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november 2009 doc id 10869 rev 4 1/22 1 VN750PEP-E high side driver features ecopack ? : lead free and rohs compliant automotive grade: compliance with aec guidelines cmos compatible input on-state open-load detection off-state open-load detection shorted load protection undervoltage and overvoltage shutdown protection against loss of ground very low standby current reverse battery protection (see application schematic on page 13 ) in compliance with the 2002/95/ec european directive description the VN750PEP-E is a monolithic device designed in stmicroelectronics vipower? m0-3 technology, intended for driving any kind of load with one side connected to ground. active v cc pin voltage clamp protects the device against low energy spikes (see iso7637 transient compatibility table). acti ve current limitation combined with thermal shutdown and automatic restart help protect the device against overload. the device detects open load condition in on and off-state. output shorted to v cc is detected in the off-state. device automatically turns off in case of ground pin disconnection. type r ds(on) i out v cc VN750PEP-E 60 m 6 a 36 v powersso-12 table 1. device summary package order codes tube tape and reel powersso-12 VN750PEP-E vn750peptr-e www.st.com obsolete product(s) - obsolete product(s) obsolete product(s) - obsolete product(s) obsolete product(s) - obsolete product(s)
contents VN750PEP-E 2/22 doc id 10869 rev 4 contents 1 block diagram and pin description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 2 electrical specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 2.1 absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 2.2 thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 2.3 electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 2.4 gnd protection network against reverse battery . . . . . . . . . . . . . . . . . . . 13 2.4.1 solution 1: resistor in the ground line (rgnd only) . . . . . . . . . . . . . . . . 13 2.4.2 solution 2: diode (dgnd) in the ground line . . . . . . . . . . . . . . . . . . . . . 14 2.5 load dump protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 2.6 microcontroller i/os protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 2.7 open-load detection in off-state . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 3 package and pcb thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 3.1 powersso-12 thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 4 package and packing information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 4.1 ecopack ? packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 4.2 powersso-12 mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 5 revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 obsolete product(s) - obsolete product(s) obsolete product(s) - obsolete product(s) obsolete product(s) - obsolete product(s)
VN750PEP-E list of tables doc id 10869 rev 4 3/22 list of tables table 1. device summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 table 2. suggested connections for unused and not connected pins . . . . . . . . . . . . . . . . . . . . . . . . 5 table 3. absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 table 4. thermal data. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 table 5. power . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 table 6. switching (v cc =13 v) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 table 7. input pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 table 8. v cc output diode. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 table 9. status pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 table 10. protections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 table 11. open-load detection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 table 12. truth table. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 table 13. electrical transient requirements on v cc pin (part 1/3). . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 table 14. electrical transient requirements on v cc pin (part 2/3). . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 table 15. electrical transient requirements on v cc pin (part 3/3). . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 table 16. powersso-12 thermal parameter . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 table 17. powersso-12 mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 table 18. document revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 obsolete product(s) - obsolete product(s) obsolete product(s) - obsolete product(s) obsolete product(s) - obsolete product(s)
list of figures VN750PEP-E 4/22 doc id 10869 rev 4 list of figures figure 1. block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 figure 2. configuration diagram (top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 figure 3. current and voltage conventions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 figure 4. status timings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 figure 5. switching time waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 figure 6. waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 figure 7. application schematic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 figure 8. open-load detection in off-state . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 figure 9. powersso-12 pc board. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 figure 10. rthj-amb vs pcb copper area in open box free air condition . . . . . . . . . . . . . . . . . . . . . . 16 figure 11. p 2 pak thermal impedance junction ambien t single pulse . . . . . . . . . . . . . . . . . . . . . . . . . 17 figure 12. powersso-12 thermal fitting model of a single channel . . . . . . . . . . . . . . . . . . . . . . . . . . 17 figure 13. powersso-12 package dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 obsolete product(s) - obsolete product(s) obsolete product(s) - obsolete product(s) obsolete product(s) - obsolete product(s)
VN750PEP-E block diagra m and pin description doc id 10869 rev 4 5/22 1 block diagram and pin description figure 1. block diagram figure 2. configurati on diagram (top view) table 2. suggested connections for unused and not connected pins connection/pin status n.c. output input floating x x x x to ground x through 10 k resistor undervoltage overtemperature v cc gnd input output overvoltage current limiter logic driver power clamp status v cc clamp on state openload off state openload and output shorted to v cc detection detection detection detection detection ta b = v cc output output output output output output 12 11 10 9 8 7 1 2 3 4 5 6 v cc v cc input n.c. gnd cs_dis obsolete product(s) - obsolete product(s) obsolete product(s) - obsolete product(s) obsolete product(s) - obsolete product(s)
electrical specifications VN750PEP-E 6/22 doc id 10869 rev 4 2 electrical specifications figure 3. current and voltage conventions 2.1 absolute maximum ratings stress values that exceed those listed in t he ?absolute maximum ratings? table can cause permanent damage to the device. these are stress ratings only, and operation of the device at these, or any other conditions greater than those, indicated in the operating sections of this specification is not imp lied. exposure to absolute ma ximum rating conditions for extended periods may affect device reliability. refer also to the st microelectronics sure program and other relevant quality documents. input i s i in v in v cc status i stat v stat gnd v cc i out v out i gnd output v f table 3. absolute maximum ratings symbol parameter value unit v cc dc supply voltage 41 v - v cc reverse dc supply voltage - 0.3 v - i gnd dc reverse ground pin current - 200 ma i out dc output current internally limited a - i out reverse dc output current - 6 a i in dc input current +/- 10 ma i stat dc status current +/- 10 ma v esd electrostatic discharge (human body model: r=1.5 k ; c=100pf) - input - status - output - v cc 4000 4000 5000 5000 v v v v p tot power dissipation t c =25c 74 w obsolete product(s) - obsolete product(s) obsolete product(s) - obsolete product(s) obsolete product(s) - obsolete product(s)
VN750PEP-E electrica l specifications doc id 10869 rev 4 7/22 2.2 thermal data 2.3 electrical characteristics values specified in this section are for 8 v 8 v i out =2 a; v cc >8 v 60 120 m m i s supply current off-state; v cc =13 v; v in =v out =0 v off-state; v cc =13 v; v in =v out =0 v; t j =25 c on-state; v cc =13 v; v in =5 v; i out =0 a 10 10 2 25 20 3.5 a a ma i l(off1) off-state output current v in =v out =0 v 0 50 a i l(off2) off-state output current v in =0v; v out =3.5 v -75 0 a i l(off3) off-state output current v in =v out =0 v; vcc=13 v; t j =125 c 5 a i l(off4) off-state output current v in =v out =0 v; vcc=13 v; t j =25 c 3 a obsolete product(s) - obsolete product(s) obsolete product(s) - obsolete product(s) obsolete product(s) - obsolete product(s)
electrical specifications VN750PEP-E 8/22 doc id 10869 rev 4 table 6. switching (v cc =13 v) symbol parameter test conditions min. typ. max. unit t d(on) turn-on delay time r l =6.5 from v in rising edge to v out =1.3 v -40-s t d(off) turn-off delay time r l =6.5 from v in falling edge to v out =11.7 v -30-s dv out /dt (on) turn-on voltage slope r l =6.5 from v out =1.3 v to v out =10.4 v - 0.5 - v/s dv out /dt (off) turn-off voltage slope r l =6.5 from v out =11.7 v to v out =1.3 v - 0.2 - v/s table 7. input pin symbol parameter test conditions min. typ. max. unit v il input low level 1.25 v i il low level input current v in =1.25 v 1 a v ih input high level 3.25 v i ih high level input current v in =3.25 v 10 a v hyst input hysteresis voltage 0.5 v v icl input clamp voltage i in =1 ma i in =-1 ma 66.8 -0.7 8v v table 8. v cc output diode symbol parameter test conditions min. typ. max. unit v f forward on voltage -i out =1.3 a; t j =150 c 0.6 v table 9. status pin symbol parameter test conditions min. typ. max. unit v stat status low output voltage i stat =1.6 ma 0.5 v i lstat status leakage current normal operation; v stat =5 v 10 a c stat status pin input capacitance normal operation; v stat =5 v 100 pf v scl status clamp voltage i stat =1ma i stat =-1ma 66.8 -0.7 8v v table 10. protections (1) symbol parameter test conditions min. typ. max. unit t tsd shutdown temperature 150 175 200 c t r reset temperature 135 c obsolete product(s) - obsolete product(s) obsolete product(s) - obsolete product(s) obsolete product(s) - obsolete product(s)
VN750PEP-E electrica l specifications doc id 10869 rev 4 9/22 figure 4. status timings t hyst thermal hysteresis 7 15 c t sdl status delay in overload condition t j >t jsh 20 ms i lim current limitation 9v v ol t dol(on) t j > t jsh v in v stat t sdl t sdl obsolete product(s) - obsolete product(s) obsolete product(s) - obsolete product(s) obsolete product(s) - obsolete product(s)
electrical specifications VN750PEP-E 10/22 doc id 10869 rev 4 figure 5. switching time waveforms table 12. truth table conditions input output status normal operation l h l h h h current limitation l h h l x x h (t j < t tsd ) h (t j > t tsd ) l overtemperature l h l l h l undervoltage l h l l x x overvoltage l h l l h h output voltage > v ol l h h h l h output current < i ol l h l h h l table 13. electrical transient requirements on v cc pin (part 1/3) iso t/r 7637/1 test pulse test levels i ii iii iv delays and impedance 1 -25 v -50 v -75 v -100 v 2 ms 10 2 +25 v +50 v +75 v +100 v 0.2 ms 10 3a -25 v -50 v -100 v -150 v 0.1 s 50 t t v out v in 80% 10% dv out /dt (on) t d(off) 90% dv out /dt (off) t d(on) obsolete product(s) - obsolete product(s) obsolete product(s) - obsolete product(s) obsolete product(s) - obsolete product(s)
VN750PEP-E electrica l specifications doc id 10869 rev 4 11/22 3b +25 v +50 v +75 v +100 v 0.1 s 50 4 -4 v -5 v -6 v -7 v 100 ms, 0.01 5 +26.5 v +46.5 v +66.5 v +86.5 v 400 ms, 2 table 14. electrical transient requirements on v cc pin (part 2/3) iso t/r 7637/1 test pulse test levels results i ii iii iv 1cccc 2cccc 3acccc 3bcccc 4cccc 5c e e e table 15. electrical transient requirements on v cc pin (part 3/3) class contents c all functions of the device are performed as designed after exposure to disturbance. e one or more functions of the device is not performed as designed after exposure to disturbance and cannot be returned to prope r operation without replacing the device. table 13. electrical transient requirements on v cc pin (part 1/3) (continued) iso t/r 7637/1 test pulse test levels i ii iii iv delays and impedance obsolete product(s) - obsolete product(s) obsolete product(s) - obsolete product(s) obsolete product(s) - obsolete product(s)
electrical specifications VN750PEP-E 12/22 doc id 10869 rev 4 figure 6. waveforms open load without external pull-up status input normal operation undervoltage v cc v usd v usdhyst input overvoltage v cc v cc >v ov status input status status input status input open load with external pull-up undefined load voltage v cc v ol v ol obsolete product(s) - obsolete product(s) obsolete product(s) - obsolete product(s) obsolete product(s) - obsolete product(s)
VN750PEP-E electrica l specifications doc id 10869 rev 4 13/22 figure 7. application schematic 2.4 gnd protection network against reverse battery 2.4.1 solution 1: resist or in the ground line (r gnd only) this can be used with any type of load. the following is an indication on how to dimension the r gnd resistor. 1. r gnd 600mv / (i s(on)max ). 2. r gnd (? v cc ) / (-i gnd ) where -i gnd is the dc reverse ground pin current and can be found in the absolute maximum rating section of the device datasheet. power dissipation in r gnd (when v cc <0: during reverse battery situations) is: p d = (-v cc ) 2 /r gnd this resistor can be shared amongst several different hsds. please note that the value of this resistor should be calculated with formula (1) where i s(on)max becomes the sum of the maximum on-state currents of the different devices. please note that if the microprocessor ground is not shared by the device ground then the r gnd produces a shift (i s(on)max * r gnd ) in the input thresholds and the status output values. this shift varies depending on how many devices are on in the case of several high side drivers sharing the same r gnd . if the calculated power dissipation leads to a large resistor or several devices have to share the same resistor then st suggests to utilize solution 2 (see below). v cc gnd output d gnd r gnd d ld c +5v r prot v gnd status input +5v r prot obsolete product(s) - obsolete product(s) obsolete product(s) - obsolete product(s) obsolete product(s) - obsolete product(s)
electrical specifications VN750PEP-E 14/22 doc id 10869 rev 4 2.4.2 solution 2: diode (d gnd ) in the ground line a resistor (r gnd =1 k ) should be inserted in parallel to d gnd if the device drives an inductive load. this small signal diode can be safely shared amongst several different hsds. also in this case, the presence of the ground network produces a shift ( 600mv) in the input threshold and in the status output values if the microprocessor ground is not common to the device ground. this shift not varies if more than one hsd shares the same diode/resistor network. series resistor in input and status lines are also required to prevent that, during battery voltage transient, the current exceeds the absolute maximum rating. safest configuration for unused input and status pin is to leave them unconnected. 2.5 load dump protection d ld is necessary (voltage transient suppressor) if the load dump peak voltage exceeds the v cc max dc rating. the same applies if the device is subject to transients on the v cc line that are greater than the ones shown in the iso 7637-2: 2004(e) table. 2.6 microcontroller i/os protection if a ground protection network is used and negative transient are present on the v cc line, the control pins is pulled negative. st suggests to insert a resistor (r prot ) in line to prevent the c i/os pins to latch-up. the value of these resistors is a compromise between the leakage current of c and the current required by the hsd i/o s (input levels compatibility) with the latch-up limit of c i/os. -v ccpeak /i latchup r prot (v oh c -v ih -v gnd ) / i ihmax calculation example: for v ccpeak = - 100 v and i latchup 20 ma; v oh c 4.5 v 5k r prot 65 k . recommended values: r prot =10 k . 2.7 open-load detecti on in off-state off-state open-load detection requires an external pull-up resistor (r pu ) connected between output pin and a positive supply voltage (v pu ) like the +5 v line used to supply the microprocessor. the external resistor has to be selected according to the following requirements: 1. no false open-load indication when load is connected: in this case we have to avoid v out to be higher than v olmin ; this results in the following condition v out =(v pu /(r l +r pu ))r l VN750PEP-E electrica l specifications doc id 10869 rev 4 15/22 because i s(off) may significantly increase if v out is pulled high (up to several ma), the pull- up resistor r pu should be connected to a supply that is switched off when the module is in standby. the values of v olmin , v olmax and i l(off2) are available in the electrical characteristics section. figure 8. open-load detection in off-state v ol v batt. v pu r pu r l r driver + logic + - input status v cc out ground i l(off2) obsolete product(s) - obsolete product(s) obsolete product(s) - obsolete product(s) obsolete product(s) - obsolete product(s)
package and pcb thermal data VN750PEP-E 16/22 doc id 10869 rev 4 3 package and pcb thermal data 3.1 powersso-12 thermal data figure 9. powersso-12 pc board note: layout condition of r th and z th measurements (pcb fr4 area = 78 mm x 78 mm, pcb thickness = 2 mm, cu thickness=35 m, copper areas: from minimum pad lay-out to 8 cm 2 ). figure 10. r thj-amb vs pcb copper area in open box free air condition obsolete product(s) - obsolete product(s) obsolete product(s) - obsolete product(s) obsolete product(s) - obsolete product(s)
VN750PEP-E package a nd pcb thermal data doc id 10869 rev 4 17/22 figure 11. p 2 pak thermal impedance junction ambient single pulse equation 1: pulse calculation formula where = t p /t figure 12. powersso-12 thermal fitting model of a single channel table 16. powersso-12 thermal parameter area/island (cm 2 )footprint8 r1 (c/w) 0.1 r2 (c/w) 0.6 z th r th z thtp 1 ? () + ? = obsolete product(s) - obsolete product(s) obsolete product(s) - obsolete product(s) obsolete product(s) - obsolete product(s)
package and pcb thermal data VN750PEP-E 18/22 doc id 10869 rev 4 r3 (c/w) 1.5 r4 (c/w) 8 r5 (c/w) 28 18 r6 (c/w) 30 22 c1 (ws/c) 0.001 c2 (ws/c) 0.0035 c3 (ws/c) 0.015 c4 (ws/c) 0.1 c5 (ws/c) 0.15 0.017 c6 (ws/c) 3 5 table 16. powersso-12 the rmal parameter (continued) area/island (cm 2 )footprint8 obsolete product(s) - obsolete product(s) obsolete product(s) - obsolete product(s) obsolete product(s) - obsolete product(s)
VN750PEP-E package a nd packing information doc id 10869 rev 4 19/22 4 package and packing information 4.1 ecopack ? packages in order to meet environmental requirements, st offers these devices in different grades of ecopack? packages, depending on their level of environmental compliance. ecopack? specifications, grade definitions and product status are available at: www.st.com . ecopack? is an st trademark. 4.2 powersso-12 mechanical data figure 13. powersso-12 package dimensions obsolete product(s) - obsolete product(s) obsolete product(s) - obsolete product(s) obsolete product(s) - obsolete product(s)
package and packing information VN750PEP-E 20/22 doc id 10869 rev 4 table 17. powersso-12 mechanical data symbol millimeters min. typ. max. a 1.25 1.62 a1 0 0.1 a2 1.10 1.65 b 0.23 0.41 c 0.19 0.25 d4.8 5.0 e3.8 4.0 e0.8 h5.8 6.2 h 0.25 0.5 l 0.4 1.27 k0 8 x1.9 2.5 y3.6 4.2 ddd 0.1 obsolete product(s) - obsolete product(s) obsolete product(s) - obsolete product(s) obsolete product(s) - obsolete product(s)
VN750PEP-E revision history doc id 10869 rev 4 21/22 5 revision history table 18. document revision history date revision changes 07-oct-2004 1 initial release. 24-nov-2004 2 powersso-12 therma l characteristics insertion. 12-dec-2004 3 thermal data correction. 23-nov-2009 4 updated feature list. obsolete product(s) - obsolete product(s) obsolete product(s) - obsolete product(s) obsolete product(s) - obsolete product(s)
VN750PEP-E 22/22 doc id 10869 rev 4 please read carefully: information in this document is provided solely in connection with st products. stmicroelectronics nv and its subsidiaries (?st ?) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described he rein at any time, without notice. all st products are sold pursuant to st?s terms and conditions of sale. purchasers are solely responsible for the choice, selection and use of the st products and services described herein, and st as sumes no liability whatsoever relating to the choice, selection or use of the st products and services described herein. no license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. i f any part of this document refers to any third party products or services it shall not be deemed a license grant by st for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoev er of such third party products or services or any intellectual property contained therein. unless otherwise set forth in st?s terms and conditions of sale st disclaims any express or implied warranty with respect to the use and/or sale of st products including without limitation implied warranties of merchantability, fitness for a parti cular purpose (and their equivalents under the laws of any jurisdiction), or infringement of any patent, copyright or other intellectual property right. unless expressly approved in writing by an authorized st representative, st products are not recommended, authorized or warranted for use in military , air craft, space, life saving, or life sustaining applications, nor in products or systems where failure or malfunction may result in personal injury, death, or severe property or environmental damage. st products which are not specified as "automotive grade" may only be used in automotive applications at user?s own risk. resale of st products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by st for the st product or service described herein and shall not create or extend in any manner whatsoev er, any liability of st. st and the st logo are trademarks or registered trademarks of st in various countries. information in this document supersedes and replaces all information previously supplied. the st logo is a registered trademark of stmicroelectronics. all other names are the property of their respective owners. ? 2009 stmicroelectronics - all rights reserved stmicroelectronics group of companies australia - belgium - brazil - canada - china - czech republic - finland - france - germany - hong kong - india - israel - ital y - japan - malaysia - malta - morocco - philippines - singapore - spain - sweden - switzerland - united kingdom - united states of america www.st.com obsolete product(s) - obsolete product(s) obsolete product(s) - obsolete product(s) obsolete product(s) - obsolete product(s)

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