rclamp7524t final datasheet rev 5 revision date 10/24/2016 1 of 9 semtech features ? esd protection for high-speed data lines to iec 61000-4-2 (esd) 30kv (air), 25kv (contact) iec 61000-4-5 (lightning) 5a (8/20s) iec 61000-4-4 (eft) 40a (5/50ns) ? package design optimized for high speed lines ? flow-through design ? protects four high-speed lines ? low capacitance: 0.60pf maximum (i/o to ground) ? low esd clamping voltage ? low dynamic resistance: 0.50 ohms (typ) ? solid-state silicon-avalanche technology mechanical characteristics ? slp1308n5t 5-pin package (1.3 x 0.8 x 0.40mm) ? pb-free, halogen free, rohs/weee compliant ? lead pitch: 0.45mm ? lead fnish: nipdau ? marking: marking code ? packaging: tape and reel applications ? hdmi 1.3 and hdmi 1.4 ? v-by-one ? usb 3.0 ? mhl ? edp ? lvds interfaces ? esata interfaces rclamp7524t low capacitance rclamp? 4-line esd protection description railclamp? tvs arrays are ultra low capacitance esd protection devices designed to protect high speed data interfaces. this series has been specifcally engineered to protect sensitive components which are connected to high-speed data and transmission lines from overvoltage caused by esd (electrostatic discharge), cde (cable discharge events), and eft (electrical fast transients). the rclamp?7524t will protect four lines or two diferential pairs. each line has a maximum capacitance of only 0.60pf between any i/o pin and ground. this allows it to be used on circuits operating in excess of 5ghz without signal attenuation. they feature high maximum esd withstand voltage of +/- 25kv contact, +/-30kv air discharge per iec 61000-4-2. the rclamp7524t is in a 5-pin slp1308n5t package. it measures 1.3 x 0.8mm with a nominal height of 0.40mm. the innovative fow through package design simplifes pcb layout and allows matched trace lengths for consistant impedance between high speed diferential lines. the combination of small size, low capacitance, and high level of esd protection makes this device a fexible solution for applications such as hdmi, mhl, mddi, and edp interfaces. 1. 30 0. 40 0.80 0.45 bsc 0.50 bsc 1 2 1 3 4 5 2 package dimension schematic & pin confguration protection products www.semtech.com
rclamp7524t final datasheet rev 5 revision date 10/24/2016 2 of 9 semtech absolute maximum rating rating symbol value units peak pulse power (tp = 8/20s) p pk 75 w peak pulse current (tp = 8/20s) i pp 5 a esd per iec 61000-4-2 (air) (1) esd per iec 61000-4-2 (contact) (1) v esd 30 25 kv operating temperature t j -55 to +125 o c storage temperature t stg -55 to +150 o c electrical characteristics (t=25 o c unless otherwise specifed) parameter symbol conditions min. typ. max. units reverse stand-of voltage v rwm any i/o to gnd 5 v reverse breakdown voltage v br i br = 1ma, any i/o to gnd 6.5 9 11 v reverse leakage current i r v rwm = 5v, any i/o to gnd 5 100 na clamping voltage v c tp = 8/20s any i/o to gnd i pp = 1a 12 v i pp = 5a 15 esd clamping voltage 2 v c tp = 0.2/100ns any i/o to gnd i tlp = 4a 11 v i tlp = 16a 17 dynamic resistance 2,3 r dyn tp = 0.2/100ns 0.5 junction capacitance c j v r = 0v, f = 1mhz any i/o to gnd 0.5 0.6 pf between i/o pins 0.25 0.4 notes 1) measured with a 20db attenuator, 50 ohm scope input impedance, 2ghz bandwidth. esd gun return path connected to esd ground plane. 2) transmission line pulse test (tlp) settings: tp = 100ns, tr = 0.2ns, i tlp and v tlp averaging window: t1 = 70ns to t2 = 90ns. 3) dynamic resistance calculated from i tlp = 4a to i tlp = 16a www.semtech.com
rclamp7524t final datasheet rev 5 revision date 10/24/2016 3 of 9 semtech typical characteristics non-repetitive peak pulse power power derating curve clamping voltage vs. peak pulse current (between any i/o and ground) tlp characteristic (positive) 0 2 4 6 8 10 12 14 0 1 2 3 4 5 6 clamping voltage (v) peak pulse current - i pp (a) 5164.1 por current (a) voltage (v) transmission line pulse test (tlp) settings: t p =100ns, t r =0.2ns, i tlp and v tlp averaging window: t 1 =70ns to t 2 =90ns 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1 0 1 2 3 4 5 6 capacitacnce (pf) reversed voltage - v r (v) current (a) voltage (v) transmission line pulse test (tlp) settings: t p =100ns, t r =0.2ns, i tlp and v tlp averaging window: t 1 =70ns to t 2 =90ns 0.01 0.1 1 10 0.1 1 10 100 1000 peak pulse power - p pp (kw) pulse duration - tp (s) t a = 25 o c 0 20 40 60 80 100 120 0 25 50 75 100 125 150 % of rated power or i pp ambient temperature - t a ( o c) dr040514 - 25- 125- 150 junction capacitance vs. reverse voltage (between any i/o and ground) tlp characteristic (negative) www.semtech.com
rclamp7524t final datasheet rev 5 revision date 10/24/2016 4 of 9 semtech typical characteristics (continued) esd clamping (+8kv contact per iec 614000-4-2) (between any i/o to ground) esd clamping (-8kv contact per iec 614000-4-2) (between any i/o to ground) typical insetion loss s21 analog crosstalk -120 -110 -100 -90 -80 -70 -60 -50 -40 -30 -20 10 100 1000 crosstalk (db) frequency (mhz) -6 -5 -4 -3 -2 -1 0 10 100 1000 insertion loss (db) frequency (mhz) 0 10 20 30 40 50 60 70 -10 0 10 20 30 40 50 60 70 80 voltage (v) time (ns) measured with 50 ohm scope input impedance, 2ghz bandwidth. corrected for 50 ohm, 20db attenuator. esd gun return path connected to esd ground plane -70 -60 -50 -40 -30 -20 -10 0 -10 0 10 20 30 40 50 60 70 80 voltage (v) time (ns) measured with 50 ohm scope input impedance, 2ghz bandwidth. corrected for 50 ohm, 20db attenuator. esd gun return path connected to esd ground plane www.semtech.com
rclamp7524t final datasheet rev 5 revision date 10/24/2016 5 of 9 semtech application information assembly guidelines the small size of this device means that some care must be taken during the mounting process to insure reliable solder joint. the table below provides semtechs recommended assembly guidelines for mounting this device. the fgure at the right details semtechs recommended aperture based on the below recommendations. note that these are only recommendations and should serve only as a starting point for design since there are many factors that afect the assembly process. the exact manufacturing parameters will require some experimentation to get the desired solder application. assembly parameter recommendation solder stencil design laser cut, electro-polished aperture shape rectangular solder stencil thickness 0.100 mm (0.004) solder paster type type 4 size sphere or smaller solder refow profle per jedec j-std-020 pcb solder pad design non-solder mask defned pcb pad finish osp or niau all dimensions are in mm . component land pad. stencil opening 0. 250 0. 025 0. 450 0. 025 0. 020 0. 450 0. 500 0. 180 0. 250 0. 800 1 . 300 recommended mounting pattern www.semtech.com
rclamp7524t final datasheet rev 5 revision date 10/24/2016 6 of 9 semtech application information application information hdmi 1.4 type a connector rclamp 7528 t rclamp 7524 t rclamp 7524 t rclamp 7524t vbus tmds- tmds+ cbus gnd hdmi 1.4 layout with rclamp7524t mhl layout with rclamp7524t www.semtech.com
rclamp7524t final datasheet rev 5 revision date 10/24/2016 7 of 9 semtech outline drawing - slp1308n5t land pattern - slp1308n5t e bbb c a b b bbb aaa n e d dim a1 a2 a 0. 23 0.13 0.18 0. 08 0. 10 5 1.30 0. 45 bsc millimeters max 0.05 0.43 dimensions min 0.00 nom 0.37 0.02 ( 0.13) 0.40 controlling dimensions are in millimeters ( angles in degrees ). notes : 1. 0.80 e 1.40 1.20 0.70 0.90 a b pin 1 indicator (laser mark) aaa c c seating plane e1 0.50 bsc l 0.20 0.25 0.30 1 n 2 e1/2 e1 d e a 2 a 1 a d /2 e /2 lxn bxn this land pattern is for reference purposes only . consult your manufacturing group to ensure your notes: 2. dim x y p1 g c millimeters (0 .65) 0 .18 0 .40 0 .50 0 .25 dimensions company ' s manufacturing guidelines are met. 1 .05 z 1. controlling dimensions are in millimeters ( angles in degrees). p 0 .45 x p y z g ( c ) p 1/ 2 p1 www.semtech.com
rclamp7524t final datasheet rev 5 revision date 10/24/2016 8 of 9 semtech marking code 7524t yyww note: yyww = date code tape and reel specifcation ordering information part number qty per reel reel size rclamp7524t.tnt 10,000 7 pin 1 location ( towards sprocket holes) user direction of feed 7524 t yyww 7524 t yyww 7524 t yyww 7524 t yyww 7524 t yyww 7524 t yyww www.semtech.com
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