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product structure silicon monolithic integrated circuit this product has no designed protection against radioactive ra ys 1/ 14 tsz02201-0h3h0b300440-1-2 ? 2012 rohm co., ltd. all rights reserved. 09.dec.2015 rev.002 www.rohm.com tsz22111 ? 14 ? 001 h-bridge drivers for dc brush motors dual h-bridge driver high-speed switching type BD65492MUV general description the BD65492MUV provides a dual h-bridge motor driver which features wide range of motor power supply voltage from 1.8 v to 16.0v and low power consumption to switch low on-resistance dmos transistors at high speed . this small surface mounting package is most suitable for mobile system, home appliance and variou s applications. features ? low on-resistance power dmos output ? charge pump-less with pdmos high-side driver ? drive mode switch function ? control input voltage range fit 1.8v controller ? under voltage locked out protection & thermal shut down circuit applications ? mobile system ? home appliance ? amusement system, etc key specifications ? power supply voltage r ange : 2.5v to 5.5v ? motor power supply voltage r ange : 1.8v to 16.0v ? circuit current (open mode): 0.90ma(typ) ? stand-b y current: 1a (max ) ? control input voltage range: 0v to v cc v ? logic input frequency: 500khz(max) ? minimum logic input pulse width: 0.5 s(min) ? turn o n time: 200ns(typ) ? turn off time: 80ns(typ) ? h-bridge output current (dc): -1.0a to +1.0a ? output on-resistance (total): 0.90 (typ) ? operating temperature range: -30c to +85c package w(typ) x d(typ) x h(max) vqfn024v4040 4.00mm x 4. 00mm x 1.00 mm typical application circuit vqfn024v4040 power-saving h: active l: stand- by motor control i nput selectable drive mode h: en/in l: in/in bypass filter capacitor for power supply bypass filter capacitor for power supply ps vcc 1 f to 100f out1a out1b vm in1a bandgap tsd & uvlo 11 17 15 24 3 22 power save level shift & pre driver in1b 18 pwm 19 h-bridge full on 23 2 21 pgnd out2a out2b 8 5 6 10 h-bridge full on 7 4 1 9 14 12 level shift & pre driver gnd 16 in2a in2b motor control i nput n.c. 13 n.c. 20 always keep n.c. pins open. keep o pen vm it's better for vm pin groups of 9,10 and 21,22 to short-circ uit on the pcb pattern. if cannot, check into transitional characteristics of total application circuit including two motors. through low impedance materials, the possibility of causing some unexpected malfunctions is incontrovertible. 1 f t o 100f logic logic datashee t datashee t downloaded from: http:///
2/ 14 BD65492MUV tsz02201-0h3h0b300440-1-2 ? 2012 rohm co., ltd. all rights reserved. 09.dec.2015 rev.002 www.rohm.com tsz22111 ? 15 ? 001 pin configuration pin description block diagram pin no. pin name functi on pin no. pin name function 1 pgnd motor ground 13 n.c. - 2 out1b h-bridge output 1b 14 in2a control logic input 2a 3 out1b h-bridge output 1b 15 vcc power supply 4 out2b h-bridge output 2b 16 gnd ground 5 out2b h-bridge output 2b 17 in1a control logic input 1a 6 pgnd motor ground 18 in1b control logic input 1b 7 out2a h-bridge output 2a 19 pwm drive mode logic input 8 out2a h-bridge output 2a 20 n.c. - 9 vm motor power supply 21 vm motor power supply 10 vm motor power supply 22 vm motor power s upply 11 ps power-saving function 23 out1a h-bridge output 1a 12 in2b control logic input 2b 24 out1a h-bridge output 1a the pins of the same name, such as vm, pgnd, out1a, out1b, out2a and out2b, must be shorted on printed circuit boards. pgnd 1 2 out1b out1b out2b out2b pgnd 3 4 5 6 7 8 9 10 11 12 24 23 22 21 20 19 out2a vm in2b out2a pwm n.c. vm vm out1a out1a 18 17 16 15 14 13 in1b in1a gnd vcc in2a n.c. vm ps (top view) ps vcc out1a out1b vm in1a bandgap tsd & uvlo 11 17 15 24 3 22 power save level shift & pre driver in1b 18 pwm 19 h-bridge full on 23 2 21 pgnd out2a out2b 8 5 6 10 h-bridge full on 7 4 1 9 14 12 level shift & pre driver gnd 16 in2a in2b n.c. 13 n.c. 20 vm logic logic downloaded from: http:///
3/ 14 BD65492MUV tsz02201-0h3h0b300440-1-2 ? 2012 rohm co., ltd. all rights reserved. 09.dec.2015 rev.002 www.rohm.com tsz22111 ? 15 ? 001 description of blocks 1. power-saving function a power-saving function is included, which allows the syste m to save power when not driving the motor. the voltage level on this pin should be set high so as to keep the operation mode. (see the electrica l characteristics; p.4/ 14) 2. motor control input (a) in1a, in1b, in2a and in2b pins logic level controls the output logic of h-bridge. (see the electrical characteristics; p .4 /1 4, and i/o truth table; p .7 /1 4) (b) pwm p in logic level sets the in/in or en/in drive mode. (see the electrical characteristics; p.4 /1 4 and i/o truth table; p.7 /1 4) 3. vm terminal each h-bridge can be controlled independently. take into consid eration that each vm terminal (9, 10, 21 and 22pin) is short-circuited internally. (see the block diagr am ; p.2/1 4) absolute maximum ratings (ta=25 c ) parameter symbol limit unit power supply voltage v cc - 0. 3 to +7.0 v motor power supply voltage v m - 0. 3 to +20.0 v control input voltage v in - 0. 3 to +v cc +0.3 v power dissipation pd 0. 70 (note 1) w 2. 20 (note 2) 3. 56 (note 3) h-bridge output current (dc) i out -1.0 to +1.0 (note 4) a storage temperature range tstg -55 to +150 c junction temperature tjmax +150 c (note 1) reduced by 5.6mw/ c over 25 c , when mounted on a glass epoxy 1-layer board (74.2mm x 74.2mm x 1.6mm) in surface layer copper foil area: 10.29mm 2 (note 2) reduced by 17.6mw/ c over 25 c , when mounted on a glass epoxy 4-layer board (74.2mm x 74.2mm x 1.6mm) in surface & back layers copper foil area: 10.29mm 2 , 2&3 layers copper foil area: 5505mm 2 (note 3) reduced by 28.4mw/ c over 25 c , when mounted on a glass epoxy 4-layer board (74.2mm x 74.2mm x 1.6mm) in all 4-layers copper foil area: 5505mm 2 (note 4) must not exceed pd, aso, or tjmax of 150 c caution : operating the ic over the absolute maximum ratings may damage th e ic. the damage can either be a short circuit between pins or an open circuit between pins and the internal circuitry. therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the ic is operated over the absolute maximum ratings. recommended operating ratings parameter symb ol min typ max unit power supply voltage v cc 2.5 - 5.5 v motor power supply voltage v m 1.8 - 16.0 v control input voltage v in 0 - v cc v logic input frequency f in 0 - 500 khz minimum logic input pulse width t in 0.5 - - s operating temperature range t opr - 30 - +85 c downloaded from: http:///
4/ 14 BD65492MUV tsz02201-0h3h0b300440-1-2 ? 2012 rohm co., ltd. all rights reserved. 09.dec.2015 rev.002 www.rohm.com tsz22111 ? 15 ? 001 electrical characteristics (unless otherwise specified v cc =3 .0v , v m =5.0v , ta=25c) parameter symbol min typ max unit conditions all circuits stand-by current i ccst - 0 1 a v ps =0v circuit current 1 i c c1 0.50 0.90 1.25 ma v ps =3v, open mode circuit current 2 i cc2 0.50 0.95 1.30 ma v ps =3v, cw & ccw mode circuit current 3 i cc3 0.50 0.95 1.30 ma v ps =3v, short brake mode ps input (ps) high-level input voltage v psh 1.45 - v cc v low -level input voltage v psl 0 - 0.5 v high-level input current i psh 15 30 60 a v ps =3v low -level input current i psl -1 0 +1 a v ps =0v control input (in=in1a, in1b, in2a, in2b, pwm) high-level input voltage v inh 1.45 - v cc v low -level input voltage v inl 0 - 0.5 v high-level input current i inh 15 30 60 a v in =3v low -level input current i inl -1 0 +1 a v in =0v under voltage locked out (uvlo) uvlo voltage v uvlo 2.0 - 2.4 v full on type h-bridge driver output on-resistance r on - 0.9 1.2 i out =500ma, high & low-side total turn on time t on - 200 400 ns 20 loading turn off time t off - 80 400 ns 20 loading downloaded from: http:///
5/ 14 BD65492MUV tsz02201-0h3h0b300440-1-2 ? 2012 rohm co., ltd. all rights reserved. 09.dec.2015 rev.002 www.rohm.com tsz22111 ? 15 ? 001 typical performance curves (reference data) figure 1. circuit current vs power supply voltage (stand-by mode) figure 2. circuit current vs power supply voltage (open mode) figure 3. output vds vs power output current (output on-resistance on high-side, v m =5v, v cc =3v) figure 4. output vds vs power output current (output on-resistance on low-side v m =5v, v cc =3v) 0.0 1.0 2.0 3.0 4.0 5.0 0 1 2 3 4 5 6 7 power supply voltage : v cc [v] circuit current : i cc [a] top 85 c mid 25 c low -30c operating range (2.5v to 5.5v) 0.0 1.0 2.0 3.0 0 1 2 3 4 5 6 7 power supply voltage : v cc [v] circuit current : i cc [ma] top 85 c mid 25 c low -30c operating range (2.5v to 5.5v) 0 200 400 600 800 0 200 400 600 800 1000 output current : i out [ma] output vd s : v dsh [mv] top 85 c mid 25 c low -30c 0 200 400 600 800 0 200 400 600 800 1000 output current : i out [ma] output vds : v dsl [mv] top 85 c mid 25 c low -30c downloaded from: http:///
6/ 14 BD65492MUV tsz02201-0h3h0b300440-1-2 ? 2012 rohm co., ltd. all rights reserved. 09.dec.2015 rev.002 www.rohm.com tsz22111 ? 15 ? 001 typical performance curves (reference data) - continued figure 5. output on-resistance vs motor power supply voltage (output on-resistance on high-side v m dependency, v cc =3v) figure 6. output on-resistance vs motor power supply voltage (output on-resistance on low-side v m dependency, v cc =3v) 0.0 0.2 0.4 0.6 0.8 1.0 0 5 10 15 20 motor power supply voltage : v m [v] output on resistance : r on [] top 85c mid 25c low - 30 c operating range (1.8v to 16 .0 v) 0.0 0.1 0.2 0.3 0.4 0.5 0 5 10 15 20 motor power supply voltage : v m [v] output on resistance : r on [] top 85c mid 25c low - 30 c operating range (1.8v to 16 .0 v) downloaded from: http:///
7/ 14 BD65492MUV tsz02201-0h3h0b300440-1-2 ? 2012 rohm co., ltd. all rights reserved. 09.dec.2015 rev.002 www.rohm.com tsz22111 ? 15 ? 001 timing chart table 1 . i/o truth table input mode input output ps (note 5) pwm in1a/2a in1b/2b out1a/2a out1b/2b output mode (note 6) en/in h h l x l l short brake h l h l cw h h l h ccw in/in l l l z z open h l h l cw l h l h ccw h h l l short brake - l x x x z z open l: low, h: high, x: don t care, z: hi impedance (note 5) ps= high: operation mode, ps=low: stand-by mode (note 6) cw : current flows from outxa to outxb, ccw: current flows from outx b to outxa (x=1, 2) 1.0v 50% - 50% 1.45v 0.5v 100% 0% - 100% t on t off 50% - 50% motor current control input t on t off t in t in figure 7 . input-output ac characteristic downloaded from: http:///
8/ 14 BD65492MUV tsz02201-0h3h0b300440-1-2 ? 2012 rohm co., ltd. all rights reserved. 09.dec.2015 rev.002 www.rohm.com tsz22111 ? 15 ? 001 application example selection of components externally connected when using the circuit with changes to the external circu it constants, make sure to leave an adequate margin for e xternal components including static and transitional characteristics as well as dispersion of the ic. power-saving h: active l: stand- by motor control i nput selectable drive mode h: en/in l: in/in bypass filter capacitor for power supply bypass filter capacitor for power supply ps vcc 1f t o 100f out1a out1b vm in1a bandgap tsd & uvlo 11 17 15 24 3 22 power save level shift & pre driver in1b 18 pwm 19 h-bridge full on 23 2 21 pgnd out2a out2b 8 5 6 10 h-bridge full on 7 4 1 9 14 12 level shift & pre driver gnd 16 in2a in2b motor control i nput n.c. 13 n.c. 20 always keep n.c. pins open. keep open vm it's better for vm pin groups of 9,10 and 21,22 to short-circ uit on the pcb pattern. if cannot, check into transitional characteristics of total application circuit including two motors. through low impedance materials, the possibility of causing some unexpected malfunctions is incontrovertible. 1 f to 100f logic logic downloaded from: http:///
9/ 14 BD65492MUV tsz02201-0h3h0b300440-1-2 ? 2012 rohm co., ltd. all rights reserved. 09.dec.2015 rev.002 www.rohm.com tsz22111 ? 15 ? 001 power dissipation figure 8 . power dissipation vs ambient temperature i/o equivalence circuits ps in1a, in1b, in2a, in2b, pwm vm, pgnd, outxa, outxb (x=1,2) outxa pgnd vm outxb 100k 10k 300k 75k 0.0 1.0 2.0 3.0 4.0 0 25 50 75 100 125 150 ambient temperature : ta [c] power dissipation : pd [w] 3.56w 2.20w 85 c 0.70w 0.36w 1.86w 1.14w downloaded from: http:///
10 / 14 BD65492MUV tsz02201-0h3h0b300440-1-2 ? 2012 rohm co., ltd. all rights reserved. 09.dec.2015 rev.002 www.rohm.com tsz22111 ? 15 ? 001 operational notes 1. reverse connection of power supply connecting the power supply in reverse polarity can damage the ic. take precautions against reverse polarity when connecting the power supply, such as mounting an extern al diode between the power supply and the ic s power supply pin s. 2. power supply lines design the pcb layout pattern to provide low impedance sup ply lines. separate the ground and supply lines of the digital and analog blocks to prevent noise in the grou nd and supply lines of the digital block from affecting the analog block. furthermore, connect a capacitor to ground at all pow er supply pins . consider the effect of temperature and aging on the capacitance value when using electrolytic capa citors. 3. ground voltage ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition. 4. ground wiring pattern when using both small-signal(gnd) and large-current groun d(pgnd) traces, the two ground traces should be routed separately but connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal ground caused by large currents. also ensure that the ground traces of external components do not cause variations on the ground voltage. the ground lin es must be as short and thick as possible to reduce line impedance. 5. thermal consideration should by any chance the power dissipation rating be exc eeded the rise in temperature of the chip may result in deterioration of the properties of the chip. in case of exceeding t his absolute maximum rating, increase the board size and copper area to prevent exceeding the pd rating. 6. recommended operating conditions these conditions represent a range within which the expe ct ed characteristics of the ic can be approximately obtained . the electrical characteristics are guaranteed under the condi tions of each parameter. 7. inrush current when power is first supplied to the ic, it is possible that the internal logic may be unstable and inrush current may flow instantaneously due to the internal powering sequence and delays, especially if the ic has more than one powe r supply. therefore, give special consideration to power co upling capacitance, power wiring, width of ground wiring, and routing of connections. 8. operation under strong electromagnetic field operating the ic in the presence of a strong electromagnetic field ma y cause the ic to malfunction. 9. testing on application boards when testing the ic on an application board, connecting a capacitor directly to a low-impedance output pin may subject the ic to stress. always discharge capacitors comple tely after each process or step. the ics power supply should always be turned off completely before connecting or removing it from the test setup during the inspection process. to prevent damage from static discharge, ground the ic during assembly and use similar precautions during transport and storage. 10. inter-pin short and mounting errors ensure that the direction and position are correct when mountin g the ic on the pcb. incorrect mounting may result in damaging the ic. avoid nearby pins being shorted to each other especially to ground, power supply and output pin . inter-pin shorts could be due to many reasons such as me tal particles, water droplets (in very humid environment) and unintentional solder bridge deposited in between pins du ring assembly to name a few. 11. unused input pins input pins of an ic are often connected to the gate of a mos tran sistor. the gate has extremely high impedance and extremely low capacitance. if left unconnected, the elec tric field from the outside can easily charge it. the smal l charge acquired in this way is enough to produce a signi ficant effect on the conduction through the transistor and cause unexpected operation of the ic. so unless otherwise spec ified, unused input pins should be connected to the power supply or ground line. downloaded from: http:///
11 / 14 BD65492MUV tsz02201-0h3h0b300440-1-2 ? 2012 rohm co., ltd. all rights reserved. 09.dec.2015 rev.002 www.rohm.com tsz22111 ? 15 ? 001 operational notes C continued 12. regarding the input pin of the ic this monolithic ic contains p+ isolation and p substrate la yers between adjacent elements in order to keep them isolated. p-n junctions are formed at the intersection of t he p layers with the n layers of other elements, creating a parasitic diode or transistor. for example (refer to figure below): when gnd > pin a and gnd > pin b, the p-n junction operates as a par asitic diode. when gnd > pin b, the p-n junction operates as a parasitic transistor. parasitic diodes inevitably occur in the structure of the ic. the operation of parasitic diodes can result in mutual interference among circuits, operational faults, or physic al damage. therefore, conditions that cause these diodes to operate, such as applying a voltage lower than the gnd vo ltage to an input pin (and thus to the p substrate) should be avoided. figure 9. example of monolithic ic structure 13. ceramic capacitor when using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with temperature and the decrease in nominal capacitance due to dc bias a nd others. 14. area of safe operation (aso) operate the ic such that the output voltage, output current, and power dissipation are all within the area of safe operation (aso). 15. thermal shutdown circuit(tsd) this ic has a built-in thermal shutdown circuit that prevent s heat damage to the ic. normal operation should always be within the ics power dissipation rating. if however the ratin g is exceeded for a continued period, the junction temperature (tj) will rise which will activate the tsd circuit t hat will turn off all output pins. when the tj falls below the tsd threshold, the circuits are automatically restored to normal o peration. note that the tsd circuit operates in a situation that exceeds th e absolute maximum ratings and therefore, under no circumstances, should the tsd circuit be used in a set des ign or for any purpose other than protecting the ic from heat damage. n n p + p n n p + p substrate gnd n p + n n p + n p p substrate gnd gnd parasitic elements pin a pin a pin b pin b b c e parasitic elements gnd parasitic elements c be transistor (npn) resistor n region close-by parasitic elements downloaded from: http:///
12 / 14 BD65492MUV tsz02201-0h3h0b300440-1-2 ? 2012 rohm co., ltd. all rights reserved. 09.dec.2015 rev.002 www.rohm.com tsz22111 ? 15 ? 001 ordering information b d 6 5 4 9 2 m u v - e 2 part number package muv :vqfn024v4040 packaging and forming specification e2: embossed tape and reel marking diagram part number marking package orderable part number 65492 vqfn024v4040 BD65492MUV- e2 vqfn024v4040 (top view) 6 5 4 9 2 part number marking m lot number 1pin mark downloaded from: http:///
13 / 14 BD65492MUV tsz02201-0h3h0b300440-1-2 ? 2012 rohm co., ltd. all rights reserved. 09.dec.2015 rev.002 www.rohm.com tsz22111 ? 15 ? 001 physical dimension, tape and reel information package name vqfn024v4040 downloaded from: http:///
14 / 14 BD65492MUV tsz02201-0h3h0b300440-1-2 ? 2012 rohm co., ltd. all rights reserved. 09.dec.2015 rev.002 www.rohm.com tsz22111 ? 15 ? 001 revision history date revision changes 05.oct.2012 001 new release 09.dec.2015 002 applied the rohm standard style and improved understandability . downloaded from: http:///
datasheet d a t a s h e e t notice-pga-e rev.00 2 ? 2015 rohm co., ltd. all rights reserved. notice precaution on using rohm products 1. our products are designed and manufac tured for application in ordinary elec tronic equipments (such as av equipment, oa equipment, telecommunication equipment, home electroni c appliances, amusement equipment, etc.). if you intend to use our products in devices requiring ex tremely high reliability (such as medical equipment (note 1) , transport equipment, traffic equipment, aircraft/spacecra ft, nuclear power controllers, fuel c ontrollers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (?specific applications?), please consult with the rohm sale s representative in advance. unless otherwise agreed in writing by rohm in advance, rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ro hm?s products for specific applications. (note1) medical equipment classification of the specific applications japan usa eu china class class class b class class ? class 2. rohm designs and manufactures its products subject to strict quality control system. however, semiconductor products can fail or malfunction at a certain rate. please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe desi gn against the physical injury, damage to any property, which a failure or malfunction of our products may cause. the following are examples of safety measures: [a] installation of protection circuits or other protective devices to improve system safety [b] installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. our products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditio ns, as exemplified below. accordin gly, rohm shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of an y rohm?s products under any special or extraordinary environments or conditions. if you intend to use our products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] use of our products in any types of liquid, incl uding water, oils, chemicals, and organic solvents [b] use of our products outdoors or in places where the products are exposed to direct sunlight or dust [c] use of our products in places where the products ar e exposed to sea wind or corrosive gases, including cl 2 , h 2 s, nh 3 , so 2 , and no 2 [d] use of our products in places where the products are exposed to static electricity or electromagnetic waves [e] use of our products in proximity to heat-producing components, plastic cords, or other flammable items [f] sealing or coating our products with resin or other coating materials [g] use of our products without cleaning residue of flux (ev en if you use no-clean type fluxes, cleaning residue of flux is recommended); or washing our products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] use of the products in places subject to dew condensation 4. the products are not subjec t to radiation-proof design. 5. please verify and confirm characteristics of the final or mounted products in using the products. 6. in particular, if a transient load (a large amount of load applied in a short per iod of time, such as pulse. is applied, confirmation of performance characteristics after on-boar d mounting is strongly recomm ended. avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading c ondition may negatively affect product performance and reliability. 7. de-rate power dissipation depending on ambient temperature. when used in sealed area, c onfirm that it is the use in the range that does not exceed t he maximum junction temperature. 8. confirm that operation temperat ure is within the specified range described in the product specification. 9. rohm shall not be in any way responsible or liable for fa ilure induced under deviant condi tion from what is defined in this document. precaution for mounting / circuit board design 1. when a highly active halogenous (chlori ne, bromine, etc.) flux is used, the resi due of flux may negatively affect product performance and reliability. 2. in principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must be used on a through hole mount products. if the flow sol dering method is preferred on a surface-mount products, please consult with the rohm representative in advance. for details, please refer to rohm mounting specification downloaded from: http:///
datasheet d a t a s h e e t notice-pga-e rev.00 2 ? 2015 rohm co., ltd. all rights reserved. precautions regarding application examples and external circuits 1. if change is made to the constant of an external circuit, pl ease allow a sufficient margin considering variations of the characteristics of the products and external components, including transient characteri stics, as well as static characteristics. 2. you agree that application notes, re ference designs, and associated data and in formation contained in this document are presented only as guidance for products use. theref ore, in case you use such information, you are solely responsible for it and you must exercise your own indepen dent verification and judgment in the use of such information contained in this document. rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. precaution for electrostatic this product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. please take proper caution in your manufacturing process and storage so that voltage exceeding t he products maximum rating will not be applied to products. please take special care under dry condit ion (e.g. grounding of human body / equipment / solder iron, isolation from charged objects, se tting of ionizer, friction prevention and temperature / humidity control). precaution for storage / transportation 1. product performance and soldered connections may deteriora te if the products are stor ed in the places where: [a] the products are exposed to sea winds or corros ive gases, including cl2, h2s, nh3, so2, and no2 [b] the temperature or humidity exceeds those recommended by rohm [c] the products are exposed to di rect sunshine or condensation [d] the products are exposed to high electrostatic 2. even under rohm recommended storage c ondition, solderability of products out of recommended storage time period may be degraded. it is strongly recommended to confirm sol derability before using products of which storage time is exceeding the recommended storage time period. 3. store / transport cartons in the co rrect direction, which is indicated on a carton with a symbol. otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. use products within the specified time after opening a humidity barrier bag. baking is required before using products of which storage time is exceeding the recommended storage time period. precaution for product label qr code printed on rohm products label is for rohm?s internal use only. precaution for disposition when disposing products please dispose them proper ly using an authorized industry waste company. precaution for foreign exchange and foreign trade act since concerned goods might be fallen under listed items of export control prescribed by foreign exchange and foreign trade act, please consult with rohm in case of export. precaution regarding intellectual property rights 1. all information and data including but not limited to application example contained in this document is for reference only. rohm does not warrant that foregoi ng information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. 2. rohm shall not have any obligations where the claims, actions or demands arising from the co mbination of the products with other articles such as components, circuits, systems or external equipment (including software). 3. no license, expressly or implied, is granted hereby under any intellectual property rights or other rights of rohm or any third parties with respect to the products or the informati on contained in this document. pr ovided, however, that rohm will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to manufacture or sell products containing the produc ts, subject to the terms and conditions herein. other precaution 1. this document may not be reprinted or reproduced, in whol e or in part, without prior written consent of rohm. 2. the products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of rohm. 3. in no event shall you use in any wa y whatsoever the products and the related technical information contained in the products or this document for any military purposes, incl uding but not limited to, the development of mass-destruction weapons. 4. the proper names of companies or products described in this document are trademarks or registered trademarks of rohm, its affiliated companies or third parties. downloaded from: http:///
datasheet datasheet notice ? we rev.001 ? 201 5 rohm co., ltd. all rights reserved. general precaution 1. before you use our pro ducts, you are requested to care fully read this document and fully understand its contents. rohm shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny rohms products against warning, caution or note contained in this document. 2. all information contained in this docume nt is current as of the issuing date and subj ec t to change without any prior notice. before purchasing or using rohms products, please confirm the la test information with a rohm sale s representative. 3. the information contained in this doc ument is provi ded on an as is basis and rohm does not warrant that all information contained in this document is accurate an d/or error-free. rohm shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information. downloaded from: http:///

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