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an important notice at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. production data. ref3425 , ref3430 , ref3433 sbas804a ? september 2017 ? revised december 2017 ref34xx low-drift, low-power, small-footprint series voltage reference 1 1 features 1 ? initial accuracy: 0.05% (maximum) ? temperature coefficient : 6 ppm/ c (maximum) ? operating temperature range: ? 40 c to +125 c ? output current: 10 ma ? low quiescent current: 95 a (maximum) ? wide input voltage: 12 v ? output 1/f noise (0.1 hz to 10 hz): 5 v pp /v ? excellent long-term stability 30 ppm/1000 hrs ? small footprint 6-pin sot-23 package 2 applications ? precision data acquisition systems ? plc analog i/o modules ? field transmitters ? portable, battery - operated equipment ? industrial instrumentation ? test equipment ? power monitoring ? lcr meters 3 description the ref34xx device is a low temperature drift (6 ppm/ c), low-power, high-precision cmos voltage reference, featuring 0.05% initial accuracy, low operating current with power consumption less than 95 a. this device also offers very low output noise of 5 v p-p /v, which enables its ability to maintain high signal integrity with high-resolution data converters in noise critical systems. with a small sot-23 package, ref34xx offers enhanced specifications and pin-to- pin replacement for max607x and adr34xx. the ref34xx family is compatible to most of the adc and dac such as ads1287, aducm360, ads1112. stability and system reliability are further improved by the low output-voltage hysteresis of the device and low long-term output voltage drift. furthermore, the small size and low operating current of the devices (95 a) can benefit portable and battery-powered applications. ref34xx is specified for the wide temperature range of ? 40 c to +125 c. contact the ti sales representative for additional voltage options. device information (1) part name package body size (nom) ref3425 sot-23 (6) 2.90 mm 1.60 mm ref3430 ref3433 (1) for all available packages, see the orderable addendum at the end of the data sheet. simplified schematic dropout vs. current load over temperature 10 10 input signal 124 1 nf ads1287 vin ref cin 1f cout 10 f - + ref34xx copyright ? 2017, texas instruments incorporated load current (ma) dropout voltage (v) 0 0.04 0.08 0.12 0.16 0.2 0.24 0.28 0.32 0.36 0.4 5 10 0 +25c -40c +125c d001 tools & software referencedesign technical documents ordernow productfolder support &community
2 ref3425 , ref3430 , ref3433 sbas804a ? september 2017 ? revised december 2017 www.ti.com product folder links: ref3425 ref3430 ref3433 submit documentation feedback copyright ? 2017, texas instruments incorporated table of contents 1 features .................................................................. 1 2 applications ........................................................... 1 3 description ............................................................. 1 4 revision history ..................................................... 2 5 device comparison table ..................................... 2 6 pin configuration and functions ......................... 3 7 specifications ......................................................... 4 7.1 absolute maximum ratings ...................................... 4 7.2 esd ratings .............................................................. 4 7.3 recommended operating conditions ....................... 4 7.4 thermal information .................................................. 4 7.5 electrical characteristics ........................................... 5 7.6 typical characteristics .............................................. 7 8 parameter measurement information ................ 11 8.1 solder heat shift ..................................................... 11 8.2 long-term stability ................................................. 12 8.3 thermal hysteresis ................................................. 12 8.4 power dissipation ................................................... 13 8.5 noise performance ................................................. 14 9 detailed description ............................................ 15 9.1 overview ................................................................. 15 9.2 functional block diagram ....................................... 15 9.3 feature description ................................................. 15 9.4 device functional modes ........................................ 16 10 applications and implementation ...................... 17 10.1 application information .......................................... 17 10.2 typical application: basic voltage reference connection ............................................................... 17 11 power-supply recommendations ..................... 19 12 layout ................................................................... 20 12.1 layout guidelines ................................................. 20 12.2 layout example .................................................... 20 13 device and documentation support ................. 21 13.1 documentation support ........................................ 21 13.2 receiving notification of documentation updates 21 13.3 community resources .......................................... 21 13.4 trademarks ........................................................... 21 13.5 electrostatic discharge caution ............................ 21 13.6 glossary ................................................................ 21 14 mechanical, packaging, and orderable information ........................................................... 21 4 revision history note: page numbers for previous revisions may differ from page numbers in the current version. changes from original (september 2017) to revision a page ? added production release of 2 new output voltage option devices, ref3430 and ref3433 ............................................... 1 5 device comparison table product v out ref3425 2.5 v ref3430 3 v ref3433 3.3 v
3 ref3425 , ref3430 , ref3433 www.ti.com sbas804a ? september 2017 ? revised december 2017 product folder links: ref3425 ref3430 ref3433 submit documentation feedback copyright ? 2017, texas instruments incorporated 6 pin configuration and functions dbv package 6-pin sot-23 top view pin functions pin type description no. name 1 gnd_f ground ground force connection 2 gnd_s ground ground sense connection 3 enable input enable connection. enables or disables the device. 4 in power input supply voltage connection 5 out_s output reference voltage output sense connection 6 out_f output reference voltage output force connection 1 gnd_f 3 enable 2 gnd_s 6 out_f 4 in 5 out_s not to scale
4 ref3425 , ref3430 , ref3433 sbas804a ? september 2017 ? revised december 2017 www.ti.com product folder links: ref3425 ref3430 ref3433 submit documentation feedback copyright ? 2017, texas instruments incorporated (1) stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. these are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions . exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) by design, the device is guaranteed functional over the operating temperature of -55 c to 150 c. 7 specifications 7.1 absolute maximum ratings over operating free-air temperature range (unless otherwise noted) (1) min max unit input voltage in v ref + 0.05 13 v en ? 0.3 in + 0.3 output voltage v ref ? 0.3 5.5 v output short circuit current 20 ma temperature operating, t a (2) ? 55 150 c storage t stg ? 65 170 (1) jedec document jep155 states that 500-v hbm allows safe manufacturing with a standard esd control process. (2) jedec document jep157 states that 250-v cdm allows safe manufacturing with a standard esd control process. 7.2 esd ratings value unit v (esd) electrostatic discharge human-body model (hbm), per ansi/esda/jedec js-001 (1) 2500 v charged-device model (cdm), per jedec specification jesd22-c101 (2) 1500 (1) dropout voltage 7.3 recommended operating conditions over operating free-air temperature range (unless otherwise noted) min nom max unit in supply input voltage (i l = 0 ma, t a = 25 c) v ref + v do (1) 12 v en enable voltage 0 in v i l output current ? 10 10 ma t a operating temperature ? 40 25 125 c (1) for more information about traditional and new thermal metrics, see the semiconductor and ic package thermal metrics application report. 7.4 thermal information thermal metric (1) ref34xx unit dbv (sot-23) 6 pins r ja junction-to-ambient thermal resistance 185 c/w r jc(top) junction-to-case (top) thermal resistance 156 c/w r jb junction-to-board thermal resistance 29.6 c/w jt junction-to-top characterization parameter 33.8 c/w jb junction-to-board characterization parameter 29.1 c/w r jc(bot) junction-to-case (bottom) thermal resistance n/a c/w
5 ref3425 , ref3430 , ref3433 www.ti.com sbas804a ? september 2017 ? revised december 2017 product folder links: ref3425 ref3430 ref3433 submit documentation feedback copyright ? 2017, texas instruments incorporated (1) temperature drift is specified according to the box method. see feature description for more details. (2) the ppm/v and ppm/ma in line and load regulation can be also expressed as v/v and v/ma. (3) the dropout voltage in line regulation test condition is 50 mv. (4) the dropout voltage in test condition is 500 mv. (5) the peak-to-peak noise measurement procedure is explained in more detail in noise performance . (6) long-term stability measurement procedure is explained in more in detail in long-term stability . (7) the thermal hysteresis measurement procedure is explained in more detail in thermal hysteresis . 7.5 electrical characteristics at t a = 25 c unless otherwise noted. parameter test conditions min typ max unit accuracy and drift output voltage accuracy ? 40 c t a 125 c ? 0.0 5% 0.05% output voltage temperature coefficient (1) 2.5 6 ppm/ c line and load regulation v (o vin) line regulation (2) v in = 2.55 v to 12 v , t a = 25 c 2 ppm/v v in = v ref + v do (3) to 12 v, ? 40 c t a 125 c 15 v (o il) load regulation (2) i l = 0 ma to 10 ma, v in = 3 v, t a = 25 c sourcing 20 ppm/ma i l = 0 ma to 10 ma, v in = 3 v, ? 40 c t a 125 c sourcing 30 i l = 0 ma to ? 10 ma, v in = v ref + v do (4) , t a = 25 c sinking ref3425 40 ref3430 43 ref3433 48 i l = 0 ma to ? 10 ma, v in = v ref + v do (4) , ? 40 c t a 125 c sinking ref3425 70 ref3430 75 ref3433 84 i sc short-circuit current (output shorted to ground) v ref = 0, t a = 25 c 18 22 ma noise e n p-p output voltage noise (5) ? = 0.1 hz to 10 hz 5 v p-p/v ? = 10 hz to 10 khz 24 v rms e n output voltage noise density ? = 1 khz 0.25 ppm/ hz hysteresis and long term stability long-term stability (6) 1000 hours 30 ppm output voltage hysteresis (7) t a = 25 c to ? 40 c to 125 c to 25 c, cycle 1 30 ppm t a = 25 c to ? 40 c to 125 c to 25 c, cycle 2 10 turnon t on turnon time 0.1% of output voltage settling, c l = 10 f, ref34xx 2.5 ms capacitive load c l stable output capacitor value ? 40 c t a 125 c 0.1 10 f output voltage v ref output voltage ref3425 2.5 v ref3430 3 v ref3433 3.3 v
6 ref3425 , ref3430 , ref3433 sbas804a ? september 2017 ? revised december 2017 www.ti.com product folder links: ref3425 ref3430 ref3433 submit documentation feedback copyright ? 2017, texas instruments incorporated electrical characteristics (continued) at t a = 25 c unless otherwise noted. parameter test conditions min typ max unit power supply v in input voltage v ref + v do 12 v i l output current capacity v in = v ref + v do (4) to 12 v sourcing 10 ma v in = v ref + v do (4) to 12 v sinking ? 10 i q quiescent current ? 40 c t a 125 c active mode 72 95 a ? 40 c t a 125 c shutdown mode 2.5 3 v do dropout voltage i l = 0 ma, t a = 25 c 50 mv i l = 0 ma, ? 40 c t a +125 c 100 i l = 10 ma, ? 40 c t a +125 c 500 v en enable pin voltage voltage reference in active mode (en = 1) 1.6 v voltage reference in shutdown mode (en = 0) 0.5 i en enable pin leakage current v en = v in =12 v, ? 40 c t a 125 c 1 2 a
7 ref3425 , ref3430 , ref3433 www.ti.com sbas804a ? september 2017 ? revised december 2017 product folder links: ref3425 ref3430 ref3433 submit documentation feedback copyright ? 2017, texas instruments incorporated 7.6 typical characteristics at t a = 25 c, v in = v en = 12 v, i l = 0 ma, c l = 10 f, c in = 0.1 f (unless otherwise noted) figure 1. temperature drift figure 2. vin vs iq over temperature figure 3. output voltage accuracy vs temperature figure 4. quiescent current vs temperature temperature (c) quiescent current (ma) -40 -15 10 35 60 85 110 125 68 69 70 71 72 73 74 3v 3.3v 5v 12v d003 temperature (c) quiescent current (a) -50 -25 0 25 50 75 100 125 71 71.5 72 72.5 73 73.5 74 74.5 75 d004 drift (ppm/c) population (%) 0.00 0.25 0.50 0.75 1.00 1.25 1.50 1.75 2.00 2.25 2.50 2.75 3.00 3.25 3.50 3.75 4.00 4.25 4.50 4.75 5.00 (-40c to 125c) d001 temperature (c) output voltage accuracy (%) -50 -25 0 25 50 75 100 125 -0.02 -0.015 -0.01 -0.005 0 0.005 0.01 0.015 0.02 d002
8 ref3425 , ref3430 , ref3433 sbas804a ? september 2017 ? revised december 2017 www.ti.com product folder links: ref3425 ref3430 ref3433 submit documentation feedback copyright ? 2017, texas instruments incorporated typical characteristics (continued) at t a = 25 c, v in = v en = 12 v, i l = 0 ma, c l = 10 f, c in = 0.1 f (unless otherwise noted) figure 5. power-supply rejection ratio vs frequency figure 6. line regulation figure 7. load regulation sourcing figure 8. load regulation sinking figure 9. noise performance 10hz to 10khz figure 10. load transient 250s/div 1ma/div 4mv/div i load v out +1ma +1ma -1ma (c l = 1f, i out = 1ma) d010 temperature (c) load regulation sourcing (ppm/ma) -40 -20 0 20 40 60 80 100 120 140 5.7 6 6.3 6.6 6.9 7.2 7.5 7.8 8.1 8.4 8.7 d020 frequency(hz) noise (nv/vhz) 0 80 160 240 320 400 480 560 640 720 800 10 100 1k 10k 100k d009 temperature (c) line regulation (ppm/v) -40 -20 0 20 40 60 80 100 120 140 0.13 0.14 0.15 0.16 0.17 0.18 0.19 0.2 0.21 0.22 0.23 0.24 d019 frequency (hz) power supply rejection ratio (db) -120 -100 -80 -60 -40 -20 10 100 1k 10k 100k d005 c l = 1uf c l = 10uf temperature (c) load regulation sinking (ppm/ma) -40 -20 0 20 40 60 80 100 120 140 30 32.5 35 37.5 40 42.5 45 47.5 50 52.5 55 d021
9 ref3425 , ref3430 , ref3433 www.ti.com sbas804a ? september 2017 ? revised december 2017 product folder links: ref3425 ref3430 ref3433 submit documentation feedback copyright ? 2017, texas instruments incorporated typical characteristics (continued) at t a = 25 c, v in = v en = 12 v, i l = 0 ma, c l = 10 f, c in = 0.1 f (unless otherwise noted) figure 11. load transient figure 12. load transient figure 13. load transient figure 14. line transient figure 15. line transient figure 16. quiescent current shutdown mode 250s/div 4v/div 15mv/div v in v out (c l = 1f) d011 250s/div 4v/div 5mv/div v in v out (c l = 10f) d011 250s/div 10ma/div 20mv/div i load v out +10ma -10ma +10ma (c l = 10f, i out = 10ma) d010 temperature (c) quiescent current off (a) -40 -15 10 35 60 85 110 125 2 2.1 2.2 2.3 2.4 2.5 2.6 d013 250s/div 1ma/div 4mv/div i load v out +1ma +1ma -1ma (c l = 10f, i out = 1ma) d010 250s/div 10ma/div 100mv/div i load v out +10ma +10ma -10ma (c l = 1f, i out = 10ma) d010
10 ref3425 , ref3430 , ref3433 sbas804a ? september 2017 ? revised december 2017 www.ti.com product folder links: ref3425 ref3430 ref3433 submit documentation feedback copyright ? 2017, texas instruments incorporated typical characteristics (continued) at t a = 25 c, v in = v en = 12 v, i l = 0 ma, c l = 10 f, c in = 0.1 f (unless otherwise noted) figure 17. thermal hysteresis distribution (cycle 1) figure 18. thermal hysteresis distribution (cycle 2) refer to solder heat shift for more information figure 19. solder heat shift distribution figure 20. turnon time (enable) figure 21. 0.1-hz to 10-hz noise (v ref ) figure 22. long term stability - 1000 hours (v ref ) time 1s/div 2v/div d08_ solder heat shift (%) population (%) -0.02 -0.01 0 0.01 0.02 0 10% 20% 30% 40% 50% d017 0.5ms/div 1v/div en v out d018 thermal hysteresis - cycle 1 (ppm) population (%) -80 -60 -40 -20 0 20 40 60 80 0 5% 10% 15% 20% 25% 30% d016 thermal hysteresis - cycle 2 (ppm) population (%) -40 -30 -20 -10 0 10 20 30 40 0 5% 10% 15% 20% 25% 30% d016 hours output voltage stability (ppm) 0 100 200 300 400 500 600 700 800 900 1000 -25 -15 -5 5 15 25 35 45 55 65 d015
11 ref3425 , ref3430 , ref3433 www.ti.com sbas804a ? september 2017 ? revised december 2017 product folder links: ref3425 ref3430 ref3433 submit documentation feedback copyright ? 2017, texas instruments incorporated 8 parameter measurement information 8.1 solder heat shift the materials used in the manufacture of the ref34xx have differing coefficients of thermal expansion, resulting in stress on the device die when the part is heated. mechanical and thermal stress on the device die can cause the output voltages to shift, degrading the initial accuracy specifications of the product. reflow soldering is a common cause of this error. in order to illustrate this effect, a total of 32 devices were soldered on four printed circuit boards [16 devices on each printed circuit board (pcb)] using lead-free solder paste and the paste manufacturer suggested reflow profile. the reflow profile is as shown in figure 23 . the printed circuit board is comprised of fr4 material. the board thickness is 1.65 mm and the area is 114 mm 152 mm. figure 23. reflow profile the reference output voltage is measured before and after the reflow process; the typical shift is displayed in figure 24 . although all tested units exhibit very low shifts ( < 0.01%), higher shifts are also possible depending on the size, thickness, and material of the printed circuit board. an important note is that the histograms display the typical shift for exposure to a single reflow profile. exposure to multiple reflows, as is common on pcbs with surface-mount components on both sides, causes additional shifts in the output bias voltage. if the pcb is exposed to multiple reflows, the device must be soldered in the second pass to minimize its exposure to thermal stress. figure 24. solder heat shift distribution, v ref (%) solder heat shift (%) population (%) -0.02 -0.01 0 0.01 0.02 0 10% 20% 30% 40% 50% d017 0 50 100 150 200 250 300 0 50 100 150 200 250 300 350 400 temperature ( ? c) time (seconds) c01
12 ref3425 , ref3430 , ref3433 sbas804a ? september 2017 ? revised december 2017 www.ti.com product folder links: ref3425 ref3430 ref3433 submit documentation feedback copyright ? 2017, texas instruments incorporated 8.2 long-term stability one of the key parameters of the ref34xx references is long-term stability. typical characteristic expressed as: curves shows the typical drift value for the ref34xx is 30 ppm from 0 to 1000 hours. this parameter is characterized by measuring 32 units at regular intervals for a period of 1000 hours. it is important to understand that long-term stability is not ensured by design and that the output from the device may shift beyond the typical 30 ppm specification at any time. for systems that require highly stable output voltages over long periods of time, the designer should consider burning in the devices prior to use to minimize the amount of output drift exhibited by the reference over time figure 25. long term stability - 1000 hours (v ref ) 8.3 thermal hysteresis thermal hysteresis is measured with the ref34xx soldered to a pcb, similar to a real-world application. thermal hysteresis for the device is defined as the change in output voltage after operating the device at 25 c, cycling the device through the specified temperature range, and returning to 25 c. the pcb was baked at 150 c for 30 minutes before thermal hysteresis was measured. hysteresis can be expressed by equation 1 : where ? v hyst = thermal hysteresis (in units of ppm) ? v nom = the specified output voltage ? v pre = output voltage measured at 25 c pre-temperature cycling ? v post = output voltage measured after the device has cycled from 25 c through the specified temperature range of ? 40 c to +125 c and returns to 25 c. (1) typical thermal hysteresis distribution is as shown in figure 26 . 6 pre post hyst nom | v v | v 10 ppm v u ? ? 1 hours output voltage stability (ppm) 0 100 200 300 400 500 600 700 800 900 1000 -25 -15 -5 5 15 25 35 45 55 65 d015
13 ref3425 , ref3430 , ref3433 www.ti.com sbas804a ? september 2017 ? revised december 2017 product folder links: ref3425 ref3430 ref3433 submit documentation feedback copyright ? 2017, texas instruments incorporated thermal hysteresis (continued) figure 26. thermal hysteresis distribution (v ref ) 8.4 power dissipation the ref34xx voltage references are capable of source and sink up to 10 ma of load current across the rated input voltage range. however, when used in applications subject to high ambient temperatures, the input voltage and load current must be carefully monitored to ensure that the device does not exceeded its maximum power dissipation rating. the maximum power dissipation of the device can be calculated with equation 2 : where ? p d is the device power dissipation ? t j is the device junction temperature ? t a is the ambient temperature ? r ja is the package (junction-to-air) thermal resistance (2) because of this relationship, acceptable load current in high temperature conditions may be less than the maximum current-sourcing capability of the device. in no case should the device be operated outside of its maximum power rating because doing so can result in premature failure or permanent damage to the device. thermal hysteresis - cycle 1 (ppm) population (%) -80 -60 -40 -20 0 20 40 60 80 0 5% 10% 15% 20% 25% 30% d016 j a d ja t t p r t u
14 ref3425 , ref3430 , ref3433 sbas804a ? september 2017 ? revised december 2017 www.ti.com product folder links: ref3425 ref3430 ref3433 submit documentation feedback copyright ? 2017, texas instruments incorporated 8.5 noise performance typical 0.1-hz to 10-hz voltage noise can be seen in figure 27 . device noise increases with output voltage and operating temperature. additional filtering can be used to improve output noise levels, although care must be taken to ensure the output impedance does not degrade ac performance. peak-to-peak noise measurement setup is shown in figure 27 . figure 27. 0.1-hz to 10-hz noise (v ref ) time 1s/div 2v/div d08_
15 ref3425 , ref3430 , ref3433 www.ti.com sbas804a ? september 2017 ? revised december 2017 product folder links: ref3425 ref3430 ref3433 submit documentation feedback copyright ? 2017, texas instruments incorporated 9 detailed description 9.1 overview the ref34xx is family of low-noise, precision bandgap voltage references that are specifically designed for excellent initial voltage accuracy and drift. the functional block diagram is a simplified block diagram of the ref34xx showing basic band-gap topology. 9.2 functional block diagram 9.3 feature description 9.3.1 supply voltage the ref34xx family of references features an extremely low dropout voltage. for loaded conditions, a typical dropout voltage versus load is shown on the front page. the ref34xx features a low quiescent current that is extremely stable over changes in both temperature and supply. the typical room temperature quiescent current is 72 a, and the maximum quiescent current over temperature is just 95 a. supply voltages below the specified levels can cause the ref34xx to momentarily draw currents greater than the typical quiescent current. use a power supply with a fast rising edge and low output impedance to easily prevent this issue. 9.3.2 low temperature drift the ref34xx is designed for minimal drift error, which is defined as the change in output voltage over temperature. the drift is calculated using the box method, as described by equation 3 : (3) 9.3.3 load current the ref34xx family is specified to deliver a current load of 10 ma per output. the v ref output of the device are protected from short circuits by limiting the output short-circuit current to 18 ma. the device temperature increases according to equation 4 : where ? t j = junction temperature ( c), ? t a = ambient temperature ( c), ? p d = power dissipated (w), and ? r ja = junction-to-ambient thermal resistance ( c/w) (4) the ref34xx maximum junction temperature must not exceed the absolute maximum rating of 150 c. bandgap core buffer digital enable blocks inrush en in gndf outs current vdd gnds outf limit ref(max) ref(min) 6 ref v v drift = 10 v temperature range u ? u ? 1 j a d ja t t p r t u
16 ref3425 , ref3430 , ref3433 sbas804a ? september 2017 ? revised december 2017 www.ti.com product folder links: ref3425 ref3430 ref3433 submit documentation feedback copyright ? 2017, texas instruments incorporated 9.4 device functional modes 9.4.1 en pin when the en pin of the ref34xx is pulled high, the device is in active mode. the device must be in active mode for normal operation. the ref34xx can be placed in a low-power mode by pulling the enable pin low. when in shutdown mode, the output of the device becomes high impedance and the quiescent current of the device reduces to 2 a in shutdown mode. the en pin must not be pulled higher than vin supply voltage. see the thermal information for logic high and logic low voltage levels. 9.4.2 negative reference voltage for applications requiring a negative and positive reference voltage, the ref34xx and opa735 can be used to provide a dual-supply reference from a 5-v supply. figure 28 shows the ref34xx used to provide a 2.5-v supply reference voltage. the low drift performance of the ref34xx complements the low offset voltage and zero drift of the opa735 to provide an accurate solution for split-supply applications. take care to match the temperature coefficients of r1 and r2. figure 28. ref34xx and opa735 create positive and negative reference voltages -2.5 v +2.5 v +5 v 1 2 56 3 4 r 1 10 k r 2 10 k -5 v +5 v opa735 ref3425 copyright ? 2017, texas instruments incorporated
17 ref3425 , ref3430 , ref3433 www.ti.com sbas804a ? september 2017 ? revised december 2017 product folder links: ref3425 ref3430 ref3433 submit documentation feedback copyright ? 2017, texas instruments incorporated 10 applications and implementation note information in the following applications sections is not part of the ti component specification, and ti does not warrant its accuracy or completeness. ti ? s customers are responsible for determining suitability of components for their purposes. customers should validate and test their design implementation to confirm system functionality. 10.1 application information as this device has many applications and setups, there are many situations that this datasheet can not characterize in detail. basic applications includes positive/negative voltage reference and data acquisition systems. the table below shows the typical application of ref34xx and its companion adc/dac. table 1. typical applications and companion adc/dac applications adc/dac plc - dcs dac8881, ads8332, ads8568, ads8317, ads8588s, ads1287 display test equipment ads8332 field transmitters - pressure aducm360 video surveillance - thermal cameras ads7279 medical blood glucose meter ads1112 10.2 typical application: basic voltage reference connection the circuit shown in figure 29 shows the basic configuration for the ref34xx references. connect bypass capacitors according to the guidelines in input and output capacitors . figure 29. basic reference connection 10.2.1 design requirements a detailed design procedure is described based on a design example. for this design example, use the parameters listed in table 2 as the input parameters. table 2. design example parameters design parameter value input voltage v in 5 v output voltage v out 2.5 v ref34xx input capacitor 1 f ref34xx output capacitor 10 f 10 10 input signal 124 1 nf ads1287 vin ref cin 1f cout 10 f - + ref34xx copyright ? 2017, texas instruments incorporated
18 ref3425 , ref3430 , ref3433 sbas804a ? september 2017 ? revised december 2017 www.ti.com product folder links: ref3425 ref3430 ref3433 submit documentation feedback copyright ? 2017, texas instruments incorporated 10.2.2 detailed design procedure 10.2.2.1 input and output capacitors a 1- f to 10- f electrolytic or ceramic capacitor can be connected to the input to improve transient response in applications where the supply voltage may fluctuate. connect an additional 0.1- f ceramic capacitor in parallel to reduce high frequency supply noise. a ceramic capacitor of at least a 0.1 f must be connected to the output to improve stability and help filter out high frequency noise. an additional 1- f to 10- f electrolytic or ceramic capacitor can be added in parallel to improve transient performance in response to sudden changes in load current; however, keep in mind that doing so increases the turnon time of the device. best performance and stability is attained with low-esr, low-inductance ceramic chip-type output capacitors (x5r, x7r, or similar). if using an electrolytic capacitor on the output, place a 0.1- f ceramic capacitor in parallel to reduce overall esr on the output. 10.2.2.2 4-wire kelvin connections current flowing through a pcb trace produces an ir voltage drop, and with longer traces, this drop can reach several millivolts or more, introducing a considerable error into the output voltage of the reference. a 1-inch long, 5-millimeter wide trace of 1-ounce copper has a resistance of approximately 100 m at room temperature; at a load current of 10 ma, this can introduce a full millivolt of error. in an ideal board layout, the reference must be mounted as close as possible to the load to minimize the length of the output traces, and, therefore, the error introduced by voltage drop. however, in applications where this is not possible or convenient, force and sense connections (sometimes referred to as kelvin sensing connections) are provided as a means of minimizing the ir drop and improving accuracy. kelvin connections work by providing a set of high impedance voltage-sensing lines to the output and ground nodes. because very little current flows through these connections, the ir drop across their traces is negligible, and the output and ground it is always advantageous to use kelvin connections whenever possible. however, in applications where the ir drop is negligible or an extra set of traces cannot be routed to the load, the force and sense pins for both v out and gnd can simply be tied together, and the device can be used in the same fashion as a normal 3-terminal reference (as shown in figure 26 ). 10.2.2.3 v in slew rate considerations in applications with slow-rising input voltage signals, the reference exhibits overshoot or other transient anomalies that appear on the output. these phenomena also appear during shutdown as the internal circuitry loses power. to avoid such conditions, ensure that the input voltage wave-form has both a rising and falling slew rate close to 6 v/ms. 10.2.2.4 shutdown/enable feature the ref34xx references can be switched to a low power shut-down mode when a voltage of 0.5 v or lower is input to the enable pin. likewise, the reference becomes operational for enable voltages of 1.6 v or higher. during shutdown, the supply current drops to less than 2 a, useful in applications that are sensitive to power consumption. if using the shutdown feature, ensure that the enable pin voltage does not fall between 0.5 v and 1.6 v because this causes a large increase in the supply current of the device and may keep the reference from starting up correctly. if not using the shutdown feature, however, the enable pin can simply be tied to the in pin, and the reference remains operational continuously.
19 ref3425 , ref3430 , ref3433 www.ti.com sbas804a ? september 2017 ? revised december 2017 product folder links: ref3425 ref3430 ref3433 submit documentation feedback copyright ? 2017, texas instruments incorporated 10.2.3 application curves figure 30. quiescent current vs temperature figure 31. quiescent current shutdown mode 11 power-supply recommendations the ref34xx family of references feature an extremely low-dropout voltage. these references can be operated with a supply of only 50 mv above the output voltage. ti recommends a supply bypass capacitor ranging between 0.1 f to 10 f. temperature (c) quiescent current (a) -50 -25 0 25 50 75 100 125 71 71.5 72 72.5 73 73.5 74 74.5 75 d004 temperature (c) quiescent current off (a) -40 -15 10 35 60 85 110 125 2 2.1 2.2 2.3 2.4 2.5 2.6 d013
20 ref3425 , ref3430 , ref3433 sbas804a ? september 2017 ? revised december 2017 www.ti.com product folder links: ref3425 ref3430 ref3433 submit documentation feedback copyright ? 2017, texas instruments incorporated 12 layout 12.1 layout guidelines figure 32 illustrates an example of a pcb layout for a data acquisition system using the ref34xx. some key considerations are: ? connect low-esr, 0.1- f ceramic bypass capacitors at v in , v ref of the ref34xx. ? decouple other active devices in the system per the device specifications. ? using a solid ground plane helps distribute heat and reduces electromagnetic interference (emi) noise pickup. ? place the external components as close to the device as possible. this configuration prevents parasitic errors (such as the seebeck effect) from occurring. ? do not run sensitive analog traces in parallel with digital traces. avoid crossing digital and analog traces if possible, and only make perpendicular crossings when absolutely necessary. 12.2 layout example figure 32. layout example 1 6 2 3 4 gnd_f gnd_s en out_f in ref34xx c 5 out_s
21 ref3425 , ref3430 , ref3433 www.ti.com sbas804a ? september 2017 ? revised december 2017 product folder links: ref3425 ref3430 ref3433 submit documentation feedback copyright ? 2017, texas instruments incorporated 13 device and documentation support 13.1 documentation support 13.1.1 related documentation for related documentation see the following: ? ina21x voltage output, low- or high-side measurement, bidirectional, zero-drift series, current-shunt monitors ? low-drift bidirectional single-supply low-side current sensing reference design 13.2 receiving notification of documentation updates to receive notification of documentation updates, navigate to the device product folder on ti.com. in the upper right corner, click on alert me to register and receive a weekly digest of any product information that has changed. for change details, review the revision history included in any revised document. 13.3 community resources the following links connect to ti community resources. linked contents are provided "as is" by the respective contributors. they do not constitute ti specifications and do not necessarily reflect ti's views; see ti's terms of use . ti e2e ? online community ti's engineer-to-engineer (e2e) community. created to foster collaboration among engineers. at e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers. design support ti's design support quickly find helpful e2e forums along with design support tools and contact information for technical support. 13.4 trademarks e2e is a trademark of texas instruments. all other trademarks are the property of their respective owners. 13.5 electrostatic discharge caution this integrated circuit can be damaged by esd. texas instruments recommends that all integrated circuits be handled with appropriate precautions. failure to observe proper handling and installation procedures can cause damage. esd damage can range from subtle performance degradation to complete device failure. precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. 13.6 glossary slyz022 ? ti glossary . this glossary lists and explains terms, acronyms, and definitions. 14 mechanical, packaging, and orderable information the following pages include mechanical packaging and orderable information. this information is the most current data available for the designated devices. this data is subject to change without notice and revision of this document. for browser-based versions of this data sheet, refer to the left-hand navigation.
package option addendum www.ti.com 22-dec-2017 addendum-page 1 packaging information orderable device status (1) package type package drawing pins package qty eco plan (2) lead/ball finish (6) msl peak temp (3) op temp (c) device marking (4/5) samples ref3425idbvr active sot-23 dbv 6 3000 green (rohs & no sb/br) cu nipdau level-2-250c-1 year -40 to 125 19ed ref3430idbvr active sot-23 dbv 6 3000 green (rohs & no sb/br) cu nipdau level-2-260c-1 year -40 to 125 1h6d REF3433IDBVR active sot-23 dbv 6 3000 green (rohs & no sb/br) cu nipdau level-2-260c-1 year -40 to 125 1h5d (1) the marketing status values are defined as follows: active: product device recommended for new designs. lifebuy: ti has announced that the device will be discontinued, and a lifetime-buy period is in effect. nrnd: not recommended for new designs. device is in production to support existing customers, but ti does not recommend using this part in a new design. preview: device has been announced but is not in production. samples may or may not be available. obsolete: ti has discontinued the production of the device. (2) rohs: ti defines "rohs" to mean semiconductor products that are compliant with the current eu rohs requirements for all 10 rohs substances, including the requirement that rohs substance do not exceed 0.1% by weight in homogeneous materials. where designed to be soldered at high temperatures, "rohs" products are suitable for use in specified lead-free processes. ti may reference these types of products as "pb-free". rohs exempt: ti defines "rohs exempt" to mean products that contain lead but are compliant with eu rohs pursuant to a specific eu rohs exemption. green: ti defines "green" to mean the content of chlorine (cl) and bromine (br) based flame retardants meet js709b low halogen requirements of <=1000ppm threshold. antimony trioxide based flame retardants must also meet the <=1000ppm threshold requirement. (3) msl, peak temp. - the moisture sensitivity level rating according to the jedec industry standard classifications, and peak solder temperature. (4) there may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) multiple device markings will be inside parentheses. only one device marking contained in parentheses and separated by a "~" will appear on a device. if a line is indented then it is a continuation of the previous line and the two combined represent the entire device marking for that device. (6) lead/ball finish - orderable devices may have multiple material finish options. finish options are separated by a vertical ruled line. lead/ball finish values may wrap to two lines if the finish value exceeds the maximum column width. important information and disclaimer: the information provided on this page represents ti's knowledge and belief as of the date that it is provided. ti bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. efforts are underway to better integrate information from third parties. ti has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. ti and ti suppliers consider certain information to be proprietary, and thus cas numbers and other limited information may not be available for release.
package option addendum www.ti.com 22-dec-2017 addendum-page 2 in no event shall ti's liability arising out of such information exceed the total purchase price of the ti part(s) at issue in this document sold by ti to customer on an annual basis.

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