questions? contact us: marketing@amkor.com visit amkor technology online for locations and to view the most current product information. ds831c rev date: 9/15 features ? die sizes up to 26 mm ? package sizes from 10 mm to 55 mm (60 mm and 65 mm in development) ? 0.4 mm, 0.5 mm, 0.65 mm, 0.8 mm and 1.0 mm pitch bga footprints ? 130 m minimum array bump pitch ? < 100 m minimum peripheral bump pitch technology options ? substrates C 4-16 layer laminate build up substrates C high cte ceramic C ltcc alumina ceramic C coreless ? bump types C eutectic sn/pb C high pb C pb free C cu pillar (array and fine pitch peripheral) ? package formats C bare die C lidded thermal solutions the variety of FCBGA package options allows package selection to be tailored to the specific thermal needs of the end product. high performance asic products typically utilize a lidded format that features a controlled bondline die attach direct to a copper heat spreader. this feature produces the lowest possible thermal resistance (theta jc) between the package and any externally applied thermal solution. the copper heat spreader effectively spreads heat laterally away from the die to the package perimeter and into the motherboard. lower wattage products generally utilize bare die or molded configurations. in these cases, the flip chip construction, with solder bumps and core vias, provides a lower resistance path from the active side of the die through the substrate, allowing heat dissipation both from the package surface and into the motherboard. flip chip bga packages (FCBGA) flip chip interconnect utilizes array interconnect of die to substrate as a replacement for conventional wire bonding. this allows the entire die surface to be used for electrical connections to the substrate, exponentially increasing the i/o per unit area vs. perimeter interconnect technologies. using flip chip interconnect improves package electrical performance by removing the high inductance wires and replacing them with low inductance solder connections. flip chip interconnect also allows highly parallel, direct connection with on-die power planes, which enables performance at lower operating voltages. amkor FCBGA packages are assembled around state-of-the- art, single unit laminate or ceramic substrates. utilizing multiple high density routing layers, laser drilled blind, buried, and stacked vias, and ultra fine line/space metallization, FCBGA substrates have the highest routing density available. by combining flip chip interconnect with ultra advanced substrate technology, FCBGA packages can be electrically tuned for maximum electrical performance. once the electrical function is defined, the design flexibility enabled by flip chip also allows for significant options in final package design. amkor offers FCBGA packaging in a variety of product formats to fit a wide range of end application requirements. applications this ic packaging technology is applicable for high pincount and/or high performance asics. large body FCBGAs provide package solutions for the demands of internet, workstation processors and high bandwidth system communication devices. by incorporating flip chip interconnect technology, packages supporting thousands of connections are enabled in conventional surface mount package sizes. FCBGAs are also the package of choice for gaming system processors and graphics, as well as high- end applications processors for leading-edge portable devices. FCBGA laminate data sheet
questions? contact us: marketing@amkor.com visit amkor technology online for locations and to view the most current product information. ds831c rev date: 9/15 cross-section FCBGA additional package options ? wafer node - 28 nm qualified, 20 nm in development ? smt components on top or bottom side ? multi-die capability ? memory components on top side ? variety of lid material options ? grounded lid ? custom bga footprints test services ? program generation/conversion ? product engineering ? available test/handling technology ? burn-in capabilities shipping ? standard jedec trays FCBGA lidded FCBGA bare die FCBGA configuration options full array ball counts (ball count shown indicates maximum package size produced to date) body size 0.4 mm 0.5 mm 0.65 mm 0.8 mm 1 mm body size 0.4 mm 0.5 mm 0.65 mm 0.8 mm 1 mm ball count ball count ball count ball count ball count ball count ball count ball count ball count ball count 10 576 361 196 121 81 31 1369 900 11 676 441 256 144 100 33 1600 1024 12 841 529 289 196 121 35 1764 1156 13 961 625 361 225 144 37.5 2025 1296 14 1156 729 400 256 169 40 1521 15 1296 841 484 289 196 42.5 1681 16 1521 961 529 361 225 45 1936 17 625 400 256 47.5 2116 19 784 484 324 50 2401 21 961 625 400 52.5 2601 23 1156 729 484 55 2916 25 1369 900 576 57.5 3136 27 1024 676 60 3481 29 1225 784 65 4096 laminate data sheet with respect to the information in this document, amkor makes no guarantee or warranty of its accuracy or that the use of such information will not infringe upon the intellectual rights of third parties. amkor shall not be responsible for any loss or damage of whatever nature resulting from the use of, or reliance upon it and no patent or other license is implied hereby. this document does not in any way extend or modify amkors warranty on any product beyond that set forth in its standard terms and conditions of sale. amkor reserves the right to make changes in its product and specifications at any time and without notice. the amkor name and logo are registered trademarks of amkor technology, inc. all other trademarks mentioned are property of their respective companies. ? 2015, amkor technology incorporated. all rights reserved.
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