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1. product profile 1.1 general description the X3G-OH047, x3g-oh048, x3t-oh047 and x3t-oh048 are sensitive magnetic field sensors, employing the magneto-resistive effe ct of thin film pe rmalloy. the sensors contain two parallel supplied wheatstone bridges at a relative angle of 45 ? to each other. a rotating magnetic field in the surface parallel to the ch ip (x-y plane) will deliver two independent sinusoidal output signals, one following a cos(2 ? ) and the other following asin(2 ? ) function, ? being the angle between sens or and field direction (see figure 5 and figure 6 ). the X3G-OH047, x3g-oh048, x3t-oh047 and x3t-oh048 are suited for high precision angle measurement applications under low field conditions (saturation field strength 25 ka/m). the sensors can be operated at any frequency between dc and 1 mhz. all type numbers shown in this data sheet are valid for a single-die (single sensor). the double-die has two magnetic field sensor s with electrical and magnetic parameters which fulfill the specified si ngle-die values and do not correlate to each other. X3G-OH047; x3t-oh047; x3g-oh048; x3t-oh048 magnetic field sensor rev. 1 ? 4 april 2011 product specification table 1. product overview type number sensor packing X3G-OH047 double-die sawn wafer; on foil x3g-oh048 single-die sawn wafer; on foil x3t-oh047 double-die taped on reel x3t-oh048 single-die taped on reel
x3g_t_oh047_048 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product specification rev. 1 ? 4 april 2011 2 of 19 nxp semiconductors X3G-OH047/8; x3t-oh047/8 magnetic field sensor 1.2 features and benefits ? accurate and reliable angle measurement ? mechanical robustness, contactless principle ? wear-free operation ? accuracy independent of mechanical tolerances ? extended temperature range 1.3 applications kmz44 is an internal name which is visible on the die fig 1. sensor die 001aan663 ? steering angle and torsion ? window wipers ? headlight adjustment ? fuel level ? motor positioning ? mirror positioning
x3g_t_oh047_048 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product specification rev. 1 ? 4 april 2011 3 of 19 nxp semiconductors X3G-OH047/8; x3t-oh047/8 magnetic field sensor 1.4 quick reference data [1] applicable for bridge 1 and bridge 2. [2] v m = ? v o(max) ? v offset ? . periodicity of v m : sin(2 ? ) and cos(2 ? ), respectively. [3] [4] bridge resistance between pad 5 to pad 1 and pad 4 to pad 2. 2. pinning information table 2. quick reference data t amb =25 ? c; h ext =25ka/m; v cc = 5 v; unless otherwise specified. symbol parameter conditions min typ max unit v cc supply voltage - 5 9 v v m peak voltage see figure 3 [1] [2] 60 67 75 mv v offset offset voltage per supply voltage; see figure 3 [1] ? 2- +2mv/v tc v(offset) offset voltage temperature coefficient per supply voltage; t amb = ? 40 ? c to +150 ?c; see figure 3 [1] [3] ? 2- +2( ? v/v)/k r bridge bridge resistance [1] [4] 2.7 3.2 3.7 k ? tc v offset ?? v offset at 150 ? c ?? v offset at 40 ? ? c ?? ? 150 ? c40 ? ? c ?? ? -------------------------------------------------------------------------------------------------- = table 3. pinning pad symbol description simplified outline 1 on1 output voltage bridge 1 2 on2 output voltage bridge 2 3 gnd common ground 4 op2 output voltage bridge 2 5 op1 output voltage bridge 1 6v cc common bridge supply voltage 1 2 3 6 5 4 001aan662
x3g_t_oh047_048 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product specification rev. 1 ? 4 april 2011 4 of 19 nxp semiconductors X3G-OH047/8; x3t-oh047/8 magnetic field sensor 3. ordering information 4. circuit diagram 5. limiting values [1] minimum stimulating magnetic field parallel to th e chip surface (x-y plane) to achieve specified angular accuracy. table 4. ordering information type number package name description version X3G-OH047 bare die double-die; sawn wafer; on foil ol-X3G-OH047 x3g-oh048 bare die single-die; sawn wafer; on foil ol-x3g-oh048 x3t-oh047 bare die double-die; taped on reel ol-x3t-oh047 x3t-oh048 bare die single-die; taped on reel ol-x3t-oh048 fig 2. device and test circuit diagram 008aaa264 v cc v cc v op1 v o1 v on1 v op2 v o2 v on2 op1 gnd on1 cos r12 r14 r13 r11 bridge 1 X3G-OH047/8; x3t-oh047/8 op2 on2 sin r22 r24 r23 r21 bridge 2 v v v v v v table 5. limiting values in accordance with the absolute maximum rating system (iec 60134). symbol parameter conditions min max unit v cc supply voltage - 9 v h ext external magnetic field strength [1] 25 - ka/m t amb ambient temperature ? 40 +150 ?c
x3g_t_oh047_048 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product specification rev. 1 ? 4 april 2011 5 of 19 nxp semiconductors X3G-OH047/8; x3t-oh047/8 magnetic field sensor 6. characteristics [1] minimum stimulating magnetic field parallel to the ch ip surface (x-y plane) to achieve angular inaccuracy. [2] applicable for bridge 1 and bridge 2. [3] v m = ? v o(max) ? v offset ? . periodicity of v m : sin(2? ) and cos(2 ? ), respectively. [4] [5] bridge resistance between pad 5 to pad 1 and pad 4 to pad 2. [6] [7] [8] [9] [10] [11] ; v offset = 0 v; inaccuracy of angular measurement due to devia tions from ideal sinusoi dal characteristics, calculated from the third and fifth harmonics of the spectrum v o . table 6. characteristics t amb =25 ? c; h ext =25ka/m [1] ; v cc = 5 v; unless otherwise specified. symbol parameter conditions min typ max unit v cc supply voltage - 5 9 v v m peak voltage see figure 3 [2] [3] 60 67 75 mv tc vm peak voltage temperature coefficient t amb = ? 40 ? c to +150 ?c [2] [4] ? 0.30 ? 0.36 ? 0.42 %/k r bridge bridge resistance [2] [5] 2.7 3.2 3.7 k ? tc r(bridge) bridge resistance temperature coefficient t amb = ? 40 ? c to +150 ?c [2] [6] 0.24 0.27 0.29 %/k v offset offset voltage per supply voltage; see figure 3 [2] ? 2- +2mv/v tc v(offset) offset voltage temperature coefficient per supply voltage; t amb = ? 40 ? c to +150 ? c; see figure 3 [2] [7] ? 2- +2( ? v/v)/k v o(hys) hysteresis output voltage see figure 4 [2] [8] 0 0.050.18%fs ? angular velocity 0 - 1 mhz k amplitude synchronism [9] 98.9 100 101.1 % tc k amplitude synchronism temperature coefficient t amb = ? 40 ? c to +150 ?c [10] ? 0.01 0 +0.01 %/k ?? angular inaccuracy [11] 0 0.05 0.1 deg tc vm v m at 150 ? c ?? v m at 40 ? ? c ?? ? v m at 25 ? c ?? 150 ? c40 ? ? c ?? ? ?? ? -------------------------------------------------------------------------------------------- - = tc rbridge ?? r bridge at 150 ? c ?? r bridge at 40 ? ? c ?? ? r bridge at 25 ? c ?? 150 ? c40 ? ? c ?? ? ?? ? ------------------------------------------------------------------------------------------------------- = tc v offset ?? v offset at 150 ? c ?? v offset at 40 ? ? c ?? ? 150 ? c40 ? ? c ?? ? -------------------------------------------------------------------------------------------------- = v ohys ?? 1 v o1 67 . 5 ? ?? 135 ? 45 ?? v o1 67 . 5 ? ?? 45 ? 135 ?? ? 2v m1 ? --------------------------------------------------------------------------------------------------------------------------- = v ohys ?? 2 v o2 22 . 5 ? ?? 90 ? 0 ?? v o2 22 . 5 ? ?? 0 ? 90 ?? ? 2v m2 ? --------------------------------------------------------------------------------------------------------------- = k v m1 v m2 --------- - = tc k kat 150 ? c ?? kat 40 ? ? c ?? ? kat 25 ? c ?? 150 ? c40 ? ? c ?? ? ?? ? --------------------------------------------------------------------------------------- - = ?? ? real ? meas ?=
x3g_t_oh047_048 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product specification rev. 1 ? 4 april 2011 6 of 19 nxp semiconductors X3G-OH047/8; x3t-oh047/8 magnetic field sensor fig 3. output signals related to the direction of the magnetic field fig 4. definition of hysteresis 008aaa265 0 v o (mv) v offset2 0 90 180 360 270 (deg) v o2 v m2 v o1 008aaa266 (deg) 0 135 90 45 0 v o (mv) v o(hys)2 v o1 v o2 v o(hys)1
x3g_t_oh047_048 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product specification rev. 1 ? 4 april 2011 7 of 19 nxp semiconductors X3G-OH047/8; x3t-oh047/8 magnetic field sensor 7. bare die outline fig 5. bare die outline (single die) table 7. mechanical dimensions for figure 5 symbol parameter x y radius/diameter unit ld die size 1150 1150 - ? m ls sawing lane width 60 60 - ? m rp reading point position 575 642 - ? m rs sensitive area radius - - 480 ? m pd pad diameter - - 110 ? m 1 position pad 1 108 230 - ? m 2 position pad 2 243 125 - ? m 3 position pad 3 489 95 - ? m 4 position pad 4 632 95 - ? m 5 position pad 5 900 125 - ? m 6 position pad 6 1032 200 - ? m 001aan691 1 2 3 4 5 6 x = 0, y = 0 rpy lsy ldy pd rpx ldx h ext x y r13 r12 r11 r14 r22 r21 r24 r23 lsx bridge 1 (cos) rs bridge 2 (sin)
x3g_t_oh047_048 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product specification rev. 1 ? 4 april 2011 8 of 19 nxp semiconductors X3G-OH047/8; x3t-oh047/8 magnetic field sensor fig 6. bare die outline (double die) 001aan692 x = 0, y = 0 rpy lsy ldy pd rp1x rp2x ldx bridge 1 (cos) bridge 2 (sin) lsx h ext x y 1 2 3 4 5 6 7 8 9 10 11 12 r13 r12 r11 r14 r22 r21 r24 r23 rs table 8. mechanical dimensions for figure 6 symbol parameter x y radius/diameter unit ld die size 2360 1150 ? m ls sawing lane width 60 60 ? m rp1 reading point position 1 575 642 ? m rp2 reading point position 2 1785 642 ? m rs sensitive area radius - - 480 ? m pd pad diameter - - 110 ? m 1 position pad 1 108 230 ? m 2 position pad 2 243 125 ? m 3 position pad 3 489 95 ? m 4 position pad 4 632 95 ? m 5 position pad 5 900 125 ? m 6 position pad 6 1032 200 ? m 7 position pad 7 1318 230 ? m 8 position pad 8 1453 125 ? m 9 position pad 9 1699 95 ? m
x3g_t_oh047_048 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product specification rev. 1 ? 4 april 2011 9 of 19 nxp semiconductors X3G-OH047/8; x3t-oh047/8 magnetic field sensor 8. packing information 8.1 tape construction for X3G-OH047 and x3g-oh048 10 position pad 10 1842 95 ? m 11 position pad 11 2110 125 ? m 12 position pad 12 2242 200 ? m table 8. mechanical dimensions for figure 6 ?continued symbol parameter x y radius/diameter unit table 9. wafer dimensions symbol parameter value unit wd wafer diameter 150 mm wt wafer thickness 380 ? 15 ? m fig 7. tape construction 019aab732 liner (pet) adhesive (acrylic) base film (pe) (38 m) (10 m) (65 m) table 10. material composition parameter content typical value unit total thickness - 75 ? m adhesion - 55 / 20 g/mm ionic impurity na + 0.027 ? g/ml k + <0.004 ? g/ml cl 0.045 ? g/ml
xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxx x x x xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xx xx xxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxx x x xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxx xxx x3g_t_oh047_048 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product specification rev. 1 ? 4 april 2011 10 of 19 nxp semiconductors X3G-OH047/8; x3t-oh047/8 magnetic field sensor fig 8. geometrical dimensions of frame 019aab727 b ?195 ?3.175 h6 (2) r (2) ?227 -0.5 0 216 b01 ejector marks and sprue marks on this side below the surface min 0.05 max 0.2 79.42 4 0.3 71.5 0.3 148 2 216 1b r1 max 0.8 a 60 20 +2 0 2.5 +0.05 0 30 30 a 1 b 0.2 0.2 b 0.2 b 2 b 0.2
x3g_t_oh047_048 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product specification rev. 1 ? 4 april 2011 11 of 19 nxp semiconductors X3G-OH047/8; x3t-oh047/8 magnetic field sensor fig 9. film frame carrier (ffc) with barcode label 019aab728 for example 69594. 030 the barcode label consists of several numbers which are explained below: the first digits of the barcode show the batch number the last three digits of the barcode show the wafer number for example 69594 .030
x3g_t_oh047_048 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product specification rev. 1 ? 4 april 2011 12 of 19 nxp semiconductors X3G-OH047/8; x3t-oh047/8 magnetic field sensor fig 10. wafer position to frame an d double die position to wafer 019aab731 wafer position to frame double die parallel to flat flat
x3g_t_oh047_048 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product specification rev. 1 ? 4 april 2011 13 of 19 nxp semiconductors X3G-OH047/8; x3t-oh047/8 magnetic field sensor 8.2 carrier tape for x3t-oh047 and x3t-oh048 fig 11. tape outline, carrier tape x3t-oh048 table 11. dimensions for figure 11 ? tape outline, carrier tape x3t-oh048 ? item symbol specification dimension [mm] tolerance overall dimensions tape width w 8 ? 0.1 thickness k ? 1.2 - distance g ? 0.75 - sprocket holes diameter d 0 1.5 ? 0.1 distance e 1.75 ? 0.1 pitch [1] p 0 4 ? 0.1 distance between center lines length direction p 2 2 ? 0.05 width direction f 3.5 ? 0.05 compartments length a 0 1.4 ? 0.05 width b 0 1.4 ? 0.05 depth k 0 0.8 ? 0.05 hole diameter d 1 0.5 ? 0.1 pitch p 4 ? 0.1 device outline x3t-oh048 rotation ?? 20 ? - carrier tape antistatic film thickness [2] t0 . 2 5 ? 0.07 019aab730 w 1 b feed direction position of pad 1 w f b e a-a k b-b a a 0 d 1 p ad 0 p 0 p 2 k 0 t 1 t g b 0
x3g_t_oh047_048 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product specification rev. 1 ? 4 april 2011 14 of 19 nxp semiconductors X3G-OH047/8; x3t-oh047/8 magnetic field sensor [1] cumulate pitch error ? 0.2 over 10 pitch. [2] carbon loaded polystyrene 100 % recyclable. cover tape width w 1 ? 5.75 - film thickness t 1 ? 0.1 - bending radius in winding direction r ? 30 - fig 12. tape outline, carrier tape x3t-oh047 table 12. dimensions for figure 12 ? tape outline, carrier tape x3t-oh047 ? item symbol specification dimension [mm] tolerance overall dimensions tape width w 8 ? 0.1 distance g ? 0.75 - sprocket holes diameter d 0 1.5 ? 0.1 distance e 1.75 ? 0.1 pitch [1] p 0 4 ? 0.1 table 11. dimensions for figure 11 ? tape outline, carrier tape x3t-oh048 ? ?continued item symbol specification dimension [mm] tolerance t t 1 k 0 w 1 a p 1 p 2 /p 3 d 1 b w ad 0 p 0 detail z 50:1 section b-b measurement method of compartment dimensions section a-a pad 1 feed direction 019aab729 b g f 0 /f 2 b 0 a 0 z e d
x3g_t_oh047_048 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product specification rev. 1 ? 4 april 2011 15 of 19 nxp semiconductors X3G-OH047/8; x3t-oh047/8 magnetic field sensor [1] cumulate pitch error ? 0.2 over 10 pitch. [2] carbon loaded polystyrene 100 % recyclable. distance between center lines sprocket hole / cavity center p 2 2 ? 0.05 sprocket hole / cavity hole p 3 2 ? 0.05 sprocket hole / cavity center f 0 3.5 ? 0.05 sprocket hole / cavity hole f 2 3.5 ? 0.05 compartments length a 0 1.4 ? 0.05 width overall b 0 2.7 ? 0.05 depth k 0 0.5 ? 0.05 hole diameter d 1 0.5 ? 0.1 pitch p 1 4 ? 0.1 device outline x3t-oh047 rotation ?? 15 ? - carrier tape antistatic film thickness [2] t0 . 2 5 ? 0.07 bend ?? 0.3 - cover tape width w 1 5.3 ? 0.1 film thickness t 1 0.05 ? 0.01 bending radius in winding direction r ? 30 - table 12. dimensions for figure 12 ? tape outline, carrier tape x3t-oh047 ? ?continued item symbol specification dimension [mm] tolerance
x3g_t_oh047_048 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product specification rev. 1 ? 4 april 2011 16 of 19 nxp semiconductors X3G-OH047/8; x3t-oh047/8 magnetic field sensor 9. revision history fig 13. chip position and pad 1 location for x3t-oh048 fig 14. chip position and pad 1 location for x3t-oh047 019aab734 pad 1 w b 0 p 1 diagonale a 0 d 0 p 10 k 0 p 0 t camber p 2 /p 3 d 1 e 1 f 0 /f 2 019aab733 pad 1 table 13. revision history document id release date data sheet status change notice supersedes x3g_t_oh047_048 v.1 20110404 product specification - -
x3g_t_oh047_048 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product specification rev. 1 ? 4 april 2011 17 of 19 nxp semiconductors X3G-OH047/8; x3t-oh047/8 magnetic field sensor 10. legal information 10.1 data sheet status [1] please consult the most recently issued document before initiating or completing a design. [2] the term ?short data sheet? is explained in section ?definitions?. [3] the product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple device s. the latest product status information is available on the internet at url http://www.nxp.com . 10.2 definitions draft ? the document is a draft versi on only. the content is still under internal review and subject to formal approval, which may result in modifications or additions. nxp semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall hav e no liability for the consequences of use of such information. short data sheet ? a short data sheet is an extract from a full data sheet with the same product type number(s) and title. a short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. for detailed and full information see the relevant full data sheet, which is available on request vi a the local nxp semiconductors sales office. in case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. product specification ? the information and data provided in a product data sheet shall define the specification of the product as agreed between nxp semiconductors and its customer , unless nxp semiconductors and customer have explicitly agreed otherwis e in writing. in no event however, shall an agreement be valid in which the nxp semiconductors product is deemed to offer functions and qualities beyond those described in the product data sheet. 10.3 disclaimers limited warranty and liability ? information in this document is believed to be accurate and reliable. however, nxp semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. in no event shall nxp semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. notwithstanding any damages that customer might incur for any reason whatsoever, nxp semiconductors? aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the terms and conditions of commercial sale of nxp semiconductors. right to make changes ? nxp semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. this document supersedes and replaces all information supplied prior to the publication hereof. suitability for use in automotive applications ? this nxp semiconductors product has been qua lified for use in automotive applications. the product is not desi gned, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of an nxp semiconductors product can reasonably be ex pected to result in personal injury, death or severe property or environmental dam age. nxp semiconductors accepts no liability for inclusion and/or use of nxp semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer?s own risk. applications ? applications that are described herein for any of these products are for illustrative purpos es only. nxp semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. customers are responsible for the design and operation of their applications and products using nxp semiconductors products, and nxp semiconductors accepts no liability for any assistance with applications or customer product design. it is customer?s sole responsibility to determine whether the nxp semiconductors product is suitable and fit for the customer?s applications and products planned, as well as fo r the planned application and use of customer?s third party customer(s). customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. nxp semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer?s applications or products, or the application or use by customer?s third party customer(s). customer is responsible for doing all necessary testing for the customer?s applic ations and products using nxp semiconductors products in order to av oid a default of the applications and the products or of the application or use by customer?s third party customer(s). nxp does not accept any liability in this respect. limiting values ? stress above one or more limiting values (as defined in the absolute maximum ratings system of iec 60134) will cause permanent damage to the device. limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the recommended operating conditions section (if present) or the characteristics sections of this document is not warranted. constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. terms and conditions of commercial sale ? nxp semiconductors products are sold subject to the gener al terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms , unless otherwise agreed in a valid written individual agreement. in case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. nxp semiconductors hereby expressly objects to applying the customer?s general terms and conditions with regard to the purchase of nxp semiconducto rs products by customer. no offer to sell or license ? nothing in this document may be interpreted or construed as an offer to sell products t hat is open for acceptance or the grant, conveyance or implication of any lic ense under any copyrights, patents or other industrial or intellectual property rights. document status [1] [2] product status [3] definition objective [short] data sheet development this document contains data from the objecti ve specification for product development. preliminary [short] data sheet qualification this document contains data from the preliminary specification. product [short] data sheet production this document contains the product specification.
x3g_t_oh047_048 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product specification rev. 1 ? 4 april 2011 18 of 19 nxp semiconductors X3G-OH047/8; x3t-oh047/8 magnetic field sensor export control ? this document as well as the item(s) described herein may be subject to export control regu lations. export might require a prior authorization from national authorities. quick reference data ? the quick reference data is an extract of the product data given in the limiting values and characteristics sections of this document, and as such is not comple te, exhaustive or legally binding. 10.4 trademarks notice: all referenced brands, produc t names, service names and trademarks are the property of their respective owners. 11. contact information for more information, please visit: http://www.nxp.com for sales office addresses, please send an email to: salesaddresses@nxp.com
nxp semiconductors X3G-OH047/8; x3t-oh047/8 magnetic field sensor ? nxp b.v. 2011. all rights reserved. for more information, please visit: http://www.nxp.com for sales office addresses, please se nd an email to: salesaddresses@nxp.com date of release: 4 april 2011 document identifier: x3g_t_oh047_048 please be aware that important notices concerning this document and the product(s) described herein, have been included in section ?legal information?. 12. contents 1 product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.1 general description . . . . . . . . . . . . . . . . . . . . . 1 1.2 features and benefits . . . . . . . . . . . . . . . . . . . . 2 1.3 applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 1.4 quick reference data . . . . . . . . . . . . . . . . . . . . 3 2 pinning information . . . . . . . . . . . . . . . . . . . . . . 3 3 ordering information . . . . . . . . . . . . . . . . . . . . . 4 4 circuit diagram . . . . . . . . . . . . . . . . . . . . . . . . . 4 5 limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 4 6 characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 5 7 bare die outline . . . . . . . . . . . . . . . . . . . . . . . . . 7 8 packing information . . . . . . . . . . . . . . . . . . . . . 9 8.1 tape construction for X3G-OH047 and x3g-oh048 . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 8.2 carrier tape for x3t-oh047 and x3t-oh048. 13 9 revision history . . . . . . . . . . . . . . . . . . . . . . . . 16 10 legal information. . . . . . . . . . . . . . . . . . . . . . . 17 10.1 data sheet status . . . . . . . . . . . . . . . . . . . . . . 17 10.2 definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 10.3 disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 10.4 trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 18 11 contact information. . . . . . . . . . . . . . . . . . . . . 18 12 contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19

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