rf37s114 scbs907 ? november 2015 rf37s114 tag-it ? hf-i type 5 nfc, iso/iec 15693 transponder, 4 mm 4 mm 1 device overview 1.1 features 1 ? iso/iec 15693-2, iso/iec 15693-3, ? 256-bit user memory in eight 32-bit blocks iso/iec 18000 ? 3, nfc tag type 5 ? application family identifier (afi) ? integrated antenna ? fast simultaneous identification (anticollision) ? 13.56-mhz operating frequency 1.2 applications ? product authentication ? asset management ? supply chain management ? medical 1.3 description the ti tag-it ? hf-i type 5 nfc transponder is compliant with the iso/iec 15693 and iso/iec 18000-3 global open standards. this product offers a user-accessible memory of 256 bits, organized in 8 blocks, and an optimized command set. this transponder product comes with an integrated antenna and, therefore, is ready for application without the need for an external antenna. device information (1) part number package body size RF37S114HTFJB rfidp (0) 4 mm 4 mm x 0.66 mm (1) for the most current device, package, and ordering information, see the package option addendum in section 6 . figure 1-1 shows the transponder. figure 1-1. RF37S114HTFJB transponder 1 an important notice at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. production data. productfolder sample &buy technical documents tools & software support &community
rf37s114 scbs907 ? november 2015 www.ti.com table of contents 1 device overview ......................................... 1 4.1 supported command set ............................ 4 1.1 features .............................................. 1 4.2 memory organization ................................. 4 1.2 applications ........................................... 1 5 device and documentation support ................. 5 1.3 description ............................................ 1 5.1 device support ....................................... 5 2 revision history ......................................... 2 5.2 documentation support .............................. 6 3 specifications ............................................ 3 5.3 community resources ............................... 6 3.1 absolute maximum ratings .......................... 3 5.4 trademarks ........................................... 6 3.2 esd ratings .......................................... 3 5.5 electrostatic discharge caution ...................... 7 3.3 recommended operating conditions ................ 3 5.6 export control notice ................................. 7 3.4 electrical characteristics ............................. 3 5.7 glossary .............................................. 7 3.5 physical characteristics .............................. 3 6 mechanical, packaging, and orderable information ................................................ 7 4 detailed description ..................................... 4 2 revision history date revision notes november 2015 * initial release 2 revision history copyright ? 2015, texas instruments incorporated submit documentation feedback product folder links: rf37s114
rf37s114 www.ti.com scbs907 ? november 2015 3 specifications 3.1 absolute maximum ratings over operating free-air temperature range (unless otherwise noted) min max unit t a operating temperature ? 25 70 c t stg storage temperature ? 40 85 c 3.2 esd ratings device is fully encapsulated and protected. no esd classification applies. 3.3 recommended operating conditions over operating free-air temperature range (unless otherwise noted) min max unit t a operating temperature ? 25 70 c 3.4 electrical characteristics over operating free-air temperature range (unless otherwise noted) parameter RF37S114HTFJB supported standard iso/iec 15693-2, iso/iec 15693-3, iso/iec 18000-3 recommended operating frequency 13.56 mhz typical read activation field strength (at 25 c) 136.0 db a/m typical write activation field strength (at 25 c) 136.0 db a/m factory programmed read-only number 64 bits memory (user programmable) 256 bits organized in eight 32-bit blocks typical programming cycles (at 25 c) 100000 data retention time (at 55 c) > 10 years simultaneous identification of tags up to 50 tags per second (reader and antenna dependent) 3.5 physical characteristics over operating free-air temperature range (unless otherwise noted) parameter RF37S114HTFJB dimensions 4 mm 4 mm 0.66 mm 0.1 mm copyright ? 2015, texas instruments incorporated specifications 3 submit documentation feedback product folder links: rf37s114
rf37s114 scbs907 ? november 2015 www.ti.com 4 detailed description 4.1 supported command set table 4-1 summarizes the iso/iec 15693 mandatory and optional commands that are supported by this transponder. table 4-1. supported command set (iso/iec 15693 mandatory and optional commands) request mode (1) request request optional inventory addressed nonaddressed afi code flag inventory 0x01 ? ? ? ? 0/ ? stay quiet 0x02 ? ? ? ? 0/ ? read_single_block 0x20 ? ? ? ? ? /1 write_single_block 0x21 ? ? ? ? ? /1 lock_block 0x22 ? ? ? ? ? /1 (1) ? = implemented, ? = not applicable 4.2 memory organization figure 4-1 shows the organization of the user-accessible memory on this transponder. figure 4-1. memory organization 4 detailed description copyright ? 2015, texas instruments incorporated submit documentation feedback product folder links: rf37s114 user data (256 bits) uid number (64 bits) x afi 0x06 0x08 0x09 0x0a block address 0x00 0x01 0x02 32 bits lock bit 0x03 0x04 0x05 0x07
rf37s114 www.ti.com scbs907 ? november 2015 5 device and documentation support 5.1 device support 5.1.1 development support 5.1.1.1 getting started and next steps rfid products from ti provide the ultimate solution for a wide range of applications. with its patented hdx technology, ti rfid offers unmatched performance in read range, read rate, and robustness. ti offers one-stop-shopping of transponders, inlays, reader modules, and reader ics. for more information, see the overview for nfc / rfid page. 5.1.2 device nomenclature to designate the stages in the product development cycle, ti assigns prefixes to the part numbers of devices. each commercial family member has one of three prefixes: x, p, or no prefix (for example, xRF37S114HTFJB).these prefixes represent evolutionary stages of product development from engineering prototypes (with prefix x) through fully qualified production devices (with no prefix). device development evolutionary flow: xrf... ? experimental device that is not necessarily representative of the electrical specifications of the final device prf... ? final device that conforms to the electrical specifications of the final product but has not completed quality and reliability verification rf... ? fully qualified production device devices with a prefix of x or p are shipped against the following disclaimer: "developmental product is intended for internal evaluation purposes." production devices have been characterized fully, and the quality and reliability of the device have been demonstrated fully. ti's standard warranty applies. predictions show that prototype devices have a greater failure rate than the standard production devices. ti recommends that these devices not be used in any production system because their expected end-use failure rate still is undefined. only qualified production devices are to be used. ti device nomenclature also includes a suffix with the device family name. this suffix indicates the package type (for example, tel) and, optionally, the temperature range (for example, t). figure 5-1 provides a legend for reading the complete device name for any family member. copyright ? 2015, texas instruments incorporated device and documentation support 5 submit documentation feedback product folder links: rf37s114
rf37s114 scbs907 ? november 2015 www.ti.com figure 5-1. device nomenclature 5.2 documentation support the following documents describe the RF37S114HTFJB device. copies of these documents are available on the internet at www.ti.com . spat178 rfid systems product specifications. texas instruments radio frequency identification systems is an industry leader in rfid technology, and the world ? s largest integrated manufacturer of ti-rfid ? tags, ti-rfid smart labels, and ti-rfid reader systems. with more than 1 billion rfid tags manufactured, ti-rfid technology is used in a broad range of rfid applications worldwide. ti is an active member of many standards bodies, including iso, iso/iec, ecma international, etsi, and several national standardization bodies working to drive the adoption of global standards for rfid technology. 5.3 community resources the following links connect to ti community resources. linked contents are provided "as is" by the respective contributors. they do not constitute ti specifications and do not necessarily reflect ti's views; see ti's terms of use. ti e2e ? online community ti's engineer-to-engineer (e2e) community. created to foster collaboration among engineers. at e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers. 5.4 trademarks tag-it, ti-rfid, e2e are trademarks of texas instruments. 6 device and documentation support copyright ? 2015, texas instruments incorporated submit documentation feedback product folder links: rf37s114 form factor rf = integrated circuit device family function type s = security temperature range family 114 = device type package tfj = rfidp packing 37 = family rf 37 s 114 h tfj form factor family device family package function type temperature h = C25c to 70c b = bulk b packing
rf37s114 www.ti.com scbs907 ? november 2015 5.5 electrostatic discharge caution these devices have limited built-in esd protection. the leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the mos gates. 5.6 export control notice recipient agrees to not knowingly export or re-export, directly or indirectly, any product or technical data (as defined by the u.s., eu, and other export administration regulations) including software, or any controlled product restricted by other applicable national regulations, received from disclosing party under nondisclosure obligations (if any), or any direct product of such technology, to any destination to which such export or re-export is restricted or prohibited by u.s. or other applicable laws, without obtaining prior authorization from u.s. department of commerce and other competent government authorities to the extent required by those laws. 5.7 glossary ti glossary this glossary lists and explains terms, acronyms, and definitions. 6 mechanical, packaging, and orderable information the following pages include mechanical, packaging, and orderable information. this information is the most current data available for the designated devices. this data is subject to change without notice and revision of this document. for browser-based versions of this data sheet, refer to the left-hand navigation. copyright ? 2015, texas instruments incorporated mechanical, packaging, and orderable information 7 submit documentation feedback product folder links: rf37s114
package option addendum www.ti.com 26-nov-2015 addendum-page 1 packaging information orderable device status (1) package type package drawing pins package qty eco plan (2) lead/ball finish (6) msl peak temp (3) op temp (c) device marking (4/5) samples RF37S114HTFJB active rfidn tfj 0 5000 pb-free (rohs exempt) call ti level-1-260c-unlim -25 to 70 (1) the marketing status values are defined as follows: active: product device recommended for new designs. lifebuy: ti has announced that the device will be discontinued, and a lifetime-buy period is in effect. nrnd: not recommended for new designs. device is in production to support existing customers, but ti does not recommend using this part in a new design. preview: device has been announced but is not in production. samples may or may not be available. obsolete: ti has discontinued the production of the device. (2) eco plan - the planned eco-friendly classification: pb-free (rohs), pb-free (rohs exempt), or green (rohs & no sb/br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. tbd: the pb-free/green conversion plan has not been defined. pb-free (rohs): ti's terms "lead-free" or "pb-free" mean semiconductor products that are compatible with the current rohs requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. where designed to be soldered at high temperatures, ti pb-free products are suitable for use in specified lead-free processes. pb-free (rohs exempt): this component has a rohs exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. the component is otherwise considered pb-free (rohs compatible) as defined above. green (rohs & no sb/br): ti defines "green" to mean pb-free (rohs compatible), and free of bromine (br) and antimony (sb) based flame retardants (br or sb do not exceed 0.1% by weight in homogeneous material) (3) msl, peak temp. - the moisture sensitivity level rating according to the jedec industry standard classifications, and peak solder temperature. (4) there may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) multiple device markings will be inside parentheses. only one device marking contained in parentheses and separated by a "~" will appear on a device. if a line is indented then it is a continuation of the previous line and the two combined represent the entire device marking for that device. (6) lead/ball finish - orderable devices may have multiple material finish options. finish options are separated by a vertical ruled line. lead/ball finish values may wrap to two lines if the finish value exceeds the maximum column width. important information and disclaimer: the information provided on this page represents ti's knowledge and belief as of the date that it is provided. ti bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. efforts are underway to better integrate information from third parties. ti has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. ti and ti suppliers consider certain information to be proprietary, and thus cas numbers and other limited information may not be available for release. in no event shall ti's liability arising out of such information exceed the total purchase price of the ti part(s) at issue in this document sold by ti to customer on an annual basis.
package option addendum www.ti.com 26-nov-2015 addendum-page 2
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