bulletin # 1607271 _____________________________________________________________________________________________________ w7206f2 silicon labs bulletin rev q the information contained in this document is proprietary to silicon laboratories, inc. and shall not be reproduced or used in part or whole without silicon laboratories written consent. the document is uncontrolled if printed or electronically saved. pg 3 user registration register today to create your account on silabs.com. your personalized profile allows you to receive technical document updates, new product announcements, ?how - to? and design documents, product change notices (pcn) and other valuable content available only to registered users . http://www.silabs.com/profile bulletin date: 7/27/2016 bulletin effective date: 7/27/2016 title: si7050/1/3/4/5 d ata s heet update from rev 1.13 to rev 1.14 bulletin details description: the si7050/1/3/4/5 data sheet was updated from revision 1.13 to revision 1.14. the following changes were made: ? updated ?no hold master mode? diagram in "5.1. issuing a measurement command" on page 13. ? updated diagram in "5.4. firmware revision" on page 16. ? updated notes in table 14, ?pcb land pattern dimensions,? on page 21 to rem ove un ne cessary recommendation about a need for no clean solder paste. reason: correcting minor errors found in data sheet. product identification: si7050 - a20 - im, si7050 - a20 - imr si7051 - a20 - im, si7051 - a20 - imr si7053 - a20 - im, si7053 - a20 - imr si7054 - a20 - im, si7054 - a20 - imr si7055 - a20 - im, si7055 - a20 - imr si7055 - a20 - zm, si7055 - a20 - zmr this change is considered a minor change which does not affect form, fit, function, quality, or reliability. the information is being provided as a customer cour tesy. please contact your local silicon lab s sales representative with any questions about this notification. a list of silicon labs sales representatives may be found at www.silabs.com customer actions needed: review document change list on page 25 of the data sheet .
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