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http://www.shoulder.cn shoulder electronics limited page: 1 shoulder electronics limited ceramic resonator data sheet product ? : ceramic resonator model no : ztacv mx prepared : fengyu checked : york approved ? : lijiating date : 2008-01-25
1 scope this specification shall c over the characteri stics of the ceramic resonator 16.00 -50.00mhz. 2 part no. part number customer part no specification no ztacv mx 3 outline drawing and structure 3.1 appearance no visible damage and dirt. 3.2 except the chip(ceramic elem ent, ceramic base, capacitance slice), the materials don?t contain lead. 3.3 dimensions input output *:eiaj monthly code 4 rating and electrical specifications: 4.1 rating items content withstanding voltage (v) 50 (dc 1min) insulation resistance ri, m ? min. 100 100v 1min operating temperature range ( ) -25 +85 storage temperature range ( ) -55 +85 0.70.2 3.10.2 p 1.20.2 3.00.2 3.70.2 0.70.2 25.0 * http://www.shoulder.cn shoulder electronics limited page: 2 4.2 electrical specifications items content oscillation frequency fosc mhz 25.000 frequency accuracy % 0.5 resonant impedance ro ? max. 40 temperature coefficient of oscillation frequency % max. 0.3 oscillation frequency drift -25 +85 6v dc rating voltage ur v max. 15v p-p aging rate % max. 0.2 for ten years 5 test 5.1 test conditions parts shall be tested under a condition (temperature:+20 15 humidity: 65%20%r.h.)unless the standard condition(temperature:+25 3 ,humidity :65%5% r.h.) is regulated to test. 5.2 test circuit: 6 physical and environmental characteristics no item condition of test performance requirements 6.1 humidity keep the resonator at 40 2 and 90%-95% rh for 96h4h. then release the resonator into the room condition for 1h prior to the measurement. it shall fulfill the specifications in table 1. 6.2 high temperature exposure subject the resonator to 85 5 for 96s, then release the resonator into the room conditions for 1h prior to the measurement. it shall fulfill the specifications in table 1. 6.3 low temperature exposure subject the resonator to -25 5 for 96h, then release the resonator into the room conditions for 1h prior to the measurement. it shall fulfill the specifications http://www.shoulder.cn ic: 1/6 tc74hcu04 x: ceramic resonator c1,c2: 15pf shoulder electronics limited page: 3 in table 1. passed through the re -flow oven under the following condition and left at room temperature for 1h before measurement. temperature at the surface of the substrate time preheat 150 5 80s-120 s 230 20 s -40s 6.4 soldering test solder- ing 250 (peak 260 ) 10s max it shall fulfill the specifications in table 1. 6.5 solder ability dipped in 245 5 solder bath for 3s0.5 s with rosin flux (25wt% ethanol solution.) the terminals shall be at least 95% covered by solder. 6.6 vibration subject the resonator to vibration for 2h each in x y and z axis with the amplitude of 1.5mm, the frequency shall be varied uniformly between the limits of 10 hz?55hz. it shall fulfill the specifications in table 1. 6.7 mechanical shock drop the resonator randomly onto a wooden floor from the height of 100cm 3 times. it shall fulfill the specifications in table 1. to be continued 6 physical and environmenal characterisics no item condition of test performance requirements 6.8 temperature cycling subject the resonator to -40 for 30 min. followed by a high temperature of 85 for 30 min. cycling shall be repeated 5 times with a transfer time of 15s. at the room temperature for 1h prior to the measurement. it shall fulfill the specifications in table 1. board bending 6.9 mount a glass-epoxy board (width=40mm,thickness=1.6mm),then bend it to 1mm displacement and keep it for 5s. (see the following figure) mechanical damage such as breaks shall not occur. http://www.shoulder.cn shoulder electronics limited page: 4 support bar press head press table 1 item specification after test oscillation frequency change | f/fosc| 0.3% resonant impedance ( ) max 40 the limits in the above table are refe renced to the initial measurements. http://www.shoulder.cn shoulder electronics limited page: 5 7 recommended land pattern a nd reflow soldering standard conditions 7.1recommended land pattern t 1 t 2 w 3.00.2 0.70.2 4.10.2 7.2recommended reflow soldering standard conditions peak:260 250 255 pre-heating within 10s within 80-120s. within 20-40s tem.() 8 package to protect the products in storage and transportation it is necessary to pack them(outer and inner package).on paper pack, the following requirements are requested. 8.1 dimensions and mark at the end of package, the warning (moistur e proof, upward put) should be stick to it. dimensions and mark (see below) of approval label inner box belt tying adhesive tape certificate package 8.2 section of package package is made of corrugated paper with thickness of 0.8cm.package has 12 inner boxes, each box has 5 reels (each reel for plastic bag). http://www.shoulder.cn shoulder electronics limited page: 6 8.3 quantity of package per plastic reel 1000 pi eces of piezoelectric ceramic part per inner box 5 reels per package 12 inner boxes (60000 pieces of piezoel ectric ceramic part) 8.4reel max 8.5 packing method sketch map leader 200mm max blank pocket 20 pitches loaded pocket blank pocket 20 pitches 8.6test condition of peeling strength 7 8 3 h h o l q j 6 w u h q j w k j e 0 d [ 8 7 7 r s 7 d s h & |