multilayer ceramic chip capacitors 1 of 3 creation date : november 30, 2017 (gmt) C2012C0G2W272J125AE u? tdk item description c2012c0g2w272jt***s applications commercial grade please refer to part no. cga4j4c0g2w272j125ae for automotive use. feature mid mid voltage (100 to 630v) soft soft termination series c2012 [eia 0805] status production size length(l) 2.00mm +0.45,-0.20mm width(w) 1.25mm +0.25,-0.20mm thickness(t) 1.25mm +0.25,-0.20mm terminal width(b) 0.20mm min. terminal spacing(g) 0.50mm min. recommended land pattern (pa) 1.00mm to 1.30mm(flow soldering) 0.90mm to 1.20mm(re?ow soldering) recommended land pattern (pb) 1.00mm to 1.20mm(flow soldering) 0.70mm to 0.90mm(re?ow soldering) recommended land pattern (pc) 0.80mm to 1.10mm(flow soldering) 0.90mm to 1.20mm(re?ow soldering) electrical characteristics capacitance 2.7nf 5% rated voltage 450vdc temperature characteristic c0g(030ppm/c) q (min.) 1000 insulation resistance (min.) 10000m other soldering method wave (flow) re?ow aec-q200 no packing blister (plastic)taping [180mm reel] package quantity 2000pcs ! images are for reference only and show exemplary products. ! this pdf document was created based on the data listed on the tdk corporation website. ! all speci?cations are subject to change without notice. copyright(c) tdk corporation. all rights reserved.
multilayer ceramic chip capacitors 2 of 3 creation date : november 30, 2017 (gmt) C2012C0G2W272J125AE u? characteristic graphs (this is reference data, and does not guarantee the products characteristics.) impedance C2012C0G2W272J125AE capacitance C2012C0G2W272J125AE dc bias characteristic C2012C0G2W272J125AE temperature characteristic C2012C0G2W272J125AE(no bias) C2012C0G2W272J125AE(dc bias = 225v) ! images are for reference only and show exemplary products. ! this pdf document was created based on the data listed on the tdk corporation website. ! all speci?cations are subject to change without notice. copyright(c) tdk corporation. all rights reserved.
multilayer ceramic chip capacitors 3 of 3 creation date : november 30, 2017 (gmt) C2012C0G2W272J125AE u? associated images land pattern (terminal connection) ! images are for reference only and show exemplary products. ! this pdf document was created based on the data listed on the tdk corporation website. ! all speci?cations are subject to change without notice. copyright(c) tdk corporation. all rights reserved.
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