , under voltage lockout and soft - start circuit . features ? built - in l ow on -r esistance nch mosfet ( typ = 100m ) ? control i nput l ogic : active - low ? soft -s tart c ircuit ? over -c urrent pro tection ? thermal s hutdown ? under v oltage l ockout f unction ? open d rain error f lag o utput ? reverse -current p rotection when s witch o ff applications usb h ub in c onsumer a ppliances, pc, pc p eripheral e quipment key specifications ? i nput v oltage r ange: 3.0v to 5.5v ? continu ous current l oad: 0.5a ? on r esistance (v dd =5v) 100m(typ) ? over -c urrent t hreshold: 0. 7 a (min) , 1.6 a (max) ? s tandby current: 0.01 a ( typ ) ? operating t emperature r ange : - 40 c to +85 c package w (typ) d (typ) h (max) typical application circuit lineup over -c urrent t hreshold control i nput l ogic package orderable part number min typ max 0.7a 1.1a 1.6a low sop - j8 reel of 2500 bd6519fj -e2 sop - j8 4.90mm x 6.00mm x 1.65mm out out out vdd vdd flag gnd vbus d - d+ gnd 5v( t yp) c l c in - + ctrl produ ct structure silicon monolithic integrated circuit this product has not designed protection against radioactive rays 1/ 21 tsz22111 ? 14 ? 001 ? 2013 rohm co., ltd. all rights reserved. 21.aug.2014 rev.002 www.rohm.com tsz02201 - 0e3e0h300330 -1-2 datashee t downloaded from: http:///
bd 6519fj block diagram pin configuration pin description pin no. symbol i / o pin f unction 1 gnd i ground pin 2, 3 vdd i power supply input. input terminal to power switch and power supply terminal of the internal circuit. when i n use, connect each pin outside. 4 ctrl i enable input. power switch on at l ow level . high level input > 2.5v, l ow level input < 0.7v. 5 flag o error flag output . low at over -current and thermal shutdown . open drain output. 6, 7, 8 out o power switch o utput. when in use, connect each pin outside. vdd vdd flag ctrl out out out gnd charge pump gate logic tsd ocd uvlo top view 1 2 3 4 8 7 6 5 gnd vdd vdd flag out out out ctrl 2/ 21 ? 2013 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 tsz02201 - 0e3e0h300330 -1-2 21.aug.2014 rev.002 downloaded from: http:///
bd 6519fj absolute maximum ratings parameter symbol limit unit supply v oltage v dd - 0.3 to + 6.0 v ctrl v oltage v ctrl - 0.3 to + 6.0 v flag v oltage v flag - 0.3 to + 6.0 v flag c urrent i flag 10 ma out v oltage v out - 0.3 to + 6.0 v storage t emperature t stg - 55 to + 150 c power d issipation pd 0.67 (note 1) w (note 1) mounted on 70mm x 70mm x 1.6mm glass - epoxy pcb. derating : 5.4mw/ o c above ta=25 o c. caution: operating the ic over the absolute maximum ratings may damage the ic. the damage can either be a short circuit between pins or an open circuit between pins and the internal circuitry. therefore, it is important to co nsider circuit protection measures, such as adding a fuse, in case the ic is operated over the absolu te maximum ratings. recommended operating conditions parameter symbol rating unit min typ max operating v oltage v dd 3.0 - 5.5 v operating t emperature t opr - 40 - + 85 c continuous o utput current i lo 0 - 50 0 ma electrical characteristics (u nless otherwise specified , v dd = 5.0v, ta = 25 c) parameter s ymbol limit unit condition s min typ max operating current i dd - 90 140 a v ctrl = 0v, out = open standby c urrent - 0.01 2 a v ctrl = 5v, out = open ctrl i nput v oltage v ctrl 2.5 - - v high i nput - - 0.7 v low in put ctrl i nput c urrent i ctrl - 1.0 + 0.01 + 1.0 a v ctrl = 0v or v ctrl = 5v flag o utput r esistance r flag - 180 4 50 i flag = 1ma flag o utput l eak current i l_ flag - 0.01 1 a v flag = 5v flag o utput d elay t d_ flag - 2.5 8 ms on -r esistance r on - 100 140 m v dd = 5v, i out = 500ma - 140 180 m v dd = 3.3v, i out = 500ma short c ircuit o utput c urrent i sc 0.6 - 1.6 a v dd = 5v , v out = 0v output l eak c urrent i leak - - 10 a v ctrl = 5v output ri se t ime t on1 - 1 4 ms r l = 10 , c l = open output t urn on d elay t ime t on2 - 1.3 6 ms output f all t ime t off1 - 1 20 s output t urn o ff d elay t ime t off2 - 3 20 s thermal sh utdown t hreshold t ts - 135 - c tj i ncrease over -c urrent threshold i th 0.7 1.1 1.6 a uvlo t hreshold v tuvh 2.3 2.5 2.7 v v dd i ncreasing v tuvl 2.1 2.3 2.5 v v dd d ecreasing 3/ 21 ? 2013 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 tsz02201 - 0e3e0h300330 -1-2 21.aug.2014 rev.002 downloaded from: http:///
bd 6519fj measurement circuit a. operating current b. ctrl i nput v oltage , output r ise / f all t ime ctrl out flag vdd gnd v dd c l vdd out out 1uf i out v dd 10k v ctrl ctrl out flag vdd gnd v dd vdd out out 1uf i flag v dd v ctrl c. on -r esistance, over -c urrent d etection d. flag o utpu t l ow v oltage figure 1. measurement c ircuit timing diagram t on2 t on1 10% 90% 90% 10% t off2 t off1 v out v ctrl ctrl ctrl v v figure 2. timing d iagram ctrl out flag vdd gnd v dd vdd out out 1f a v ctrl ctrl out flag vdd gnd v dd r l c l vdd out out 1f v ctrl 1f 1f t on1 t on 2 t off 1 t o ff2 v out v ctrl v ctrl v ctrl 4/ 21 ? 2013 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 tsz02201 - 0e3e0h300330 -1-2 21.aug.2014 rev.002 downloaded from: http:///
bd 6519fj figure 4. operating current vs ambient temperature (ctrl enable) typical performance curves figure 3. operating current vs supply voltage (ctrl enable) figure 5. standby current vs supply voltage (ctrl disable) figure 6. standby current vs ambient temperature (ctrl disable) supply voltage : v dd [v] operating current : i dd [a] 0 20 40 60 80 100 120 2 3 4 5 6 ta=25 c ambient temperature : ta[ c] operating current : i dd [a] 0 20 40 60 80 100 120 -50 0 50 100 v dd =5.0v supply voltage : v dd [v] standby current : i stb [a] 0.0 0.2 0.4 0.6 0.8 1.0 2 3 4 5 6 ta=25 c ambient temperature : ta[ c] standby current : i stb [a] 0.0 0.2 0.4 0.6 0.8 1.0 -50 0 50 100 v dd =5.0v 5/ 21 ? 2013 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 tsz02201 - 0e3e0h300330 -1-2 21.aug.2014 rev.002 downloaded from: http:///
bd 6519fj typical performance curves C c ontinued figure 7. ctrl i nput v oltage vs supply voltage 0.0 0.5 1.0 1.5 2.0 2.5 2 3 4 5 6 supply voltage : v dd [v] enable input voltage : v ctrl [v] 0 low to high high to low ta=25 c supply voltage : v dd [v] ctrl input voltage : v ctrl [v] figure 8. ctrl i nput v oltage vs ambient temperature 0.0 0.5 1.0 1.5 2.0 2.5 -50 0 50 100 ambient temperature : ta[ ] enable input voltage : v ctrl [v] v dd =5.0v high to low low to high ambient temperature : ta[ c] ctrl input voltage : v ctrl [v] figure 9. flag o utput r esistance vs supply voltage figure 1 0. flag o utput r esistance vs ambient temperature supply voltage : v dd [v] f lag output resistance : r flag [] 0 50 100 150 200 250 2 3 4 5 6 ta=25 c ambient temperature : ta[ c] flag output resistance : r flag [] 0 50 100 150 200 250 -50 0 50 100 v dd =5.0v 6/ 21 ? 2013 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 tsz02201 - 0e3e0h300330 -1-2 21.aug.2014 rev.002 downloaded from: http:///
bd 6519fj typical performance curves C c ontinued figure 1 1. on -r esistance vs supply voltage 0 50 100 150 200 2 3 4 5 6 supply voltage : v dd [v] on resistance : r on[ m] ta=25 c supply voltage : v dd [v] on - resistance : r on [m ] 0 50 100 150 200 -50 0 50 100 ambient temperature : ta[ ] on resistance : r on [m] v dd =5.0v figure 1 2. on -r esistance vs ambient temperature ambient temperature : ta[ c] on - resistance : r on [m ] figure 1 4. s hort c ircuit output current vs ambient temperature figure 1 3. s hort c ircuit output current vs supply voltage 0.0 0.5 1.0 1.5 2.0 2 3 4 5 6 supply voltage : v dd [v] short circuit current : i sc [a] ta=25 c supply voltage : v dd [v] short circuit output current : i sc [a] 0.0 0.5 1.0 1.5 2.0 -50 0 50 100 ambient temperature : ta[ ] short circuit current : i sc [a] v dd =5.0v ambient temperature : ta[ c] short circuit output current : i sc [a] 7/ 21 ? 2013 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 tsz02201 - 0e3e0h300330 -1-2 21.aug.2014 rev.002 downloaded from: http:///
bd 6519fj typical performance curves C c ontinued figure 1 6. flag o utput d elay vs ambient temperature 0.0 1.0 2.0 3.0 4.0 5.0 -50 0 50 100 ambient temperature : ta[ ] flag output delay : td fl ag [ms] v dd =5.0v ambient temperature : ta[ c] flag output delay : t d_ flag [ms] figure 17. output r ise t ime vs supply voltage 0.0 1.0 2.0 3.0 4.0 5.0 2 3 4 5 6 supply voltage : v dd [v] rise time : t on1 [ms] ta=25 c supply voltage : v dd [v] output rise time : t on 1 [ms] figure 1 5. flag o utput d elay vs supply voltage 0.0 1.0 2.0 3.0 4.0 5.0 2 3 4 5 6 supply voltage : v dd [v] flag output delay : td fl ag [ms] ta=25 c supply voltage : v dd [v] flag output delay : t d_ flag [ms] ambient temperature : ta[ c] output rise time : t on1 [ms] figure 18. output r ise t ime vs ambient temperature 0.0 1.0 2.0 3.0 4.0 5.0 -50 0 50 100 v dd =5.0v 8/ 21 ? 2013 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 tsz02201 - 0e3e0h300330 -1-2 21.aug.2014 rev.002 downloaded from: http:///
bd 6519fj typica l performance curves C c ontinued figure 22. output f all t ime vs ambient temperature 0.0 1.0 2.0 3.0 4.0 5.0 -50 0 50 100 ambient temperature : ta[ ] fall time : t off1 [s] v dd =5.0v ambient temperature : ta[ c] output fall time : t off1 [ s] figure 19. output turn on delay time vs supply voltage figure 20. output turn on delay time vs ambient temperature 0.0 1.0 2.0 3.0 4.0 5.0 -50 0 50 100 ambient temperature : ta[ ] turn on time : t on2 [ms] v dd =5.0v ambient temperature : ta[ c] output turn on delay time : t on2 [ms] supply voltage : v dd [v] output turn on delay time : t on2 [ms] 0.0 1.0 2.0 3.0 4.0 5.0 2 3 4 5 6 ta=25 c figure 21. output f all t ime vs supply voltage supply voltage : v dd [v] output fall time :t off1 [ s] 0.0 1.0 2.0 3.0 4.0 5.0 2 3 4 5 6 ta=25 c 9/ 21 ? 2013 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 tsz02201 - 0e3e0h300330 -1-2 21.aug.2014 rev.002 downloaded from: http:///
bd 6519fj typical performance curves C c ontinued figure 23. output t urn off delay t ime vs supply voltage figure 24. output t urn off delay t ime vs ambient temperature 0.0 1.0 2.0 3.0 4.0 5.0 2 3 4 5 6 supply voltage : v dd [v] turn off time : t off2 [s] ta=25 c supply voltage : v dd [v] out put turn off delay time : t off2 [ s] figure 25. uvlo t hreshold voltage vs ambient temperature ambient temperature : ta[ c] uvlo threshold : v tuvh , v tuvl [v] 2.1 2.2 2.3 2.4 2.5 2.6 2.7 -50 0 50 100 v tuvh v tuvl figure 26. uvlo h ysteresis vo ltage vs am bient temperature ambient temperature : ta[ c] uvlo hysteresis voltage : v hys [v] 0.0 0.2 0.4 0.6 0.8 1.0 -50 0 50 100 ambient temperature : ta[ c] output turn off delay time : t off2 [ s] 0.0 1.0 2.0 3.0 4.0 5.0 -50 0 50 100 v dd =5.0v 10 / 21 ? 2013 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 tsz02201 - 0e3e0h300330 -1-2 21.aug.2014 rev.002 downloaded from: http:///
bd 6519fj typical wave forms v ctrl (1v/div.) v dd =5v r l =10 c l =147 f v flag (1v/div.) v out (1v/div.) i out (0.2a/div.) time(1ms/div.) figure 27. output r ise c haracteristic v dd = 5v v out (1 v/div.) i out 0.2a/div.) v flag (1v/div.) time(20 ms /div.) figure 30. over -current r esponse r amp ed l oad time(0.5ms/div.) figure 29. inrush c urrent c haracteristic v ctrl (1 v/div.) v dd =5v r l =10 v flag (1 v/div.) i out (0. 2a/div.) c l =47 f c l =14 7f c l =220 f c l =330 f time(1ms/div.) figure 28. output f all c haracteristic v ctrl (1v/div.) v dd =5v r l =10 c l =147 f v out (1v/div.) i out (0.2a/div.) v flag (1v/div.) 11 / 21 ? 2013 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 tsz02201 - 0e3e0h300330 -1-2 21.aug.2014 rev.002 downloaded from: http:///
bd 6519fj typical wave forms C c ontinued time(2ms/div.) figure 31. over -current r esponse r amp ed l oad v fl ag (1v/div.) v out ( 1v/div.) i ou t ( 0.2a/div.) v dd =5v time ( 1ms/div.) figure 33. over -current r esponse output s hort c ircuit at enable v dd = 5v c l =100 f v out ( 1v/div.) v f lag (1v/div.) i out ( 0.5a/div.) time ( 200ms/div.) figure 34. over -curr ent r esponse output s hort c ircuit at enable v fla g (1v/div.) v out ( 1v/div.) i out ( 0.5a/div.) v dd = 5v c l =100 f thermal shutdown time ( 1ms/div.) figure 32. over -current r esponse enable to s hort c ircuit v dd = 5v c l =100 f v c trl (1v/div.) v out ( 1v/di v.) v f lag (1v/div.) i out ( 0.2a/div.) 12 / 21 ? 2013 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 tsz02201 - 0e3e0h300330 -1-2 21.aug.2014 rev.002 downloaded from: http:///
bd 6519fj typical wave forms C c ontinued time ( 10ms/div.) figure 35. uvlo v dd i ncreasing v dd ( v/div.) v out ( 1v/div.) v fla g (1v/div.) i out ( 0.2a/div.) r l =10 c l =147 f time ( 10ms/div.) figure 36. uvlo v dd d ecreasing v dd ( v/div.) v out ( 1v/div.) v fla g (1v/div.) i out ( 0.2a/div.) r l =10 c l =147 f 13 / 21 ? 2013 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 tsz02201 - 0e3e0h300330 -1-2 21.aug.2014 rev.002 downloaded from: http:///
bd 6519fj typ ical a pplication c ircuit in out regulator out out out vdd vdd flag gnd vbus d- d+ gnd usb controller 5v( t yp ) 10k to 100k c l c in - + ctrl application information when excessive current flows due to output short circuit or so, ringing occurs by inductance of power source line and ic . this may cause bad effects on ic oper ations. in orde r to avoid this case, a bypa ss capacitor should be connected across by vdd terminal and gnd terminal of ic. 1f or higher is recommended. pull- up flag output by resistance 10k to 100k. set- up v alue s for c l which satisfies the application. this application circuit does no t guarantee its operation. when using the circuit with changes to t he external circuit constant s , it is better to have an adequate margin for the external component s such as static and transient characteristics as well as dispersion of the ic . functional description 1. switch o peration vdd terminal and out terminal are connected to the drain and the source of switch mos fet respectively. t he vdd terminal is also used as power source input to internal control circuit. when the switch is turned on by ctrl input, both the vdd and out terminal s are connected by a 1 00m bidirectional switch. in on status, the switch is bidirectional. therefore, current flows from out terminal to vdd terminal since the potential of out terminal is higher than that of vdd terminal . on the other hand, when the switch is turned off , it is possible to prevent current from flowing reversely from out to vdd s ince a parasitic diode between the drain and the source of switch mosfet is not activated. 2. thermal s hutdown c ircuit ( tsd) if over - current would continue , the temperature of the ic would increase drastically. if the junction tem perature is beyond 135 c ( t yp) during the condition of over - current detection, thermal shutdown circuit operates and turn s the power switch off, causing the ic to output an error flag (f la g). then, when the juncti on temperature d rop s lower than 125 c ( t yp), power switch is turned on and error flag (flag) is cancelled. this operation repeats u nless the cause of the increase in chip s temperature is removed or the output of power switch is turned o f f. the thermal s hutdown circuit operates when the switch is on ( ctrl signal is active) 14 / 21 ? 2013 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 tsz02201 - 0e3e0h300330 -1-2 21.aug.2014 rev.002 downloaded from: http:///
bd 6519fj 3. over -c urrent d etection ( ocd) the over - current detection circuit limits current (i sc ) and outputs error flag (flag) when current flowing in each switch mosfet exceeds a specified value. the over - current detection circuit works when the switch is on ( ctrl signal is active). there are three types of response against over -current: (1) when the switch is turned on while the output is in short circuit status, the switch g oe s in to current limit s tatus immediately (2) when the output short circuits or high - current load is connected while the switch is on , very large current flows until the over - current limit circuit react s. when it exceeds detection value , current limitation is carried out. (3) when the ou tput current increases gradually, current limit circuit would not oper ate unless the output current exceeds the over - current detection value. but when the output current increases gradually and it exceeds the detection value, current limitation is carried out. 4. under v oltage l ockout (uvlo) uvlo circuit prevents the switch from turning on until vdd exceeds 2. 3v(typ). if the vdd drops below 2.3v(typ) while the switch is on , then uvlo shuts off the power switch. uvlo has hysteresis of a 200mv(typ) . under voltag e lockout circuit works when the switch is on ( ctrl signal is active). 5. error f lag (flag) o utput error flag output is n- mos open drain output. during detection of over -current and/or thermal shutdown, the output level is low. o ver - current detection has de lay filter of 2.5ms(typ) . this delay filter prevents current detection flags from being sent during instantaneous events such as in rush current at switch on or during hot plug. if error flag output is unused, flag pin should be connected to open or ground line. v ctrl v out i out v flag output shortcircuit thermal shut down delay figure 37 . o ver - cu rrent d etection, t hermal s hutdown t iming d iagram v ctrl v out i out v flag delay output short circuit thermal shutdown 15 / 21 ? 2013 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 tsz02201 - 0e3e0h300330 -1-2 21.aug.2014 rev.002 downloaded from: http:///
bd 6519fj power dissipation (sop- j8) 70mm x 70mm x 1.6mm glass epoxy board figure 38 . power di ssipation c urve (pd- ta curve) i/o equ ivalen ce circuit symbol pin no e quivalen ce c ircuit ctrl 4 flag 5 out 6,7,8 0 100 200 300 400 500 600 700 0 25 50 75 100 125 150 a mbient tempera ture : ta [ ] power dissipation : pd [mw] power dissipation: p d [ mw ] ambient temperature: ta[c] 16 / 21 ? 2013 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 tsz02201 - 0e3e0h300330 -1-2 21.aug.2014 rev.002 downloaded from: http:///
bd 6519fj operational notes 1. reverse c onnection of p ower s upply connecting the power supply in reverse polarity can damage the ic. take pr ecautions against reverse polarity when connecting the power supply, such as mounting an external diode between the power supply and the ic s power supply pins . 2. power s upply l ines design the pcb layout pattern to provide low impedance supply lines. s eparate the ground and supply lines of the digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affect ing the analog block . furthermore, connect a capacitor to ground at all power supply pins . consider the effect of temperature and aging on the capacitance value when using electrolytic capacitors. 3. g round voltage ensure that no pins are at a voltage below that of the ground pin at any time, ev en during transient condition. 4. g round w iring pattern when using both small - signal and large - current ground traces, the two ground traces should be routed separately but connected to a single ground at the reference point of the application board to av oid fluctuations in the small - signal ground caused by large currents. also ensure that the ground traces of ex ternal components do not cause variations on the ground voltage. the ground lines must be as short and thick as possibl e to reduce line impedance. 5. thermal c onsideration should by any chance the power dissipation rating be exceeded the rise in temperature of the c hip may result in deterioration of the properties of the chip. the absolute maximum rating of t he pd stated in this specification is when the ic is mounted on a 70mm x 70m m x 1.6mm glass epoxy board. in case of exceeding this absolute maximum rating, increase the board size and copper area to prevent exceeding the pd rating. 6. recommended o perating c onditions these conditions represent a range within which the expected char acteristics of the ic can be approximately obtained . the electrical characteristics are guaranteed under the conditions of each parameter . 7. in r ush current when power is first supplied to the ic, it is possible that the inter nal logic may be unstable and inrush current may flow instantaneously due to the internal powering sequence and delays , especially if the ic has more than one power supply. therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and routing of connections. 8. operation u nder s trong e lectromagnetic f ield operating the ic in the presence of a strong electromagnetic field may cause the ic to malfunction . 9. testing on a pplication b oards when testing the ic on an application board, connecting a capacitor directly to a low - impedance output pin may subject the ic to stress. always discharge capacitors completely af ter each process or step. the ics power supply should always be turned off completely before connecting or removing it from the test setup during the inspection process. to prevent damage from static discharge, ground the ic during assem bly and use similar precautions during transport and storage. 10. inter- pin short and mounting errors ensure that the direction and position are correct when mounting the ic on the pcb. incorrect mounting may result in damaging the ic. avoid nearby pins being shorted to each other especia lly to ground, power supply and output pin . inter - pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and unintentional solder bridge deposited in between pins during assembly to name a few . 17 / 21 ? 2013 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 tsz02201 - 0e3e0h300330 -1-2 21.aug.2014 rev.002 downloaded from: http:///
bd 6519fj operational notes - continued 11. unused input pins input pins of an ic are often connected to the gate of a mos transistor. the gate has ext remely high impedance and extremely low capacitance. if left unconnected, the electric field from the outside can easily char ge it. the small charge acquired in this way is enough to produce a significant effect on the conduction through the tran sistor and cause unexpected operation of the ic. so unless otherwise specified, unused inpu t pins should be connected to the power supply or ground line. 12. regard ing the i nput p in of the ic this monolithic ic contains p+ isolation and p substrate layers between adjacent elements in order to keep them isolated. p - n junctions are formed at the intersection of the p layers with t he n layers o f other elements, creating a parasitic diode or transistor. for example (refer to figure below): when gnd > pin a and gnd > pin b, the p - n junction operates as a parasitic diode. when gnd > pin b, the p - n junction operates as a parasitic transistor. par asitic diodes inevitably occur in the structure of the ic. the operation of parasitic diodes can result in mutual interfe rence among circuits, operational faults, or physical damage. therefore , conditions that cause these diodes to operate, such as applying a voltage lower than the gnd voltage to an input pin (and thus to the p substrate) should be avoided. fig ure 39. exa mple of monolithic ic structure 13. ceramic capacitor when using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with temperature and the decrease in nominal capacitance due to dc bias and oth ers. 14. thermal s hutdown circuit(tsd) this ic has a built - in thermal shutdown circuit that prevents heat damage to the ic. normal operat ion should always be within the ics power dissipation rating. if however the rating is exceeded for a continued period, the junction temperatur e (tj) will rise which will activate the tsd circuit that will turn off all output pins. when the tj falls below the tsd threshold, the circuits are automatically restored to normal operat ion. note that the tsd circuit operates in a situation that exceeds the absol ute maximum ratings and therefore, under no circumstances, should the tsd circuit be used in a set design or for any purpose other than protecting the ic from heat damage. n n p + p n n p + p substrate gnd n p + n n p + n p p substrate gnd gnd parasitic elements pin a pin a pin b pin b b c e parasitic elements gnd parasitic elements c be transistor (npn) resistor n region close-by parasitic elements 18 / 21 ? 2013 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 tsz02201 - 0e3e0h300330 -1-2 21.aug.2014 rev.002 downloaded from: http:///
bd 6519fj bd6519 ordering information b d 6 5 1 9 f j - e 2 part n umber package fj: sop - j8 packaging and forming specification e2: embossed tape and reel marking diagram sop - j8 (top view) part number marki ng lot number 1 pin mark 19 / 21 ? 2013 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 tsz02201 - 0e3e0h300330 -1-2 21.aug.2014 rev.002 downloaded from: http:///
bd 6519fj physical dimension , tape and reel information package name sop -j8 20 / 21 ? 2013 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 tsz02201 - 0e3e0h300330 -1-2 21.aug.2014 rev.002 downloaded from: http:///
bd 6519fj revision history date revision changes 11.m ar.2013 001 new release 21 .aug .201 4 002 applied the rohm standard style and i mproved u nderstandability . 21 / 21 ? 2013 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 tsz02201 - 0e3e0h300330 -1-2 21.aug.2014 rev.002 downloaded from: http:///
datasheet d a t a s h e e t notice C ge rev.002 ? 2013 rohm co., ltd. all rights reserved. notice precaution on using rohm products 1. our products are designed and manufac tured for application in ordinary elec tronic equipments (such as av equipment, oa equipment, telecommunication equipment, home electroni c appliances, amusement equipment, etc.). if you intend to use our products in devices requiring ex tremely high reliability (such as medical equipment (note 1) , transport equipment, traffic equipment, aircraft/spacecra ft, nuclear power controllers, fuel c ontrollers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (specific applications), please consult with the rohm sale s representative in advance. unless otherwise agreed in writing by rohm in advance, rohm shall not be in any way responsible or l iable for any damages, expenses or losses incurred by you or third parties arising from the use of any ro hms products for specific applications. (note1) medical equipment classification of the specific applications japan usa eu china class class class b class class | class 2. rohm designs and manufactures its products subject to strict quality control system. however, semiconductor products can fail or malfunction at a certain rate. please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe desi gn against the physical injury, damage to any property, which a failure or malfunction of our products may cause. the following are examples of safety measures: [a] installation of protection circuits or other protective devices to improve system safety [b] installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. our products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditio ns, as exemplified below. accordin gly, rohm shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of an y rohms products under any special or extraordinary environments or conditions. if you intend to use our products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and c onfirmation of product performance, reliability, etc, prior to use, must be necessary: [a] use of our products in any types of liquid, incl uding water, oils, chemicals, and organic solvents [b] use of our products outdoors or in places where the products are exposed to direct sunlight or dust [c] use of our products in places where the products ar e exposed to sea wind or corrosive gases, including cl 2 , h 2 s, nh 3 , so 2 , and no 2 [d] use of our products in places where the products are exposed to static electricity or electromagnetic waves [e] use of our products in proximity to heat-producing components, plastic cords, or other flammable items [f] sealing or coating our products with resin or other coating materials [g] use of our products without cleaning residue of flux (ev en if you use no-clean type fluxes, cleaning residue of flux is recommended); or washing our products by using water or water-soluble cleaning agents for cl eaning residue after soldering [h] use of the products in places subject to dew condensation 4. the products are not subjec t to radiation-proof design. 5. please verify and confirm characteristics of the final or mounted products in using the products. 6. in particular, if a transient load (a large amount of load applied in a short per iod of time, such as pulse. is applied, confirmation of performance characteristics after on-boar d mounting is strongly recomm ended. avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading c ondition may negatively affect product performance and reliability. 7. de-rate power dissipation (pd) depending on ambient temper ature (ta). when used in seal ed area, confirm the actual ambient temperature. 8. confirm that operation temperat ure is within the specified range described in the product specification. 9. rohm shall not be in any way responsible or liable for fa ilure induced under deviant condi tion from what is defined in this document. precaution for mounting / circuit board design 1. when a highly active halogenous (chlori ne, bromine, etc.) flux is used, the resi due of flux may negatively affect product performance and reliability. 2. in principle, the reflow soldering method must be used; if flow soldering met hod is preferred, please consult with the rohm representative in advance. for details, please refer to rohm mounting specification downloaded from: http:///
datasheet d a t a s h e e t notice C ge rev.002 ? 2013 rohm co., ltd. all rights reserved. precautions regarding application examples and external circuits 1. if change is made to the constant of an external circuit, pl ease allow a sufficient margin considering variations of the characteristics of the products and external components, including transient characteri stics, as well as static characteristics. 2. you agree that application notes, re ference designs, and associated data and in formation contained in this document are presented only as guidance for products use. theref ore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. rohm shall not be in any way responsible or liable for any damages, exp enses or losses incurred by you or third parties arising from the use of such information. precaution for electrostatic this product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. please take proper caution in your manufacturing process and storage so that voltage exceeding t he products maximum rating will not be applied to products. please take special care under dry condit ion (e.g. grounding of human body / equipment / solder iron, isolation from charged objects, se tting of ionizer, friction prevention and temperature / humidity control). precaution for storage / transportation 1. product performance and soldered connections may deteriora te if the products are stor ed in the places where: [a] the products are exposed to sea winds or corros ive gases, including cl2, h2s, nh3, so2, and no2 [b] the temperature or humidity exceeds those recommended by rohm [c] the products are exposed to di rect sunshine or condensation [d] the products are exposed to high electrostatic 2. even under rohm recommended storage c ondition, solderability of products out of recommended storage time period may be degraded. it is strongly recommended to confirm sol derability before using products of which storage time is exceeding the recommended storage time period. 3. store / transport cartons in the co rrect direction, which is indicated on a carton with a symbol. otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. use products within the specified time after opening a humidity barrier bag. baking is required before using products of which storage time is exceeding the recommended storage time period. precaution for product label qr code printed on rohm products label is for rohms internal use only. precaution for disposition when disposing products please dispose them proper ly using an authorized industry waste company. precaution for foreign exchange and foreign trade act since our products might fall under cont rolled goods prescribed by the applicable foreign exchange and foreign trade act, please consult with rohm representative in case of export. precaution regarding intellectual property rights 1. all information and data including but not limited to application example contained in this document is for reference only. rohm does not warrant that foregoi ng information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. rohm shall not be in any way responsible or liable for infringement of any intellectual property rights or ot her damages arising from use of such information or data.: 2. no license, expressly or implied, is granted hereby under any intellectual property rights or other rights of rohm or any third parties with respect to the information contained in this document. other precaution 1. this document may not be reprinted or reproduced, in whol e or in part, without prior written consent of rohm. 2. the products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of rohm. 3. in no event shall you use in any wa y whatsoever the products and the related technical information contained in the products or this document for any military purposes, incl uding but not limited to, the development of mass-destruction weapons. 4. the proper names of companies or products described in this document are trademarks or registered trademarks of rohm, its affiliated companies or third parties. downloaded from: http:///
datasheet datasheet notice C we rev.001 ? 2014 rohm co., ltd. all rights reserved. general precaution 1. before you use our pro ducts, you are requested to care fully read this document and fully understand its contents. rohm shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny rohms products against warning, caution or note contained in this document. 2. all information contained in this docume nt is current as of the issuing date and subj ec t to change without any prior notice. before purchasing or using rohms products, please confirm the la test information with a rohm sale s representative. 3. the information contained in this doc ument is provi ded on an as is basis and rohm does not warrant that all information contained in this document is accurate an d/or error-free. rohm shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information. downloaded from: http:///

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